Search NASA⌕ Search

SEARCH · Search NASA

Results for “thermal cycle”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 235 records · Page 13

High reliability bond program using small diameter aluminum wire

The program was undertaken to characterize the performance of small diameter aluminum wire ultrasonically bonded to conductors commonly encountered in hybrid assemblies, and to recommend guidelines for improving this performance. Wire, 25.4, 38.1 and 50.8 um (1, 1.5 and 2 mil), was used with bonding metallization consisting of thick film gold, thin film gold and aluminum as well as conventional aluminum pads on semiconductor chips. The chief tool for evaluating the performance was the double bond pull test in conjunction with a 72 hour - 150 C heat soak and -65 C to +150 C thermal cycling. In practice the thermal cycling was found to have relatively little effect compared to the heat soak. Pull strength will decrease after heat soak as a result of annealing of the aluminum wire; when bonded to thick film gold, the pull strength decreased by about 50% (weakening of the bond interface was the major cause of the reduction). Bonds to thin film gold lost about 30 - 40% of their initial pull strenth; weakening of the wire itself at the bond heel was the predominant cause. Bonds to aluminum substrate metallization lost only about 22%. Bonds between thick and thin film gold substrate metallization and semiconductor chips substantiated the previous conclusions but also showed that in about 20 to 25% of the cases, bond interface failure occurred at the semiconductor chip.

Macha, M.↗

High temperature - low mass solar blanket

Interconnect materials and designs for use with ultrathin silicon solar cells are discussed, as well as the results of an investigation of the applicability of parallel-gap resistance welding for interconnecting these cells. Data relating contact pull strength and cell electrical degradation to variations in welding parameters such as time, voltage and pressure are presented. Methods for bonding ultrathin cells to flexible substances and for bonding thin (75 micrometers) covers to these cells are described. Also, factors influencing fabrication yield and approaches for increasing yield are discussed. The results of vacuum thermal cycling and thermal soak tests on prototype ultrathin cell test coupons and one solar module blanket are presented.

Mesch, H. G.↗

High temperature, low mass solar blanket development

This paper presents methods of incorporating ultrathin silicon solar cells into photovoltaic blankets for space applications. This type of cell has the highest power-to-mass ratio and best performance under space radiation of any silicon solar cell. Interconnect materials and designs, and the results of the investigation of the applicability of parallel-gap resistance welding for interconnecting ultrathin cells are discussed. Data relating contact pull strength and cell electrical degradation to welding parameters such as time, voltage, and pressure are presented. Methods for bonding ultrathin cells to flexible substrates and for bonding thin covers to these cells are described, and the results of vacuum thermal cycling and thermal soak tests on prototype ultrathin cell test coupons are included.

Mesch, H. G.↗

Accelerated stress testing of terrestrial solar cells

The development of an accelerated test schedule for terrestrial solar cells is described. This schedule, based on anticipated failure modes deduced from a consideration of IC failure mechanisms, involves bias-temperature testing, humidity testing (including both 85-85 and pressure cooker stress), and thermal-cycle thermal-shock testing. Results are described for 12 different unencapsulated cell types. Both gradual electrical degradation and sudden catastrophic mechanical change were observed. These effects can be used to discriminate between cell types and technologies relative to their reliability attributes. Consideration is given to identifying laboratory failure modes which might lead to severe degradation in the field through second quadrant operation. Test results indicate that the ability of most cell types to withstand accelerated stress testing depends more on the manufacturer's design, processing, and worksmanship than on the particular metallization system. Preliminary tests comparing accelerated test results on encapsulated and unencapsulated cells are described.

Lathrop, J. W.↗

Development of heat flux sensors for turbine airfoils

The objectives of this program are to develop heat flux sensors suitable for installation in hot section airfoils of advanced aircraft turbine engines and to experimentally verify the operation of these heat flux sensors in a cylinder in a cross flow experiment. Embedded thermocouple and Gardon gauge sensors were developed and fabricated into both blades and vanes. These were then calibrated using a quartz lamp bank heat source and finally subjected to thermal cycle and thermal soak testing. These sensors were also fabricated into cylindrical test pieces and tested in a burner exhaust to verify heat flux measurements produced by these sensors. The results of the cylinder in cross flow tests are given.

