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At least 253 records · Page 14

Anisotropic Tribological Properties of Silicon Carbide

The anisotropic friction, deformation and fracture behavior of single crystal silicon carbide surfaces were investigated in two categories. The categories were called adhesive and abrasive wear processes, respectively. In the adhesive wear process, the adhesion, friction and wear of silicon carbide were markedly dependent on crystallographic orientation. The force to reestablish the shearing fracture of adhesive bond at the interface between silicon carbide and metal was the lowest in the preferred orientation of silicon carbide slip system. The fracturing of silicon carbide occurred near the adhesive bond to metal and it was due to primary cleavages of both prismatic (10(-1)0) and basal (0001) planes.

Miyoshi, K.↗

A thermoplastic polyimidesulfone

A polymer system has been prepared which has the excellent thermoplastic properties generally associated with polysulfones, and the solvent resistance and thermal stability of aromatic polyimides. This material, with improved processability over the base polyimide, can be processed in the 260-325 C range in such a manner as to yield high quality, tough unfilled moldings; strong, high-temperature-resistant adhesive bonds; and well consolidated, graphite-fiber-reinforced moldings (composities). The unfilled moldings have physical properties that are similar to aromatic polysulfones which demonstrates the potential as an engineering thermoplastic. The adhesive bonds exhibit excellent retention of initial strength levels even after thermal aging for 5000 hours at 232 C. The graphite-fiber-reinforced moldings have mechanical properties which makes this polymer attractive for the fabrication of structural composites.

St.clair, T. L.↗

A thermoplastic polyimidesulfone

A polymer system has been prepared which has the excellent thermoplastic properties generally associated with polysulfones, and the solvent resistance and thermal stability of aromatic polyimides. This material, with improved processability over the base polyimide, can be processed in the 260-325 C range in such a manner as to yield high quality, tough unfilled moldings; strong, high-temperature-resistant adhesive bonds; and well consolidated, graphite-fiber-reinforced moldings (composites). The unfilled moldings have physical properties that are similar to aromatic polysulfones which demonstrates the potential as an engineering thermoplastic. The adhesive bonds exhibit excellent retention of initial strength levels even after thermal aging for 5000 hours at 232 C. The graphite-fiber-reinforced moldings have mechanical properties which makes this polymer attractive for the fabrication of structural composites.

St. Clair, T. L.↗

Cryogenic Insulation System

This invention relates to reusable, low density, high temperature cryogenic foam insulation systems and the process for their manufacture. A pacing technology for liquid hydrogen fueled, high speed aircraft is the development of a fully reusable, flight weight cryogenic insulation system for propellant tank structures. In the invention cryogenic foam insulation is adhesively bonded to the outer wall of the fuel tank structure. The cryogenic insulation consists of square sheets fabricated from an array of abutting square blocks. Each block consists of a sheet of glass cloth adhesively bonded between two layers of polymethacrylimide foam. Each block is wrapped in a vapor impermeable membrane, such as Kapton(R) aluminum Kapton(R), to provide a vapor barrier. Very beneficial results can be obtained by employing the present invention in conjunction with fibrous insulation and an outer aeroshell, a hot fuselage structure with an internal thermal protection system.

Davis, Randall C.↗

Residual stress alleviation of aircraft metal structures reinforced with filamentary composites

Methods to eliminate or reduce residual stresses in aircraft metal structures reinforced by filamentary composites are discussed. Residual stress level reductions were achieved by modifying the manufacturing procedures used during adhesive bonding. The residual stress alleviation techniques involved various forms of mechanical constraint which were applied to the components during bonding. Nine methods were evaluated, covering a wide range in complexity. All methods investigated during the program affected the residual stress level. In general, residual stresses were reduced by 70 percent or more from the stress level produced by conventional adhesive bonding procedures.

Kelly, J. B.↗

The design of repairable advanced composite structures

This paper addresses the repair of advanced composite structures by mechanical fasteners or by adhesive bonding. It is shown that many of today's composite designs are unreasonably difficult to repair. Conversely, the knowledge to design repairable structures is already available, if only it is applied during the initial design stage. Bolted or riveted repairs require only the avoidance of extremely orthotropic composite fiber patterns; those near the quasi-isotropic layup are the most suitable. Mildly orthotropic fiber patterns are appropriate for structures in which there is a dominant load direction. Thick composite structures are shown to require bolted or riveted repairs while thin structures favor adhesively bonded permanent repairs, although provisions can be easily made for temporary mechanical repairs. The reasons why integrally stiffened cocured composite designs are usually impractical to repair are explained and alternative repairable design concepts are presented.

Hart-Smith, L. J.↗

Materials Safety - Not just Flammability and Toxic Offgassing

For many years, the safety community has focused on a limited subset of materials and processes requirements as key to safety: Materials flammability, Toxic offgassing, Propellant compatibility, Oxygen compatibility, and Stress-corrosion cracking. All these items are important, but the exclusive focus on these items neglects many other items that are equally important to materials safety. Examples include (but are not limited to): 1. Materials process control -- proper qualification and execution of manufacturing processes such as structural adhesive bonding, welding, and forging are crucial to materials safety. Limitation of discussions on materials process control to an arbitrary subset of processes, known as "critical processes" is a mistake, because any process where the quality of the product cannot be verified by inspection can potentially result in unsafe hardware 2 Materials structural design allowables -- development of valid design allowables when none exist in the literature requires extensive testing of multiple lots of materials and is extremely expensive. But, without valid allowables, structural analysis cannot verify structural safety 3. Corrosion control -- All forms of corrosion, not just stress corrosion, can affect structural integrity of hardware 4. Contamination control during ground processing -- contamination control is critical to manufacturing processes such as adhesive bonding and also to elimination foreign objects and debris (FOD) that are hazardous to the crew of manned spacecraft in microgravity environments. 5. Fasteners -- Fastener design, the use of verifiable secondary locking features, and proper verification of fastener torque are essential for proper structural performance This presentation discusses some of these key factors and the importance of considering them in ensuring the safety of space hardware.

