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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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NASA NTRS2011

Fiber-Reinforced Reactive Nano-Epoxy Composites

An ultra-high-molecular-weight polyethylene/ matrix interface based on the fabrication of a reactive nano-epoxy matrix with lower surface energy has been improved. Enhanced mechanical properties versus pure epoxy on a three-point bend test include: strength (25 percent), modulus (20 percent), and toughness (30 percent). Increased thermal properties include higher Tg (glass transition temperature) and stable CTE (coefficient of thermal expansion). Improved processability for manufacturing composites includes faster wetting rates on macro-fiber surfaces, lower viscosity, better resin infusion rates, and improved rheological properties. Improved interfacial adhesion properties with Spectra fibers by pullout tests include initial debonding force of 35 percent, a maximum pullout force of 25 percent, and energy to debond at 65 percent. Improved mechanical properties of Spectra fiber composites (tensile) aging resistance properties include hygrothermal effects. With this innovation, high-performance composites have been created, including carbon fibers/nano-epoxy, glass fibers/nano-epoxy, aramid fibers/ nano-epoxy, and ultra-high-molecularweight polyethylene fiber (UHMWPE).

Zhong, Wei-Hong↗
NASA NTRS2011

Metal-Matrix/Hollow-Ceramic-Sphere Composites

A family of metal/ceramic composite materials has been developed that are relatively inexpensive, lightweight alternatives to structural materials that are typified by beryllium, aluminum, and graphite/epoxy composites. These metal/ceramic composites were originally intended to replace beryllium (which is toxic and expensive) as a structural material for lightweight mirrors for aerospace applications. These materials also have potential utility in automotive and many other terrestrial applications in which there are requirements for lightweight materials that have high strengths and other tailorable properties as described below. The ceramic component of a material in this family consists of hollow ceramic spheres that have been formulated to be lightweight (0.5 g/cm3) and have high crush strength [40.80 ksi (.276.552 MPa)]. The hollow spheres are coated with a metal to enhance a specific performance . such as shielding against radiation (cosmic rays or x rays) or against electromagnetic interference at radio and lower frequencies, or a material to reduce the coefficient of thermal expansion (CTE) of the final composite material, and/or materials to mitigate any mismatch between the spheres and the matrix metal. Because of the high crush strength of the spheres, the initial composite workpiece can be forged or extruded into a high-strength part. The total time taken in processing from the raw ingredients to a finished part is typically 10 to 14 days depending on machining required.

Baker, Dean M.↗
NASA NTRS2012

Enabling Large Focal Plane Arrays through Mosaic Hybridization

We have demonstrated the hybridization of large mosaics of far-infrared detectors, joining separately fabricated sub-units into a single unit on a single, large substrate. We produced a single detector mockup on a 100mm diameter wafer and four mockup readout quadrant chips from a separate 100mm wafer. The individually fabricated parts were hybridized using a Suss FC150 flip chip bonder to assemble the detector-readout stack. Once all of the hybridized readouts were in place, a single, large and thick silicon substrate was placed on the stack and attached with permanent epoxy to provide strength and a Coefficient of Thermal Expansion (CTE) match to the silicon components underneath. Wirebond pads on the readout chips connect circuits to warm readout electronics; and were used to validate the successful superconducting electrical interconnection of the mockup mosaic-hybridized detector. This demonstration is directly scalable to 150 mm diameter wafers, enabling pixel areas over ten times the area currently demonstrated.

