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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 235 records · Page 13
All sourcesNASA NTRSDOE OSTI
NASA NTRS1995

Digital Pulse-Width-Modulation Circuit

Digital pulse-width-modulation circuit provides programmable duration from 1 microsecond to full on, at repetition rate of 1 kHz. Designed for use in controlling CO2 laser, also used in applications in which precision and flexibility of digital control of pulse durations needed. Circuit incorporates low-power Schottky transistor/transistor-logic (TTL) devices in critical high-speed parts. Designed in TTL to make it compatible with Pro-Log 7914 (or equivalent) decoder input/output (I/O) utility printed-circuit card.

Wenzler, Carl J.↗
NASA NTRS1987

System architecture of a gallium arsenide one-gigahertz digital IC tester

The design for a 1-GHz digital integrated circuit tester for the evaluation of custom GaAs chips and subsystems is discussed. Technology-related problems affecting the design of a GaAs computer are discussed, with emphasis on the problems introduced by long printed-circuit-board interconnect. High-speed interface modules provide a link between the low-speed microprocessor and the chip under test. Memory-multiplexer and memory-shift register architectures for the storage of test vectors are described in addition to an architecture for local data storage consisting of a long chain of GaAs shift registers. The tester is constructed around a VME system card cage and backplane, and very little high-speed interconnect exists between boards. The tester has a three part self-test consisting of a CPU board confidence test, a main memory confidence test, and a high-speed interface module functional test.

Fouts, Douglas J.↗
NASA NTRS1993

Wide-bandwidth high-resolution search for extraterrestrial intelligence

A third antenna was added to the system. It is a terrestrial low-gain feed, to act as a veto for local interference. The 3-chip design for a 4 megapoint complex FFT was reduced to finished working hardware. The 4-Megachannel circuit board contains 36 MByte of DRAM, 5 CPLDs, the three large FFT ASICs, and 74 ICs in all. The Austek FDP-based Spectrometer/Power Accumulator (SPA) has now been implemented as a 4-layer printed circuit. A PC interface board has been designed and together with its associated user interface and control software allows an IBM compatible computer to control the SPA board, and facilitates the transfer of spectra to the PC for display, processing, and storage. The Feature Recognizer Array cards receive the stream of modulus words from the 4M FFT cards, and forward a greatly thinned set of reports to the PC's in whose backplane they reside. In particular, a powerful ROM-based state-machine architecture has been adopted, and DRAM has been added to permit integration modes when tracking or reobserving source candidates. The general purpose (GP) array consists of twenty '486 PC class computers, each of which receives and processes the data from a feature extractor/correlator board set. The array performs a first analysis on the provided 'features' and then passes this information on to the workstation. The core workstation software is now written. That is, the communication channels between the user interface, the backend monitor program and the PC's have working software.

Horowitz, Paul↗
NASA NTRS1999

Design of Advanced Atmospheric Water Vapor Differential Absorption Lidar (DIAL) Detection System

The measurement of atmospheric water vapor is very important for understanding the Earth's climate and water cycle. The lidar atmospheric sensing experiment (LASE) is an instrument designed and operated by the Langley Research Center for high precision water vapor measurements. The design details of a new water vapor lidar detection system that improves the measurement sensitivity of the LASE instrument by a factor of 10 are discussed. The new system consists of an advanced, very low noise, avalanche photodiode (APD) and a state-of-the-art signal processing circuit. The new low-power system is also compact and lightweight so that it would be suitable for space flight and unpiloted atmospheric vehicles (UAV) applications. The whole system is contained on one small printed circuit board (9 x 15 sq cm). The detection system is mounted at the focal plane of a lidar receiver telescope, and the digital output is read by a personal computer with a digital data acquisition card.

Refaat, Tamer F.↗
NASA NTRS1989

Silver Ink For Jet Printing

Metallo-organic ink containing silver (with some bismuth as adhesion agent) applied to printed-circuit boards and pyrolized in air to form electrically conductive patterns. Ink contains no particles of silver, does not have to be mixed during use to maintain homogeneity, and applied to boards by ink-jet printing heads. Consists of silver neodecanoate and bismuth 2-ethylhexanoate dissolved in xylene and/or toluene.

