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At least 253 records · Page 14

Reliability Effects of Surge Current Testing of Solid Tantalum Capacitors

Solid tantalum capacitors are widely used in space applications to filter low-frequency ripple currents in power supply circuits and stabilize DC voltages in the system. Tantalum capacitors manufactured per military specifications (MIL-PRF-55365) are established reliability components and have less than 0.001% of failures per 1000 hours (the failure rate is less than 10 FIT) for grades D or S, thus positioning these parts among electronic components with the highest reliability characteristics. Still, failures of tantalum capacitors do happen and when it occurs it might have catastrophic consequences for the system. This is due to a short-circuit failure mode, which might be damaging to a power supply, and also to the capability of tantalum capacitors with manganese cathodes to self-ignite when a failure occurs in low-impedance applications. During such a failure, a substantial amount of energy is released by exothermic reaction of the tantalum pellet with oxygen generated by the overheated manganese oxide cathode, resulting not only in destruction of the part, but also in damage of the board and surrounding components. A specific feature of tantalum capacitors, compared to ceramic parts, is a relatively large value of capacitance, which in contemporary low-size chip capacitors reaches dozens and hundreds of microfarads. This might result in so-called surge current or turn-on failures in the parts when the board is first powered up. Such a failure, which is considered as the most prevalent type of failures in tantalum capacitors [I], is due to fast changes of the voltage in the circuit, dV/dt, producing high surge current spikes, I(sub sp) = Cx(dV/dt), when current in the circuit is unrestricted. These spikes can reach hundreds of amperes and cause catastrophic failures in the system. The mechanism of surge current failures has not been understood completely yet, and different hypotheses were discussed in relevant literature. These include a sustained scintillation breakdown model [1-3]; electrical oscillations in circuits with a relatively high inductance [4-6]; local overheating of the cathode [5,7, 8]; mechanical damage to tantalum pentoxide dielectric caused by the impact of MnO2 crystals [2,9, 10]; or stress-induced-generation of electron traps caused by electromagnetic forces developed during current spikes [11]. A commonly accepted explanation of the surge current failures is that at unlimited current supply during surge current conditions, the self-healing mechanism in tantalum capacitors does not work, and what would be a minor scintillation spike if the current were limited, becomes a catastrophic failure of the part [l, 12]. However, our data show that the scintillation breakdown voltages are significantly greater that the surge current breakdown voltages, so it is still not clear why the part, which has no scintillations, would fail at the same voltage during surge current testing (SCT).

Teverovsky, Alexander↗

Vibration resistance of the wire-feed mechanism of a magnetic recording apparatus

The effects of external mechanical and climatic actions on the efficient operation of magnetic tape recording equipment are analyzed. The efficiency and reliability of the recording system are determined by the structural parameters and the characteristics of the individual elements of the transport mechanism circuit. The resistance of tape recording equipment to the effects of vibration is considered essential for reliable operations. Methods for insuring reliable tape transport and recording action are discussed.

Kitra, S. P.↗

A technique for evaluating the application of the pin-level stuck-at fault model to VLSI circuits

Accurate fault models are required to conduct the experiments defined in validation methodologies for highly reliable fault-tolerant computers (e.g., computers with a probability of failure of 10 to the -9 for a 10-hour mission). Described is a technique by which a researcher can evaluate the capability of the pin-level stuck-at fault model to simulate true error behavior symptoms in very large scale integrated (VLSI) digital circuits. The technique is based on a statistical comparison of the error behavior resulting from faults applied at the pin-level of and internal to a VLSI circuit. As an example of an application of the technique, the error behavior of a microprocessor simulation subjected to internal stuck-at faults is compared with the error behavior which results from pin-level stuck-at faults. The error behavior is characterized by the time between errors and the duration of errors. Based on this example data, the pin-level stuck-at fault model is found to deliver less than ideal performance. However, with respect to the class of faults which cause a system crash, the pin-level, stuck-at fault model is found to provide a good modeling capability.

