SEARCH · Search NASA

Results for “power electronic packaging”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

SourceResearch connectionFrom yearThrough year

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 235 records · Page 13

All sources NASA NTRS DOE OSTI

NASA NTRS2001

Performance of High-Speed PWM Control Chips at Cryogenic Temperatures

The operation of power electronic systems at cryogenic temperatures is anticipated in many NASA space missions such as planetary exploration and deep space probes. In addition to surviving the space hostile environment, electronics capable of low temperature operation would contribute to improving circuit performance, increasing system efficiency, and reducing development and launch costs. As part of the NASA Glenn Low Temperature Electronics Program, several commercial high-speed Pulse Width Modulation (PWM) chips have been characterized in terms of their performance as a function of temperature in the range of 25 to -196 C (liquid nitrogen). These chips ranged in their electrical characteristics, modes of control, packaging options, and applications. The experimental procedures along with the experimental data obtained on the investigated chips are presented and discussed.

Elbuluk, Malik E.↗

NASA NTRS2009

Evaluation methodology guidance for stack packages

This report provides evaluation methodology guidance based on previous National Aeronautics and Space Administration (NASA) reports and literature surveys for 3D stack packages and assemblies. Two aspects of technology are covered: the package itself (guidance for functional packages) and package assembly manufacturing and reliability. This work was funded by the NASA Electronic Parts and Packaging (NEPP) Program. The objectives of this NEPP project are to: Perform a literature survey of 3D stack technology; perform a literature survey on the evaluation methodology for 3D package and assembly; combine the two aspects to provide evaluation methodology for both aspects with consideration of interactions between package and assembly; generate guidance on the evaluation methodology for 3D stack package integrity prior to and after assembly; provide recommendations on future experimental activities. The qualification and evaluation methodology guidelines will facilitate NASA projects in effectively evaluating the reliability of very dense and newly available high-density 3D stack packages, allowing more processing power in a smaller board footprint and lower system weight.

Gerke, David↗

NASA NTRS2008

Performance of High Temperature Operational Amplifier, Type LM2904WH, under Extreme Temperatures

Operation of electronic parts and circuits under extreme temperatures is anticipated in NASA space exploration missions as well as terrestrial applications. Exposure of electronics to extreme temperatures and wide-range thermal swings greatly affects their performance via induced changes in the semiconductor material properties, packaging and interconnects, or due to incompatibility issues between interfaces that result from thermal expansion/contraction mismatch. Electronics that are designed to withstand operation and perform efficiently in extreme temperatures would mitigate risks for failure due to thermal stresses and, therefore, improve system reliability. In addition, they contribute to reducing system size and weight, simplifying its design, and reducing development cost through the elimination of otherwise required thermal control elements for proper ambient operation. A large DC voltage gain (100 dB) operational amplifier with a maximum junction temperature of 150 C was recently introduced by STMicroelectronics [1]. This LM2904WH chip comes in a plastic package and is designed specifically for automotive and industrial control systems. It operates from a single power supply over a wide range of voltages, and it consists of two independent, high gain, internally frequency compensated operational amplifiers. Table I shows some of the device manufacturer s specifications.

Patterson, Richard↗

NASA NTRS2004

Advanced Power Electronics Components

This paper will give a description and status of the Advanced Power Electronics Materials and Components Technology program being conducted by the NASA Glenn Research Center for future aerospace power applications. The focus of this research program is on the following: 1) New and/or significantly improved dielectric materials for the development of power capacitors with increased volumetric efficiency, energy density, and operating temperature. Materials being investigated include nanocrystalline and composite ceramic dielectrics and diamond-like carbon films; 2) New and/or significantly improved high frequency, high temperature, low loss soft magnetic materials for the development of transformers/inductors with increased power/energy density, electrical efficiency, and operating temperature. Materials being investigated include nanocrystalline and nanocomposite soft magnetic materials; 3) Packaged high temperature, high power density, high voltage, and low loss SiC diodes and switches. Development of high quality 4H- and 6H- SiC atomically smooth substrates to significantly improve device performance is a major emphasis of the SiC materials program; 4) Demonstration of high temperature (> 200 C) circuits using the components developed above.