Atkinson, William H.↗

An environmental testing facility for Space Station Freedom power management and distribution hardware

The plans for a new test facility, including new environmental test systems, which are presently under construction, and the major environmental Test Support Equipment (TSE) used therein are addressed. This all-new Rocketdyne facility will perform space simulation environmental tests on Power Management and Distribution (PMAD) hardware to Space Station Freedom (SSF) at the Engineering Model, Qualification Model, and Flight Model levels of fidelity. Testing will include Random Vibration in three axes - Thermal Vacuum, Thermal Cycling and Thermal Burn-in - as well as numerous electrical functional tests. The facility is designed to support a relatively high throughput of hardware under test, while maintaining the high standards required for a man-rated space program.

Jackola, Arthur S.↗

Thermal performance testing of the Explorer Platform

The Explorer Platform (EP) has been designed to accommodate on-orbit payload and bus module changeout via Space Transportation System (STS) servicing. Such a versatile spacecraft platform designed to experience widely different environmental exposures and operational conditions, coupled with program constraints on schedule and budget, presented a challenge to implementing a technically sound thermal vacuum/thermal balance test program. This paper discusses thermal performance tests implemented at the subsystem and system levels, and the risks accepted resulting from test sequence, configuration. and tests omitted from the program. No thermal cycling or thermal balance tests were performed on the integrated spacecraft level, although both the Payload (EUVE) and Platform (EP) received independent testing. The decision to take this approach is discussed with respect to the thermal design and the associated risks taken to maintain budget and schedule.

Wasson, David↗

Interfacial Effects on the Thermal and Mechanical Properties of Graphite/Copper Composites

Graphite surfaces are not wet by pure copper. This lack of wetting has been responsible for a debonding phenomenon that has been found in continuous graphite fiber reinforced copper matrix composites subjected to elevated temperatures. By suitably alloying copper, its ability to wet graphite surfaces can be enhanced. Information obtained during sessile drop testing has led to the development of a copper-chromium alloy that suitably wets graphite. Unidirectionally reinforced graphite/copper composites have been fabricated using a pressure infiltration casting procedure. P100 pitch-based fibers have been used to reinforce copper and copper-chromium alloys. X-ray radiography and optical microscopy have been used to assess the fiber distribution in the cast composites. Scanning electron microscopy and Auger electron spectroscopy analyses were conducted to study the distribution and continuity of the chromium carbide reaction phase that forms at the fiber/matrix interface in the alloyed matrix composites. The effects of the chromium in the copper matrix on the mechanical and thermal properties of P100Gr/Cu composites have been evaluated through tensile testing, three-point bend testing, thermal cycling and thermal conductivity calculations. The addition of chromium has resulted in an increased shear modulus and essentially zero thermal expansion in the P100Gr/Cu-xCr composites through enhanced fiber/matrix bonding. The composites have longitudinal tensile strengths in excess of 700 MPa with elastic moduli of 393 GPa. After 100 hr at 760 deg C 84 percent of the as-cast strength is retained in the alloyed matrix composites. The elastic moduli are unchanged by the thermal exposure. It has been found that problems with spreading of the fiber tows strongly affect the long transverse tensile properties and the short transverse thermal conductivity of the P100Gr/Cu-xCr composites. The long transverse tensile strength is limited by rows of touching fibers which are paths of easy crack propagation under low tensile loads. The short transverse thermal conductivity is dictated by the fiber/matrix interface. Conduction across this interface has been estimated to be two orders of magnitude lower than that across the composite. This is due to the mechanical, and not chemical, nature of Gr/Cu bond.

