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At least 253 records · Page 14

Analysis of Advanced Thermoelectric Materials and Their Functional Limits

The world's demand for energy is increasing dramatically, but the best energy conversion systems operate at approximately 30% efficiency. One way to decrease energy loss is in the recovery of waste heat using thermoelectric (TE) generators. A TE generator is device that generates electricity by exploiting heat flow across a thermal gradient. The efficiency of a TE material for power generation and cooling is determined by the dimensionless Figure of Merit (ZT): ZT = S(exp. 2)sigmaT/κ: where S is the Seebeck coefficient, sigma is the electrical conductivity, T is the absolute temperature, and κ is the thermal conductivity. The parameters are not physically independent, but intrinsically coupled since they are a function of the transport properties of electrons. Traditional research on TE materials has focused on synthesizing bulk semiconductor-type materials that have low thermal conductivity and high electrical conductivity affording ZT values of 1. The optimization of the σ/κ ratio is difficult to achieve using current material formats, as these material constants are complementary. Recent areas of research are focusing on using nanostructural artifacts that introduce specific dislocations and boundary conditions that scatter the phonons. This disrupts the physical link between thermal (phonon) and electrical (electron) transport. The result is that κ is decreased without decreasing σ. These material formats give ZT values of up to 2 which represent approximately 18% energy gain from waste heat recovery. The next challenge in developing the next generation of TE materials with superior performance is to tailor the interconnected thermoelectric physical parameters of the material system. In order to approach this problem, the fundamental physics of each parameter S, sigma, and κ need to be physically understood in their context of electron/phonon interaction for the construction of new high ZT thermoelectric devices. Is it possible to overcome the physical limit imposed by of the effect of phonon lattice oscillation and energetic electrons towards thermal conductivity? Is the Seebeck coefficient, based on the difference in voltage over temperature gradient ( deltaV/deltaT), an intrinsic parameter of each material? All these parameters were manipulated using nano-bridge and twin-lattice structural concepts at the NASA Langley Research Center. This talk will review the current trend of TE research to optimize the ZT and discuss about new approaches on increasing ZT within functional limits of each parameter.

Kim, Hyun Jung↗

Developing a Novel Platform for Characterizing Thermoelectric Materials for Uncooled Detectors for Land Imaging Applications

Thermal land imaging (imaging at ~8-14 micron optical wavelength) is an essential tool for understanding and managing terrestrial freshwater resources. Current thermal imaging instruments employ low temperature detectors, which require cryocoolers. Consequently, cost-saving reductions in size, weight, and power can be achieved by employing uncooled detectors. One uncooled detector concept, which NASA is pursuing, is a thermopile detector with sub-micron thick doped-Si thermoelectric materials. In order to characterize the thermoelectric properties of the doped silicon, we designed and optimized a novel apparatus. This simple apparatus measures the Seebeck coefficient with thermally isolated stages and LABVIEW automation. We optimized thermal stability using PID tuning and optimized the thermal contact between the thin film samples and stages using electrically conductive springs. Utilizing our apparatus, we measured the Seebeck coefficient of 0.45 micron thick phosphorus-doped single crystal Si samples bonded to alumina substrates. Using these Seebeck coefficient measurements and four-wire electrical resistivity measurements, we determined the relationship between the thermoelectric figure of merit and dopant concentration. These characterization results for doped-Si will guide our thermopile detector design to provide an optimal and competitive detector alternative for future thermal imaging instruments.

Reid, Riley A.↗

Next-Generation Radioisotope Thermoelectric Generator Study

Radioisotope Thermoelectric Generators (RTGs) have been used to power NASA missions of various types throughout the past five decades. The most recent RTG iteration, used for NASA’s Mars Science Laboratory, is the Multi-Mission RTG (MMRTG), which is currently the only spaceflight-qualified system available. The U.S. planetary science community has expressed a desire for more power system options to be available to accommodate a range of ambitious future mission concepts across the solar system. Recent advancements in thermoelectric (TE) materials technology have raised a potential for significantly increased efficiency in future RTGs, which helped spur a recent in-depth NASA study of options for future systems. A “next-generation” RTG study was conducted to develop new RTG concepts that could meet the needs of planetary science missions through the 2030s and beyond. A Next-Generation RTG would aim to extend the types of potential NASA missions able to be supported, while fulfilling requirements related to technical risk and schedule. In this study, 21 potential thermoelectric couple configurations were analyzed by considering various high-performance, high-temperature TE materials and segmentation techniques that maximize convertor efficiency and power density. System modularity was explored, and found to be a promising means to offer improved flexibility for NASA mission concepts with varying scope and power requirements. This paper presents the results of the study, demonstrating the viability of developing an updated RTG system design, and defining conceptual system approaches for a new, potentially revolutionary RTG.