Schwarze, Gene E.↗

NASA NTRS2019

A Comparison of ARTEMIS Data with the Lunar Plasma Design Environment for NASA Crewed Missions

NASA’s Gateway will provide the capability for sustaining a human presence in cis-lunar space. Operations of the Gateway will include spacecraft dockings, extra vehicular activities (EVA), and high-power solar arrays. NASA’s experience with the International Space Station highlighted the importance of evaluating spacecraft charging effects for such operations. For crewed spacecraft, which tend to employ the use of dielectric surfaces in this dynamic plasma environment, reliance on spacecraft charging simulation packages, such as the NASA/Air Force Spacecraft Charging Analyzer Program (Nascap-2k) [Mandell et al., 2006] and Spacecraft Plasma Interaction System (SPIS) [Roussel et al., 2008], is required to understand the risks to hardware and humans. The variability in the lunar plasma environment as the Moon revolves around the Earth, lunar wake effects, and a strong dependency on photoemission and secondary electron emission creates challenges for spacecraft charging analysis. The Design Specification for Natural Environments (DSNE) [NASA, MSFC] is the primary resource for space environments affecting NASA’s crewed missions, and the DSNE provides plasma environments in a standard form for input into simulation packages. NASA developed the existing lunar plasma environment using data from Geotail [Nishida, 1994] along with published lunar plasma wake models [Halekas et al., 2005] based on Lunar Prospector. Since 2011, NASA’s twin Acceleration Reconnection Turbulence & Electrodynamics of Moon’s Interaction with the Sun (ARTEMIS) satellites [Angelopoulos, 2010] have been collecting high resolution plasma and fields observations within the lunar plasma environment providing a much larger dataset of the plasma properties in cislunar space. This research compares the existing lunar plasma environment definition with ARTEMIS data and makes recommendations on the refinement of the environment definition for future lunar missions.

ARTEMIS mission↗

NASA NTRS2003

Microelectromechanical Systems (MEMS) Broadband Light Source Developed

A miniature, low-power broadband light source has been developed for aerospace applications, including calibrating spectrometers and powering miniature optical sensors. The initial motivation for this research was based on flight tests of a Fabry-Perot fiberoptic temperature sensor system used to detect aircraft engine exhaust gas temperature. Although the feasibility of the sensor system was proven, the commercial light source optically powering the device was identified as a critical component requiring improvement. Problems with the light source included a long stabilization time (approximately 1 hr), a large amount of heat generation, and a large input electrical power (6.5 W). Thus, we developed a new light source to enable the use of broadband optical sensors in aerospace applications. Semiconductor chip-based light sources, such as lasers and light-emitting diodes, have a relatively narrow range of emission wavelengths in comparison to incandescent sources. Incandescent light sources emit broadband radiation from visible to infrared wavelengths; the intensity at each wavelength is determined by the filament temperature and the materials chosen for the filament and the lamp window. However, present commercial incandescent light sources are large in size and inefficient, requiring several watts of electrical power to obtain the desired optical power, and they emit a large percentage of the input power as heat that must be dissipated. The miniature light source, developed jointly by the NASA Glenn Research Center, the Jet Propulsion Laboratory, and the Lighting Innovations Institute, requires one-fifth the electrical input power of some commercial light sources, while providing similar output light power that is easily coupled to an optical fiber. Furthermore, it is small, rugged, and lightweight. Microfabrication technology was used to reduce the size, weight, power consumption, and potential cost-parameters critical to future aerospace applications. This chip-based light source has the potential for monolithic fabrication with on-chip drive electronics. Other uses for these light sources are in systems for vehicle navigation, remote sensing applications such as monitoring bridges for stress, calibration sources for spectrometers, light sources for space sensors, display lighting, addressable arrays, and industrial plant monitoring. Two methods for filament fabrication are being developed: wet-chemical etching and laser ablation. Both yield a 25-mm-thick tungsten spiral filament. The proof-of-concept filament shown was fabricated with the wet etch method. Then it was tested by heating it in a vacuum chamber using about 1.25 W of electrical power; it generated bright, blackbody radiation at approximately 2650 K. The filament was packaged in Glenn's clean-room facilities. This design uses three chips vacuum-sealed with glass tape. The bottom chip consists of a reflective film deposited on silicon, the middle chip contains a tungsten filament bonded to silicon, and the top layer is a transparent window. Lifetime testing on the package will begin shortly. The emitted optical power is expected to be approximately 1.0 W with the spectral peak at 1.1 mm.

