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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 235 records · Page 13
All sourcesNASA NTRSDOE OSTI
NASA NTRS1994

The MAMMOTH project

On the surface MAMMOTH is a high performance 5.25-inch half-high 8mm helical scan tape drive that records a native 20 Gigabytes of data on Advanced Metal Evaporated media at a sustained throughput of 3 Megabyte per second over a high speed SCSI interface, that is scheduled for production in the second half of 1995. But it's much more than that. Inside its custom designed sheet metal enclosure lies one of the greatest technical achievements of its kind. Exabyte's strategic direction is to increase throughput and capacity while continuing to improve drive, data and media reliability to its products. MAMMOTH adheres to that direction and the description of its technical advances is described in this paper. MAMMOTH can be broken down into four main functional assemblies: high-performance integrated digital electronics, high-reliability tape transport mechanism, high-performance scanner, and advanced metal evaporated media. All this technology is packaged into a standard 5.25-inch half-high form factor that dissipates only 15 watts.

Gerchar, Tim↗
DOE OSTI2022

Functional fiber-optic sensors embedded in stainless steel components using ultrasonic additive manufacturing for distributed temperature and strain measurements

The nuclear industry is progressing toward microreactors that can be factory assembled and deployed to remote regions for reliable, scalable power generation. However, the reduced power output requires enhanced monitoring capabilities to reduce staffing and eventually move toward autonomous control to improve the economics of microreactors. The ability to embed sensors such as fiber-optics, which can provide spatially distributed temperature and strain measurements, within microreactor components for real-time health monitoring would be particularly advantageous. Recent advances in ultrasonic additive manufacturing (UAM) have demonstrated the successful embedding of fiber-optics in soft materials such as Al and Cu by placing the sensors in machined cavities and ultrasonically welding over the top with thin foils. This article reports the first successful embedment of fiber-optic sensors and thermocouples within a common nuclear reactor material, SS304, via UAM. UAM parameters were first explored with simple plate geometries before moving to more complex geometries, such as pipes and other test articles for heat pipe–based microreactors. Select samples were sectioned for microscopy to evaluate the sensor/foil and foil/foil interfaces from samples fabricated by using 100% SS304 foils vs. foils plated with a Ni coating to improve UAM bonding. Furthermore, embedding metal-coated, low-bend loss fibers resulted in greatly reduced signal attenuation and adequate compressive residual strain in the embedded region to ensure successful strain coupling. Pipe specimen functional testing was performed by monitoring temperature and strain during transient and steady-state thermal testing.

36 MATERIALS SCIENCE↗
DOE OSTI2026

Charge Transport in Solvated Donor–Acceptor Functionalized Peptoids: Molecular Dynamics and Rate Theory

Scalable solar-energy conversion requires photoactive materials that combine the efficiency of natural photosynthetic systems with the stability and processability needed for practical applications. Achieving reliable charge transport in soft, self-assembled organic materials remains challenging, as structural fluctuations and environmental effects strongly influence charge-transfer (CT) rates. Here, we present a broadly applicable computational framework for evaluating CT rates in the condensed phase, combining Fermi’s golden rule rate theory with inputs from all-atom molecular dynamics (MD) simulations and first-principles electronic-structure calculations. The approach does not rely on system-specific parametrization and is applicable to a wide range of soft and disordered materials. We demonstrate the applicability and usefulness of the framework on redox-active peptoids functionalized with iron–porphyrin (Fe–P) complexes, a bioinspired platform with programmable donor–acceptor units and tunable three-dimensional organization. The calculated CT rates exhibit strong sensitivity to molecular conformation, with variations spanning several orders of magnitude. This dependence is shown to arise from the pronounced variation in diabatic electronic coupling with the relative orientations and separations of the Fe–P complexes across the conformational ensemble. The framework provides a consistent route for connecting atomistic structure to CT kinetics in the condensed phase and enables analysis of structure–rate relations in organic semiconducting systems.