Matthes, Christopher S. R.↗

High efficiency segmented thermoelectric unicouples

Highly efficient, segmented thermoelectric unicouple incorporating advanced thermoelectric materials with superior thermoelectric figures of merit are currently being developed at the Jet Propulsion Laboratory (JPL).

segmented↗

Thermoelectric System Economics - The Apex: New Paradigms in Manufacturing and Interface Performance Relationships Driving System Cost Optimizations

Thermoelectric energy recovery systems require cost-optimized designs with high thermal and thermoelectric (TE) performance to surmount common commercialization barriers controlling the acceptance of thermoelectric generator (TEG) systems. Recent work has addressed this requirement with new analytic tools and paradigms that allow integrated TEG cost-performance analysis and optimization. New work herein has identified the existence of optimized TE element design (i.e., TE element length) for minimizing TEG cost and provides design guidelines associated with critical thermal and electrical contact resistance effects and TE manufacturing sensitivities. Once optimum hot-side heat flux criteria are satisfied, this work highlights the tradeoffs between interface resistance effects and manufacturing cost effects in determining optimum-cost TE element lengths, and then quantifies the increase in optimum-cost TE lengths as manufacturing costs become more sensitive to TE element lengths. Optimized TE element design criteria and key non-dimensional design parameters (i.e., [𝐶′′′LTE/𝐶′′], [TE/con], [con/(TE,aveLTE)]) driving the design are presented and explained showing the interdependencies between manufacturing cost parameters and thermal and electrical interface impacts on integrated TE cost-performance analysis and design. Comprehensive TEG system cost-performance relationships clearly demonstrate the two parameters that most greatly impact the TEG system cost are heat exchanger costs ($/(W/K)) and TE hot side heat flux. Reducing heat exhanger cost from $1/(W/K) to $0.5/(W/K) can decrease TEG system cost by $2/W to $4/W depending on TE hot side heat fluxes from 4-10 W/cm2. The impact of TE hot side heat flux on TEG system cost is larger; reducing TE system cost by factors of 2-4 as TE hot side heat flux increases from 4 W/cm2 to high levels around 18 W/cm2. The levels of thermal contact resistance and electrical contact resistance required to even approach the critical TEG system cost level of $1/W are characterized by con = 1.0 x 10-10 -m2 and r = 0.1, respectively. This not only lowers TEG costs, but it also makes the TEG system costs less sensitive to TE manufacturing dependences on TE element length. New design paradigms and relationships create holistic, integrated TE performance-cost models that enhance understanding of crucial interrelationships between component costs, TE design parameters and material properties, heat exchanger design parameters, interfacial heat flux, and now thermal and electrical interface effects in minimizing TEG system costs.

Hendricks, Terry J.↗

The Next Generation Radioisotope Thermoelectric Generator Project - Overview and Progress Status

The Next Generation Radioisotope Thermoelectric Generator (Next Gen RTG) Project is a spaceflight system project within NASA’s Radioisotope Power Systems (RPS) Program. The project, in partnership with the Idaho National Laboratory (INL) / Battelle Energy Alliance (BEA), will build and deliver an unfueled, flight qualified Radioisotope Thermoelectric Generator (RTG) system based on RPS Program needs. The Next Gen RTG Project aims to assure the availability of high-power, vacuum-rated RTGs to enable future deep space missions. The Project team is developing that capability through a multi-phase effort that leverages the heritage General Purpose Heat Source - RTG (GPHS-RTG) design and available legacy hardware. The Project’s primary aim is to re-establish the capability to manufacture a silicon germanium (SiGe) unicouple based thermoelectric converter and associated hardware with minimal changes to the heritage GPHS-RTG design. The project will also refurbish the GPHS-RTG Flight Unit #5 (F-5) located at INL and verify its compliance with heritage GPHS-RTG requirements. This paper will detail the project’s plans for the development of these systems. Management approaches, technical challenges, and risks will also be discussed.