Vest, R. W.↗
NASA NTRS1983

Stable Polyurethane Coatings for Electronic Circuits

Alkane-based polyurethanes resist deterioration while maintaining good dielectric properties. Weight loss after prolonged immersion in hot water far less for alkane-based polyurethanes than for more common ether based polyurethanes, at any given oxygen content. Major uses of polyurethanes are as connector potting materials and conformal coatings for printed circuit boards.

Morris, D. E.↗
DOE OSTI2023

BICEP Array: 150 GHz Detector Module Development

The Background Imaging of Cosmic Extragalactic Polarization (BICEP)/Keck (BK) collaboration is currently leading the quest for the highest-sensitivity measurements of the polarized cosmic microwave background (CMB) anisotropies on a degree scale with a series of cryogenic telescopes, of which BICEP Array (BA) is the latest Stage-3 upgrade with a total of ~ 32,000 detectors. The instrument comprises 4 receivers spanning 30–270 GHz, with the low-frequency 30/40 GHz deployed to the South Pole Station in late 2019. The full complement of receivers is forecast to set the most stringent constraints on the tensor-to-scalar ratio r. Building on these advances, the overarching small-aperture telescope concept is already being used as the reference for further Stage-4 experiment design. This paper describes the development of the BICEP Array 150 GHz detector module and its fabrication requirements, with highlights on the high-density time division multiplexing (TDM) design of the cryogenic circuit boards. The low-impedance wiring required between the detectors and the frst stage of superconducting quantum interference device amplifers is crucial to maintaining a stable bias current on the detectors. Here, a novel multilayer FR4 Printed Circuit Board with superconducting traces, capable of reading out up to 648 detectors, is detailed along with its validation tests. An ultra-high-density TDM detector module concept we developed for a CMB-S4-like experiment that allows up to 1920 detectors to be read out is also presented. TDM has been chosen as the detector readout technology for the Cosmic Microwave Background Stage-4 (CMB-S4) experiment based on its proven low-noise performance, predictable costs, and overall maturity of the architecture. The heritage for TDM is rooted in mm- and sub-mm-wave experiments dating back 20 years and has since evolved to support a multiplexing factor of 64x in Stage-3 experiments.

79 ASTRONOMY AND ASTROPHYSICS↗
NASA NTRS2000

Advanced Atmospheric Water Vapor DIAL Detection System

Measurement of atmospheric water vapor is very important for understanding the Earth's climate and water cycle. The remote sensing Differential Absorption Lidar (DIAL) technique is a powerful method to perform such measurement from aircraft and space. This thesis describes a new advanced detection system, which incorporates major improvements regarding sensitivity and size. These improvements include a low noise advanced avalanche photodiode detector, a custom analog circuit, a 14-bit digitizer, a microcontroller for on board averaging and finally a fast computer interface. This thesis describes the design and validation of this new water vapor DIAL detection system which was integrated onto a small Printed Circuit Board (PCB) with minimal weight and power consumption. Comparing its measurements to an existing DIAL system for aerosol and water vapor profiling validated the detection system.

Refaat, Tamer F.↗
NASA NTRS2014

Reliability of CGA/LGA/HDI Package Board/Assembly (Final Report)

