Search NASA⌕ Search

SEARCH · Search NASA

Results for “interfacial layer”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

221 records · Page 13

The Influence of Interstitial Ga and Interfacial Au (sub 2)P (sub 3) on the Electrical and Metallurgical Behavior of Au-Contacted III-V Semiconductors

The introduction of a very small amount of Ga into Au contact metallization on InP is shown to have a significant effect on both the metallurgical and electrical behavior of that contact system. Ga atoms in the interstices of the Au lattice are shown to be effective in preventing the solid state reactions that normally take place between Au and InP during contact sintering. In addition to suppressing the metallurgical interaction, the presence of small amounts of Ga is shown to cause an order of magnitude reduction in the specific contact resistivity. Evidence is presented that the reactions of GaP and GaAs with Au contacts are also drastically affected by the presence of Ga. The sintering behavior of the Au-GaP and the Au-GaAs systems (as contrasted with that of the Au-InP system) is explained as due to the presence of interstitial Ga in the contact metallization. Finally the large, two-to-three order of magnitude drop in the contact resistance that occurs in the Au-InP system upon sintering at 400 degrees Centigrade is shown to be a result of the formation of an Au (sub 2) P (sub 3) layer at the metal-semiconductor interface. Contact resistivities in the 10 (sup -6) ohm square centimeter range are obtained for as-deposited Au on InP when a thin (20 Angstrom) layer of Au (sub 2) P (sub 3) is introduced between the InP and the Au contacts.

Weizer, Victor G.↗

Measuring Diffusion of Liquids by Common-Path Interferometry

A method of observing the interdiffusion of a pair of miscible liquids is based on the use of a common-path interferometer (CPI) to measure the spatially varying gradient of the index refraction in the interfacial region in which the interdiffusion takes place. Assuming that the indices of refraction of the two liquids are different and that the gradient of the index of refraction of the liquid is proportional to the gradient in the relative concentrations of either liquid, the diffusivity of the pair of liquids can be calculated from the temporal variation of the spatial variation of the index of refraction. This method yields robust measurements and does not require precise knowledge of the indices of refraction of the pure liquids. Moreover, the CPI instrumentation is compact and is optomechanically robust by virtue of its common- path design. The two liquids are placed in a transparent rectangular parallelepiped test cell. Initially, the interface between the liquids is a horizontal plane, above which lies pure liquid 2 (the less-dense liquid) and below which lies pure liquid 1 (the denser liquid). The subsequent interdiffusion of the liquids gives rise to a gradient of concentration and a corresponding gradient of the index of refraction in a mixing layer. For the purpose of observing the interdiffusion, the test cell is placed in the test section of the CPI, in which a collimated, polarized beam of light from a low-power laser is projected horizontally through a region that contains the mixing layer.

Rashidnia, Nasser↗

Iridium Interfacial Stack - IrIS

Iridium Interfacial Stack (IrIS) is the sputter deposition of high-purity tantalum silicide (TaSi2-400 nm)/platinum (Pt-200 nm)/iridium (Ir-200 nm)/platinum (Pt-200 nm) in an ultra-high vacuum system followed by a 600 C anneal in nitrogen for 30 minutes. IrIS simultaneously acts as both a bond metal and a diffusion barrier. This bondable metallization that also acts as a diffusion barrier can prevent oxygen from air and gold from the wire-bond from infiltrating silicon carbide (SiC) monolithically integrated circuits (ICs) operating above 500 C in air for over 1,000 hours. This TaSi2/Pt/Ir/Pt metallization is easily bonded for electrical connection to off-chip circuitry and does not require extra anneals or masking steps. There are two ways that IrIS can be used in SiC ICs for applications above 500 C: it can be put directly on a SiC ohmic contact metal, such as Ti, or be used as a bond metal residing on top of an interconnect metal. For simplicity, only the use as a bond metal is discussed. The layer thickness ratio of TaSi2 to the first Pt layer deposited thereon should be 2:1. This will allow Si from the TaSi2 to react with the Pt to form Pt2Si during the 600 C anneal carried out after all layers have been deposited. The Ir layer does not readily form a silicide at 600 C, and thereby prevents the Si from migrating into the top-most Pt layer during future anneals and high-temperature IC operation. The second (i.e., top-most) deposited Pt layer needs to be about 200 nm to enable easy wire bonding. The thickness of 200 nm for Ir was chosen for initial experiments; further optimization of the Ir layer thickness may be possible via further experimentation. Ir itself is not easily wire-bonded because of its hardness and much higher melting point than Pt. Below the iridium layer, the TaSi2 and Pt react and form desired Pt2Si during the post-deposition anneal while above the iridium layer remains pure Pt as desired to facilitate easy and strong wire-bonding to the SiC chip circuitry.

