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At least 253 records · Page 14

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NASA NTRS2006

Correction for Thermal EMFs in Thermocouple Feedthroughs

A straightforward measurement technique provides for correction of thermal-electromotive-force (thermal-EMF) errors introduced by temperature gradients along the pins of non-thermocouple-alloy hermetic feedthrough connectors for thermocouple extension wires that must pass through bulkheads. This technique is an alternative to the traditional technique in which the thermal-EMF errors are eliminated by use of custom-made multipin hermetic feedthrough connectors that contain pins made of the same alloys as those of the thermocouple extension wires. One disadvantage of the traditional technique is that it is expensive and time-consuming to fabricate multipin custom thermocouple connectors. In addition, the thermocouple-alloy pins in these connectors tend to corrode easily and/or tend to be less rugged compared to the non-thermocouple-alloy pins of ordinary connectors. As the number of thermocouples (and thus pins) is increased in a given setup, the magnitude of these disadvantages increases accordingly. The present technique is implemented by means of a little additional hardware and software, the cost of which is more than offset by the savings incurred through the use of ordinary instead of thermocouple connectors. The figure schematically depicts a typical measurement setup to which the technique is applied. The additional hardware includes an isothermal block (made of copper) instrumented with a reference thermocouple and a compensation thermocouple. The reference thermocouple is connected to an external data-acquisition system (DAS) through a two-pin thermocouple-alloy hermetic feedthrough connector, but this is the only such connector in the apparatus. The compensation thermocouple is connected to the DAS through two pins of the same ordinary multipin connector that connects the measurement thermocouples to the DAS.

Ziemke, Robert A.↗

NASA NTRS1973

Testing of uranium nitride fuel in T-111 cladding at 1200 K cladding temperature

Two groups of six fuel pins each were assembled, encapsulated, and irradiated in the Plum Brook Reactor. The fuel pins employed uranium mononitride (UN) in a tantalum alloy clad. The first group of fuel pins was irradiated for 1500 hours to a maximum burnup of 0.7-atom-percent uranium. The second group of fuel pins was irradiated for about 3000 hours to a maximum burnup of 1.0-atom-percent uranium. The average clad surface temperature during irradiation of both groups of fuel pins was approximately 1200 K. The postirradiation examination revealed the following: no clad failures or fuel swelling occurred; less than 1 percent of the fission gases escaped from the fuel; and the clad of the first group of fuel pins experienced clad embrittlement whereas the second group, which had modified assembly and fabrication procedures to minimize contamination, had a ductile clad after irradiation.

Rohal, R. G.↗

NASA NTRS1971

Avalanche-diode oscillator circuit with tuning at multiple frequencies

Detailed theoretical analysis of three different modes or types of high efficiency oscillation in a PIN diode are presented. For the TRAPATT mode in a PIN diode, it is shown that a traveling avalanche zone is not necessary to generate a dense trapped plasma. An economical computer program for TRAPATT oscillations in a PIN diode is described. Typical results of diode power, dc-to-RF conversion efficiency, and required circuit impedances are presented for several different current waveforms. A semianalytical solution for a second type of high efficiency mode in a PIN diode is derived assuming a rectangular current waveform. A quasi-static approximation is employed to derive a semianalytical solution for the voltage across a PIN diode in a third mode, where avalanching occurs during a major portion of a half cycle. Calculations for this mode indicate that the power increases proportionally to the magnitude of the drive current with a small decrease in efficiency relative to the ordinary TRAPATT mode. An analytical solution is also given for a PIN diode, where it is assumed that the ionization coefficient is a step function. It is shown that the step-ionization approximation permits one to draw possible patterns of avalanche region in the depletion layer as a function of time. A rule governing admissible patterns is derived and an example solution given for one admissible pattern. Preliminary experimental results on the high-efficiency oscillations are presented and discussed. Two different experimental circuits, which used channel-dropping filters to provide independent harmonic tuning, are described. Simpler circuits used to produce high-efficiency oscillations are discussed. Results of experiments using inexpensive Fairchild FD300 diodes are given.

Parker, D.↗

NASA NTRS1989

Impact of device level faults in a digital avionic processor

This study describes an experimental analysis of the impact of gate and device-level faults in the processor of a Bendix BDX-930 flight control system. Via mixed mode simulation, faults were injected at the gate (stuck-at) and at the transistor levels and, their propagation through the chip to the output pins was measured. The results show that there is little correspondence between a stuck-at and a device-level fault model, as far as error activity or detection within a functional unit is concerned. In so far as error activity outside the injected unit and at the output pins are concerned, the stuck-at and device models track each other. The stuck-at model, however, overestimates, by over 100 percent, the probability of fault propagation to the output pins. An evaluation of the Mean Error Durations and the Mean Time Between Errors at the output pins shows that the stuck-at model significantly underestimates (by 62 percent) the impact of an internal chip fault on the output pins. Finally, the study also quantifies the impact of device fault by location, both internally and at the output pins.