Tuma, Margaret L.↗

NASA NTRSDate not supplied

Heliophysics Environmental & Radiation Measurement Experiment Suite (HERMES): A Small External Payload for the Lunar Gateway with Big Challenges

Currently scheduled for liftoff in 2024, Gateway will be an outpost orbiting the moon for astronauts headed to and from the lunar surface and serve as a staging point for deep space exploration. In January of 2020 NASA headquarters contacted Goddard Space Flight Center to request that they develop a Heliophysics instrumentation package for Gateway. This package would later become known as HERMES-Heliophysics Environmental & Radiation Measurement Experiment Suite. HERMES consists of a Miniaturized Electron pRoton Telescope (MERIT), an Electron Electrostatic Analyzer (EEA), Solar Probe Analyzers (SPAN)-A-ions, and Noise Eliminating Magnetometer Instrument in a Small Integrated System (NEMISIS), which consists of one fluxgate and two Magneto-Inductive Magnetometers. From the beginning the HERMES mission faced a number of Challenges. It was constrained to fit in a small, half meter, cube and it was required to weigh no more than 25kg. A new boom design for the magnetometer would be required and for safety reasons it must be able to retract autonomously with power removed. To complicate matters the location of the SORI-Small ORU- (Orbital Replacement Unit) Robotics Interface, the primary interface for the HERMES platform to the Gateway elements, was undetermined. Also, the mechanical, thermal and electrical interfaces are not fully defined. The Canadian Space Agency is still in process of designing the version of the SORI that will be flown on the Power and Propulsion Element (PPE) and Habitation and Logistics Outpost (HALO) elements, each of which are being developed by different contractors. At the time of initiating the HERMES project, neither of the Gateway module providers were under contract. Additionally, we would later learn the ISS heritage SORI modules were not originally designed for launching on the Gateway elements with a payload directly attached but rather were intended to be brought up on a separate carrier outfitted with launch locks and specialized launch structures from which the robotic arm on Gateway would then be used to detach the payload and install it on the SORI adapters while on orbit. Launching the integrated Payload/SORI on the PPE and HALO elements complicates the stiffness requirements and coupled loads analysis. Adding to this are serious constraints on Field-Of-View (FOV) for solar viewing and severe radiation exposure considerations brought on by slowly raising the orbit through the Van Allen Belts. Just to make things a little more challenging the budget for the entire project was intended to be a low-cost tailored Class-D mission approach. Plus, the effects of Corona VIrus Disease 2019 (COVID-19) were not factored in from the beginning. This paper will discuss what’s being done to overcome these challenges and put HERMES on track for a 2024 Launch Readiness Date (LRD).