Charge transfer↗
DOE OSTI2018

DNA Strand Buffers

A buffer reaction actively resists changes to the concentration of a chemical species. Typically, buffering reactions have only been able to regulate the concentration of hydronium (i.e., pH) and other ions. In this work, we develop a new class of buffers that regulate the concentrations of short sequences of DNA (i.e., oligonucleotides). A buffer’s behavior is determined by its set point concentration, capacity to resist disturbances, and response time after a disturbance. We provide simple mathematical formulas for selecting rate constants to tune each of these properties and show how to design DNA sequences and concentrations to implement the desired rate constants. We demonstrate several oligonucleotide buffers that maintain oligonucleotide set point concentrations between 10 and 80 nM in the presence of disturbances of 50 to 500 nM, with response times of less than 10 min to 1.5 h. Multiple buffers can regulate different sequences of DNA in parallel without crosstalk. Oligonucleotide buffers could stabilize and restore reactant concentrations in DNA circuits or in self-assembly processes, allowing such systems to operate reliably for extended durations. These buffers might also be coupled to other reactions to buffer molecules other than DNA. In general, an oligonucleotide buffer can be viewed as a chemical “battery” that maintains the total chemical potential of a buffered species in a closed system.

Biopolymers↗
DOE OSTI2020

A robust benchmark for detection of germline large deletions and insertions

New technologies and analysis methods are enabling genomic structural variants (SVs) to be detected with ever-increasing accuracy, resolution and comprehensiveness. To help translate these methods to routine research and clinical practice, we developed a sequence-resolved benchmark set for identification of both false-negative and false-positive germline large insertions and deletions. To create this benchmark for a broadly consented son in a Personal Genome Project trio with broadly available cells and DNA, the Genome in a Bottle Consortium integrated 19 sequence-resolved variant calling methods from diverse technologies. The final benchmark set contains 12,745 isolated, sequence-resolved insertion (7,281) and deletion (5,464) calls ≥50 base pairs (bp). The Tier 1 benchmark regions, for which any extra calls are putative false positives, cover 2.51 Gbp and 5,262 insertions and 4,095 deletions supported by ≥1 diploid assembly. We demonstrate that the benchmark set reliably identifies false negatives and false positives in high-quality SV callsets from short-, linked- and long-read sequencing and optical mapping.

59 BASIC BIOLOGICAL SCIENCES↗
DOE OSTI2013

Measurement and modeling of intrinsic transcription terminators

The reliable forward engineering of genetic systems remains limited by the ad hoc reuse of many types of basic genetic elements. Although a few intrinsic prokaryotic transcription terminators are used routinely, termination efficiencies have not been studied systematically. Here, we developed and validated a genetic architecture that enables reliable measurement of termination efficiencies. We then assembled a collection of 61 natural and synthetic terminators that collectively encode termination efficiencies across an 800-fold dynamic range within Escherichia coli. We simulated co-transcriptional RNA folding dynamics to identify competing secondary structures that might interfere with terminator folding kinetics or impact termination activity. We found that structures extending beyond the core terminator stem are likely to increase terminator activity. By excluding terminators encoding such context-confounding elements, we were able to develop a linear sequence-function model that can be used to estimate termination efficiencies (r = 0.9, n = 31) better than models trained on all terminators (r = 0.67, n = 54). The resulting systematically measured collection of terminators should improve the engineering of synthetic genetic systems and also advance quantitative modeling of transcription termination.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
DOE OSTI2021

Characterization of Embedded Sensors in Stainless Steel Test Articles and Design/Planning for MAGNET Testing

