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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 253 records · Page 14

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NASA NTRS1992

Development of the FITS tools package for multiple software environments

The HEASARC is developing a package of general purpose software for analyzing data files in FITS format. This paper describes the design philosophy which makes the software both machine-independent (it runs on VAXs, Suns, and DEC-stations) and software environment-independent. Currently the software can be compiled and linked to produce IRAF tasks, or alternatively, the same source code can be used to generate stand-alone tasks using one of two implementations of a user-parameter interface library. The machine independence of the software is achieved by writing the source code in ANSI standard Fortran or C, using the machine-independent FITSIO subroutine interface for all data file I/O, and using a standard user-parameter subroutine interface for all user I/O. The latter interface is based on the Fortran IRAF Parameter File interface developed at STScI. The IRAF tasks are built by linking to the IRAF implementation of this parameter interface library. Two other implementations of this parameter interface library, which have no IRAF dependencies, are now available which can be used to generate stand-alone executable tasks. These stand-alone tasks can simply be executed from the machine operating system prompt either by supplying all the task parameters on the command line or by entering the task name after which the user will be prompted for any required parameters. A first release of this FTOOLS package is now publicly available. The currently available tasks are described, along with instructions on how to obtain a copy of the software.

Pence, W. D.↗

NASA NTRS1992

The IRAF Fabry-Perot analysis package: Ring fitting

As introduced at ADASSI, a Fabry-Perot analysis package for IRAF is currently under development as a joint effort of ourselves and Frank Valdes of the IRAF group. Although additional portions of the package were also implemented, we report primarily on the development of a robust ring fitting task, useful for fitting the calibration rings obtained in Fabry-Perot observations. The general equation of an ellipse is fit to the shape of the rings, providing information on ring center, ellipticity, and position angle. Such parameters provide valuable information on the wavelength response of the etalon and the geometric stability of the system. Appropriate statistical weighting is applied to the pixels to account for increasing numbers with radius, the Lorentzian cross-section, and uneven illumination. The major problems of incomplete, non-uniform, and multiple rings are addressed with the final task capable of fitting rings regardless of center, cross-section, or completion. The task requires only minimal user intervention, allowing large numbers of rings to be fit in an extremely automated manner.

Shopbell, P. L.↗

NASA NTRS1991

A portable X-band front-end test package for beam-waveguide antenna performance evaluation. Part 2: Tests on the antenna

Results are given for an X-band (8.45 GHz) test package for testing the new 34-m beam-waveguide antenna at Goldstone in an 'on-the-antenna' configuration. Included are X-band zenith noise temperature values and tipping-curve data obtained at the Cassegrain focal point F1 as well as at the pedestal room focal point F3. Subreflector Z-defocus test results for both F1 and F3 are also presented. The X-band test package operated well in all of the different test configurations and exceeded expected performance.

Otoshi, T. Y.↗

NASA NTRS1995

JTEC Panel report on electronic manufacturing and packaging in Japan

Kelly, Michael J.↗

NASA NTRS1995

Japan's electronic packaging technologies

The JTEC panel found Japan to have significant leadership over the United States in the strategic area of electronic packaging. Many technologies and products once considered the 'heart and soul' of U.S. industry have been lost over the past decades to Japan and other Asian countries. The loss of consumer electronics technologies and products is the most notable of these losses, because electronics is the United States' largest employment sector and is critical for growth businesses in consumer products, computers, automobiles, aerospace, and telecommunications. In the past there was a distinction between consumer and industrial product technologies. While Japan concentrated on the consumer market, the United States dominated the industrial sector. No such distinction is anticipated in the future; the consumer-oriented technologies Japan has dominated are expected to characterize both domains. The future of U.S. competitiveness will, therefore, depend on the ability of the United States to rebuild its technological capabilities in the area of portable electronic packaging.

Tummala, Rao R.↗

NASA NTRS1994

Closing the loop on improvement: Packaging experience in the Software Engineering Laboratory

As part of its award-winning software process improvement program, the Software Engineering Laboratory (SEL) has developed an effective method for packaging organizational best practices based on real project experience into useful handbooks and training courses. This paper shares the SEL's experience over the past 12 years creating and updating software process handbooks and training courses. It provides cost models and guidelines for successful experience packaging derived from SEL experience.

Waligora, Sharon R.↗

NASA NTRS1990

Integrating Commercial Off-The-Shelf (COTS) graphics and extended memory packages with CLIPS

This paper addresses the question of how to mix CLIPS with graphics and how to overcome PC's memory limitations by using the extended memory available in the computer. By adding graphics and extended memory capabilities, CLIPS can be converted into a complete and powerful system development tool, on the other most economical and popular computer platform. New models of PCs have amazing processing capabilities and graphic resolutions that cannot be ignored and should be used to the fullest of their resources. CLIPS is a powerful expert system development tool, but it cannot be complete without the support of a graphics package needed to create user interfaces and general purpose graphics, or without enough memory to handle large knowledge bases. Now, a well known limitation on the PC's is the usage of real memory which limits CLIPS to use only 640 Kb of real memory, but now that problem can be solved by developing a version of CLIPS that uses extended memory. The user has access of up to 16 MB of memory on 80286 based computers and, practically, all the available memory (4 GB) on computers that use the 80386 processor. So if we give CLIPS a self-configuring graphics package that will automatically detect the graphics hardware and pointing device present in the computer, and we add the availability of the extended memory that exists in the computer (with no special hardware needed), the user will be able to create more powerful systems at a fraction of the cost and on the most popular, portable, and economic platform available such as the PC platform.