Miller, Timothy M.↗
NASA NTRS2012

Demonstration of Minimally Machined Honeycomb Silicon Carbide Mirrors

Honeycomb silicon carbide composite mirrors are made from a carbon fiber preform that is molded into a honeycomb shape using a rigid mold. The carbon fiber honeycomb is densified by using polymer infiltration pyrolysis, or through a reaction with liquid silicon. A chemical vapor deposit, or chemical vapor composite (CVC), process is used to deposit a polishable silicon or silicon carbide cladding on the honeycomb structure. Alternatively, the cladding may be replaced by a freestanding, replicated CVC SiC facesheet that is bonded to the honeycomb. The resulting carbon fiber-reinforced silicon carbide honeycomb structure is a ceramic matrix composite material with high stiffness and mechanical strength, high thermal conductivity, and low CTE (coefficient of thermal expansion). This innovation enables rapid, inexpensive manufacturing. The web thickness of the new material is less than 1 millimeter, and core geometries tailored. These parameters are based on precursor carbon-carbon honeycomb material made and patented by Ultracor. It is estimated at the time of this reporting that the HoneySiC(Trademark) will have a net production cost on the order of $38,000 per square meter. This includes an Ultracor raw material cost of about $97,000 per square meter, and a Trex silicon carbide deposition cost of $27,000 per square meter. Even at double this price, HoneySiC would beat NASA's goal of $100,000 per square meter. Cost savings are estimated to be 40 to 100 times that of current mirror technologies. The organic, rich prepreg material has a density of 56 kilograms per cubic meter. A charred carbon-carbon panel (volatile organics burnt off) has a density of 270 kilograms per cubic meter. Therefore, it is estimated that a HoneySiC panel would have a density of no more than 900 kilograms per cubic meter, which is about half that of beryllium and about onethird the density of bulk silicon carbide. It is also estimated that larger mirrors could be produced in a matter of weeks. Each cell is completely uniform, maintaining the shape of the inserted mandrel. Furthermore, the layup creates pressure that insures node bond strength. Each node is a composite laminate using only the inherent resin system to form the bond. This contrasts starkly with the other known method of producing composite honeycomb, in which individual corrugations are formed, cured, and then bonded together in a secondary process. By varying the size of the mandrels within the layup, varying degrees of density can be achieved. Typical sizes are 3/8 and 3/16 in. (approximately 10 and 5 millimeters). Cell sizes up to 1 in. (approximately 25 millimeters) have been manufactured. Similarly, the shape of the core can be altered for a flexible honeycomb structure.

Goodman, William↗
NASA NTRS2012

Ceramic matrix composite turbine engine vane

A vane has an airfoil shell and a spar within the shell. The vane has an outboard shroud at an outboard end of the shell and an inboard platform at an inboard end of the shell. The shell includes a region having a coefficient of thermal expansion (CTE) varying with depth.

Schaff, Jeffery R.↗
NASA NTRS2012

Improving the Inventory of Large Lunar Basins: Using LOLA Data to Test Previous Candidates and Search for New Ones

Topography and crustal thickness data from LOLA altimetry were used to test the validity of 98 candidate large lunar basins derived from photogeologic and earlier topographic and crustal thickness data, and to search for possible new candidates. We eliminate 23 previous candidates but find good evidence for 20 new candidates. The number of basins greater than 300 km diameter on the Moon is almost certainly a factor 2 (maybe 3?) larger than the number of named features having basin-like topography. Unified Lunar Control Net 2005 data [1] and model crustal thickness data [2] were previously used to search for possible previously unrecognized large lunar impact basins [3,4]. An inventory of 98 candidate topographic basins greater than 300 km in diameter was found [5]. This includes 33 named features (only those having basin-like topography) out of the 45 listed by Wilhelms [6], 38 additional Quasi-Circular Depressions (QCDs) found in the ULCN2005 topography, and 27 Circular Thin Areas (CTAs) found in model crustal thickness data [2]. Most named features and additional QCDs have strong CTA signatures, but there may be a class of CTAs that are not easily recognized in the old and low resolution ULCN2005 topography. Lunar Orbiter Laser Altimeter (LOLA) data have recently become publically available. We used these data to (a) refine the center and ring diameters of known basins, (b) test the viability of the candidate basins previously found (as described above), and (c) search for additional candidate basins not revealed by the earlier lower resolution data. We used the LOLA topography directly but also a recent new model crustal thickness data that includes Kaguya gravity data [7]. We repeated a Topographic Expression (TE) and a Crustal Thickness Expression (CTE) scoring exercise originally done with the basins found in ULCN and earlier model crustal thickness data [5]. Each candidate was scored on a scale from 0 (no topographic basin or circular thin area signature) to 5 (strong circular low or strong circular thin area signature). These were combined into a total score used to rank the probability for each candidate basin. We used the same GRIDVIEW software to stretch, contour and profile the LOLA and new crustal thickness data as was done with the ULCN2005 and older model crustal thickness data.

