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At least 235 records · Page 13

Solar wind rare gas analysis: Trapped solar wind helium and neon in Surveyor 3 material

The He-4 and Ne-20 contents in sections of the Surveyor 3 support strut samples were determined by optical and scanning electron microscopy and are compared to the results of the Apollo solar wind composition (SWC) experiments. The He-4/Ne-20 ratio in the samples from the sunlit side of the strut was approximately 300; the ratios determined in Apollo 12 lunar fines and SWC foil were below 100. The He-4/He-3 ratios were also determined, and the ratio obtained from Surveyor 3 material is higher than those found with Apollo 11 and 12 SWC experiments. The effects of spallation by cosmic rays or solar protons, stripping by cosmic ray or energetic solar alpha particles, recycling of solar wind He and radiogenic Ne, He from terrestrial atmosphere, mass discrimination near the moon, mass dependence of trapping probability, diffusion, and contamination by lunar dust are considered.

Buehler, F.↗

Solar particle tracks in glass from Surveyor 3

Samples of glass from the Surveyor 3 TV camera filter were examined for particle tracks by optical and scanning electron microscopy. The corrected density value is 1.7 million + or - 0.1 million tracks/sq cm, and the track density vs depth curve is determined. Comparisons with other estimated and calculated data are discussed, and lack of agreement between data sets is considered. It is felt that considerable erosion occurs, and that erosion also occurs by a flaking of small thicknesses of material, possibly caused by solar wind irradiation.

Crozaz, G.↗

Some observations on the three-dimensional growth of L5178Y cell colonies in soft agar culture.

The three-dimensional organization of spherical colonies formed by L5178Y cells grown in soft agar cultures was investigated by light and scanning electron microscopy. Visible colonies were formed after 7 days of incubation and increased in size for more than 2 weeks. At this time the colonies contained a central core of necrotic cells surrounded by an outer shell of normal-looking cells in loose contact with each other. Cross sectional radioautographs revealed that tritiated precursors were incorporated only into those cells in the ?viable cell' shell and not in the necrotic center of the colony. It is pointed out that increased knowledge of the factors leading to this type of three-dimensional organization is of particular interest, since it is similar to the conditions found in certain types of solid tumors (Thomlinson and Gray, 1955).

Dalen, H.↗

Lubrication with sputtered MoS2 films.

Sputtered MoS2 films (2000-6500 A) were deposited on highly polished metal surfaces. These films have a low coefficient of friction (0.03-0.04) at speeds of 40-80 rpm and loads of 250-1000 grams. At loads of 250 grams the wear lives are over 0.5 million cycles, but at 1000 gram loads, it decreases to 38,000 cycles. Friction experiments and tensile tests have indicated that sputtered films have a strong adherence to metal surfaces. Electron transmission, diffraction and scanning electron microscopy show that these films have an extremely small particle size, less than 30 A in diameter, and are very dense and free from observable pinholes. The high kinetic energy of these sputtered species, the submicroscopic particle size and the sputter-etched substrate surface is responsible for strong adhesion and cohesion of the sputtered film.

Spalvins, T.↗

Lubrication with sputtered MoS2 films.

Sputtered MoS2 films (2000-6500 A) were deposited on highly polished metal surfaces. These films have a low coefficient of friction (0.03-0.04) at speeds of 40-80 rpm and loads of 250-1000 grams. At loads of 250 grams, the wear lives are over 0.5 million cycles, but at 1000 gram loads, it decreases to 38,000 cycles. Friction experiments and tensile tests have indicated that sputtered films have a strong adherence to metal surfaces. Electron transmission, diffraction, and scanning electron microscopy show that these films have an extremely small particle size less than 30 A in diameter and are very dense and free from observable pinholes.

Spalvins, T.↗

An exploratory investigation of cumulative shock fatigue.

A simple device for producing cumulative shock loading in solids is described. The device uses a ballistic-impact-driven projectile to introduce high-stress waves into a solid. The impact time and load amplitude can be varied to produce fracture in one or several impacts in PMMA rods. The wavefront approached a square wave shape. Materials other than PMMA were loaded to failure to demonstrate the versatility of the device. Fracture morphologies observed with optical and scanning-electron microscopy are described.

Simonson, D.↗

Micrometeorite craters on lunar glass particles - The relationship between radial fracture zones and spall zones.

Discussion of the microimpact-crater morphology observed by scanning electron microscopy on a glass bead (nearly 580 microns in maximum diameter) recovered from zone A of the Luna 16 sample. The microcrater has a diameter of approximately 200 microns and a centrally located melted region or pit that is slightly elevated above the surrounding area. Around the pit is a radial fracture zone half of which has spalled off. The spall zone is more than half again as large as the radial fracture zone.

Glass, B. P.↗

Morphology and petrography of volcanic ashes.

Study of volcanic ash samples collected from a variety of recent eruptions using petrography, chemical analyses, and scanning electron microscopy to characterize each type and to relate ash morphology to magma composition and the type of eruption. The ashes are placed in the broad genetic categories of magmatic and phreatomagmatic. The morphology of ash particles from magmatic eruptions of high viscosity magma is governed primarily by vesicle density and shape. Ash particles from eruptions of low viscosity magmas are mostly droplets. The morphology of ash particles from phreatomagmatic eruptions is controlled by stresses within the chilled magma which result in fragmentation of the glass to form small blocky or pyramidal glass ash particles.

Heiken, G.↗

Adhesion, friction, and wear of a copper bicrystal with (111) and (210) grains

Sliding friction experiments were conducted in air with polycrystalline copper and ruby riders sliding against a copper bicrystal. Friction coefficient was measured across the bicrystal surface, and the initiation of adhesive wear was examined with scanning electron microscopy. Results indicate a marked increase in friction coefficient as the copper rider crossed the grain boundary from the (111) plane to the (210) plane of the bicrystal. Adhesion, friction, and initiation of adhesive wear was notably different in the adjacent grains of differing orientation. A slip-band adhesion-generated fracture mechanism for wear particle formation is proposed.