Callegari, Andres C.↗

NASA NTRS1995

Electronic manufacturing and packaging in Japan

This report summarizes the status of electronic manufacturing and packaging technology in Japan in comparison to that in the United States, and its impact on competition in electronic manufacturing in general. In addition to electronic manufacturing technologies, the report covers technology and manufacturing infrastructure, electronics manufacturing and assembly, quality assurance and reliability in the Japanese electronics industry, and successful product realization strategies. The panel found that Japan leads the United States in almost every electronics packaging technology. Japan clearly has achieved a strategic advantage in electronics production and process technologies. Panel members believe that Japanese competitors could be leading U.S. firms by as much as a decade in some electronics process technologies. Japan has established this marked competitive advantage in electronics as a consequence of developing low-cost, high-volume consumer products. Japan's infrastructure, and the remarkable cohesiveness of vision and purpose in government and industry, are key factors in the success of Japan's electronics industry. Although Japan will continue to dominate consumer electronics in the foreseeable future, opportunities exist for the United States and other industrial countries to capture an increasingly large part of the market. The JTEC panel has identified no insurmountable barriers that would prevent the United States from regaining a significant share of the consumer electronics market; in fact, there is ample evidence that the United States needs to aggressively pursue high-volume, low-cost electronic assembly, because it is a critical path leading to high-performance electronic systems.

Kelly, Michael J.↗

NASA NTRS1996

ASpec: A New Spectrum and Line Analysis Package for IRAF

ASpec is a new spectrum and line analysis package developed at STScI. ASpec is designed as an add-on package for IRAF and incorporates a variety of analysis techniques for astronomical spectra. ASpec operates on spectra from a wide variety of ground-based and space-based instruments. ASpec allows simultaneous handling of spectra from different wavelength regimes. ASpec accommodates non-linear dispersion relations. ASpec provides a variety of functions, individually or in combination, with which to fit spectral features and the continuum. ASpec permits the masking of known bad data. ASpec provides a powerful, intuitive graphical user interface implemented using the new IRAF Object Manager and customized to handle: data input/output (I/O); on-line 'help'; selection of relevant features for analysis; plotting and graphical interaction; and data base management.

Hulbert, Stephen J.↗

NASA NTRS1997

Neural Network Prototyping Package Within IRAF

The purpose of this contract was to develop a neural network package within the IRAF environment to allow users to easily understand and use different neural network algorithms the analysis of astronomical data. The package was developed for use within IRAF to allow portability to different computing environments and to provide a familiar and easy to use interface with the routines. In addition to developing the software and supporting documentation, we planned to use the system for the analysis of several sample problems to prove its viability and usefulness.

Bazell, David↗

NASA NTRS1998

An Environment Monitoring Package for the International Space Station

The first elements of the International Space Station (ISS) will soon be launched into space and over the next few years ISS will be assembled on orbit into its final configuration. Experiments will be performed on a continuous basis both inside and outside the station. External experiments will be mounted on attached payload locations specifically designed to accommodate experiments, provide data and supply power from ISS. From the beginning of the space station program it has been recognized that experiments will require knowledge of the external local environment which can affect the science being performed and may impact lifetime and operations of the experiment hardware. Recently an effort was initiated to design and develop an Environment Monitoring Package (EMP). This paper describes the derivation of the requirements for the EMP package, the type of measurements that the EMP will make and types of instruments which will be employed to make these measurements.

Carruth, M. Ralph↗

NASA NTRS1999

Development of an Environmental Monitoring Package for the International Space Station

The first elements of the International Space Station (ISS) will soon be launched into space and over the next few years ISS will be assembled on orbit into its final configuration. Experiments will be performed on a continuous basis both inside and outside the station. External experiments will be mounted on attached payload locations specifically designed to accommodate experiments and provide data and power from ISS. From the beginning of the space station program it has been recognized that external experiments will require knowledge of the external environment because it can affect the science being performed and may impact lifetime and operations of the experiments. Recently an effort was initiated to design and develop an Environment Monitoring Package (EMP) was started. This paper describes the derivation of the requirements for the EMP package, the type of measurements that the EMP will make and types of instruments which will be employed to make these measurements.