Package manufacturers are now offering commercial-off-the-shelf column grid array (COTS CGA) packaging technologies in high-reliability versions. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronics packages. The previous reports, released in January of 2012 and January of 2013, presented package test data, assembly information, and reliability evaluation by thermal cycling for CGA packages with 1752, 1517, 1509, and 1272 inputs/outputs (I/Os) and 1-mm pitch. It presented the thermal cycling (-55C either 100C or 125C) test results for up to 200 cycles. This report presents up to 500 thermal cycles with quality assurance and failure analysis evaluation represented by optical photomicrographs, 2D real time X-ray images, dye-and-pry photomicrographs, and optical/scanning electron Microscopy (SEM) cross-sectional images. The report also presents assembly challenge using reflowing by either vapor phase or rework station of CGA and land grid array (LGA) versions of three high I/O packages both ceramic and plastic configuration. A new test vehicle was designed having high density interconnect (HDI) printed circuit board (PCB) with microvia-in-pad to accommodate both LGA packages as well as a large number of fine pitch ball grid arrays (BGAs). The LGAs either were assembled onto HDI PCB as an LGA or were solder paste print and reflow first to form solder dome on pads before assembly. Both plastic BGAs with 1156 I/O and ceramic LGAs were assembled. It also presented the X-ray inspection results as well as failures due to 200 thermal cycles. Lessons learned on assembly of ceramic LGAs are also presented.

Ghaffaroam. Reza↗
NASA NTRS2009

Embedded passives emulator FY2003 interim report

The National Aeronautics and Space Administration Electronic Parts and Packaging (NEPP) Program has been evaluating state-of-the-art Embedded Passive Technology for the printed circuit board (PCB) industry for the past several years and has conducted its own testing on embedded passive coupons (resistors and capacitors). This document is a progress report of the work performed through fiscal year 2008 by NASA and the Navy to convert an existing PWB (printed wiring board) design to a design that incorporates embedded passive components. The work is being performed through a memorandum of understanding (MOU) between the NEPP Program (NASA) and the Naval Surface Warfare Center (NSWC) Crane Emerging Critical Interconnect Technology (ECIT) Program. NSWC Crane’s ECIT Program has funding to convert two PCB designs from the military and aerospace industry to a PCB design with embedded passives. ECIT will provide a design team that will take a well characterized design and convert it to an embedded design. They will also provide electrical modeling and layout expertise as well as build the PWB in their facility in Indiana. NEPP, through the Jet Propulsion Laboratory (JPL), will assemble any passives deemed not suitable for embedding and the active components and electrically test the new design to the existing (non-embedded) design

Gerke, David↗
DOE OSTI2023

PRINTED, PLANAR MICROWAVE CONNECTOR WITH MULTIPLE SIGNAL LINES

Microwave connectors with a planar geometry have been demonstrated using additive manufacturing techniques. This planar form factor is expected to enable connectors to be integrated directly with other components onto a printed circuit board. The connectors were developed with multiple signal lines that will increase the density of signal connections to PCBs, eliminating the physical constraints of single-signal COTS microwave connectors. This work developed electromagnetic models (using Ansys HFSS) of these planar connectors to predict performance and optimize connector design. Materials and printing processes were developed to fabricate the connectors based on high-temperature PEEK thermoplastics. The multiple signal connectors were designed to operate over the 1-6GHz band and are built upon the single signal printed planar geometry connector introduced in a previous paper [1].

Additive Manufacturing↗
DOE OSTI2025

Obtaining Real Production Data Through On-Component Printed SIR Patterns

Cleanliness validation of printed circuit assemblies has become increasingly important as electronic assemblies become smaller, denser, and more challenging to clean, prompting an increase in reliance in custom solutions. With increasingly fast paced development cycles, long lead times and costs of quality custom surrogate test boards become prohibitive in obtaining cleanliness data that is a true representative of the final product. In this study, aerosol jet printing, an additive manufacturing technology for electronics, was used to manufacture surface insulation resistance (SIR) test structures that were evaluated on their ability to detect cleanliness defects and remain stable when clean, as well as their survivability to standard electronics wash processes. Additionally, in an effort to further increase the agility of true product testing, SIR test structures were printed directly onto ball-grid-arrays (BGAs) and tested the survivability of conformally printed leads for data acquisition. SIR test structures displayed good wash survivability on standard FR4 and BGAs, including wraparounds for on-component prints, and high sensitivity to cleanliness defects. The presented results demonstrate the feasibility of printed SIR structures as a quick-turn, highly customizable solution for wash validation with potential for increased fidelity cleanliness testing.