Brainard, W. A.↗

Investigation of high temperature fracture of T-111 and ASTAR-811C

The high temperature deformation and fracture behavior of T-111 and ASTAR-811C were studied over the temperature range 982 to 2205 C (1800 to 4000 F). As-cast and wrought-recrystallized material as well as GTA welds in sheet and plate were evaluated using conventional tensile and creep tests. Post test examinations were performed using optical metallography, scanning electron microscopy and transmission electron microscopy. A high temperature region of reduced ductility, in terms of tensile elongation, was identified for both alloys. The reduction in tensile elongation became more severe with increase in grain size, being near catastrophic for the as-cast specimens. Optical and electron metallography indicated that even for failures at very low total strain, considerable deformation of a very localized nature had occurred prior to fracture.

Gold, R. E.↗

Application of diffusion bonding to electronic interconnection of flatpack leads

Diffusion-bonded joints between gold-plated Kovar leads and indium-plated copper circuit pads offer some advantages for electronic circuit packaging. Test results show that consistent high strength bonds stronger than the copper circuit foil are achieved by parallel-gap bonding at relatively low power settings. The bonds are basically formed by the alloying of the gold, indium and copper at the bond interface. Other low melting metals such as tin can also be used; however, tin does not offer the ease of bonding that results in consistent separation of the copper foil during pull testing. The investigation was conducted in three parts consisting of: (1) an evaluation of the physical strength of resulting bonds at ambient and elevated temperature, (2) a metallurgical analysis of bonds using scanning electron microscopy and nondispersive X-ray analysis, and (3) evaluation and development of various schemes for multiple lead flatpack bonding.

Korb, R. W.↗

Activated sintering of ThO2 and ThO2-Y2O3 with NiO.

Scanning electron microscopy and isothermal shrinkage measurements were used to study the effects of additives on the sintering of Thoria-Yttria compacts and loose powders. Small amounts of the oxides of Ni, Zn, Co, and Cu were found to reduce the sintering temperature (which is normally above 2000 C). In particular, NiO, at a concentration of 0.8 wt %, was found to yield high-density bodies at temperatures below 1500 C. Densification occurs very rapidly, and is followed by a much slower sintering process typical of volume diffusion.

Halbfinger, G. P.↗

An evaluation of pyrolytic techniques with regard to the Apollo 11, 12 and 14 lunar samples analyses.

The first technique involved pyrolysis at 700 C under an inert atmosphere in a flowing He system at normal pressure. The products were collected at liquid nitrogen temperature and then allowed to pass instantaneously into a combined capillary gas chromatograph-mass spectrometer. The second technique consisted of a vacuum pyrolysis where the sample was first degassed at 150 C and then pyrolized at 500 C and 1000 C consecutively. The products were again collected at liquid nitrogen temperature and then they were directly introduced to the ion source of the mass spectrometer through a modified gas inlet system. The experiments have shown the importance of taking into account the factors that influence pyrolytic degradation and/or the synthesis of products. Pyrolysis of Apollo 14 lunar fines and scrapings from an astronaut's glove gave different products by mass spectroscopy and showed different looking flaky materials upon scanning electron microscopy.

Nagy, B.↗

Solid-phase epitaxial growth of Si mesas from Al metallization.

Using scanning electron microscopy, Si epitaxial growth from solution in solid Al onto crystal Si substrates was studied. Growth in reentrant corners of the substrate was found to be favored over growth onto a flat surface. These preferred locations for growth appear to be the result of a force not present in conventional crystal growth from fluid media, namely, the nonuniform stress field present in solids.

Sankur, H.↗

Tensile fracture of unidirectional B-Al composite.

Fracture studies on unidirectional boron filament/aluminum matrix composite under axial tension were conducted using scanning electron microscopy, microradiography, and an acoustic emission technique. The combination of these analysis techniques has allowed the description and microstructural characterization of a new noncumulative fracture mode which involves filament break propagation. This fracture mode was found to severely limit the tensile strength of the composite, since the initiation of break propagation leads immediately to catastrophic failure at filament stress levels above a critical value. This critical filament stress was found to be 170,000 psi, and it appeared to be independent of filament diameter, number of filament layers, and the type of matrix alloy.

Steele, J. H.↗

Emittance measurement of Surveyor 3 material.

Calorimetric measurements of the total hemispherical emittance of a section of polished aluminum support tubing from the Surveyor 3 spacecraft are reported. The values found, 0.090 at 25 C and 0.089 at 50 C, are lower than was expected from a visual estimate but are in good agreement with an estimate based upon scanning electron microscopy of the tubing.

Dahms, R. G.↗

Methods of Measurement for Semiconductor Materials, Process Control, and Devices

The development of methods of measurement for semiconductor materials, process control, and devices is reported. Significant accomplishments include: (1) Completion of an initial identification of the more important problems in process control for integrated circuit fabrication and assembly; (2) preparations for making silicon bulk resistivity wafer standards available to the industry; and (3) establishment of the relationship between carrier mobility and impurity density in silicon. Work is continuing on measurement of resistivity of semiconductor crystals; characterization of generation-recombination-trapping centers, including gold, in silicon; evaluation of wire bonds and die attachment; study of scanning electron microscopy for wafer inspection and test; measurement of thermal properties of semiconductor devices; determination of S-parameters and delay time in junction devices; and characterization of noise and conversion loss of microwave detector diodes.

Bullis, W. M.↗