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At least 235 records · Page 13
All sourcesNASA NTRSDOE OSTI
NASA NTRS2013

Advanced Signal Processing for High Temperatures Health Monitoring of Condensed Water Height in Steam Pipes

An advanced signal processing methodology is being developed to monitor the height of condensed water thru the wall of a steel pipe while operating at temperatures as high as 250deg. Using existing techniques, previous study indicated that, when the water height is low or there is disturbance in the environment, the predicted water height may not be accurate. In recent years, the use of the autocorrelation and envelope techniques in the signal processing has been demonstrated to be a very useful tool for practical applications. In this paper, various signal processing techniques including the auto correlation, Hilbert transform, and the Shannon Energy Envelope methods were studied and implemented to determine the water height in the steam pipe. The results have shown that the developed method provides a good capability for monitoring the height in the regular conditions. An alternative solution for shallow water or no water conditions based on a developed hybrid method based on Hilbert transform (HT) with a high pass filter and using the optimized windowing technique is suggested. Further development of the reported methods would provide a powerful tool for the identification of the disturbances of water height inside the pipe.

health monitoring↗
NASA NTRS2017

Fiber Optic Temperature Sensor Insert for High Temperature Environments

A thermal protection system (TPS) test plug has optical fibers with FBGs embedded in the optical fiber arranged in a helix, an axial fiber, and a combination of the two. Optionally, one of the optical fibers is a sapphire FBG for measurement of the highest temperatures in the TPS plug. The test plug may include an ablating surface and a non-ablating surface, with an engagement surface with threads formed, the threads having a groove for placement of the optical fiber. The test plug may also include an optical connector positioned at the non-ablating surface for protection of the optical fiber during insertion and removal.

Black, Richard James↗
NASA NTRSDate not supplied

Understanding thermal stability in doped zirconia aerogels for high temperature applications

The high porosities and low densities of ceramic aerogels offer outstanding insulative performance in applications where weight is a critical factor. The high surface-to-volume ratios and specific surface areas provide extremely low thermal conductivity, but also contribute to rapid densification of the pore structure at elevated temperatures. This densification diminishes their favorable properties and inhibits use of aerogels in high temperature applications. The purpose of this work is the establishment of a design framework for thermally stable, highly porous materials. Here we will review our recent studies on the effects of synthetic parameters and dopant chemistry on the evolution of zirconia-based aerogels. The structural evolution was studied to 1200 °C using nitrogen physisorption, scanning and transmission electron microscopy, and x-ray diffraction. The role of dopant identity and concentration in thermal stability was elucidated. In context of the design framework, dopant chemistry is an aggregate for many closely related material properties, each of which may contribute to aerogel structural evolution. To develop a truly predictive design framework for ceramic-based aerogels, systematic and comprehensive evaluation of thermodynamic and kinetic properties must be performed in conjunction with studies on structural evolution.

aerogel↗
NASA NTRS1994

A high temperature testing system for ceramic composites

Ceramic composites are presently being developed for high temperature use in heat engine and space power system applications. The operating temperature range is expected to be 1090 to 1650 C (2000 F to 3000 F). Very little material data is available at these temperatures and, therefore, it is desirable to thoroughly characterize the basic unidirectional fiber reinforced ceramic composite. This includes testing mainly for mechanical material properties at high temperatures. The proper conduct of such characterization tests requires the development of a tensile testing system includes unique gripping, heating, and strain measuring devices which require special considerations. The system also requires an optimized specimen shape. The purpose of this paper is to review various techniques for measuring displacements or strains, preferably at elevated temperatures. Due to current equipment limitations it is assumed that the specimen is to be tested at a temperature of 1430 C (2600F) in an oxidizing atmosphere. For the most part, previous high temperature material characterization tests, such as flexure and tensile tests, have been performed in inert atmospheres. Due to the harsh environment in which the ceramic specimen is to be tested, many conventional strain measuring techniques can not be applied. Initially a brief description of the more commonly used mechanical strain measuring techniques is given. Major advantages and disadvantages with their application to high temperature tensile testing of ceramic composites are discussed. Next, a general overview is given for various optical techniques. Advantages and disadvantages which are common to these techniques are noted. The optical methods for measuring strain or displacement are categorized into two sections. These include real-time techniques. Finally, an optical technique which offers optimum performance with the high temperature tensile testing of ceramic composites is recommended.