The nuclear industry is pursuing microreactors that can be factory assembled and deployed to remote regions for reliable power generation. One class of microreactors uses a monolithic metal core block coupled to heat pipes for heat rejection, which results in significant thermal stresses in the monolithic structures. This work describes the initial characterization and test plan for evaluating stainless steel test articles fabricated with embedded sensors for measuring heat pipe performance limits, as well as spatially distributed temperatures and strains during electrically heated thermal testing. The electrically heated testing will be performed in the non-nuclear Microreactor Agile Non-Nuclear Testbed and Single Primary Heat Extraction and Removal Emulator facilities located at Idaho National Laboratory. The goals of these tests are to (1) accurately monitor temperature and strain distributions that result from differential thermal expansion in the test articles and (2) quantify heat rejection limits of heat pipes as a function of operating temperature and working fluid during steady-state and transient operations. More generally, the ability to monitor component and system health during microreactor operation is attractive for providing a high sensor density to inform a limited number of microreactor operators to ultimately reduce operation and maintenance costs and move toward semi-autonomous operation. This report discusses the characterization of embedded thermocouples and fiber optic sensors in relevant test articles, including cylindrical pipes and hexagonal monolithic test articles for heat pipe-based reactors. The sensors were embedded by placing them in machined channels and then building up additional material by using ultrasonic additive manufacturing (UAM). UAM is a solid-state welding process that uses downward pressure and a lateral scrubbing motion to bond thin metal foils to a base material layer by layer. The ultrasonic welding process relies on the plastic deformation of the metal—as opposed to typical melting and solidification—to break oxide scales and bond the metal layers. The characterization of these embedded sensors included evaluating fiber optic signal attenuation, observing residual strain in the fibers, investigating microstructural and mechanical aspects, and demonstrating the sensors under various thermal loads and acoustic vibrations. Post-embedding characterization showed a fine grain structure (<1 μm) near the interfaces of the bonded foils as a result of severe deformation from the welding process. A large increase in hardness was observed at the foil interfaces and the fiber/matrix interface compared with the bulk matrix. Even when compared with the SS304 interfaces, the higher hardness observed around the embedded fiber suggests a higher degree of deformation due to the soft metal coating around the silica fiber core. The distributed fiber-optic temperature sensors and embedded thermocouples reliably measured temperature distributions during steady-state and transient thermal testing. The embedded fiber-optic sensors reliably measured strain during both transient and steady-state testing and properly identified resonant frequencies during acoustic testing.

21 SPECIFIC NUCLEAR REACTORS AND ASSOCIATED PLANTS↗
DOE OSTI2022

Performance of Microreactor Test Article with Embedded Sensors During Testing in The Single Primary Heat Extraction and Removal Emulator

The nuclear industry is pursuing microreactors that can be factory assembled and deployed to remote regions for reliable power generation. One class of microreactors uses a monolithic metal core block coupled to heat pipes that use passive heat flow, increasing the surface area for heat transfer without requiring active coolant flow through the reactor core. Additional experimental testing is required to understand the heat rejection limitations of heat pipes and thermal stresses in the monolithic core block due to significant temperature gradients. This report describes the initial characterization and testing of a stainless-steel test article that was fabricated with embedded sensors to measure heat pipe performance limits, as well as spatially distributed temperatures and strains during electrically heated thermal testing to simulate nuclear heating. The electrically heated testing was performed in the Single Primary Heat Extraction and Removal Emulator facility located at Idaho National Laboratory. The ultimate goals of this work are to (1) accurately monitor temperature and strain distributions that result from differential thermal expansion in the test articles and (2) quantify the heat rejection limits of heat pipes as a function of operating temperature and working fluid during steady-state and transient operations. Initial tests focused on the feasibility of using advanced fiber-optic sensors and other sensor technologies to improve the understanding of temperature and strain distributions within the electrically heated experiments. However, these sensing capabilities could benefit the broader microreactor community if the sensors could be used to monitor component and system health during nuclear operations to inform a limited number of microreactor operators, ultimately reducing operation and maintenance costs and moving toward semiautonomous operation.

22 GENERAL STUDIES OF NUCLEAR REACTORS↗
DOE OSTI2017

Implications of Galaxy Buildup for Putative IMF Variations in Massive Galaxies

Recent observational evidence for initial mass function (IMF) variations in massive quiescent galaxies at z = 0 challenges the long-established paradigm of a universal IMF. While a few theoretical models relate the IMF to birth cloud conditions, the physical driver underlying these putative IMF variations is still largely unclear. Here we use post-processing analysis of the Illustris cosmological hydrodynamical simulation to investigate possible physical origins of IMF variability with galactic properties. We do so by tagging stellar particles in the simulation (each representing a stellar population of ≈10{sup 6} M{sub ⊙}) with individual IMFs that depend on various physical conditions, such as velocity dispersion, metallicity, or star formation rate, at the time and place in which the stars are formed. We then follow the assembly of these populations throughout cosmic time and reconstruct the overall IMF of each z = 0 galaxy from the many distinct IMFs it is composed of. Our main result is that applying the observed relations between IMF and galactic properties to the conditions at the star formation sites does not result in strong enough IMF variations between z = 0 galaxies. Steeper physical IMF relations are required for reproducing the observed IMF trends, and some stellar populations must form with more extreme IMFs than those observed. The origin of this result is the hierarchical nature of massive galaxy assembly, and it has implications for the reliability of the strong observed trends, for the ability of cosmological simulations to capture certain physical conditions in galaxies, and for theories of star formation aiming to explain the physical origin of a variable IMF.

