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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 253 records · Page 14

Electrical Devices and Circuits for Low Temperature Space Applications

The environmental temperature in many NASA missions, such as deep space probes and outer planetary exploration, is significantly below the range for which conventional commercial-off-the-shelf electronics is designed. Presently, spacecraft operating in the cold environment of such deep space missions carry a large number of radioisotope or other heating units in order to maintain the surrounding temperature of the on-board electronics at approximately 20 C. Electronic devices and circuits capable of operation at cryogenic temperatures will not only tolerate the harsh environment of deep space but also will reduce system size and weight by eliminating or reducing the heating units and their associate structures; thereby reducing system development cost as well as launch costs. In addition, power electronic circuits designed for operation at low temperatures are expected to result in more efficient systems than those at room temperature. This improvement results from better behavior in the electrical and thermal properties of some semiconductor and dielectric materials at low temperatures. An on-going research and development program on low temperature electronics at the NASA Glenn Research Center focuses on the development of efficient electrical systems and circuits capable of surviving and exploiting the advantages of low temperature environments. An overview of the program will be presented in this paper. A description of the low temperature test facilities along with selected data obtained from in-house component testing will also be discussed. On-going research activities that are being performed in collaboration with various organizations will also be presented.

Patterson, R. L.↗

Specific Power and Efficiency Projections of Electric Machines and Circuit Protection Exploration for Aircraft Applications

The purpose of this paper is to generate specific power and efficiency projections through the year 2050 for electric machines for aircraft applications. A general literature review was performed to identify the types of electric machines that are commonly used and which types have the biggest potential for future aircraft applications due to their high specific power and efficiency. A database with historical data was built to include parameters such as weight [kg], rated power [kW], specific power [kW/kg], RPM, efficiency, year, motor cooling type, application type and motor type to allow for trend identification and accurate projections. Once the data was gathered, multiple curve fits on the historical data were generated and extrapolated to produce the projections for specific power according to conservative, nominal and aggressive projection scenarios. A different process was followed for the efficiency projections due to the scattered nature of the data. A state of the art (SoA) value for efficiency was identified through literature review and was used to create the conservative, nominal and aggressive projections for the time frames of 2030, 2040, and 2050. The efficiency and the specific power projections of EMs for 2050 are 0.989 and 50kW/kg respectively. This paper will also be examining circuit protection as it is an additional component of electric powertrains.

electric machines↗

General purpose computer programs for numerically analyzing linear ac electrical and electronic circuits for steady-state conditions

Digital computer programs determine steady-state performance characteristics of active and passive linear circuits. The ac analysis program solves the basic circuit parameters. The compiler program solves these circuit parameters and in addition provides a more versatile program by allowing the user to perform mathematical and logical operations.

Egebrecht, R. A.↗

Split-cross-bridge resistor for testing for proper fabrication of integrated circuits

An electrical testing structure and method is described whereby a test structure is fabricated on a large scale integrated circuit wafer along with the circuit components and has a van der Pauw cross resistor in conjunction with a bridge resistor and a split bridge resistor, the latter having two channels each a line width wide, corresponding to the line width of the wafer circuit components, and with the two channels separated by a space equal to the line spacing of the wafer circuit components. The testing structure has associated voltage and current contact pads arranged in a two by four array for conveniently passing currents through the test structure and measuring voltages at appropriate points to calculate the sheet resistance, line width, line spacing, and line pitch of the circuit components on the wafer electrically.

Buehler, M. G.↗

Monitor For Electrical-Discharge Machining

Circuit monitors electrical-discharge-machining (EDM) process to detect and prevent abnormal arcing, which can produce unacceptable "burn" marks on workpiece. When voltage between EDM electrode and workpiece behaves in manner indicative of abnormal arcing, relay made to switch off EDM power, which remains off until operator attends to EDM setup and resets monitor.

Burley, Richard K.↗

Fabricating and using a micromachined magnetostatic relay or switch

A micromachined magnetostatic relay or switch includes a springing beam on which a magnetic actuation plate is formed. The springing beam also includes an electrically conductive contact. In the presence of a magnetic field, the magnetic material causes the springing beam to bend, moving the electrically conductive contact either toward or away from another contact, and thus creating either an electrical short-circuit or an electrical open-circuit. The switch is fabricated from silicon substrates and is particularly useful in forming a MEMs commutation and control circuit for a miniaturized DC motor.