SIR, Additive Manufacturing, Printed Electronics, ↗
DOE OSTI2022

Self-Sensing, Stretchable, Active Circuit Arrays: Liquid Metal Paste as a Combination Interconnect and Strain Sensor

Stretchable electrical interconnects and substrate materials are increasingly used to create flexible and con-formable electronic systems for soft robotics, smart textiles, and wearable devices. Wires fabricated using composite or liquid conductive inks encapsulated in silicone enable high strain and are mechanically robust. The resistance of these inter-connects increases with strain, which can present challenges for power delivery and signaling among electronic components. However, this effect can be used directly to estimate strain within a stretchable circuit without the need for additional sensor components. In this work, we present an approach for fabricating fully-stretchable, multi-layer active circuit arrays in silicone using liquid metal paste interconnects, in which power and data wires are re-purposed as strain sensors to estimate substrate deformation. As a proof-of-principle, we demonstrate a 3×3 active circuit array that self-senses relative voltage supply at each node to estimate deformation and consumes less than 10 mA per node. Each node is digitally addressable and performs both analog measurement and digital conversion. All interconnects are fabricated using liquid metal paste, and power, data, and sensing are performed over a shared, four-wire interface in this multi-layer stretchable printed circuit board.

99 GENERAL AND MISCELLANEOUS↗
NASA NTRS1991

Testing interconnected VLSI circuits in the Big Viterbi Decoder

The Big Viterbi Decoder (BVD) is a powerful error-correcting hardware device for the Deep Space Network (DSN), in support of the Galileo and Comet Rendezvous Asteroid Flyby (CRAF)/Cassini Missions. Recently, a prototype was completed and run successfully at 400,000 or more decoded bits per second. This prototype is a complex digital system whose core arithmetic unit consists of 256 identical very large scale integration (VLSI) gate-array chips, 16 on each of 16 identical boards which are connected through a 28-layer, printed-circuit backplane using 4416 wires. Special techniques were developed for debugging, testing, and locating faults inside individual chips, on boards, and within the entire decoder. The methods are based upon hierarchical structure in the decoder, and require that chips or boards be wired themselves as Viterbi decoders. The basic procedure consists of sending a small set of known, very noisy channel symbols through a decoder, and matching observables against values computed by a software simulation. Also, tests were devised for finding open and short-circuited wires which connect VLSI chips on the boards and through the backplane.

Onyszchuk, I. M.↗
DOE OSTI2023

Online Monitoring of Medium Voltage Cable Systems with Spread Spectrum Time Domain and Frequency Domain Reflectometry

In-service failures of wave energy convertor (WEC) cable systems can have a significant cost and power availability impact. Close parallel research 2019 data showed > 1B£ and 9 Terra-Watt-Hours associated with global off-shore wind (OSW) cable failures (Strang-Moran 2020). OSW is a closely related technology but currently is significantly cheaper than WEC technology. For wave energy to compete, the problem of reliable cable transmission must be mitigated. This project develops isolation technology to allow online high frequency reflectometry testing of medium voltage cables (1 to 10 kV and higher) without arcing or damage to the test instrument. Online spread spectrum time domain reflectometry (SSTDR) testing has been established for low voltage cable systems in the aircraft and rail industry and the ability to detect and locate cable flaws of interest is well understood. Extending reflectometry testing to medium voltage systems could enable detection of cable damage before failures occur thereby allowing repair and replacement of damaged cable segments to be scheduled and managed. The seedling project succeeded to pass and receive high frequency SSTDR signals onto a cable up to 1 kV using a parallel trace isolation circuit board that can be connected onto the test cable. The approach used a novel circuit design for which an invention disclosure has been filed. A proposed sapling project would extend the technology toward the higher operating voltages used by WEC systems, thereby enabling online SSTDR cable monitoring. The goal of the seedling project was to extend the capability of the ARENA cable/motor test bed to address medium voltages and to develop a high pass filter isolation architecture to protect the reflectometry instrument from the low frequency (DC – 60 Hz) line voltage while allowing the high frequency diagnostic signal to pass to and from the test instrument to the live line. Initial efforts focused on passive LCR filter circuits to reduce 60 Hz levels below 10 volts from a 10 kV line while allowing the MHz high frequency chirps to pass onto the cables and for mV signals to be detected. We discovered that the parasitic loss behavior of real high voltage components precluded this approach from working. An alternate approach was adapted for the electric field to couple between two parallel traces on a printed circuit board much like a radio-frequency coupler. The challenge here was and is to have the parallel traces close enough to each other to effectively pass the high frequency chirp onto the live line and receive any reflected signal from any encountered impedance change along the cable. This reflected signal will be in the mV range. The traces however must be far enough apart to not allow arcing on the board. A design with 3 mm spacing was determined to allow the high frequency signal to pass onto the live line and receive the mV signal back into the instrument while reducing the 60 Hz voltage amplitude by >80 dB (more than a factor of 10,000) without allowing arcing from across the parallel traces. This was confirmed by simulation and test.