Irving Joseph Burt↗

NASA NTRSDate not supplied

Progress Towards SiC ASICs for Extreme Temperature and Radiation Environments

This presentation describes development and demonstrations of semiconductor integrated circuits (ICs) and ceramic packaging that are arguably the most environmentally durable transistor electronics ever demonstrated. Silicon carbide (SiC) junction field effect transistor-resistor (JFET-R) ICs fabricated by NASA Glenn Research Center with two-level interconnect have successfully operated for over 1 year in 500 °C air-ambient, 60 days in 460 °C and 9.3 MPa pressure caustic Venus surface environment test chamber, and radiation exposure through 7 Mrad(Si) total ionizing dose (TID) and 86 MeV-cm2/mg heavy ion strikes. Furthermore, these ICs have also demonstrated operation from -190 °C to +812 °C (over 1000 °C temperature span) without significant change in signal (input /output) or power supply voltages. While the operating frequency and functional complexity is far below silicon-based ICs, these SiC application specific ICs (ASICs) are nevertheless becoming capable of providing unique and advantageous harsh-environment circuit functionality without cooling/sheltering overhead. With modest adjustments, the SiC JFET-R fabrication process is compatible with semiconductor mass-production tools and materials. As an initial step towards manufacture, a majority of processing steps to realize the next SiC JFET-R IC prototype wafer run have been outsourced to commercial foundry. It is expected that further upscaling combined with technology transfer to commercial production will lower investment and risk barriers to useful application deployment.

high temperature↗

NASA NTRS2012

Low-Power Architecture for an Optical Life Gas Analyzer

Analog and digital electronic control architecture has been combined with an operating methodology for an optical trace gas sensor platform that allows very low power consumption while providing four independent gas measurements in essentially real time, as well as a user interface and digital data storage and output. The implemented design eliminates the cross-talk between the measurement channels while maximizing the sensitivity, selectivity, and dynamic range for each measured gas. The combination provides for battery operation on a simple camcorder battery for as long as eight hours. The custom, compact, rugged, self-contained design specifically targets applications of optical major constituent and trace gas detection for multiple gases using multiple lasers and photodetectors in an integrated package.

Pilgrim, Jeffrey↗

NASA NTRS1984

Thermal energy management process experiment

The thermal energy management processes experiment (TEMP) will demonstrate that through the use of two-phase flow technology, thermal systems can be significantly enhanced by increasing heat transport capabilities at reduced power consumption while operating within narrow temperature limits. It has been noted that such phenomena as excess fluid puddling, priming, stratification, and surface tension effects all tend to mask the performance of two-phase flow systems in a 1-g field. The flight experiment approach would be to attack the experiment to an appropriate mounting surface with a 15 to 20 meter effective length and provide a heat input and output station in the form of heaters and a radiator. Using environmental data, the size, location, and orientation of the experiment can be optimized. The approach would be to provide a self-contained panel and mount it to the STEP through a frame. A small electronics package would be developed to interface with the STEP avionics for command and data handling. During the flight, heaters on the evaporator will be exercised to determine performance. Flight data will be evaluated against the ground tests to determine any anomalous behavior.

Ollendorf, S.↗

NASA NTRS1988

An analysis of whistler mode radiation from the Spacelab 2 electron beam

During the Spacelab 2 mission the plasma diagnostics package (PDP) was released from the Shuttle to free fly. At times during this free flight, when the PDP was magnetically connected to the Shuttle, Stanford's fast-pulsed electron generator, located in the Shuttle cargo bay, ejected a 1-keV 50-mA electron beam. The PDP plasma-wave instrument detected intense whistler-mode radiation during these beam ejections. This paper presents a study of a whistler mode emission detected during one particular continuous electron beam firing. Calculations indicate that the beam radiated approximately 1.6 mW in the whistler mode as the beam traversed the 200 m from the Shuttle to the PDP. The emissivity also decreased by about a factor of 10 over this same distance. The measured wave powers are 10 to the 7th greater than wave powers expected from incoherent Cerenkov radiation, verifying that the radiation is generated by a coherent process. Estimates of the emissivity based on measured electric field intensities in the beam indicate that the whistler-mode noise is produced by radiation from electron bunches created by an electrostatic beam-plasma instability.