Radioisotope↗

Measurement techniques of thermoelectric devices and modules

Thermoelectric (TE) energy conversion devices are designed based on measured material transport properties. Although an ideal device efficiency can be calculated using the figure of merit, zT, the actual efficiency of a thermoelectric module is smaller and must be measured. TE device performance testing techniques and procedures are reviewed with a focus on energy conversion efficiency. One of the areas that attract less attention in the literature is the transition from basic thermoelectric materials research to the production of modules and devices. The effects of interface layers, diffusion barriers, thermal insulations, and heat sinks are reviewed. Finally, device performance from single couples to standard modules and long-term reliability are discussed.

Wang, Hsin↗

Stabilized copper selenide thermoelectric materials and methods of fabrication thereof

A thermoelectric composition is provided that includes a nanocomposite comprising a copper selenide (Cu 2 Se) matrix having a plurality of nanoinclusions comprising copper metal selenide (CuMSe 2 ) distributed therein. M may be selected from the group consisting of: indium (In), aluminum (Al), gallium (Ga), antimony (Sb), bismuth (Bi), and combinations thereof. The thermoelectric composition has an average figure of merit (ZT) of greater than or equal to about 1.5 at a temperature of less than or equal to about 850K (about 577° C.). Methods of making such a thermoelectric nanocomposite material by a sequential solid-state transformation of a CuSe 2 precursor are also provided.

Poudeu-Poudeu, Pierre Ferdinand↗

Synthesis of N-type thermoelectric materials, including Mg--Sn--Ge materials, and methods for fabrication thereof

Discussed herein are systems and methods for fabrication of MgSnGe-based thermoelectric materials for applications from room temperature and near room temperature to high temperature applications. The TE materials may be fabricated by hand or ball milling a powder to a predetermined particle size and hot-pressing the milled powder to form a thermoelectric component with desired properties including a figure of merit (ZT) over a temperature range. The TE materials fabricated may be disposed in thermoelectric devices for varying applications.

Ren, Zhifeng↗

Stabilized copper selenide thermoelectric materials and methods of fabrication thereof

A thermoelectric composition is provided that includes a nanocomposite comprising a copper selenide (Cu 2 Se) matrix having a plurality of nanoinclusions comprising copper metal selenide (CuMSe 2 ) distributed therein. M may be selected from the group consisting of: indium (In), aluminum (Al), gallium (Ga), antimony (Sb), bismuth (Bi), and combinations thereof. The thermoelectric composition has an average figure of merit (ZT) of greater than or equal to about 1.5 at a temperature of less than or equal to about 850K (about 577° C.). Methods of making such a thermoelectric nanocomposite material by a sequential solid-state transformation of a CuSe2 precursor are also provided.

Poudeu-Poudeu, Pierre Ferdinand↗

Zintl compounds with high thermoelectric performance and methods of manufacture thereof

Systems and methods discussed herein relate to Zintl-type thermoelectric materials, including a p-type thermoelectric material according to the formula AM y X y , and includes at least one of calcium (Ca), europium (Eu), ytterbium (Yb), and strontium (Sr), and has a ZT of the above about 0.60 above 675K. The n-type thermoelectric component includes magnesium (Mg), tellurium (Te), antimony (Sb), and bismuth (Bi) according to the formula Mg 3.2 Sb 1.3 Bi 0.5-x Te x that has an average ZT above 0.8 from 400K to 800K. The p-type and n-type materials discussed herein may be used alone, in combination with other materials, or in combination with each other in various configurations.

30 DIRECT ENERGY CONVERSION↗

Experimental Investigation on Cooling performance of A Thermoelectric Freezer

Thermoelectric heat pumps (TEHPs) have found widespread use in the electronics cooling industry and portable refrigerators. However, there has been a lack of extensive research on the application of TEHPs in low-temperature refrigeration settings. To address this gap, various configurations of TEHPs were fabricated to assess their suitability for freezer applications. Key parameters such as cooling capacity and system performance of the TEHPs were crucial in evaluating these configurations. Three configurations, each with different numbers of cooling units and fan arrangements, were tested using a 300-liter freezer prototype under typical room conditions (21°C). A cooling unit is comprised of two-stage thermoelectric modules, an aluminum plate fin heat exchanger sink with fans positioned either on top or directing airflow through the center, and a cooling block with circulating icy water for heat dissipation. Across all configurations, the minimum temperature inside the freezer cabinet reached -16.0°C. The cooling capacity peaked at 74.7 W, with the thermoelectric coefficient of performance (COP) reaching a maximum of 0.45. System COP ranged from 0.23 to 0.28. Minimum TE power consumption was recorded at 138.8 W, with TE system power consumption at 174.4 W, indicating feasibility for practical residential freezer applications. This investigation lays the foundation for integrating TE freezers with ice thermal storage systems.