Frey, H. V.↗
NASA NTRS2012

Preliminary Crater Retention Ages for an Expanded Inventory of Large Lunar Basins

Based on LOLA topography and a new crustal thickness model, the number of candidate lunar basins greater than 300 km in diameter is at least a factor 2 larger than the traditional number based on photogeology alone, and may be as high as 95. Preliminary N(50) crater retention ages for this population of candidate basins shows two distinct peaks. Frey [1] suggested, based on Clementine-era topography (ULCN2005) and a crustal thickness model based on Lunar Prospector data [2], that there could be as many as 98 lunar basins greater than 300 km diameter. Many of the weaker cases have not stood up to recent testing [3,4,5] using LOLA data and a newer crustal thickness model based on Kaguya gravity data and LOLA topography data [6]. As described in companion abstracts [4,5], we have deleted from the earlier inventory 1 more named feature (Sikorsky- Rittenhouse; LOLA data show that its diameter is actually less than 300 km), 11 Quasi-Circular Depressions (QCDs) identified in the ULCN topography, and 11 Circular Thin Areas (CTAs) found in the earlier crustal thickness model [2]. We did this by repeating the scoring exercise originally done in [1] but with the new data [4,5]. Topographic Expression (TE) and Crustal Thickness Expression (CTE) scores were determined for each candidate on a scale of 0 to 5 (5 being a strong, circular signature, 0 for those with no discernible circular topographic or crustal thickness signature). These scores are added together to produce a Summary Score which has a range of 0 to 10. We eliminated all candidates with a Summary Score less than 3, as well as other cases where, for example, the TE went to zero because what looked like a single large circular QCD in the lower resolution ULCN data was in fact a cluster of smaller deep impacts readily apparent in the newer higher resolution LOLA data. This process reduced the original inventory from 98 to 75 candidates.

Frey, H. V.↗
NASA NTRS2013

Silicon Heat Pipe Array

Improved methods of heat dissipation are required for modern, high-power density electronic systems. As increased functionality is progressively compacted into decreasing volumes, this need will be exacerbated. High-performance chip power is predicted to increase monotonically and rapidly with time. Systems utilizing these chips are currently reliant upon decades of old cooling technology. Heat pipes offer a solution to this problem. Heat pipes are passive, self-contained, two-phase heat dissipation devices. Heat conducted into the device through a wick structure converts the working fluid into a vapor, which then releases the heat via condensation after being transported away from the heat source. Heat pipes have high thermal conductivities, are inexpensive, and have been utilized in previous space missions. However, the cylindrical geometry of commercial heat pipes is a poor fit to the planar geometries of microelectronic assemblies, the copper that commercial heat pipes are typically constructed of is a poor CTE (coefficient of thermal expansion) match to the semiconductor die utilized in these assemblies, and the functionality and reliability of heat pipes in general is strongly dependent on the orientation of the assembly with respect to the gravity vector. What is needed is a planar, semiconductor-based heat pipe array that can be used for cooling of generic MCM (multichip module) assemblies that can also function in all orientations. Such a structure would not only have applications in the cooling of space electronics, but would have commercial applications as well (e.g. cooling of microprocessors and high-power laser diodes). This technology is an improvement over existing heat pipe designs due to the finer porosity of the wick, which enhances capillary pumping pressure, resulting in greater effective thermal conductivity and performance in any orientation with respect to the gravity vector. In addition, it is constructed of silicon, and thus is better suited for the cooling of semiconductor devices.

Yee, Karl Y.↗
NASA NTRS2013

Advances in the Development of a WCl6 CVD System for Coating UO2 Powders with Tungsten

W-UO2 CERMET fuels are under development to enable Nuclear Thermal Propulsion (NTP) for deep space exploration. Research efforts with an emphasis on fuel fabrication, testing, and identification of potential risks is underway. One primary risk is fuel loss due to CTE mismatch between W and UO2 and the grain boundary structure of W particles resulting in higher thermal stresses. Mechanical failure can result in significant reduction of the UO2 by hot hydrogen. Fuel loss can be mitigated if the UO2 particles are coated with a layer of high density tungsten before the consolidation process. This paper discusses the work to date, results, and advances of a fluidized bed chemical vapor deposition (CVD) system that utilizes the H2-WCl6 reduction process. Keywords: Space, Nuclear, Thermal, Propulsion, Fuel, CERMET, CVD, Tungsten, Uranium

Mireles, Omar R.↗
NASA NTRS2014

Development Status of a CVD System to Deposit Tungsten onto UO2 Powder via the WCI6 Process