Farrell, W. M.↗

NASA NTRS2001

Packaging Technology Developed for High-Temperature Silicon Carbide Microsystems

High-temperature electronics and sensors are necessary for harsh-environment space and aeronautical applications, such as sensors and electronics for space missions to the inner solar system, sensors for in situ combustion and emission monitoring, and electronics for combustion control for aeronautical and automotive engines. However, these devices cannot be used until they can be packaged in appropriate forms for specific applications. Suitable packaging technology for operation temperatures up to 500 C and beyond is not commercially available. Thus, the development of a systematic high-temperature packaging technology for SiC-based microsystems is essential for both in situ testing and commercializing high-temperature SiC sensors and electronics. In response to these needs, researchers at Glenn innovatively designed, fabricated, and assembled a new prototype electronic package for high-temperature electronic microsystems using ceramic substrates (aluminum nitride and aluminum oxide) and gold (Au) thick-film metallization. Packaging components include a ceramic packaging frame, thick-film metallization-based interconnection system, and a low electrical resistance SiC die-attachment scheme. Both the materials and fabrication process of the basic packaging components have been tested with an in-house-fabricated SiC semiconductor test chip in an oxidizing environment at temperatures from room temperature to 500 C for more than 1000 hr. These test results set lifetime records for both high-temperature electronic packaging and high-temperature electronic device testing. As required, the thick-film-based interconnection system demonstrated low (2.5 times of the room-temperature resistance of the Au conductor) and stable (decreased 3 percent in 1500 hr of continuous testing) electrical resistance at 500 C in an oxidizing environment. Also as required, the electrical isolation impedance between printed wires that were not electrically joined by a wire bond remained high (greater than 0.4 GW) at 500 C in air. The attached SiC diode demonstrated low (less than 3.8 W/mm2) and relatively consistent dynamic resistance from room temperature to 500 C. These results indicate that the prototype package and the compatible die-attach scheme meet the initial design standards for high-temperature, low-power, and long-term operation. This technology will be further developed and evaluated, especially with more mechanical tests of each packaging element for operation at higher temperatures and longer lifetimes.

Chen, Liang-Yu↗

NASA NTRS1989

Vacuum microelectronics for beam power and rectennas

Vacuum Microelectronic devices can be described as vacuum transistors or micro-miniature vacuum tubes, as one chooses. The fundamental reason behind this new technology is the very large current densities available from field emitters, namely as high as 10(8) A/sq cm. Array current densities as high as 1000 A/sq cm have been measured. Total electron transit times from source to drain for 1 micron feature size devices have been predicted to be about 150fs. This very short transit time implies the possibility of submillimeter wave transmitters and rectennas in devices which can operate with reasonably high voltages and which are small in size and are lightweight. In addition, they are expected to be extremely radiation hard and very temperature insensitive. That is, they are expected to have radiation hardness characteristics similar to vacuum tubes, and both the high temperature and low temperature limits should be determined by the package. That is, there should be no practical intrinsic temperature or carrier freezeout problems for devices based on metals or composites. But the technology is difficult to implement at the present time because it is based on 300 to 500 angstrom radius field emitters which must be relatively uniform. There is also the need to understand the non-equilibrium transport physics in the near-surface regions of the field emitters.

Gray, Henry F.↗

NASA NTRS2015

Solid State Ultracapacitor

NASA analyzes, tests, packages, and fabricates electrical, electronic, and electromechanical (EEE) parts used in space vehicles. One area that NASA wishes to advance is energy storage and delivery. Currently, space vehicles use rechargeable batteries that utilize silver zinc or lithium ion electrochemical processes. These current state-of-the-art rechargeable batteries cannot be rapidly charged, contain harmful chemicals, and suffer from early wear-out mechanisms. A solid state ultracapacitor is an EEE part that offers significant advantages over current electrochemical and electrolytic devices. The objective of this research is to develop an internal barrier layer ultracapacitor (IBLC) using novel dielectric materials as a battery replacement with a focus on these advantages: longer life, lower mass-toweight ratio, rapid charging, on-demand pulse power, improved on-pad standby time without maintenance, and environmental friendliness. The approach is unique in two areas. A deposition technique is used that has been shown to produce a more uniformly coated nanoparticle than sol-gel, which has resulted in colossal permittivities. These particles are then distributed in an ink formulation developed at NASA Marshall Space Flight Center (MSFC) and deposited utilizing a 3D aerosol jet technique. This additive manufacturing technique controls layer thickness, resulting in extremely large capacitance and energy density.