Devincent, Sandra Marie↗

Thermal Design of the Micrometeoroid Satellite S-55

The thermal design of the micrometeoroid satellite S-55 involves both experimental and analytical approaches in selecting materials and coatings. A cutaway drawing of the S-55 satellite is shown. The purpose of which is to obtain scientific and engineering design data on the frequency and penetration hazard of micrometeoroids at altitudes between about 250 nautical miles and 700 nautical miles. The passive method of thermal control used involves the selection of materials and coatings that give the desired ratio of absorptivity to emissivity alpha/epsilon for keeping the telemetry temperature within narrow limits and also to prevent overheating of the separate experiments. The selection of a material or coating for this purpose, however, is dictated not only by its absorptivity and emissivity values, but also by its reliability and the constancy of these values under long exposure to the space environment. Several test programs have been conducted in order to evaluate the materials and coatings being considered. Some of these are as follows: (1) Ultraviolet radiation in a vacuum to study discoloration and weight change. (2) Solar radiation in a vacuum to determine maximum equilibrium temperature, discoloration, and weight loss. (3) Thermal cycling and thermal shock to study material integrity (leaking, spalling, melting, etc.). (4) Proton radiation to observe effects on color, crystal structure, and strength. (5) Determination of effects of heat associated with coating application on the leak rate of pressurized parts. (6) Absorptivity and emissivity measurements. The experimental tests outlined and the maximum use of coating methods successfully employed on previous satellites should provide high reliability of the material used for the thermal design of this vehicle. A theoretical analysis was made to determine the values of alpha/epsilon required for different areas in order that the telemetry remain within the desired temperature limits.

Hastings, Earl C., Jr.↗

Single Photon HgCdTe Avalanche Photodiode and Integrated Detector Cooler Assemblies for Space Lidar Applications

A linear mode photon counting HgCdTe avalanche photodiode (APD) focal plane array (FPA) detector was developed for space lidar applications. An integrated detector cooler assembly (IDCA) was manufactured using a miniature Stirling cooler. The HgCdTe APD demonstrated a greater than 60% photon detection efficiency from 0.9 to 4.3 μm wavelength and a dark count rate less than 250,000/s. The IDCA cooled the FPA to 110K from ambient room temperature at a total electrical power of 7 W. The IDCA has passed environmental tests, including vibration, thermal cycling and thermal vacuum tests.

Sun, Xiaoli↗

HgCdTe Avalanche Photodiode Array Detectors with Single Photon Sensitivity and Integrated Detector Cooler Assemblies for Space Lidar Applications

A HgCdTe avalanche photodiode (APD) focal plane array assembly with linear mode photon-counting capability has been developed for space lidar applications. An integrated detector cooler assembly (IDCA) has been built using a miniature Stirling cooler. A microlens array has been included to improve the fill factor. The HgCdTe APD has a spectral response from 0.9- to 4.3-μm wavelengths, a photon detection efficiency as high as 70%, and a dark count rate of <250 kHz at 110 K. The mass of the IDCA is 0.8 kg and the total electrical power consumption is about 7 W. The HgCdTe APD arrays have been characterized at NASA Goddard Space Flight Center. A series of environmental tests have been conducted for the IDCAs, including vibration, thermal cycling, and thermal vacuum tests. A description of the device and the test results at NASA are given in this paper.

Sun, Xiaoli↗

Experimental evaluation of thermal ratcheting behavior in UO2 fuel elements

The effects of thermal cycling of UO2 at high temperatures has been experimentally evaluated to determine the rates of distortion of UO2/clad fuel elements. Two capsules were rested in the 1500 C range, one with a 50 C thermal cycle, the other with a 100 C thermal cycle. It was observed that eight hours at the lower cycle temperature produced sufficient UO2 redistribution to cause clad distortion. The amount of distortion produced by the 100 C cycle was less than double that produced by the 50 C, indicating smaller thermal cycles would result in clad distortion. An incubation period was observed to occur before the onset of distortion with cycling similar to fuel swelling observed in-pile at these temperatures.