Palumbo, Daniel L.↗

PCB Quality Metrics that Drive Reliability

Risk-based technology infusion is a deliberate and systematic process that defines the analysis and communication methodology by which new technology is applied and integrated into existing and new designs, identifies technology development needs based on trends analysis and facilitates the identification of shortfalls against performance objectives. This presentation at IPC Works Asia Aerospace 2021 Events provides the audience a snapshot of quality variations in printed-wiring-board quality, as assessed, using experiences in processing and risk analysis of PWB structural integrity coupons. The presentation will focus on printed-wiring-board quality metrics used, the relative type and number of non-conformances observed and trend analysis using statistical methods. Trend analysis shows the top five non-conformances observed across PWB suppliers, the root cause(s) behind these non-conformance and suggestions of mitigation plans. The trends are then matched with the current state of the PWB supplier base and its challenges and opportunities. The presentation further discusses the risk-based SMA approaches and methods being applied at GSFC for evaluating candidate printed wiring board technologies that promote the adoption of higher throughput and faster processing technology for GSFC missions.

Printed circuit boards↗

Embedded Temperature-Change Sensors

Transducers sensitive to rates of change of temperature embedded in integrated circuits and discrete electronic components damaged by overheating, according to proposal. Used to detect onset of rapid heating and to trigger shutoffs of power or other corrective actions before temperatures rise beyond safe limits. Sensors respond fast and reliably to incipient overheating because they are in direct thermal contact with vulnerable circuit elements.

Thakoor, Sarita↗

Data reformatting with less hardware

Dual-function integrated circuits use one shift register array instead of two to feed video data to seven tape channels thereby making system more reliable and less expensive than predecessor. Basic principle of reformatter is also applicable to multiplexing and frequency conversion circuits.

Engel, A.↗

Fault tolerant sequential circuits using sequence invariant state machines

The idea of introducing redundancy to improve the reliability of digital systems originates from papers published in the 1950's. Since then, redundancy has been recognized as a realistic means for constructing reliable systems. A method using redundancy to reconfigure the Sequency Invariant State Machine (SISM) to achieve fault tolerance is introduced. This new architecture is most useful in space applications, where recovery rather than replacement of faulty modules is the only means of maintenance.

Alahmad, M.↗

Impact of VLSI/VHSIC on satellite on-board signal processing

Forecasted improvements in IC fabrication techniques, such as the use of X-ray lithography, are expected to yield submicron circuit feature sizes within the decade of the 1980s. As dimensions decrease, reliability, cost, speed, power consumption and density improvements will be realized which have a significant impact on the capabilities of onboard spacecraft signal processing functions. This will in turn result in increases of the intelligence that may be deployed on spaceborne remote sensing platforms. Among programs oriented toward such goals are the silicon-based Very High Speed Integrated Circuit (VHSIC) researches sponsored by the U.S. Department of Defense, and efforts toward the development of GaAs devices which will compete with silicon VLSI technology for future applications. GaAs has an electron mobility which is five to six times that of silicon, and promises commensurate computation speed increases under low field conditions.

Aanstoos, J. V.↗

Power Electronics Being Developed for Deep Space Cryogenic Applications

Electronic circuits and systems designed for deep space missions need to operate reliably and efficiently in harsh environments that include very low temperatures. Spacecraft that operate in such cold environments carry a large number of heaters so that the ambient temperature for the onboard electronics remains near 20 C. Electronics that can operate at cryogenic temperatures will simplify system design and reduce system size and weight by eliminating the heaters and their associated structures. As a result, system development and launch cost will be reduced. At the NASA Glenn Research Center, an ongoing program is focusing on the development of power electronics geared for deep space low-temperature environments. The research and development efforts include electrical components design, circuit design and construction, and system integration and demonstration at cryogenic temperatures. Investigations are being carried out on circuits and systems that are targeted for use in NASA missions where low temperatures will be encountered: devices such as ceramic and tantalum capacitors, metal film resistors, semiconductor switches, magnetics, and integrated circuits including dc/dc converters, operational amplifiers, voltage references, and motor controllers. Test activities cover a wide range of device and circuit performance under simple as well as complex test conditions, such as multistress and thermal cycling. The effect of low-temperature conditions on the switching characteristics of an advanced silicon-on-insulator field effect transistor is shown. For gate voltages (VGS) below 2.6 V, drain currents at -190 C are lower than drain currents at room temperature (20 C).