Rolin, Terry D.↗

NASA NTRS1972

ATS-5 solar cell experiment results after one year in synchronous orbit

The results of the ATS-5 solar cell experiment after one year in synchronous orbit are reported. A partial failure in the experimental electronics package has caused a loss of data from half the 80 experimental solar cells. Procedures for extracting data due to a partial spacecraft failure are described and discussed. Data from the remaining 40 solar cells, including 15 mounted on a thin flexible structure are analyzed. Data are corrected to a solar intensity of 140 mW/sq cm and a temperature of 25 C. It was found that after one year in synchronous orbit: (1) cells with 1.52-mm-thick coverslides did not show a clear-cut advantage over those with 0.15-mm coverslides, (2) cells with solderless grid lines are degrading at the same rate as are cells with solder-dipped grid lines, (3) cells not quite completely covered with coverslides suffered a large power loss in comparison to cells fully covered, (4) no clear-cut advantage of 10-cm cells over 2-cm cells has yet been observed, (5) cells mounted on the flexible panel with relatively little backshielding did not degrade any faster than those with substantial backshielding, and (6) the flight data in large part confirms the adequacy of the ground-based techniques used in our preflight radiation test program.

Anspaugh, B. E.↗

NASA NTRS2007

Compact Packaging of Photonic Millimeter-Wave Receiver

A carrier structure made from a single silicon substrate is the basis of a compact, lightweight, relatively inexpensive package that holds the main optical/electronic coupling components of a photonic millimeter-wave receiver based on a lithium niobate resonator disk. The design of the package is simple and provides for precise relative placement of optical components, eliminating the need for complex, bulky positioning mechanisms like those commonly used to align optical components to optimize focus and coupling. Although a prototype of the package was fabricated as a discrete unit, the design is amenable to integration of the package into a larger photonic and/or electronic receiver system. The components (see figure) include a lithium niobate optical resonator disk of 5-mm diameter and .200- m thickness, positioned adjacent to a millimeter- wave resonator electrode. Other components include input and output coupling prisms and input and output optical fibers tipped with ball lenses for focusing and collimation, respectively. Laser light is introduced via the input optical fiber and focused into the input coupling prism. The input coupling prism is positioned near (but not in contact with) the resonator disk so that by means of evanescent-wave coupling, the input laser light in the prism gives rise to laser light propagating circumferentially in guided modes in the resonator disk. Similarly, a portion of the circumferentially propagating optical power is extracted from the disk by evanescent-wave coupling from the disk to the output coupling prism, from whence the light passes through the collimating ball lens into the output optical fiber. The lens-tipped optical fibers must be positioned at a specified focal distance from the prisms. The optical fibers and the prisms must be correctly positioned relative to the resonator disk and must be oriented to obtain the angle of incidence (55 in the prototype) required for evanescent-wave coupling of light into and out of the desired guided modes in the resonator disk. To satisfy all these requirements, precise alignment features are formed in the silicon substrate by use of a conventional wet-etching process. These features include a 5-mm-diameter, 50- m-deep cavity that holds the disk; two trapezoidal-cross-section recesses for the prisms; and two grooves that hold the optical fibers at the correct positions and angles relative to the prisms and disk. The fiber grooves contain abrupt tapers, near the prisms, that serve as hard stops for positioning the lenses at the focal distance from the prisms. There are also two grooves for prismadjusting rods. The design provides a little slack in the prism recesses for adjusting the positions of the prisms by means of these rods to optimize the optical coupling.