Nuclear Thermal Propulsion (NTP) is under development for deep space exploration. NTP's high specific impulse (> 850 second) enables a large range of destinations, shorter trip durations, and improved reliability. W-60vol%UO2 CERMET fuel development efforts emphasize fabrication, performance testing and process optimization to meet service life requirements. Fuel elements must be able to survive operation in excess of 2850 K, exposure to flowing hydrogen (H2), vibration, acoustic, and radiation conditions. CTE mismatch between W and UO2 result in high thermal stresses and lead to mechanical failure as a result UO2 reduction by hot hydrogen (H2) [1]. Improved powder metallurgy fabrication process control and mitigated fuel loss can be attained by coating UO2 starting powders within a layer of high density tungsten [2]. This paper discusses the advances of a fluidized bed chemical vapor deposition (CVD) system that utilizes the H2-WCl6 reduction process.

Mireles, O. R.↗
NASA NTRS2013

Silicon Carbide Telescope Investigations for the LISA Mission

Space-based gravitational wave (GW) detectors are conceived to detect GWs in the low frequency range (mili-Hertz) by measuring the distance between free-falling proof masses in spacecraft (SC) separated by 5 Gm. The reference in the last decade has been the joint ESA-NASA mission LISA. One of the key elements of LISA is the telescope since it simultaneously gathers the light coming from the far SC (approximately or equal to 100 pW) and expands, collimates and sends the outgoing beam (2 W) to the far SC. Demanding requirements have been imposed on the telescope structure: the dimensional stability of the telescope must be approximately or equal to 1pm Hz(exp−1/2) at 3 mHz and the distance between the primary and the secondary mirrors must change by less than 2.5 micrometer over the mission lifetime to prevent defocussing. In addition the telescope structure must be light, strong and stiff. For this reason a potential on-axis telescope structure for LISA consisting of a silicon carbide (SiC) quadpod structure has been designed, constructed and tested. The coefficient of thermal expansion (CTE) in the LISA expected temperature range has been measured with a 1% accuracy which allows us to predict the shrinkage/expansion of the telescope due to temperature changes, and pico-meter dimensional stability has been measured at room temperature and at the expected operating temperature for the LISA telescope (around -6[deg]C). This work is supported by NASA Grants NNX10AJ38G and NX11AO26G,

carbide↗
NASA NTRS2014

Effect of Preconditioning and Soldering on Failures of Chip Tantalum Capacitors

Soldering of molded case tantalum capacitors can result in damage to Ta205 dielectric and first turn-on failures due to thermo-mechanical stresses caused by CTE mismatch between materials used in the capacitors. It is also known that presence of moisture might cause damage to plastic cases due to the pop-corning effect. However, there are only scarce literature data on the effect of moisture content on the probability of post-soldering electrical failures. In this work, that is based on a case history, different groups of similar types of CWR tantalum capacitors from two lots were prepared for soldering by bake, moisture saturation, and longterm storage at room conditions. Results of the testing showed that both factors: initial quality of the lot, and preconditioning affect the probability of failures. Baking before soldering was shown to be effective to prevent failures even in lots susceptible to pop-corning damage. Mechanism of failures is discussed and recommendations for pre-soldering bake are suggested based on analysis of moisture characteristics of materials used in the capacitors' design.

multilayer ceramic capacitor (MLCC)↗
NASA NTRS2014

Properties of Desert Sand and CMAS Glass

As-received desert sand from a Middle East country has been characterized for its phase composition and thermal stability. X-ray diffraction analysis showed the presence of quartz (SiO2), calcite (CaCO3), gypsum (CaSO4.2H2O), and NaAlSi3O8 phases in as-received desert sand and showed weight loss of approx. 35 percent due to decomposition of CaCO3 and CaSO4.2H2O when heated to 1400 C. A batch of as-received desert sand was melted into calcium magnesium aluminosilicate (CMAS) glass at approx. 1500 C. From inductively coupled plasma-atomic emission spectrometry, chemical composition of the CMAS glass was analyzed to be 27.8CaO-4MgO-5Al2O3-61.6SiO2-0.6Fe2O3-1K2O (mole percent). Various physical, thermal and mechanical properties of the glass have been evaluated. Bulk density of CMAS glass was 2.69 g/cc, Young's modulus 92 GPa, Shear modulus 36 GPa, Poisson's ratio 0.28, dilatometric glass transition temperature (T (sub g)) 706 C, softening point (T (sub d)) 764 C, Vickers microhardness 6.3 +/- 0.4 GPa, indentation fracture toughness 0.75 +/- 0.15 MPa.m (sup 1/2), and coefficient of thermal expansion (CTE) 9.8 x 10 (exp -6)/degC in the temperature range 25 to 700 C. Temperature dependence of viscosity has also been estimated from various reference points of the CMAS glass using the Vogel-Fulcher-Tamman (VFT) equation. The glass remained amorphous after heat treating at 850 C for 10 hr but crystallized into CaSiO3 and Ca-Mg-Al silicate phases at 900 C or higher temperatures. Crystallization kinetics of the CMAS glass has also been investigated by differential thermal analysis (DTA). Activation energies for the crystallization of two different phases in the glass were calculated to be 403 and 483 kJ/mol, respectively.

