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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 235 records · Page 13

Terahertz Instruments for CubeSats

We have been developing terahertz high resolution spectrometers and radiometers on CubeSat platforms for astrophysics, planetary science, and Earth science applications. We are also developing millimeter-wave communications systems on CubeSat platforms to provide communication links during the entry-descent-landing (EDL) phase of Mars and other planetary missions. In this paper, we present an overview of the state of the millimeter-wave and terahertz instrumentation development for CubeSat platforms. We discuss the design and implementation challenges for these instrument developments. We also look into innovative packaging solutions, antenna technology, and low-power backend options for these instruments. We show that CubeSats and SmallSats will play a key role in future scientific space missions and also they will find increasing applications in commercial communication and other endeavors.

SmallSat↗

One NASA PEM qualification standard : comparison of JPL and GSFC standards

Although use of Plastic Encapsulated Microelectronics (PEMs) in space applications is discouraged, their use is mandatory for selected applications involving the need for advanced technology and small packages. Various space systems designers and manufacturers have developed methods to qualify and screen PEMs. In general, each procedure is different. The purpose of this fiscal year’s investigation is to initiate a process to coordinate the efforts at various NASA centers to eventually develop a One NASA method. Part of this activity includes sharing of test data and PEM qualification methodologies. Various experts in the NASA community were identified and contacted to support this effort. We were successful in finding such experts at GSFC, APL and the Constellation office (Orion and Ares). All these experts provided typical qualification program plans. Since funding was severely restricted, it was decided to concentrate on coordination activity with GSFC. GSFC is planning a new version of IEEE-INST-002 section applying to PEMs. The GSFC expert (Dr. Alexander Teverovsky) provided a detailed assessment of the differences between the planned new version of IEEE-INST-002 and the JPL-D-19426 (JPL guideline) as well as a summary rationale for the decisions within the IEEE-INST-002. It should be noted that GSFC’s assessment of IEEE-INST-002 in the area of PEMs is not finalized. JPL is also considering changes in PEM qualification methodologies based on test data from recent qualification testing for their newer Projects (MSL, Grail, Juno). A spreadsheet delineating the differences between the JPL standard and the GSFC standard is presented.

Cooper, Mark↗

Core Recursive Hierarchical Image Segmentation

The Recursive Hierarchical Image Segmentation (RHSEG) software has been repackaged to provide a version of the RHSEG software that is not subject to patent restrictions and that can be released to the general public through NASA GSFC's Open Source release process. Like the Core HSEG Software Package, this Core RHSEG Software Package also includes a visualization program called HSEGViewer along with a utility program HSEGReader. It also includes an additional utility program called HSEGExtract. The unique feature of the Core RHSEG package is that it is a repackaging of the RHSEG technology designed to specifically avoid the inclusion of the certain software technology. Unlike the Core HSEG package, it includes the recursive portions of the technology, but does not include processing window artifact elimination technology.

Tilton, James↗

Microelectronics in Japan

The purpose of this JTEC study is to evaluate Japan's electronic manufacturing and packaging capabilities within the context of global economic competition. To carry out this study, the JTEC panel evaluated the framework of the Japanese consumer electronics industry and various technological and organizational factors that are likely to determine who will win and lose in the marketplace. This study begins with a brief overview of the electronics industry, especially as it operates in Japan today. Succeeding chapters examine the electronics infrastructure in Japan and take an in-depth look at the central issues of product development in order to identify those parameters that will determine future directions for electronic packaging technologies.

Boulton, William R.↗

Structural Bus and Release Mechanisms on the ST5 Satellites: Summary and Status

The Space Technology 5 Mechanical System met the challenge of packaging a fully functional science and technology satellite system with its Deployer mechanism into a compact 0.07cu m volume. Three 25 kg satellites were orbited in constellation in March, 2006. The ST5 mechanical system is composed of 1) The Structural Bus; 2) Magnetometer Instrument Boom 3) Spacecraft Deployer Release Mechanism This system includes a highly integrated electronics enclosure as a multifunctional structure; a lightweight, magnetically clean Magnetometer Boom; the first use of Nitinol Shape-Memory Alloy trigger devices for deploying multiple spacecraft; an innovative compliant mount for the umbilical connector and a Deployer mechanism that imparts both separation velocity and mission spin rate to three constellation flying satellites These elements employed cutting-edge design and analysis tools, state-of-the-art testing facilities and proven engineering techniques to meet stringent performance criteria, enabling the mission s success.

Rossoni, Peter↗

Mars Microprobe Project Instrumentation Package

The Mars Microprobe Project is a technology validation mission in NASA's New Millennium Program. The project is developing a pair of small, two-piece probes for delivery to the surface of Mars in December of 1999.