Nguyen, Hung↗

NASA NTRS2004

NASA Tech Briefs, March 2004

Topics covered include: 1) Advanced Signal Conditioners for Data-Acquisition Systems; 2) Downlink Data Multiplexer; 3) Viewing ISS Data in Real Time via the Internet; 4) Autonomous Environment-Monitoring Networks; 5) Readout of DSN Monitor Data; 6) Parallel-Processing Equalizers for Multi-Gbps Communications; 7) AIN-Based Packaging for SiC High-Temperature Electronics; 8) Software for Optimizing Quality Assurance of Other Software; 9) The TechSat 21 Autonomous Sciencecraft Experiment; 10) Software for Analyzing Laminar-to-Turbulent Flow Transitions; 11) Elastomer Filled With Single-Wall Carbon Nanotubes; 12) Modifying Ship Air-Wake Vortices for Aircraft Operations; 13) Strain-Gauge Measurement of Weight of Fluid in a Tank; 14) Advanced Docking System With Magnetic Initial Capture; 15) Blade-Pitch Control for Quieting Tilt-Rotor Aircraft; 16) Solar Array Panels With Dust-Removal Capability; 17) Aligning Arrays of Lenses and Single-Mode Optical Fibers; 18) Automatic Control of Arc Process for Making Carbon Nanotubes; 19) Curved-Focal-Plane Arrays Using Deformed-Membrane Photodetectors; 20) Role of Meteorology in Flights of a Solar-Powered Airplane; 21) Model of Mixing Layer With Multicomponent Evaporating Drops; 22) Solution-Assisted Optical Contacting; 23) Improved Discrete Approximation of Laplacian of Gaussian; 24) Utilizing Expert Knowledge in Estimating Future STS Costs; 25) Study of Rapid-Regression Liquefying Hybrid Rocket Fuels; and 26) More About the Phase-Synchronized Enhancement Method.

Source record↗

NASA NTRS2010

High-Precision Shape Control of In-Space Deployable Large Membrane/Thin-Shell Reflectors

This innovation has been developed to improve the resolutions of future spacebased active and passive microwave antennas for earth-science remote sensing missions by maintaining surface figure precisions of large membrane/thin-shell reflectors during orbiting. The intention is for these sensing instruments to be deployable at orbit altitudes one or two orders of magnitude higher than Low Earth Orbit (LEO), but still being able to acquire measurements at spatial resolution and sensitivity similar to those of LEO. Because active and passive microwave remote sensors are able to penetrate through clouds to acquire vertical profile measurements of geophysical parameters, it is desirable to elevate them to the higher orbits to obtain orbital geometries that offer large spatial coverage and more frequent observations. This capability is essential for monitoring and for detailed understanding of the life cycles of natural hazards, such as hurricanes, tropical storms, flash floods, and tsunamis. Major components of this high-precision antenna-surface-control system include a membrane/thin shell reflector, a metrology sensor, a controller, actuators, and corresponding power amplifier and signal conditioning electronics (see figure). Actuators are attached to the back of the reflector to produce contraction/ expansion forces to adjust the shape of the thin-material reflector. The wavefront-sensing metrology system continuously measures the surface figure of the reflector, converts the surface figure to digital data and feeds the data to the controller. The controller determines the control parameters and generates commands to the actuator system. The flexible, piezoelectric polymer actuators are thus activated, providing the control forces needed to correct any distortions that exist in the reflector surface. Piezoelectric polymer actuators are very thin and flexible. They can be implemented on the back of the membrane/thin-shell reflector without introducing significant amounts of mass or stiffness to the reflector. They can be rolled up or folded to accommodate the packaging needed for launch. An analytical model of the system, which includes the membrane reflector, actuator, and controller has been developed to investigate the functionality of this control system on a 35-meter-diameter membrane reflector. The performance of this system under external disturbances such as in space thermal loads and W-error due to inflation has been investigated. A subscale breadboard has been developed, and the functionality of this control concept has been demonstrated by this breadboard.

Watkins, Ronald↗