Pedley, Michael D.↗

Acoustic emission analysis: A test method for metal joints bonded by adhesives

Acoustic emission analysis is applied to study adhesive joints which had been subjected to mechanical and climatic stresses, taking into account conditions which make results applicable to adhesive joints used in aerospace technology. Specimens consisting of the alloy AlMgSi0.5 were used together with a phenolic resin adhesive, an epoxy resin modified with a polyamide, and an epoxy resin modified with a nitrile. Results show that the acoustic emission analysis provides valuable information concerning the behavior of adhesive joints under load and climatic stresses.

Brockmann, W.↗

Adhesives for bonding RSI tile to GrPI structure for advanced space transportation systems

A system was developed for bonding RSI tiles to a graphite/polymide composite substrate which would withstand the full range of environmental conditions. The bonding system, designated RA59, consists of a mixture of glass (sesquisiloxane) resin in RTV 560 silicone. A significant number of data points for the RA59 are in the 65-psi failure range both when tested, and after exposure to 700 F. This is over two times the best shear and tensile values obtained with RV60 at this temperature. It is concluded that with a thorough understanding of the critical parameters involved, the higher values should be obtained consistently with the RA59. This is of particular significance if higher strength tiles were to be used in a hard-bonded configuration.

Smith, K. E.↗

Repeatability of mixed-mode adhesive debonding

The repeatability of debond growth rates in adhesively bonded subjected to constant-amplitude cyclic loading was studied. Debond growth rates were compared from two sets of cracked-lap-shear specimens that were fabricated by two different manufacturers and tested in different laboratories. The fabrication method and testing procedures were identical for both sets of specimens. The specimens consisted of aluminum adherends bonded with FM-73 adhesive. Critical values of strain-energy-release rate were also determined from specimens that were monotonically loaded to failure. The test results showed that the debond growth rates for the two sets of specimens were within a scatter band which is similar to that observed in fatigue crack growth in metals. Cyclic debonding occurred at strain-energy-release rates that were more than an order of magnitude less than the critical strain-energy-release rate in static tests.

Everett, R. A., Jr.↗

Repeatability of mixed-mode adhesive debonding

The repeatability of debond growth rates in adhesively bonded subjected to constant-amplitude cyclic loading was studied. Debond growth rates were compared from two sets of cracked-lap-shear specimens that were fabricated by two different manufacturers and tested in different laboratories. The fabrication method and testing procedures were identical or both sets of specimens. The specimens consisted of aluminum adherends bonded with FM-73 adhesive. Critical values of strain-energy-release rate were also determined from specimens that were monotonically loaded to failure. The test results showed that the debond growth rates for the two sets of specimens were within a scatter band which is similar to that observed in fatigue crack growth in metals. Cyclic debonding occurred at strain-energy-release rates that were more than an order of magnitude less than the critical strain-energy-release rate in static tests.

Everett, R. A., Jr.↗

Theoretical and Experimental Evaluation of the Bond Strength Under Peeling Loads

Reliable applications of adhesively bonded joints require understanding of the stress distribution along the bond-line and the stresses that are responsible for the joint failure. To properly evaluate factors affecting peel strength, effects of defects such as voids on the stress distribution in the overlap region must be understood. In this work, the peel stress distribution in a single lap joint is derived using a strength of materials approach. The bonded joint is modeled as Euler-Bernoulli beams, bonded together with an adhesive. which is modeled as an elastic foundation which can resist both peel and shear stresses. It is found that for certain adhesive and adherend geometries and properties, a central void with the size up to 50 percent of the overlap length has negligible effect on the peak peel and shear stresses. To verify the solutions obtained from the model, the problem is solved again by using the finite element method and by treating the adherends and the adhesive as elastic materials. It is found that the model used in the analysis not only predicts the correct trend for the peel stress distribution but also gives rather surprisingly close results to that of the finite element analysis. It is also found that both shear and peel stresses can be responsible for the joint performance and when a void is introduced, both of these stresses can contribute to the joint failure as the void size increases. Acoustic emission (AE) activities of aluminum-adhesive-aluminum specimens with different void sizes were monitored. The AE ringdown counts and energy were very sensitive and decreased significantly with the void size. It was observed that the AE events were shifting towards the edge of the overlap where the maximum peeling and shearing stresses were occurring as the void size increased.

Nayeb-Hashemi, Hamid↗

Surface characterization in composite and titanium bonding

The failure surface analysis of adhesively bonded carbon fiber composites is described. The emphasis is on the bonding of composites when the surface has been made intentionally resin-rich. Also discussed is surface analysis of both commercially available and pretreated carbon fibers. The interaction of the fibers with polysulfone is described.

Devilbiss, T. A.↗