79 ASTRONOMY AND ASTROPHYSICS↗
NASA NTRS1974

Design guidelines for advanced LSI microcircuit packaging using thick film multilayer technology

Ceramic multilayer circuitry results from the sequential build-up of two or more layers of pre-determined conductive interconnections separated by dielectric layers and fired at an elevated temperature to form a solidly fused structure. The resultant ceramic interconnect matrix is used as a base to mount active and passive devices and provide the necessary electrical interconnection to accomplish the desired electrical circuit. Many methods are known for developing multilevel conductor mechanisms such as multilayer printed circuits, welded wire matrices, flexible copper tape conductors, and thin and thick-film ceramic multilayers. Each method can be considered as a specialized field with each possessing its own particular set of benefits and problems. This design guide restricts itself to the art of design, fabrication and assembly of ceramic multilayer circuitry and the reliability of the end product.

Peckinpaugh, C. J.↗
NASA NTRS1985

Manufacturing and producibility technology

Activities of the manufacturing/producibility working group within the Advanced High-Pressure O2/H2 Technology Program are summarized. The objectives of the M/P working group are: to develop and evaluate process and manufacturing techniques for advanced propulsion hardware design and selected materials; and to optimize the producibility of (SSME) components and assemblies by improved performance, increased life, greater reliability, and/or reduced cost. The technologies being developed include: plasma arc, laser, and inertia welding; combustion chamber and turbine blade coatings; coating processes; high performance alloy electroforming; and process control technology.

Hankins, J. D.↗
NASA NTRS2000

A Boundary Scan Test Vehicle for Direct Chip Attach Testing

To facilitate the new faster, better and cheaper spacecraft designs, smaller more mass efficient avionics and instruments are using higher density electronic packaging technologies such as direct chip attach (DCA). For space flight applications, these technologies need to have demonstrated reliability and reasonably well defined fabrication and assembly processes before they will be accepted as baseline designs in new missions. As electronics shrink in size, not only can repair be more difficult, but 49 probing" circuitry can be very risky and it becomes increasingly more difficult to identify the specific source of a problem. To test and monitor these new technologies, the Direct Chip Attach Task, under NASA's Electronic Parts and Packaging Program (NEPP), chose the test methodology of boundary scan testing. The boundary scan methodology was developed for interconnect integrity and functional testing at hard to access electrical nodes. With boundary scan testing, active devices are used and failures can be identified to the specific device and lead. This technology permits the incorporation of "built in test" into almost any circuit and thus gives detailed test access to the highly integrated electronic assemblies. This presentation will describe boundary scan, discuss the development of the boundary scan test vehicle for DCA and current plans for testing of direct chip attach configurations.

Parsons, Heather A.↗
NASA NTRS2012

Quantum-Well Infrared Photodetector (QWIP) Focal Plane Assembly

A paper describes the Thermal Infrared Sensor (TIRS), a QWIP-based instrument intended to supplement the Operational Land Imager (OLI) for the Landsat Data Continuity Mission (LDCM). The TIRS instrument is a far-infrared imager operating in the pushbroom mode with two IR channels: 10.8 and 12 microns. The focal plane will contain three 640x512 QWIP arrays mounted on a silicon substrate. The silicon substrate is a custom-fabricated carrier board with a single layer of aluminum interconnects. The general fabrication process starts with a 4-in. (approx.10-cm) diameter silicon wafer. The wafer is oxidized, a single substrate contact is etched, and aluminum is deposited, patterned, and alloyed. This technology development is aimed at incorporating three large-format infrared detecting arrays based on GaAs QWIP technology onto a common focal plane with precision alignment of all three arrays. This focal plane must survive the rigors of flight qualification and operate at a temperature of 43 K (-230 C) for five years while orbiting the Earth. The challenges presented include ensuring thermal compatibility among all the components, designing and building a compact, somewhat modular system and ensuring alignment to very tight levels. The multi-array focal plane integrated onto a single silicon substrate is a new application of both QWIP array development and silicon wafer scale integration. The Invar-based assembly has been tested to ensure thermal reliability.