Mars↗

Advanced Resistive Exercise Device (ARED) Flight Software (FSW): A Unique Approach to Exercise in Long Duration Habitats

ARED flight instrumentation software is associated with an overall custom designed resistive exercise system that will be deployed on the International Space Station (ISS). This innovative software application fuses together many diverse and new technologies into a robust and usable package. The software takes advantage of touchscreen user interface technology by providing a graphical user interface on a Windows based tablet PC, meeting a design constraint of keyboard-less interaction with flight crewmembers. The software interacts with modified commercial data acquisition (DAQ) hardware to acquire multiple channels of sensor measurment from the ARED device. This information is recorded on the tablet PC and made available, via International Space Station (ISS) Wireless LAN (WLAN) and telemetry subsystems, to ground based mission medics and trainers for analysis. The software includes a feature to accept electronically encoded prescriptions of exercises that guide crewmembers through a customized regimen of resistive weight training, based on personal analysis. These electronically encoded prescriptions are provided to the crew via ISS WLAN and telemetry subsystems. All personal data is securely associated with an individual crew member, based on a PIN ID mechanism.

Mangieri, Mark↗

Auxiliary propulsion system flight package

Hughes Aircraft Company developed qualified and integrated flight, a flight test Ion Auxiliary Propulsion System (IAPS), on an Air Force technology satellite. The IAPS Flight Package consists of two identical Thruster Subsystems and a Diagnostic Subsystem. Each thruster subsystem (TSS) is comprised of an 8-cm ion Thruster-Gimbal-Beam Shield Unit (TGBSU); Power Electronics Unit; Digital Controller and Interface Unit (DCIU); and Propellant Tank, Valve and Feed Unit (PTVFU) plus the requisite cables. The Diagnostic Subsystem (DSS) includes four types of sensors for measuring the effect of the ion thrusters on the spacecraft and the surrounding plasma. Flight qualifications of IAPS, prior to installation on the spacecraft, consisted of performance, vibration and thermal-vacuum testing at the unit level, and thermal-vacuum testing at the subsystem level. Mutual compatibility between IAPS and the host spacecraft was demonstrated during a series of performance and environmental tests after the IAPS Flight Package was installed on the spacecraft. After a spacecraft acoustic test, performance of the ion thrusters was reverified by removing the TGBSUs for a thorough performance test at Hughes Research Laboratories (HRL). The TGBSUs were then reinstalled on the spacecraft. The IAPS Flight Package is ready for flight testing when Shuttle flights are resumed.

Collett, C. R.↗

Overview of the large space systems technology program

A multicenter management approach which provides the opportunity to work across many disciplines and match the roles and expertise of various NASA facilities is described for the large space system technology (LSST) program which was established to define, develop, and verify structural concepts, analyses, and design procedures for a range of sizes and configurations to be deployed, erected, or fabricated in orbit during projected space missions utilizing shuttle in the 1985 to 2000 time period. Benefits from the program include reduced costs for transporting structures having low mass, high packageability, and multimission capabilities. Technologies identified by the LSST program will contribute to the solutions of problems in other sectors of the economy.

Guastaferro, A.↗

Optical Design and Status of the Large Ultra-Violet Optical Infrared Surveyor (LUVOIR)

"In preparation for the Astrophysics 2020 Decadal Survey NASA's Goddard Space Flight Center is studying a segmented aperture telescope with broad astrophysics, solar system, and exoplanet science capability called the Large Ultra-Violet Optical Infrared Surveyor (LUVOIR). This telescope design incorporates many heritage design concepts from the Hubble Space Telescope (HST), James Webb Space Telescope (JWST), and the Wide-field Infrared Survey Telescope (WFIRST). This includes similar ultraviolet instrumentation from HST, deployable segmented optics from JWST, and high-contrast coronagraph technology from WFIRST. Several optical design trades were completed to maximize the science product while maintaining reasonable packaging and fabrication constraints. Other technology developments such as freeform optics, UV enhanced coatings, coronagraph design, and ultra-stable mirrors are being studied to further improve the observatory performance.

Ultraviolet↗

Evaluation of advanced microelectronic fluxless solder-bump contacts for hybrid microcircuits

Technology for interconnecting monolithic integrated circuit chips with other components is investigated. The advantages and disadvantages of the current flip-chip approach as compared to other interconnection methods are outlined. A fluxless solder-bump contact technology is evaluated. Multiple solder-bump contacts were formed on silicon integrated circuit chips. The solder-bumps, comprised of a rigid nickel under layer and a compliant solder overlayer, were electroformed onto gold device pads with the aid of thick dry film photomasks. Different solder alloys and the use of conductive epoxy for bonding were explored. Fluxless solder-bump bond quality and reliability were evaluated by measuring the effects of centrifuge, thermal cycling, and high temperature storage on bond visual characteristics, bond electrical continuity, and bond shear tests. The applicability and suitability of this technology for hybrid microelectronic packaging is discussed.

