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Photoinitiated thermoset polymerization through controlled release of metathesis catalysts encapsulated in poly(phthalaldehyde)
Photoinitiated polymerization enables spatiotemporal control of reaction conditions and can thereby generate materials with high complexity while consuming minimal energy. Where ring opening metathesis polymerization (ROMP) is concerned, photo-activated processes are typically enabled by chemical inhibition of ruthenium carbenes via the careful design of complexed ligands such that photoactivation can proceed through an isomerization or ligand dissociation event. In this contribution, we have explored a new approach to photoinitiation of ROMP based on physical inhibition through microencapsulation and controlled release of metathesis catalysts. Micron-sized particles of poly(phthalaldehyde) (PPA), catalyst, and photoacid generator were fabricated by spray drying. The particles were dispersed in dicyclopentadiene monomer, after which polymerization was initiated through temperature or UV exposure, both inducing depolymerization of the PPA particles and in situ catalyst release. The monomer/particle dispersions were found to be stable and reproducibly polymerizable with 3 weeks of storage at room temperature. Furthermore, the dispersions can be used for both photo- and thermal-initiated frontal ROMP, yielding a polymerized thermoset of equivalent properties to conventional bulk- and frontally-polymerized analogues. In conclusion, this work will ultimately enable new manufacturing techniques for ROMP-based materials, due to the modular, easily tunable nature of the underlying initiating system and its unparalleled stability.
Iron Cluster Encapsulated N-Doped Single-Walled Carbon Nanotubes as ORR Electrocatalyst: A First-Principles Study
The ORR electrocatalytic activities of N-doped single-walled nanotubes infused with Fe7 clusters are assessed with DFT calculations. The incorporation of Fe7 leads to enhanced activity and stability via electron donation. The models presented in this work propose a promising strategy for designing non-precious metal ORR catalysts.
A simple and practical wax-encapsulation method for air-sensitive XAS samples
To facilitate X-ray absorption spectroscopy (XAS) measurements of air-sensitive samples, we present a simple method in which materials are encased in common paraffin wax to protect them from air and moisture. We demonstrate the efficacy of this approach using a highly reducing, air- and moisture-sensitive uranium(III) complex, the tris(amide) U[N(SiMe 3 ) 2 ] 3 (1). When finely dispersed in a boron nitride matrix and subsequently encased in inert paraffin wax, samples of 1 remain stable with no visible or spectroscopic degradation after several days under ambient conditions. The viability of this method for XAS measurements was further evaluated across a series of uranium compounds, ranging from uranyl species to highly air- and moisture-sensitive molecular complexes, at the uranium L 3 -edge. Edge energy determinations were highly reproducible (±0.1 eV between replicates) and, where available, showed excellent agreement with literature values. In conclusion, this low-cost, effective, and versatile method offers a viable solution for XAS studies of air-sensitive compounds and materials.
Thermoset Polymerization Through Controlled Release of Metathesis Catalysts Encapsulated in Poly(phthalaldehyde)
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Predicting Molecular Scale Dynamics And Kinetics Occurring During Photovoltaic Encapsulant Degradation
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Understanding Polymer Encapsulant Degradation: A Scale Bridging Computational Framework
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Metal Encapsulation Strategies to Optimize and Minimize PGE Use in Heterogeneous Catalysts
In the three funded years of research (and one additional year of no-cost extension), we focused on several areas of interest towards the goal of reducing the content of PGMs in emission control catalysts.
Oak Ridge National Laboratory Modernizing the Kokkos Build System: Using CMake to Encapsulate the Complexity of Build Instructions for Performance Portable Libraries
Kokkos, a C++ library focused on performance portability, requires a build system that can work with a variety of compilers and hardware. Ideally, users need only select the compiler and architecture and should not have to know or specify how programs using Kokkos are built. CMake can be used to create a flexible, robust build system and automatically configures compilers and settings based on the user’s inputs. Nevertheless, Kokkos’ requirements as a performance portability library for the build system exceed CMake’s current capabilities. This report describes the requirements, solutions, and testing of various implementations to create a CMake-based build system suitable for Kokkos. It compares the strengths and shortcomings of the approaches and evaluates the implementations with respect to the requirements. Because no solution was found to meet all of the requirements, the Kokkos team engaged with the CMake development team to discuss and plan a path toward support for performance-portable build systems in CMake in the future.
Modeling Crystallization and Melting in EVA and Polyolefin Encapsulation to Augment Stress Predictions in Cracked PV Modules Over a 24-hour Period
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MCNP Simulations of an Aluminum Encapsulated Boron Carbide Spheres for Modification of Dosimeter Response
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Encapsulating Grubbs Type Catalysts for Frontal Ring Opening Metathesis
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Exploring encapsulation strategies and compatibility for cell-free protein synthesis
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Thiol-ene dextran-based hydrogels for 3D neuron encapsulation
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Development of improved sterilizable potting and encapsulating compounds for space applications Second annual summary report, 1 Jul. 1964 - 30 Jun. 1965
Siloxyurethane and epoxysilicone investigations in program to develop sterilizable electronic embedment materials and conformal coatings for applications in aerospace environment
Encapsulating flatpack integrated circuits by means of ultrasonic welding
Ultrasonic welding of covers on flatpack integrated circuits for producing hermetically sealed packages at high rates without exposure to high temperature
Sprayed shielding of plastic-encapsulated electronic modules
Metallic coating directly sprayed on electronic modules provides simple and reliable lightweight protection against radio frequency interference. A plasma arc may be used. Aluminum and copper are the most effective metals.
Encapsulated adhesive systems and their potential applications
Microencapsulation of bonded reactive resins in packaging, logistics and adhesive applications at room and elevated temperatures