Hu, Yifeng↗

Field Demonstration and Adoption Impacts of an Affordable Thermoelectric Heat Pump

This study presents the design, field validation, and utility impacts of an air source heat pump that uses thermoelectric (TE) technology to provide supplemental heating at outside air temperatures below 17°F. Conventional heat pumps experience reduced heating capacity and COP at low outdoor temperatures due to the temperature difference between the source and demand sides of the vapor compression cycle. Consequently, during colder months, supplemental heating such as electric resistance or natural gas furnace is often needed to provide additional warmth, which increases the overall equipment and energy costs. To address this challenge, a TE subcooler (an array of solid-state, thermoelectric modules that provides heat pumping using non-vapor compression technique) is fabricated and integrated with the vapor compression cycle of a conventional air-source heat pump. In colder ambient conditions, TE subcooler exchanges heat with the refrigerant to provide additional subcooling, thereby enhancing the capacity of the heat pump. The operation of thermoelectric-integrated heat pump was demonstrated in an occupied single-family home in Nashville, TN. The TE subcooler increased the system’s heating capacity at 15°F outdoor temperature by 25–30% and reduced electricity demand by 10%. It also met the heating load in the house without supplemental electric resistance down to 5°F outdoors, delivering the additional heat at nearly 80% greater efficiency compared to electric resistance heating. With a modest first cost increment of 10–15% over conventional single-speed heat pumps, this approach offers a promising, energy-efficient solution to accelerate residential heat pump adoption in the U.S.

KRISHNAMOORTHY, Sreenidhi [Electric Power Research↗

Size- and Temperature-Dependent Suppression of Phonon Thermal Conductivity in Carbon Nanotube Thermoelectric Films

Heat transport in nanoscale carbon materials such as carbon nanotubes and graphene is normally dominated by phonons. Here, measurements of in-plane thermal conductivity, electrical conductivity, and thermopower are presented from 77–350 K on two films with thickness <100 nm formed from semiconducting single-walled carbon nanotubes. These measurements are made with silicon–nitride membrane thermal isolation platforms. The two films, formed from disordered networks of tubes with differing tube and bundle size, have very different thermal conductivity. One film matches a simple model of heat conduction assuming constant phonon velocity and mean free path, and 3D Debye heat capacity with a Debye temperature of 770 K. The second film shows a more complicated temperature dependence, with a dramatic drop in a relatively narrow window near 200 K where phonon contributions to thermal conductivity essentially vanish. This causes a corresponding large increase in thermoelectric figure-of-merit at the same temperature. A better understanding of this behavior can allow significant improvement in thermoelectric efficiency of these low-cost earth-abundant, organic electronic materials. Finally, heat and charge conductivity near room temperature is also presented as a function of doping, which provides further information on the interaction of dopant molecules and phonon transport in disordered nanotube films.

36 MATERIALS SCIENCE↗

Physical origins of the varying performance and unusual transport behaviors among thermoelectric A Mg 2 Sb 2 materials ( A = Ca, Sr, Sm, Yb, and Mg)

Contrary to the similar thermoelectric performance among both AZn 2 Sb 2 and AMg 2 Bi 2 compounds, their isostructural counterparts, AMg 2 Sb 2 , can exhibit thermoelectric figure of merit values that vary by orders of magnitude with different A elements. Here, we reveal physical origins accounting for the significantly differing performance among AMg 2 Sb 2 -based compounds (A = Ca, Sr, Sm, Yb, and Mg) through comprehensive analyses, where it is shown that the dispar- ities in performance at the macroscale essentially originate from the widely varying activation energies that equal amounts of dopant can induce. Meanwhile, a few unusual transport behaviors regarding electrical conductivity, carrier concentration, or lattice thermal con- ductivity among these compounds have been identified, and we also present their rationales in depth. Furthermore, this mechanism-focused study can not only promote further understanding of the complex transport behaviors in condensed matter but be instrumental in rationally tun- ing the physical properties of materials as well.