Mandal, R. P.↗

Advanced Concepts Liquid Droplet Radiator

An exploratory point design study was carried out on a shuttle-launchable megawatt nuclear orbit transfer vehicle (OTV) with a 5000 kg payload capacity. The system, which consists of a fixed bed reactor, a Brayton cycle power conversion system, and a liquid droplet radiator (LDR) to reject heat, is deployable from a small package. The methods and technologies of this design are discussed, as well as critical design problems. While this is a preliminary study, it indicates that a space-nuclear reactor, combined with the LDR, make possible a continuous 10 MW(e) power station on orbit with a single shuttle launch.

Hertzberg, A.↗

Development and Implementation of Real-Time Information Delivery Systems for Emergency Management

The disaster management community has an on-going need for real-time data and information, especially during catastrophic events. Currently, twin engine or jet aircraft with limited altitude and duration capabilities collect much of the data. Flight safety is also an issue. Clearly, much of the needed data could be delivered via over-the-horizon transfer through a uninhabited aerial vehicles (UAV) platform to mission managers at various locations on the ground. In fact, because of the ability to stay aloft for long periods of time, and to fly above dangerous situations, UAV's are ideally suited for disaster missions. There are numerous situations that can be considered disastrous for the human population. Some, such as fire or flood, can continue over a period of days. Disaster management officials rely on data from the site to respond in an optimum way with warnings, evacuations, rescue, relief, and to the extent possible, damage control. Although different types of disasters call for different types of response, most situations can be improved by having visual images and other remotely sensed data available. "Disaster Management" is actually made up of a number of activities, including: - Disaster Prevention and Mitigation - Emergency Response Planning - Disaster Management (real-time deployment of resources, during an event) - Disaster / Risk Modeling All of these activities could benefit from real-time information, but a major focus for UAV-based technology is in real-time deployment of resources (i.e., emergency response teams), based on changing conditions at the location of the event. With all these potential benefits, it is desirable to demonstrate to user agencies the ability to perform disaster management missions as described. The following demonstration project is the first in a program designed to prove the feasibility of supporting disaster missions with UAV technology and suitable communications packages on-board. A several-year program is envisioned, in which a broad range of disaster-related activities are demonstrated to the appropriate user communities.

Wegener, Steve↗

Commercial Sensory Survey Radiation Testing Progress Report

The NASA Electronic Parts and Packaging (NEPP) Program Sensor Technology Commercial Sensor Survey task is geared toward benefiting future NASA space missions with low-cost, short-duty-cycle, visible imaging needs. Such applications could include imaging for educational outreach purposes or short surveys of spacecraft, planetary, or lunar surfaces. Under the task, inexpensive commercial grade CMOS sensors were surveyed in fiscal year 2007 (FY07) and three sensors were selected for total ionizing dose (TID) and displacement damage dose (DDD) tolerance testing. The selected sensors had to meet selection criteria chosen to support small, low-mass cameras that produce good resolution color images. These criteria are discussed in detail in [1]. This document discusses the progress of radiation testing on the Micron and OmniVision sensors selected in FY07 for radiation tolerance testing.

Micron↗

An Overview of Wide Bandgap Silicon Carbide Sensors and Electronics Development at NASA Glenn Research Center

A brief overview is presented of the sensors and electronics development work ongoing at NASA Glenn Research Center which is intended to meet the needs of future aerospace applications. Three major technology areas are discussed: 1) high temperature SiC electronics, 2) SiC gas sensor technology development, and 3) packaging of harsh environment devices. Highlights of this work include world-record operation of SiC electronic devices including 500?C JFET transistor operation with excellent properties, atomically flat SiC gas sensors integrated with an on-chip temperature detector/heater, and operation of a packaged AC amplifier. A description of the state-of-the-art is given for each topic. It is concluded that significant progress has been made and that given recent advancements the development of high temperature smart sensors is envisioned.

Hunter, Gary W.↗

Advanced CMOS Radiation Effects Testing and Analysis

Presentation at the annual NASA Electronic Parts and Packaging (NEPP) Program Electronic Technology Workshop (ETW). The material includes an update of progress in this NEPP task area over the past year, which includes testing, evaluation, and analysis of radiation effects data on the IBM 32 nm silicon-on-insulator (SOI) complementary metal oxide semiconductor (CMOS) process. The testing was conducted using test vehicles supplied by directly by IBM.

cmos↗