Desert sand↗
NASA NTRS2015

Alumina-Forming MAX Phases in Turbine Material Systems

Coatings for high temperature turbine components are based on low conductivity YSZ thermal barriers and protective NiAl, NiCoCrAlY bond coats. Good oxidation hot corrosion resistance, intermediate CTE, and strain tolerance of Ti2AlC and Cr2AlC MAX phases are thus of special interest. Their alumina scale growth follows a cubic law in accord with FeCrAlY alloys, with oxygen grain boundary diffusivity: Dgb 1.8 x 10-10 exp(-375 kJmole) m3s. Protective cubic kinetics are also found in high pressure burner rig (6 atm., 25 ms) and TGA tests of MAXthal 211Ti2AlC. The initial portion (0.1 hr) is dominated by fast TiO2 growth (with little evidence of scale volatility in high pressure water vapor, as found for SiO2 scales). Bulk Ti2AlC and Cr2AlC substrates show promise as potential bond coats for YSZ TBCs in 1000-1200 C furnace life (500 h) tests. Cr2AlC is proving to be very resistant to 700-900 C Na2SO4 hot corrosion and is of interest for disk alloys. Preliminary diffusion bonded Cr2AlC-superalloy hybrid couples have survived 1000 hr interrupted furnace tests at 800C with no indication of cracking or debonding. Diffusion zones of -NiAl+Cr7C3 were produced in these above 1000 C, but did not grow to any great extent after 1000 hr at 800 C. Processing as coatings presents challenges, however the basic properties of MAX phases provide novel opportunities for high temperature turbine components.

MAX phase↗
NASA NTRS2015

Optimization of a Wcl6 CVD System to Coat UO2 Powder with Tungsten

In order to achieve deep space exploration via Nuclear Thermal Propulsion (NTP), Marshall Space Flight Center (MSFC) is developing W-UO2 CERMET fuel elements, with focus on fabrication, testing, and process optimization. A risk of fuel loss is present due to the CTE mismatch between tungsten and UO2 in the W-60vol%UO2 fuel element, leading to high thermal stresses. This fuel loss can be reduced by coating the spherical UO2 particles with tungsten via H2/WCl6 reduction in a fluidized bed CVD system. Since the latest incarnation of the inverted reactor was completed, various minor modifications to the system design were completed, including an inverted frit sublimer. In order to optimize the parameters to achieve the desired tungsten coating thickness, a number of trials using surrogate HfO2 powder were performed. The furnace temperature was varied between 930 C and 1000degC, and the sublimer temperature was varied between 140 C and 200 C. Each trial lasted 73-82 minutes, with one lasting 205 minutes. A total of 13 trials were performed over the course of three months, two of which were re-coatings of previous trials. The powder samples were weighed before and after coating to roughly determine mass gain, and Scanning Electron Microscope (SEM) data was also obtained. Initial mass results indicated that the rate of layer deposition was lower than desired in all of the trials. SEM confirmed that while a uniform coating was obtained, the average coating thickness was 9.1% of the goal. The two re-coating trials did increase the thickness of the tungsten layer, but only to an average 14.3% of the goal. Therefore, the number of CVD runs required to fully coat one batch of material with the current configuration is not feasible for high production rates. Therefore, the system will be modified to operate with a negative pressure environment. This will allow for better gas mixing and more efficient heating of the substrate material, yielding greater tungsten coating per trial.