Carruth, Ralph M., Jr.↗

NASA NTRS2000

ICEG2D: An Integrated Software Package for Automated Prediction of Flow Fields for Single-Element Airfoils with Ice Accretion

An integrated software package, ICEG2D, was developed to automate computational fluid dynamics (CFD) simulations for single-element airfoils with ice accretion. ICEG2D is designed to automatically perform three primary functions: (1) generating a grid-ready, surface definition based on the geometrical characteristics of the iced airfoil surface, (2) generating a high-quality grid using the generated surface point distribution, and (3) generating the input and restart files needed to run the general purpose CFD solver NPARC. ICEG2D can be executed in batch mode using a script file or in an interactive mode by entering directives from a command line. This report summarizes activities completed in the first year of a three-year research and development program to address issues related to CFD simulations for aircraft components with ice accretion. Specifically, this document describes the technology employed in the software, the installation procedure, and a description of the operation of the software package. Validation of the geometry and grid generation modules of ICEG2D is also discussed.

Thompson, David S.↗

NASA NTRS1999

Experimental Verification of the Use of Metal Filled Via Hole Fences for Crosstalk Control of Microstrip Lines in LTCC Packages

Coupling between microstrip lines in dense RF packages is a common problem that degrades circuit performance. Prior 3D-FEM electromagnetic simulations have shown that metal filled via hole fences between two adjacent microstrip lines actually increases coupling between the lines; however, if the top of the via posts are connected by a metal Strip, coupling is reduced. In this paper, experimental verification of the 3D-FEM simulations Is demonstrated for commercially fabricated LTCC packages.

Ponchak, George E.↗

NASA NTRS1998

Chip Scale Package Implementation Challenges

The JPL-led MicrotypeBGA Consortium of enterprises representing government agencies and private companies have jointed together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects. In the process of building the Consortium CSP test vehicles, many challenges were identified regarding various aspects of technology implementation. This paper will present our experience in the areas of technology implementation challenges, including design and building both standard and microvia boards, and assembly of two types of test vehicles. We also discuss the most current package isothermal aging to 2,000 hours at 100 C and 125 C and thermal cycling test results to 1,700 cycles in the range of -30 to 100 C.

Ghaffarian, Reza↗

NASA NTRS2000

Deep Internal Structure of Mars and the Geophysical Package of Netlander

Our present understanding of the interior structure of Mars is mostly based on the interpretation of gravity and rotation data, the chemistry of the SNC (shergottites, nakhlites, chassignites) meteoroids, and a comparison with the much better-known interior structure of the Earth. However geophysical information from previous missions have been insufficient to determine the deep internal structure of the planet. Therefore the state and size of the core and the depth and type of mantle discontinuities are unknown. Most previous seismic experiments have indeed failed, either due to a launch failure (as for the Optimism seismometer onboard the small surface stations of Mars 96) or after failure on Mars (as for the Viking 1 seismometer). The remaining Viking 2 seismometer did not produce a convincing marsquake detection, basically due to too strong wind sensitivity and too low resolution in the teleseismic frequency band. After almost a decade of continuous activity and proposals, the first network mission to Mars, NetLander (NL), is expected to be launched between 2005 and 2007. One of the main scientific objectives of this four-lander network mission will be the determination of the internal structure of the planet using a geophysical package. This package will have a seismometer, a magnetometer, and a geodetic experiment, allowing a complementary approach that will yield many new constraints on the mineralogy and temperature of the mantle and core of the planet.

Lognonne, P.↗

NASA NTRS2001

Heterogeneous Integration, An Approach to High Density and High Flexibility Electronic Packaging

Key to the design of spacecraft for exploration of the outer planets will be the development of highly integrated and mass/volume efficient electronic systems. Exploration of the outer planets will require optimized propulsion approaches which mandates mass minimization. If one looks at a mission such as the Europa Lander, a high mass/volume efficiency feeds back directly into lower mass for radiation shielding. Concurrently the long mission lengths will drive the need for fault isolation and fault tolerance. The ability to build distributed electronic systems is an inherent requirement and one which is enabled by heterogeneous integration. The electronic packaging approach must be capable of interconnecting various components at a scale comparable with that on the components themselves (chip scale) and it must facilitate efficient integration of the electronics with elements of the spacecraft such as structure or antennae. The concept of 'Heterogeneous Integration' is being explored in the System On A Chip (SOAC) Project at JPL. The goal, of this approach to electronic packaging, is to enable the fabrication and assembly of complete electronic subsystems from components fabricated by a range of processes. Included in such a system could be MEMS sensors, SOI mixed signal ASICs, micro scale passive components and micro power. Secondarily the compact size will enable distributed architectures and integrated assemblies. Additional information is contained in the original extended abstract.

DAgostino, S. A.↗

NASA NTRS2001

Experimental Verification of the Use of Metal Filled Via Hole Fences for Crosstalk Control of Microstrip Lines in LTCC Packages

Coupling between microstrip lines in dense RF packages is a common problem that degrades circuit performance. Prior three-dimensional-finite element method (3-D-FEM) electromagnetic simulations have shown that metal filled via hole fences between two adjacent microstrip lines actually Increases coupling between the lines: however, if the top of the via posts are connected by a metal strip, coupling is reduced. In this paper, experimental verification of the 3-D-FEM simulations is demonstrated for commercially fabricated low temperature cofired ceramic (LTCC) packages. In addition, measured attenuation of microstrip lines surrounded by the shielding structures is presented and shows that shielding structures do not change the attenuation characteristics of the line.

Ponchak, George E.↗