Patterson, Richard L.↗

Advanced combined iodine dispenser and detector

A total weight of 1.23 kg (2.7 lb), a total volume of 1213 cu m (74 cu in), and an average power consumption of 5.5W was achieved in the advanced combined iodine dispenser/detector by integrating the detector with the iodine source, arranging all iodinator components within a compact package and lowering the parasitic power to the detector and electronics circuits. These achievements surpassed the design goals of 1.36 kg (3.0 lb), 1671 cu m (102 cu in) and 8W. The reliability and maintainability were improved by reducing the detector lamp power, using an interchangeable lamp concept, making the electronic circuit boards easily accessible, providing redundant water seals and improving the accessibility to the iodine accumulator for refilling. The system was designed to iodinate (to 5 ppm iodine) the fuel cell water generated during 27 seven-day orbiter missions (equivalent to 18,500 kg (40,700 lb) of water) before the unit must be recharged with iodine crystals.

Lantz, J. B.↗

Flueric-controller pneumatic stepping motor system

Nutating stepping motor consists of an output rotating gear and a nutating gear. A flueric logic circuit controls the nutating motor. The complete system constitutes a reliable, open loop actuator system with inherently high output stiffness, reasonable slewing speeds and small step size.

Dustin, M. O.↗

Energetic particles experiment instrumentation packaging program for IMP-F (Explorer 34) and IMP-G (Explorer 41) NASA Interplanetary Monitoring Platform program

The package design and assembly techniques for the IMP-F and IMP-G space-physics experiments, provided for the NASA Interplanetary Monitoring Platform Program are described. Thin-film, hybrid, integrated circuits used in these instruments to increase component density and reliability, and special procedures and precautions for the fabrication of space hardware are described.

Source record↗

Establishment of quality, reliability and design standards for low, medium, and high power microwave hybrid microcircuits

Quality, reliability, and design standards for microwave hybrid microcircuits were established. The MSFC Standard 85M03926 for hybrid microcircuits was reviewed and modifications were generated for use with microwave hybrid microcircuits. The results for reliability tests of microwave thin film capacitors, transistors, and microwave circuits are presented. Twenty-two microwave receivers were tested for 13,500 unit hours. The result of 111,121 module burn-in and operating hours for an integrated solid state transceiver module is reported.

Robinson, E. A.↗

A concept for a transparent data acquisition and distribution system for spaceflight applications

The paper describes the Modular Data System concept of the NASA End-to-End Data System program. Data from a single instrument along with the necessary ancillary data will be assembled into self-contained packets and subsequently transmitted over various communications links (space telemetry channel, ground communications circuits, etc.) to the experimenter's facility in real time; reliable error control coding will be included in each link transmission to protect the integrity of the data packets. A major objective is to make the entire data acquisition and distribution process transparent to the experimenter in the sense that the output terminal of the distribution system will be physically, logically and electrically identical to that of the experiment output channel.

Greene, E. P.↗

All-in-One Chip

Under an SBIR contract, EMC Technology, Inc., was funded to develop a family of Temperature Compensating Attenuators. These devices are used to compensate for changes in amplifier gain with temperatures. Special thermistor materials were developed that not only satisfied NASA requirements, but also proved useful on several new commercial products. New Thermopad devices with greater compensation and lower loss were developed and used by companies such as Hughes Space and Communications, Motorola, Lucent, Ericsson, and General Instrument. A Power Sensing Termination (Smartload) was also developed for use in communication systems that require accurate, reliable, low cost power detection for level control and alarm circuits.

Source record↗

Report on Project to Characterize Multi-Junction Solar Cells in the Stratosphere using Low-Cost Balloon and Communication Technologies

Balloon, control and communication technologies are under development in our laboratory for testing multi-junction solar cells in the stratosphere to achieve near AM0 conditions. One flight, Suntracker I, has been carried out reported earlier. We report on our efforts in preparation for a second flight, Suntracker II, that was aborted due to hardware problems. The package for Suntracker I system has been modified to include separate electronics and battery packs for the 70 centimeter and 2 meter systems. The collimator control system and motor gearboxes have been redesigned to address problems with the virtual stops and backlash. Surface mount technology on a printed circuit board was used in place of the through-hole prototype circuit in efforts to reduce weight and size, and improve reliability. A mobile base station has been constructed that includes a 35' tower with a two axis rotator and multi-element yagi antennas. Modifications in Suntracker I and the factors that lead to aborting Suntracker II are discussed.

Mirza, Ali↗