Suk, Ho Kim↗

NASA NTRS1990

Clevis joint for deployable space structures

This invention relates generally to pin clevis joints, and more particularly, to zero play pin clevis joints for connecting structural members of a deployable space structure. A joint includes a pin, a tang, and a shackle. The pin is tapered at the same angle as the bores extending through the projections of the shackle and the tang. A spring washer biases the tang onto the tapered sidewall of the pin. The invention solves the free play problem associated with deployable space structures by using a tapered pin which is held in tapered holes by the spring washers.

Rhodes, Marvin D.↗

NASA NTRS1999

Flow Trajectories in Friction Stir Welding

In the Friction Stir Welding (FSW) process, a rotating, shouldered tool with a threaded pin is inserted under pressure along the seam of two pieces of metal which are tightly clamped together, and secured against a rigid anvil underneath. The rotating pin travels along the seam and through a combination of pressure and friction heating produces a zone of plastic deformation around the pin within the workpiece on either side of the seam. As the pin is moved in the direction of welding, the plasticised material moves around the tool and bonds together behind it. The elements of the material flow behavior are a combination of three elements. There is a rotational transport of material being carried around the tool, extrusion of material being forced around the pin on both sides into the cavity created behind it, and a lifting and dropping of material as it is stirred and mixed by the rotating action of the pin. It was assumed that rotational motion of the plastic zone is the primary mechanism for transport of material around the welding tool. A kinematic mathematical model was used to compute trajectories of material movement for various distributions of rotational slip within the plastic zone. These trajectories were then compared with the results of an experiment that produced radiographs of markers embedded in a workpiece that was welded with the FSW process. It was assumed that the copper wire markers retained their original length as the aluminum material flowed around them. The kinematic model included a constraint so that the displacements were such that the total length of the wire markers did not increase after deformation. There was good agreement between the calculated trajectories for the case of localized slip at the outer surface of the plastic deformation zone and the radiographs of the copper wire markers. The trajectories differed markedly from the radiograph traces when a distributed slip zone was assumed. It was concluded that the flow field could be described generally by a rotating plug model with slip occurring on the surface at the outer boundary of the plastic zone.

Bernstein, Edward L.↗

NASA NTRS1997

Deployment hinge

A hinge (20) includes two hinge plates (22, 24) and a connecting hinge pin (32). A coil spring (48) supported on a bushing (44) overlies the hinge pin (32), which is free to move along its longitudinal axis (30). A cam follower (42) on the hinge pin (32) engages a cam (32) mounted to one of the hinge plates (22), so that the hinge pin (32) slides longitudinally as the hinge plates (22, 24) pivot relative to each other about the hinge pin (32). As the hinge pin (32) slides longitudinally, it axially compresses or decompresses the spring (48). The cam (32) is oriented such that pivoting of the hinge plates (22, 24) in either direction from an open position compresses the spring (48), providing a restoring force which tends to retain the hinge plates (22, 24) in the open position.

Tourville, Thomas↗

NASA NTRS1971

Molybdenum-UO2 cerment irradiation at 1145 K

Two molybdenum-UO2 cermet fuel pins were fission heated in a helium-cooled loop at a temperature of 1145 K and to a total burnup of 5.3 % of the U-235. After irradiation the fuel pins were measured to check dimensional stability, punctured at the plenums to determine fission gas release, and examined metallographically to determine the effect of irradiation. Burnup was determined in several sections of the fuel pin. The results of the postirradiation examination indicated: (1) There was no visible change in the fuel pins on irradiation under the above conditions. (2) The maximum swelling of the fuel pins was less than 1%. (3) There was no migration of UO2 and no visible interaction between the molybdenum and the UO2. (4) Approximately 12% of the fission gas formed was released from the cermet cone into the gas plenum.

Mcdonald, G.↗

NASA NTRS1982

Thermally Insulated Glove With Good Tactility

Thermally insulated glove contains short, closely-spaced elastomeric pins that insulate without impairing flexibility. By confining pins to the inter-joint areas of palm, fingers and back of the hand, joint mobility is retained. Glove thermal-insulation requirements dictate the relationships among pin length, pin diameter, and number of pins per unit surface length.