Tai, Yu-Chong↗

Modular design of high frequency circuits

Method of circuit development separates electrical functions into noninterdependent parts, uses standard, commercially available circuit elements, and establishes unified circuit-packaging arrangement. Packaging scheme is cost-effective, does not compromise electrical circuit performance from video to UHF frequencies, and leaves circuits accessible for modification and adjustment.

Zimmer, J. T.↗

Small, Optically-Driven Power Source

Power transmitted along fiber-optic cables. Transmitted as infrared light along fiber-optic cable, converted to electricity to supply small electronic circuit. Power source and circuit remains electrically isolated from each other for safety or reduces electromagnetic interference. Array of diodes made by standard integrated-circuit techniques and packaged for mounting at end of fiber-optic cable.

Cockrum, Richard H.↗

Measuring Conductor Widths and Spacings Electrically

Widths and spacings of conductor lines on integrated circuits measured electrically by split cross-bridge resistor technique. Speeds evaluation of integrated-circuit fabrication processes. When measurement of probe currents and voltages and reduction of measurement data automated, test structure probed and characterized in less than one second.

Buehler, Martin G.↗

Double-driven shield capacitive type proximity sensor

A capacity type proximity sensor comprised of a capacitance type sensor, a capacitance type reference, and two independent and mutually opposing driven shields respectively adjacent to the sensor and reference and which are coupled in an electrical bridge circuit configuration and driven by a single frequency crystal controlled oscillator is presented. The bridge circuit additionally includes a pair of fixed electrical impedance elements which form adjacent arms of the bridge and which comprise either a pair of precision resistances or capacitors. Detection of bridge unbalance provides an indication of the mutual proximity between an object and the sensor. Drift compensation is also utilized to improve performance and thus increase sensor range and sensitivity.

Vranish, John M.↗

Study made of anodized aluminum circuit boards

Hard coated aluminum circuit boards demonstrate the feasibility of obtaining an electrical power circuit of high packaging density with very high thermal conductivity and mechanical strengths.

Jacobi, C.↗

Optimal Feedback Control of Thermal Networks

An improved approach to the mathematical modeling of feedback control of thermal networks has been devised. Heretofore software for feedback control of thermal networks has been developed by time-consuming trial-and-error methods that depend on engineers expertise. In contrast, the present approach is a systematic means of developing algorithms for feedback control that is optimal in the sense that it combines performance with low cost of implementation. An additional advantage of the present approach is that a thermal engineer need not be expert in control theory. Thermal networks are lumped-parameter approximations used to represent complex thermal systems. Thermal networks are closely related to electrical networks commonly represented by lumped-parameter circuit diagrams. Like such electrical circuits, thermal networks are mathematically modeled by systems of differential-algebraic equations (DAEs) that is, ordinary differential equations subject to a set of algebraic constraints. In the present approach, emphasis is placed on applications in which thermal networks are subject to constant disturbances and, therefore, integral control action is necessary to obtain steady-state responses. The mathematical development of the present approach begins with the derivation of optimal integral-control laws via minimization of an appropriate cost functional that involves augmented state vectors. Subsequently, classical variational arguments provide optimality conditions in the form of the Hamiltonian equations for the standard linear-quadratic-regulator (LQR) problem. These equations are reduced to an algebraic Riccati equation (ARE) with respect to the augmented state vector. The solution of the ARE leads to the direct computation of the optimal proportional- and integral-feedback control gains. In cases of very complex networks, large numbers of state variables make it difficult to implement optimal controllers in the manner described in the preceding paragraph.

Papalexandris, Miltiadis↗

Failure Analysis of Electrical Pin Connectors

A study was initiated to determine the root cause of failure for circuit board electrical connection pins that failed during vibRatory testing. The circuit board is part of an unmanned space probe, and the vibratory testing was performed to ensure component survival of launch loading conditions. The results of this study show that the pins failed as a result of fatigue loading.

Newman, John A.↗