Hemann, John↗
NASA NTRS2003

Packaging Technology Designed, Fabricated, and Assembled for High-Temperature SiC Microsystems

A series of ceramic substrates and thick-film metalization-based prototype microsystem packages designed for silicon carbide (SiC) high-temperature microsystems have been developed for operation in 500 C harsh environments. These prototype packages were designed, fabricated, and assembled at the NASA Glenn Research Center. Both the electrical interconnection system and the die-attach scheme for this packaging system have been tested extensively at high temperatures. Printed circuit boards used to interconnect these chip-level packages and passive components also are being fabricated and tested. NASA space and aeronautical missions need harsh-environment, especially high-temperature, operable microsystems for probing the inner solar planets and for in situ monitoring and control of next-generation aeronautical engines. Various SiC high-temperature-operable microelectromechanical system (MEMS) sensors, actuators, and electronics have been demonstrated at temperatures as high as 600 C, but most of these devices were demonstrated only in the laboratory environment partially because systematic packaging technology for supporting these devices at temperatures of 500 C and beyond was not available. Thus, the development of a systematic high-temperature packaging technology is essential for both in situ testing and the commercialization of high-temperature SiC MEMS. Researchers at Glenn developed new prototype packages for high-temperature microsystems using ceramic substrates (aluminum nitride and 96- and 90-wt% aluminum oxides) and gold (Au) thick-film metalization. Packaging components, which include a thick-film metalization-based wirebond interconnection system and a low-electrical-resistance SiC die-attachment scheme, have been tested at temperatures up to 500 C. The interconnection system composed of Au thick-film printed wire and 1-mil Au wire bond was tested in 500 C oxidizing air with and without 50-mA direct current for over 5000 hr. The Au thick-film metalization-based wirebond electrical interconnection system was also tested in an extremely dynamic thermal environment to assess thermal reliability. The I-V curve1 of a SiC high-temperature diode was measured in oxidizing air at 500 C for 1000 hr to electrically test the Au thick-film material-based die-attach assembly.

Chen, Liang-Yu↗
NASA NTRS2008

High-precision Non-Contact Measurement of Creep of Ultra-High Temperature Materials for Aerospace

For high-temperature applications (greater than 2,000 C) such as solid rocket motors, hypersonic aircraft, nuclear electric/thermal propulsion for spacecraft, and more efficient jet engines, creep becomes one of the most important design factors to be considered. Conventional creep-testing methods, where the specimen and test apparatus are in contact with each other, are limited to temperatures approximately 1,700 C. Development of alloys for higher-temperature applications is limited by the availability of testing methods at temperatures above 2000 C. Development of alloys for applications requiring a long service life at temperatures as low as 1500 C, such as the next generation of jet turbine superalloys, is limited by the difficulty of accelerated testing at temperatures above 1700 C. For these reasons, a new, non-contact creep-measurement technique is needed for higher temperature applications. A new non-contact method for creep measurements of ultra-high-temperature metals and ceramics has been developed and validated. Using the electrostatic levitation (ESL) facility at NASA Marshall Space Flight Center, a spherical sample is rotated quickly enough to cause creep deformation due to centrifugal acceleration. Very accurate measurement of the deformed shape through digital image analysis allows the stress exponent n to be determined very precisely from a single test, rather than from numerous conventional tests. Validation tests on single-crystal niobium spheres showed excellent agreement with conventional tests at 1985 C; however the non-contact method provides much greater precision while using only about 40 milligrams of material. This method is being applied to materials including metals and ceramics for non-eroding throats in solid rockets and next-generation superalloys for turbine engines. Recent advances in the method and the current state of these new measurements will be presented.