Spry, David↗

Boiling Heat Transfer Mechanisms in Earth and Low Gravity: Boundary Condition and Heater Aspect Ratio Effects

Boiling is a complex phenomenon where hydrodynamics, heat transfer, mass transfer, and interfacial phenomena are tightly interwoven. An understanding of boiling and critical heat flux in microgravity environments is of importance to space based hardware and processes such as heat exchange, cryogenic fuel storage and transportation, electronic cooling, and material processing due to the large amounts of heat that can be removed with relatively little increase in temperature. Although research in this area has been performed in the past four decades, the mechanisms by which heat is removed from surfaces in microgravity are still unclear. Recently, time and space resolved heat transfer data were obtained in both earth and low gravity environments using an array of microheaters varying in size between 100 microns to 700 microns. These heaters were operated in both constant temperature as well as constant heat flux mode. Heat transfer under nucleating bubbles in earth gravity were directly measured using a microheater array with 100 m resolution operated in constant temperature mode with low and high subcooled bulk liquid along with images from below and from the side. The individual bubble departure diameter and energy transfer were larger with low subcooling but the departure frequency increased at high subcooling, resulting in higher overall heat transfer. The bubble growth for both subcoolings was primarily due to energy transfer from the superheated liquid layer relatively little was due to wall heat transfer during the bubble growth process. Oscillating bubbles and sliding bubbles were also observed in highly subcooled boiling. Transient conduction and/or microconvection was the dominant heat transfer mechanism in the above cases. A transient conduction model was developed and compared with the experimental data with good agreement. Data was also obtained with the heater array operated in a constant heat flux mode and measuring the temperature distribution across the array during boiling. The instantaneous heat transfer into the substrate was numerically determined and subtracted from the supplied heat to obtain the wall to liquid heat flux.

Kim, Jungho↗

Length Scale and Gravity Effects on Microgravity Boiling Heat Transfer

Boiling is a complex phenomenon where hydrodynamics, heat transfer, mass transfer, and interfacial phenomena are tightly interwoven. An understanding of boiling and critical heat flux in microgravity environments is of importance to space based hardware and processes such as heat exchange, cryogenic fuel storage and transportation, electronic cooling, and material processing due to the large amounts of heat that can be removed with relatively little increase in temperature. Although research in this area has been performed in the past four decades, the mechanisms by which heat is removed from surfaces in microgravity are still unclear. In earth gravity, buoyancy is an important parameter that affects boiling heat transfer through the rate at which bubbles are removed from the surface. A simple model describing the bubble departure size based on a quasistatic force balance between buoyancy and surface tension is given by the Fritz [I] relation: Bo(exp 1/2) = 0.0208 theta where Bo is the ratio between buoyancy and surface tension forces. For small, rapidly growing bubbles, inertia associated with the induced liquid motion can also cause bubble departure. In microgravity, the magnitude of effects related to natural convection and buoyancy are small and physical mechanisms normally masked by natural convection in earth gravity such as Marangoni convection can substantially influence the boiling and vapor bubble dynamics. CHF (critical heat transfer) is also substantially affected by microgravity. In 1 g environments, Bo has been used as a correlating parameter for CHF. Zuber's CHF model for an infinite horizontal surface assumes that vapor columns formed by the merger of bubbles become unstable due to a Helmholtz instability blocking the supply of liquid to the surface. The jets are spaced lambda(sub D) apart, where lambda(sub D) = 2pi square root of 3[(sigma)/(g(rho(sub l) - rho(sub v)](exp 1/2) = 2pi square root of 3 L Bo(exp -1/2) = square root of 3 lambda(sub c) and is the wavelength that amplifies most rapidly. The critical wavelength, lambda(sub c), is the wavelength below which a vapor layer underneath a liquid layer is stable. For heaters with Bo smaller than about 3 (heaters smaller than lambda(sub D)), the above model is not applicable, and surface tension effects dominate. Bubble coalescence is thought to be the mechanism for CHF under these conditions. Small Bo can result by decreasing the size of a heater in earth gravity, or by operating a large heater in a lower gravity environment. In the microgravity of space, even large heaters can have low Bo, and models based on Helmholtz instability should not be applicable. The macrolayer model of Haramura and Katto is dimensionally equivalent to Zuber's model and has the same dependence on gravity, so it should not be applicable as well. The goal of this work is to determine how boiling heat transfer mechanisms in a low-g environment are altered from those at higher gravity levels. Boiling data using a microheater array was obtained under gravity environments ranging from 1.8 g to 0.02 g with heater sizes ranging from 2.7 mm to 1 mm. The boiling behavior for 2.7 mm at 0.02 g looked quite similar to boiling on the 1 mm heater at 1 g-the formation of a large primary bubble surrounded by smaller satellite bubbles was observed under both conditions. The similarity suggests that for heaters smaller than some fraction of I(sub c), coalescence and surface tension dominate boiling heat transfer. It also suggests that microgravity boiling can be studied by studying boiling on very small heaters.

Kim, Jungho↗