Balinskas, R.↗

NASA NTRS1984

Vortex creep and the internal temperature of neutron stars. II - Vela pulsar

The observed complex postglitch behavior of the Vela pulsar is explained as resulting from coupling of the crust to crustal neutron superfluid, specifically that part of the superfluid in which vortex lines are pinned to crustal nuclei. It is shown how the general theory of vortex creep provides an excellent fit to the timing observations of Downs which span the decade 1969-1979 and include four giant glitches. Relaxation times, inertial moments, and limits on superfluid pinning parameters are extracted for three distinct regions of vortex pinning in the star, with results which are consistent with microscopic theories of its internal structure. Relaxation times due to vortex creep are directly proportional to the internal temperature of the star, so that the limits obtained for pinning parameters translate to bounds on this temperature. It is concluded that the internal temperature of the Vela pulsar is about 10-million K and discuss the extent to which improved calculations of vortex pinning as well as soft X-ray observations of other stars will make possible an improved determination of the pulsar temperature.

Alpar, M. A.↗

NASA NTRS1984

T/R switch design for short-range measurements, part 6.1A

The positive intrinsic negative (PIN) diode switch which is designed to protect the receiver from burnout or damage on transmission and channel the echo signal to the receiver on reception is outlined. The receiver must be protected firmly. A schematic diagram of a transformer rectifier (TR-ATR) switch for the Urbana Radar is shown. The T/R switch consists of a half wavelength coaxial cavity with tuning condenser and PIN diodes. Two UM4300 PIN diodes were mounted between the inner and outer conductor. The dc biasing voltage required for the PIN diodes is supplied by a control circuit. On transmission, the PIN diodes are forward biased to about 0.5 amperes. On reception, about 10 volts reverse voltage is applied to the diodes, which produces an initial reverse current to speed the recovery time. The T/R switch characteristics are estimated and the result of testing at different peak transmitter powers from 410 kW to 1500 kW is shown.

Yu, B.↗

NASA NTRS1990

Double-Swivel Mechanism For Reliable Release

Double-swivel toggle mechanism releases large, heavy objects reliably. Double-swiveling action of mechanism ensures it clears restraining pins upon release. Pins retain toggle and its load. If pin fails to withdraw at designated time for releasing payload, toggle swivels about its upper ball, and ring swivels about lower ball so ring flange clears failed pin. Double-swivel action ensures disengagement even it two pins fail to withdraw.

King, Guy L.↗

NASA NTRS1989

Double swivel toggle release

A pyrotechnic actuated structural release device is disclosed which is mechanically two fault tolerant for release. The device comprises a fastener plate and fastener body each attachable to one of a pair of structures to be joined. The fastener plate and the fastener body are fastened by a dual swivel toggle member. The toggle member is supported at one end on the fastener plate and mounted for universal pivotal movement thereon. Its other end is received in a central opening in the fastener body, and has a universally mounted retainer ring member. The toggle member is restrained by three retractable latching pins symmetrically disposed in equiangular spacing about the axis of the toggle member and positionable in latching engagement with the retainer ring member on the toggle member. Each pin is retractable by a pyrotechnic charge, the expanding gases of which are applied to a pressure receiving face on the latch pins to effect retraction from the ring member. While retraction of all three pins releases the ring member, the fastener is mechanically two fault tolerant since the failure of any single one or pair of the latch pins to retract results in an asymmetrical loading on the ring member and its dual pivotal movement ensures a release.

King, Guy L.↗

NASA NTRS1991

Thermal shock testing for assuring reliability of glass-sealed microelectronic packages

Tests were performed to determine if thermal shocking is destructive to glass-to-metal seal microelectronic packages and if thermal shock step stressing can compare package reliabilities. Thermal shocking was shown to be not destructive to highly reliable glass seals. Pin-pull tests used to compare the interfacial pin glass strengths showed no differences between thermal shocked and not-thermal shocked headers. A 'critical stress resistance temperature' was not exhibited by the 14 pin Dual In-line Package (DIP) headers evaluated. Headers manufactured in cryogenic nitrogen based and exothermically generated atmospheres showed differences in as-received leak rates, residual oxide depths and pin glass interfacial strengths; these were caused by the different manufacturing methods, in particular, by the chemically etched pins used by one manufacturer. Both header types passed thermal shock tests to temperature differentials of 646 C. The sensitivity of helium leak rate measurements was improved up to 70 percent by baking headers for two hours at 200 C after thermal shocking.

Thomas, Walter B., III↗

NASA NTRS1992

Simple, Lightweight, Thermomechanical Coupling

Self-actuating thermal coupling device is light, and transfers heat efficiently. Coupling is thermostatic, making contact as necessary to maintain nearly steady temperature at hot side of interface. Hot pins on hot plate poised near cold pins on cold-plate. As temperature of hot plate rises, shape-memory wire contracts, drawing hot pin against cold pin. When temperature falls below critical level, wire expands, allowing hot pin to pull away. Critical temperature determined by composition of alloy.