Rogers, Jan R.↗
NASA NTRS1993

An extended laser flash technique for thermal diffusivity measurement of high-temperature materials

Knowledge of thermal diffusivity data for high-temperature materials (solids and liquids) is very important in analyzing a number of processes, among them solidification, crystal growth, and welding. However, reliable thermal diffusivity versus temperature data, particularly those for high-temperature liquids, are still far from complete. The main measurement difficulties are due to the presence of convection and the requirement for a container. Fortunately, the availability of levitation techniques has made it possible to solve the containment problem. Based on the feasibility of the levitation technology, a new laser flash technique which is applicable to both levitated liquid and solid samples is being developed. At this point, the analysis for solid samples is near completion and highlights of the technique are presented here. The levitated solid sample which is assumed to be a sphere is subjected to a very short burst of high power radiant energy. The temperature of the irradiated surface area is elevated and a transient heat transfer process takes place within the sample. This containerless process is a two-dimensional unsteady heat conduction problem. Due to the nonlinearity of the radiative plus convective boundary condition, an analytic solution cannot be obtained. Two options are available at this point. Firstly, the radiation boundary condition can be linearized, which then accommodates a closed-form analytic solution. Comparison of the analytic curves for the temperature rise at different points to the experimentally-measured values will then provide the thermal diffusivity values. Secondly, one may set up an inverse conduction problem whereby experimentally obtained surface temperature history is used as the boundary conditions. The thermal diffusivity can then be elevated by minimizing the difference between the real heat flux boundary condition (radiation plus convection) and the measurements. Status of an experimental study directed at measuring the thermal diffusivity of high-temperature solid samples of pure Nickel and Inconel 718 superalloys are presented. Preliminary measurements showing surface temperature histories are discussed.

Shen, F.↗
NASA NTRS1986

A high-temperature heat sensitive element

This invention concerns the high-temperature heat sensitive element which is stable at high temperatures. A solid solution of the main component MgO-Al2O3-Cr2O3-Fe2O3 which contains spinel crystal structure is mixed with the secondary component ZrO2 at the mol ratio of 100 : 0.1 to 5.0 and sintered to prepare a high-temperature heat sensitive element.

Oguro, M.↗
NASA NTRS1980

Low-pressure performance of annular, high-pressure (40 atm) high-temperature (2480 K) combustion system

Experimental tests were conducted to develop a combustion system for a 40 atmosphere pressure, 2480 K exhaust gas temperature, turbine cooling facility. The tests were conducted in an existing facility with a maximum pressure capability of 10 atmospheres and where inlet air temperatures as high as 894 K could be attained. Exhaust gas temperatures were as high as 2365 K. Combustion efficiences were about 100 percent over a fuel air ratio range of 0.016 to 0.056. Combustion efficiency decreased at leaner and richer ratios when the inlet air temperature was 589 K. Data are presented that show the effect of fuel air ratio and inlet air temperature on liner metal temperature. Isothermal system pressure loss as a function of diffuser inlet Mach number is also presented. Data included exhaust gas pattern factors; unburned hydrocarbon, carbon monoxide, and oxides of nitrogen emission index values; and smoke numbers.

Wear, J. D.↗
NASA NTRSDate not supplied

Selected Studies in High Temperature Chemistry at the NASA Glenn Research Center

Several high temperature chemistry studies, which support NASA missions in both Aeronautics and Space, will be discussed. As will be discussed, collaboration with partners both within NASA and outside of NASA was essential to attaining the goals of each study. The following studies will be presented: 1. Oxidation of the reinforced carbon/carbon on the wing leading edge of the Space Shuttle Orbiter. This was conducted for the Leading Edge Subsystem Problem Resolution Team and involved experts in mass transport, non-destructive evaluation, and mechanical properties. 2. Thermodynamic activity measurement in rare earth silicates for coatings of ceramic hot stage parts in aircraft combustors. This was conducted with colleagues at NASA in support of a larger project involving NASA and the major engine companies. 3. Planetary Science in conjunction with universities a. Thermochemical modeling to describe parts of the Venus atmosphere. b. High temperature vapor studies to describe the possible atmospheres of hot, rocky exoplanets. c. High temperature mass spectrometry for K/Ar dating of minerals. These problems are all addressed with basic laboratory studies and collaboration across multiple disciplines is necessary.