Phillips, W. M.↗

Qualification of Bonding Process of Temperature Sensors to Extreme Temperature Deep Space Missions

A process has been explored based on the state-of-the-art technology to bond the platinum resistance thermometer (PRT) on to potential aerospace material such as a flat aluminum surface and a flexible copper tube to simulate coaxial cable for the flight applications. Primarily, PRTs were inserted into a metal plated copper braid to avoid stresses on the sensor while attaching the sensor with braid to the base material for long duration deep space missions. Appropriate pretreatment has been implemented in this study to enhance the adhesion of the PRTs to the base material. NuSil product has been chosen in this research to attach PRT to the base materials. The resistance (approx.1.1 k(Omega)) of PRTs has been electrically monitored continuously during the qualification thermal cycling testing from -150 C to +120 C and -100 C to -35 C. The test hardware has been thermal cycled three times the mission life per JPL design principles for JUNO project. No PRT failures were observed during and after the PRT thermal cycling qualification test for extreme temperature environments. However, there were some failures associated with staking of the PRT pig tails as a result of thermal cycling qualification test.

Extreme temperatures↗

Use of Guided Acoustic Waves to Assess the Effects of Thermal-Mechanical Cycling on Composite Stiffness

The introduction of new, advanced composite materials into aviation systems requires it thorough understanding of the long-term effects of combined thermal and mechanical loading. As part of a study to evaluate the effects of thermal-mechanical cycling, it guided acoustic (Lamb) wave measurement system was used to measure the bending and out-of-plane stiffness coefficients of composite laminates undergoing thermal-mechanical loading. The system uses a pulse/receive technique that excites an antisymmetric Lamb mode and measures the time-of-flight over a wide frequency range. Given the material density and plate thickness, the bending and out-of-plane shear stiffnesses are calculated from a reconstruction of the velocity dispersion curve. A series of 16 and 32-ply composite laminates were subjected to it thermal-mechanical loading profile in load frames equipped with special environmental chambers. The composite systems studied were it graphite fiber reinforced amorphous thermoplastic polyimide and it graphite fiber reinforced bismaleimide thermoset. The samples were exposed to both high and low temperature extremes its well as high and low strain profiles. The bending and out-of-plane stiffnesses for composite sample that have undergone over 6,000 cycles of thermal-mechanical loading are reported. The Lamb wave generated elastic stiffness results have shown decreases of up to 20% at 4,936 loading cycles for the graphite/thermoplastic samples and up to 64% at 4,706 loading cycles for the graphite/thermoset samples.

Seale, Michael D.↗

Reannealed Fiber Bragg Gratings Demonstrated High Repeatability in Temperature Measurements

Fiber Bragg gratings (FBGs) are formed by periodic variations of the refractive index of an optical fiber. These periodic variations allow an FBG to act as an embedded optical filter, passing the majority of light propagating through a fiber while reflecting back a narrow band of the incident light. The peak reflected wavelength of the FBG is known as the Bragg wavelength. Since the period and width of the refractive index variation in the fiber determines the wavelengths that are transmitted and reflected by the grating, any force acting on the fiber that alters the physical structure of the grating will change the wavelengths that are transmitted and reflected by it. Both thermal and mechanical forces acting on the grating will alter its physical characteristics, allowing the FBG sensor to detect both the temperature variations and the physical stresses and strains placed upon it. This ability to sense multiple physical forces makes the FBG a versatile sensor. To assess the feasibility of using Bragg gratings as temperature sensors for propulsion applications, researchers at the NASA Glenn Research Center evaluated the performance of Bragg gratings at elevated temperatures for up to 300 C. For these purposes, commercially available polyimide-coated high-temperature gratings were used that were annealed by the manufacturer to 300 C. To assure the most thermally stable gratings at the operating temperatures, we reannealed the gratings to 400 C at a very slow rate for 12 to 24 hr until their reflected optical powers were stabilized. The reannealed gratings were then subjected to periodic thermal cycling from room temperature to 300 C, and their peak reflected wavelengths were monitored. The setup shown is used for reannealing and thermal cycling the FBGs. Signals from the photodetectors and the spectrum analyzer were fed into a computer equipped with LabVIEW software. The software synchronously monitored the oven/furnace temperature and the optical spectrum analyzer as well as processed the data. Experimental results presented in the following graph show typical wavelength versus temperature dependence of a reannealed FBG through six thermal cycles (80 hr). The average standard deviation of the temperature-to-wavelength relationship ranged from 1.86 to 2.92 C over the six thermal cycles each grating was subjected to. This is an error of less than 1.0 percent of full scale throughout the entire evaluation temperature range from ambient to 300 C.