16 TIDAL AND WAVE POWER↗
NASA NTRS1994

SpaceHab 1 maintenance experiment

The SpaceHab 1 flight on STS-57 served as a test platform for evaluation of two space station payloads. The first payload evaluated a space station maintenance concept using a sweep signal generator and a 48-channel logic analyzer to perform fault detection and isolation. Crew procedures files, test setup diagram files, and software to configure the test equipment were created on the ground and uplinked on the astronauts' voice communication circuit to perform tests in flight. In order to use these files, the portable computer was operated in a multi-window configuration. The test data transmitted to the ground allowing the ground staff to identify the cause of the fault and provide the crew with the repair procedures and diagrams. The crew successfully repaired the system under test. The second payload investigated hand soldering and de-soldering of standard components on printed circuit (PC) boards in zero gravity. It also used a new type of intra-vehicular foot restraints which uses the neutral body posture in zero-g to provide retention of the crew without their conscious attention.

Bohannon, Jackie W.↗
NASA NTRS1989

A programmable CCD driver circuit for multiphase CCD operation

A programmable CCD (charge-coupled device) driver circuit was designed to drive CCDs in multiphased modes. The purpose of the drive electronics is to operate developmental CCD imaging arrays for NASA's tiltable moderate resolution imaging spectrometer (MODIS-T). Five objectives for the driver were considered during its design: (1) the circuit drives CCD electrode voltages between 0 V and +30 V to produce reasonable potential wells, (2) the driving sequence is started with one input signal, (3) the driving sequence is started with one input signal, (4) the circuit allows programming of frame sequences required by arrays of any size, (5) it produces interfacing signals for the CCD and the DTF (detector test facility). Simulation of the driver verified its function with the master clock running up to 10 MHz. This suggests a maximum rate of 400,000 pixels/s. Timing and packaging parameters were verified. The design uses 54 TTL (transistor-transistor logic) chips. Two versions of hardware were fabricated: wirewrap and printed circuit board. Both were verified functionally with a logic analyzer.

Ewin, Audrey J.↗
NASA NTRS2003

Demonstration of Separation Control Using Glow-Discharge Plasma Actuators

Active flow control of boundary-layer separation using glow-discharge plasma actuators is studied experimentally. Separation is induced on a flat plate installed in a closed-circuit wind tunnel by a shaped insert on the opposite wall. The flow conditions represent flow over the suction surface of a modem low-pressure-turbine airfoil. The Reynolds number, based on wetted plate length and nominal exit velocity, is varied from 50,000 to 300,000, covering cruise to takeoff conditions. Low (0.2%) and high (2.5%) free-stream turbulence intensities are set using passive grids. A spanwise-oriented phased-plasma-array actuator, fabricated on a printed circuit board, is surface-flush-mounted upstream of the separation point and can provide forcing in a wide frequency range. Static surface pressure measurements and hot-wire anemometry of the base and controlled flows are performed and indicate that the glow-discharge plasma actuator is an effective device for separation control.

Hultgren, Lennart S.↗