Jhabvala, Murzy↗
NASA NTRS2007

NASA-DoD Lead-Free Electronics Project

The primary technical objective of the project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with lead-free alloys Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with mixed (lead/lead-free) alloys.

Kessel, Kurt↗
NASA NTRS2009

NASA-DoD Lead-Free Electronics Project

In response to concerns about risks from lead-free induced faults to high reliability products, NASA has initiated a multi-year project to provide manufacturers and users with data to clarify the risks of lead-free materials in their products. The project will also be of interest to component manufacturers supplying to high reliability markets. The project was launched in November 2006. The primary technical objective of the project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: - Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with solder interconnects consisting of lead-free alloys - Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with solder interconnects consisting of mixed alloys, lead component finish/lead-free solder and lead-free component finish/SnPb solder.

Kessel, Kurt R.↗
NASA NTRS2009

NASA-DoD Lead-Free Electronics Project

In response to concerns about risks from lead-free induced faults to high reliability products, NASA has initiated a multi-year project to provide manufacturers and users with data to clarify the risks of lead-free materials in their products. The project will also be of interest to component manufacturers supplying to high reliability markets. The project was launched in November 2006. The primary technical objective of the project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: - Packages (e.g., TSOP, BOA, PDIP) assembled and reworked with solder interconnects consisting of lead-free alloys - Packages (e.g., TSOP, BOA, PDIP) assembled and reworked with solder interconnects consisting of mixed alloys, lead component finish/lead-free solder and lead-free component finish/SnPb solder.

Kessel, Kurt R.↗
NASA NTRS2016

Upgrades to the ISS Water Recovery System

The International Space Station Water Recovery System (WRS) is comprised of the Water Processor Assembly (WPA) and the Urine Processor Assembly (UPA). The WRS produces potable water from a combination of crew urine (first processed through the UPA), crew latent, and Sabatier product water. Though the WRS has performed well since operations began in November 2008, several modifications have been identified to improve the overall system performance. These modifications can reduce resupply and improve overall system reliability, which is beneficial for the ongoing ISS mission as well as for future NASA manned missions. The following paper details efforts to reduce the resupply mass of the WPA Multifiltration Bed, develop improved catalyst for the WPA Catalytic Reactor, evaluate optimum operation of UPA through parametric testing, and improve reliability of the UPA fluids pump and Distillation Assembly.

Kayatin, Matthew J.↗
DOE OSTI2025

Lithium–Sulfur Batteries: 3D Printed Tools and Assembly Techniques for Repeatable Lab-Scale Coin Cell Manufacturing

The coin cell form factor has become a standard in energy storage research owing to its relatively low cost, low quantity of requisite electroactive material, fast experimental turnover, and capability to generate publishable quality data. Coin cell assembly at the lab-scale requires precise manual alignment of the many internal components of a cell to yield a properly functioning device. Truly repeatable device assembly presents a significant challenge to the acquisition of reliable data. In this report, we present a three-dimensional (3D) printable design for a coin cell alignment device and describe techniques for a generalized workflow to achieve reproducible coin cell assembly of lithium-based batteries. Standardized assembly techniques using readily accessible, purpose-built tools were demonstrated for labscale production of lithium−sulfur (Li−S) coin cells. Li−S batteries fabricated using the alignment device as well as conductive adhesive incorporated workflows afforded coin cells with up to 35% reduction of assembly times, comparable or better functional cell yields, and improved electrochemical device performance with more consistent and up to 150 mAh/g higher average discharge capacities coupled with Coulombic efficiency increases of up to 2.0% over manually aligned cell assembly techniques.

Batteries↗