36 MATERIALS SCIENCE↗

When band convergence is not beneficial for thermoelectrics

Abstract Band convergence is considered a clear benefit to thermoelectric performance because it increases the charge carrier concentration for a given Fermi level, which typically enhances charge conductivity while preserving the Seebeck coefficient. However, this advantage hinges on the assumption that interband scattering of carriers is weak or insignificant. With first-principles treatment of electron-phonon scattering in the CaMg 2 Sb 2 -CaZn 2 Sb 2 Zintl system and full Heusler Sr 2 SbAu, we demonstrate that the benefit of band convergence can be intrinsically negated by interband scattering depending on the manner in which bands converge. In the Zintl alloy, band convergence does not improve weighted mobility or the density-of-states effective mass. We trace the underlying reason to the fact that the bands converge at a one k-point, which induces strong interband scattering of both the deformation-potential and the polar-optical kinds. The case contrasts with band convergence at distant k-points (as in the full Heusler), which better preserves the single-band scattering behavior thereby successfully leading to improved performance. Therefore, we suggest that band convergence as thermoelectric design principle is best suited to cases in which it occurs at distant k-points.

42 ENGINEERING↗

A robust high sensitivity scanning thermal probe for simultaneous microscale thermal and thermoelectric property mapping

Scanning Thermal Microscopy (SThM) provides efficient thermal property measurement with micro- or nanoscale spatial resolution. However, the sensitivity and accuracy of state-of-the-art thermal probes have been limited by excessive thermal contact resistance between the probe and sample. Introduced herein is a robust thermal microprobe that can increase the probe-sample contact force by more than two orders of magnitude, thereby reducing the probe-sample thermal contact resistance by as much as 96% and increasing measurement sensitivity by more than 240% compared to a commercial thermal probe with the same dimensions and measurement principle. The relationship between the probe-sample thermal contact resistance, thermal exchange radius, and sample thermal conductivity is determined experimentally. Simultaneous measurement of thermal conductivity and Seebeck coefficient with unprecedented sensitivity is demonstrated using the enhanced scanning thermal microprobe on samples of an extended range of thermal conductivity up to 18 W/m K, increasing the range of samples applicable to SThM when compared to the conventional commercial probe with diminished measurement sensitivity above ~10 W/m K. The probe is further demonstrated by simultaneously mapping thermal conductivity and Seebeck coefficient as a function of depth from the irradiated surface of an ion-irradiated bulk nanostructured thermoelectric material. In addition to enabling microscale thermal conductivity and Seebeck coefficient measurement of materials previously not applicable to SThM, the probe can also facilitate high-throughput characterization of combinatorial materials to aid the rapid discovery of compositions and processing conditions that yield highly desired thermal and thermoelectric properties.

36 MATERIALS SCIENCE↗

High Thermoelectric Performance and Defect Energetics of Multipocketed Full Heusler Compounds

We report a first-principles density-functional study of electron-phonon interactions in and thermoelectric transport properties of the full Heusler compounds Sr 2 BiAu and Sr 2 SbAu. Our results show that ultrahigh intrinsic bulk thermoelectric performance across a wide range of temperatures is physically possible and point to the presence of multiply degenerate and highly dispersive carrier pockets as the key factor for achieving this. Sr 2 BiAu, which features ten energy-aligned low-effective-mass pockets (six along Γ-X and four at L), is predicted to deliver n-type zT=0.4-4.9 at T=100-700 K. Comparison with the previously investigated compound Ba 2 BiAu shows that the additional L pockets in Sr 2 BiAu significantly increase its low-temperature power factor to a maximum value of 12 mW m -1 K -2 near T=300 K. However, at high temperatures the power factor of Sr 2 BiAu drops below that of Ba 2 BiAu because the L states are heavier and subject to strong scattering by phonon deformation, as opposed to the lighter Γ-X states, which are limited by polar-optical scattering. Sr2SbAu is predicted to deliver a lower n-type zT=3.4 at T=750 K due to appreciable misalignment between the L and Γ-X carrier pockets, generally heavier scattering, and a slightly higher lattice thermal conductivity. Soft acoustic modes, which are responsible for the low lattice thermal conductivity, also increase the vibrational entropy and high-temperature stability of these Heusler compounds, suggesting that their experimental synthesis may be feasible. The dominant intrinsic defects are found to be Au vacancies, which drive the Fermi level towards the conduction band and work in favor of n-doping.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