Adamovsky, Grigory↗

Reliability Assessment of Advanced Flip-clip Interconnect Electronic Package Assemblies under Extreme Cold Temperatures (-190 and -120 C)

Flip-chip interconnect electronic package boards have been assembled, underfilled, non-destructively evaluated and subsequently subjected to extreme temperature thermal cycling to assess the reliability of this advanced packaging interconnect technology for future deep space, long-term, extreme temperature missions. In this very preliminary study, the employed temperature range covers military specifications (-55 C to 100 C), extreme cold Martian (-120 C to 115 C) and asteroid Nereus (-180 C to 25 C) environments. The resistance of daisy-chained, flip-chip interconnects were measured at room temperature and at various intervals as a function of extreme temperature thermal cycling. Electrical resistance measurements are reported and the tests to date have not shown significant change in resistance as a function of extreme temperature thermal cycling. However, the change in interconnect resistance becomes more noticeable with increasing number of thermal cycles. Further research work has been carried out to understand the reliability of flip-chip interconnect packages under extreme temperature applications (-190 C to 85 C) via continuously monitoring the daisy chain resistance. Adaptation of suitable diagnostic techniques to identify the failure mechanisms is in progress. This presentation will describe the experimental test results of flip-chip testing under extreme temperatures.

thermal cycling↗

Reliability of Sn/Pb and Lead-Free (SnAgCu) Solders of Surface Mounted Miniaturized Passive Components for Extreme Temperature (-185 C to +125 C) Space Missions

Surface mount electronic package test boards have been assembled using tin/lead (Sn/Pb) and lead-free (Pb-free or SnAgCu or SAC305) solders. The soldered surface mount packages include ball grid arrays (BGA), flat packs, various sizes of passive chip components, etc. They have been optically inspected after assembly and subsequently subjected to extreme temperature thermal cycling to assess their reliability or future deep space, long-term, extreme temperature environmental missions. In this study, the employed temperature range (-185oC to +125oC) covers military specifications (-55oC to +100oC), extreme old Martian (-120oC to +115oC), asteroid Nereus (-180oC to +25oC) and JUNO (-150oC to +120oC) environments. The boards were inspected at room temperature and at various intervals as a function of extreme temperature thermal cycling and bake duration. Electrical resistance measurements made at room temperature are reported and the tests to date have shown some change in resistance as a function of extreme temperature thermal cycling and some showed increase in resistance. However, the change in interconnect resistance becomes more noticeable with increasing number of thermal cycles. Further research work will be carried out to understand the reliability of packages under extreme temperature applications (-185oC to +125oC) via continuously monitoring the daisy chain resistance for BGA, Flat-packs, lead less chip packages, etc. This paper will describe the experimental reliability results of miniaturized passive components (01005, 0201, 0402, 0603, 0805, and 1206) assembled using surface mounting processes with tin-lead and lead-free solder alloys under extreme temperature environments.

extreme temperatures,↗

Use of unbalanced laminates as a screening method for microcracking

State-of-the-art, high temperature polyimide matrix composites, reinforced with continuous graphite fibers are known to be susceptible to intraply cracking when thermally cycled over their useful service temperature range. It is believed that the transply cracking, in part, results from residual stresses caused by differences in coefficients of thermal expansion (CTE) between the polymer matrix and the reinforcement. Thermal cycling tests to investigate this phenomenon involve expensive time and energy consuming programs which are not economically feasible for use as a part of a materials screening process. As an alternative to thermal cycling studies, a study of unbalanced crossply graphite fiber reinforcement composites was conducted to assess the effect of the composite ply layup and surface condition on the residual stresses that remain after the processing of these materials. The residual stresses were assessed by measuring the radii of curvature of the types of laminates that were studied. The temperature at which stress-free conditions existed were determined and a dye penetrant method was used to observe surface damage resulting from excessive residual stress buildup. These results are compared with some published results of thermal cycling tests that were previously conducted on balanced polyimide composites.

Papadopoulos, Demetrios S.↗