Milam, M. Bruce↗

NASA NTRS1992

Environmental effects on friction and wear of diamond and diamondlike carbon coatings

Reciprocating sliding friction experiments were conducted with a natural diamond flat, diamond film, and low and high density diamondlike carbon (DLC) films in contact with pin specimens of natural diamond and silicon nitride (Si3N4) both in humid air and dry air nitrogen. The results indicated that for natural diamond pin contacts the diamond films and the natural diamond flat were not susceptible to moisture but that moisture could increase both the coefficient of friction and the wear factors of the DLC films. The coefficients of friction and wear factors of the diamond films were generally similar to those of the natural diamond flat both in humid air and dry air nitrogen. In dry nitrogen the coefficients of friction of the high density DLC films in contact with pin specimens of both diamond and Si3N4 were generally low (about 0.02) and similar to those of the natural diamond flat and the diamond films. The wear factors of the materials in contact with both natural diamond and Si3N4 were generally in the ascending order of natural diamond flat, diamond film, high density DLC film, and low density DLC film. The moisture in the environment increased the coefficients of friction for Si3N4 pins in contact with all the materials. This increase in friction is due to the silicon oxide film produced on the surface of Si3N4 pins in humid air.

Miyoshi, Kazuhisa↗

NASA NTRS1999

Fundamental Study of Material Flow in Friction Stir Welds

The presented research project consists of two major parts. First, the material flow in solid-state, friction stir, butt-welds as been investigated using a marker insert technique. Changes in material flow due to welding parameter as well as tool geometry variations have been examined for different materials. The method provides a semi-quantitative, three-dimensional view of the material transport in the welded zone. Second, a FSW process model has been developed. The fully coupled model is based on fluid mechanics; the solid-state material transport during welding is treated as a laminar, viscous flow of a non-Newtonian fluid past a rotating circular cylinder. The heat necessary for the material softening is generated by deformation of the material. As a first step, a two-dimensional model, which contains only the pin of the FSW tool, has been created to test the suitability of the modeling approach and to perform parametric studies of the boundary conditions. The material flow visualization experiments agree very well with the predicted flow field. Accordingly, material within the pin diameter is transported only in the rotation direction around the pin. Due to the simplifying assumptions inherent in the 2-D model, other experimental data such as forces on the pin, torque, and weld energy cannot be directly used for validation. However, the 2-D model predicts the same trends as shown in the experiments. The model also predicts a deviation from the "normal" material flow at certain combinations of welding parameters, suggesting a possible mechanism for the occurrence of some typical FSW defects. The next step has been the development of a three-dimensional process model. The simplified FSW tool has been designed as a flat shoulder rotating on the top of the workpiece and a rotating, cylindrical pin, which extends throughout the total height of the flow domain. The thermal boundary conditions at the tool and at the contact area to the backing plate have been varied to fit experimental data such as temperature profiles, torque and tool forces. General aspects of the experimentally visualized material flow pattern are confirmed by the 3-D model.

Reynolds, Anthony P.↗

NASA NTRS2003

Self-Reacting Friction Stir Welding for Aluminum Alloy Circumferential Weld Applications

Friction stir welding is an innovative weld process that continues to grow in use, in the commercial, defense, and space sectors. It produces high quality and high strength welds in aluminum alloys. The process consists of a rotating weld pin tool that plasticizes material through friction. The plasticized material is welded by applying a high weld forge force through the weld pin tool against the material during pin tool rotation. The high weld forge force is reacted against an anvil and a stout tool structure. A variation of friction stir welding currently being evaluated is self-reacting friction stir welding. Self-reacting friction stir welding incorporates two opposing shoulders on the crown and root sides of the weld joint. In self-reacting friction stir welding, the weld forge force is reacted against the crown shoulder portion of the weld pin tool by the root shoulder. This eliminates the need for a stout tooling structure to react the high weld forge force required in the typical friction stir weld process. Therefore, the self-reacting feature reduces tooling requirements and, therefore, process implementation costs. This makes the process attractive for aluminum alloy circumferential weld applications. To evaluate the application of self-reacting friction stir welding for aluminum alloy circumferential welding, a feasibility study was performed. The study consisted of performing a fourteen-foot diameter aluminum alloy circumferential demonstration weld using typical fusion weld tooling. To accomplish the demonstration weld, weld and tack weld development were performed and fourteen-foot diameter rings were fabricated. Weld development consisted of weld pin tool selection and the generation of a process map and envelope. Tack weld development evaluated gas tungsten arc welding and friction stir welding for tack welding rings together for circumferential welding. As a result of the study, a successful circumferential demonstration weld was produced leading the way for future circumferential weld implementation.

Bjorkman, Gerry↗