Belancik, Grace A.↗
NASA NTRS2014

Low-Cost Radiator for Fission Power Thermal Control

NASA Glenn Research Center (GRC) is developing fission power system technology for future Lunar surface power applications. The systems are envisioned in the 10 to 100kW(sub e) range and have an anticipated design life of 8 to 15 years with no maintenance. NASA GRC is currently setting up a 55 kW(sub e) non-nuclear system ground test in thermal-vacuum to validate technologies required to transfer reactor heat, convert the heat into electricity, reject waste heat, process the electrical output, and demonstrate overall system performance. Reducing the radiator mass, size, and cost is essential to the success of the program. To meet these goals, Advanced Cooling Technologies, Inc. (ACT) and Vanguard Space Technologies, Inc. (VST) are developing a single facesheet radiator with heat pipes directly bonded to the facesheet. The facesheet material is a graphite fiber reinforced composite (GFRC) and the heat pipes are titanium/water. By directly bonding a single facesheet to the heat pipes, several heavy and expensive components can be eliminated from the traditional radiator design such as, POC(TradeMark) foam saddles, aluminum honeycomb, and a second facesheet. A two-heat pipe radiator prototype, based on the single facesheet direct-bond concept, was fabricated and tested to verify the ability of the direct-bond joint to withstand coefficient of thermal expansion (CTE) induced stresses during thermal cycling. The thermal gradients along the bonds were measured before and after thermal cycle tests to determine if the performance degraded. Overall, the results indicated that the initial uniformity of the adhesive was poor along one of the heat pipes. However, both direct bond joints showed no measureable amount of degradation after being thermally cycled at both moderate and aggressive conditions.

Bonding↗
NASA NTRS2015

Extreme Oxidative Durability of TBCs on Ti2AlC MAX Phases

APS and PS-PVD YSZ thermal barrier coatings, applied directly to oxidation resistant Ti2AlC substrates, were oxidized in interrupted furnace tests. Temperature was advanced in 50C intervals from 1100 to 1300C, each 500 h long with eleven cooling cycles. Damage only initiated on the APS coating at 1300C after 15 h, with complete delamination after 500 h. The PS-PVD coating survived all testing. Weight change and metallographic analyses indicate that the YSZ-Ti2AlC systems sustained alumina scale growth of 30-40 m. In comparison, widely used Pt-aluminide bondcoats on single crystal superalloy turbine blades exhibit TBC lives equivalent to alumina scale growth up to 7 m, equivalent to just 200 h at 1200C. It is demonstrated that 25x TBC life improvement (or 180C temperature increase) resulted from the close CTE match of Ti2AlC with those of alumina and YSZ.

protective coating↗
NASA NTRS2015

Body of Knowledge (BOK) for Copper Wire Bonds

Copper wire bonds have replaced gold wire bonds in the majority of commercial semiconductor devices for the latest technology nodes. Although economics has been the driving mechanism to lower semiconductor packaging costs for a savings of about 20% by replacing gold wire bonds with copper, copper also has materials property advantages over gold. When compared to gold, copper has approximately: 25% lower electrical resistivity, 30% higher thermal conductivity, 75% higher tensile strength and 45% higher modulus of elasticity. Copper wire bonds on aluminum bond pads are also more mechanically robust over time and elevated temperature due to the slower intermetallic formation rate - approximately 1/100th that of the gold to aluminum intermetallic formation rate. However, there are significant tradeoffs with copper wire bonding - copper has twice the hardness of gold which results in a narrower bonding manufacturing process window and requires that the semiconductor companies design more mechanically rigid bonding pads to prevent cratering to both the bond pad and underlying chip structure. Furthermore, copper is significantly more prone to corrosion issues. The semiconductor packaging industry has responded to this corrosion concern by creating a palladium coated copper bonding wire, which is more corrosion resistant than pure copper bonding wire. Also, the selection of the device molding compound is critical because use of environmentally friendly green compounds can result in internal CTE (Coefficient of Thermal Expansion) mismatches with the copper wire bonds that can eventually lead to device failures during thermal cycling. Despite the difficult problems associated with the changeover to copper bonding wire, there are billions of copper wire bonded devices delivered annually to customers. It is noteworthy that Texas Instruments announced in October of 2014 that they are shipping microcircuits containing copper wire bonds for safety critical automotive applications. An evaluation of copper wire bond technology for applicability to spaceflight hardware may be warranted along with concurrently compiling a comprehensive understanding of the failure mechanisms involved with copper wire bonded semiconductor devices.

Body of Knowledge (BOK)↗