Mass spectrometry, thermodynamics, high temperatur↗
NASA NTRS2005

DMBZ Polyimides Provide an Alternative to PMR-15 for High-Temperature Applications

PMR-15, a high-temperature polyimide developed in the mid-1970's at the NASA Lewis Research Center, offers the combination of ease of processing, low cost, and good stability and performance at temperatures up to 288 C (500 F). This material is widely regarded as one of the leading high-temperature matrix resins for polymer-matrix-composite aircraft engine components. PMR-15 is widely used in both military and civilian aircraft engines. The current worldwide market for PMR-15 is on the order of 50,000 lb, with a total sales of around $5 to $10 million. However, PMR-15 is made from methylene dianiline (MDA), a known animal mutagen and a suspected human mutagen. Recent concerns about the safety of workers involved in the manufacture and repair of PMR-15 components have led to the implementation of costly protective measures to limit worker exposure and ensure workplace safety. In some cases, because of safety and economic concerns, airlines have eliminated PMR-15 components from engines in their fleets. Current efforts at Lewis are focused on developing suitable replacements for PMR-15 that do not contain mutagenic constituents and have processability, stability, and mechanical properties comparable to that of PMR-15. A recent development from these efforts is a new class of thermosetting polyimides based on 2,2'-dimethylbenzidine (DMBZ). Autoclave processing developed for PMR-15 composites was used to prepare low-void-content T650-35 carbon-fiber-reinforced laminates from DMBZ-15 polyimides. The glass transition temperatures of these laminates were about 50 C higher than those of the T650- 35/PMR-15 composites (400 versus 348 C). In addition, DMBZ-15 polyimide composites aged for 1000 hr in air at 288 C (500 F) had weight losses close to those of comparable PMR-15 laminates (0.9 versus 0.7 percent). The elevated (288 C) and room temperature mechanical properties of T650-35-reinforced DMBZ-15 polyimide and PMR-15 laminates were comparable. Standard Ames tests are being conducted on this diamine to assess its mutagenicity.

Source record↗
NASA NTRS1995

Thermomagnetic phenomena in the mixed state of high temperature superconductors

Galvano- and thermomagnetic-phenomena in high temperature superconductors, based on kinetic coefficients, are discussed, along with a connection between the electric field and the heat flow in superconductor mixed state. The relationship that determines the transport coefficients of high temperature superconductors in the mixed state based on Seebeck and Nernst effects is developed. It is shown that this relationship is true for a whole transition region of the resistive mixed state of a superconductor. Peltier, Ettingshausen and Righi-Leduc effects associated with heat conductivity as related to high temperature superconductors are also addressed.

Meilikhov, E. Z.↗
NASA NTRS1997

High-Temperature Passive Power Electronics

In many future NASA missions - such as deep-space exploration, the National AeroSpace Plane, minisatellites, integrated engine electronics, and ion or arcjet thrusters - high-power electrical components and systems must operate reliably and efficiently in high-temperature environments. The high-temperature power electronics program at the NASA Lewis Research Center focuses on dielectric and insulating material research, the development and characterization of high-temperature components, and the integration of the developed components into a demonstrable 200 C power system - such as an inverter. NASA Lewis has developed high-temperature power components through collaborative efforts with the Air Force Wright Laboratory, Northrop Grumman, and the University of Wisconsin. Ceramic and film capacitors, molypermalloy powder inductors, and a coaxially wound transformer were designed, developed, and evaluated for high-temperature operation.

Source record↗
NASA NTRSDate not supplied

Pt/HTCC Alumina based Electronic Packaging System and Integration Processes for High Temperature Harsh Environment Applications

Electronic devices capable of operation at 500°C are required for long term Venus surface missions, as well as for in situ monitoring and control of next generation aeronautical engines. High temperature sensors and electronics can also find many applications in military, and energy and automobile industries. Various silicon carbide (SiC) sensors and electronic devices have been developed for operation at 500 °C, and a compatible packaging system is needed for long term test and deployment of these high temperature devices. High temperature co-fired ceramics (HTCC) alumina with platinum (Pt) conductor was proposed for high temperature electronic packaging. A prototype Pt/HTCC alumina packaging system including chip-level package and circuit board has been briefly reported previously for long-term electrical testing of SiC integrated circuits at 500 °C, and brief testing at much higher temperatures. HTCC alumina is an excellent dielectric material with acceptable dielectric constant and low dielectric loss over wide temperature and frequency ranges. Pt is chemically noble and can be co-fired with HTCC alumina in air ambient producing a viable electronic packaging material system for high temperature applications. This paper presents a more detailed description of this packaging system including prototype low power packages and circuit boards based on HTCC alumina and Pt metallization for 500°C and other harsh environment applications. The key technical considerations for chip-level packaging and circuit board assembly, including materials and processes for 500 °C durable wire-bonding and SiC die attach, and integration of multi-chip circuit boards, are presented. Experimental test results of this packaging approach applied to SiC integrated circuits at 500 °C and 700°C are discussed as well.

High temperature↗
NASA NTRSDate not supplied

Pt/HTCC Alumina based Electronic Packaging System and Integration Processes for High Temperature Harsh Environment Applications

Electronic devices capable of operation at 500°C are required for long term Venus surface missions, as well as for in situ monitoring and control of next generation aeronautical engines. High temperature sensors and electronics can also find many applications in military, and energy and automobile industries. Various silicon carbide (SiC) sensors and electronic devices have been developed for operation at 500 °C, and a compatible packaging system is needed for long term test and deployment of these high temperature devices. High temperature co-fired ceramics (HTCC) alumina with platinum (Pt) conductor was proposed for high temperature electronic packaging. A prototype Pt/HTCC alumina packaging system including chip-level package and circuit board has been briefly reported previously for long-term electrical testing of SiC integrated circuits at 500 °C, and brief testing at much higher temperatures. HTCC alumina is an excellent dielectric material with acceptable dielectric constant and low dielectric loss over wide temperature and frequency ranges. Pt is chemically noble and can be co-fired with HTCC alumina in air ambient producing a viable electronic packaging material system for high temperature applications. This paper presents a more detailed description of this packaging system including prototype low power packages and circuit boards based on HTCC alumina and Pt metallization for 500°C and other harsh environment applications. The key technical considerations for chip-level packaging and circuit board assembly, including materials and processes for 500 °C durable wire-bonding and SiC die attach, and integration of multi-chip circuit boards, are presented. Experimental test results of this packaging approach applied to SiC integrated circuits at 500 °C and 700°C are discussed as well.

electronic packaging↗
NASA NTRS1994

High-Temperature, Bellows Hybrid Seal

A high-temperature hybrid seal is constructed of multiple elements to meet the many demands placed on the seal. The primary elements are: a central high-temperature bellows, a braided ceramic sheath covering the bellows, an outer abrasion resistant sheath covering the ceramic sheath, and a structurally-sound seal-end termination.

Steinetz, Bruce M.↗
NASA NTRS1995

High temperature barrier coatings for refractory metals

Improvements in high temperature oxidation resistant metal coating technology will allow NASA and commercial entities to develop competitive civil space transport and communication systems. The success of investigations completed in this program will have a positive impact on broadening the technology base for high temperature materials. The work reported herein describes processes and procedures for successfully depositing coherent oxidation barrier coatings on refractory metals to prevent degradation under very severe operating environments. Application of the new technology developed is now being utilized in numerous Phase 3 applications through several prominent aerospace firms. Major achievements have included: (1) development of means to deposit thick platinum and rhodium coatings with lower stress and fewer microcracks than could be previously achieved; (2) development of processes to deposit thick adherent coatings of platinum group metals on refractory substrates that remain bonded through high temperature excursions and without need for intermediate coatings (bonding processes unique to specific refractory metals and alloys have been defined; (3) demonstration that useful alloys of refractory and platinum coatings can be made through thermal diffusion means; (4) demonstration that selected barrier coatings on refractory substrates can withstand severe oxidizing environments in the range of 1260 deg and 1760 deg C for long time periods essential to the life requirements of the hardware; and (5) successful application of the processes and procedures to prototype hardware. The results of these studies have been instrumental in improved thermal oxidation barrier coatings for the NASP propulsion system. Other Phase 3 applications currently being exploited include small uncooled thrusters for spacecraft and microsatellite maneuvering systems.

Malone, G. A.↗