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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 253 records · Page 14

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NASA NTRS1988

Evaluation of a thermoplastic polyimide (422) for bonding GR/PI composite

A hot-melt processable copolyimide previously studied and characterized as an adhesive for bonding Ti-6Al-4V was used to bond Celion 6000/LARC-160 composite. Comparisons are made for the two adherend systems. A bonding cycle was determined for the composite bonding and lap shear specimens were prepared which were thermally exposed in a forced-air oven for up to 5000 h at 204 C. The lap shear strengths (LSSs) were determined at RT, 177, and 204 C. After thermal exposure at RT, 177, and 204 C the LSS decreased significantly; however, a slight increase was noted for the 204 C tests. Initially the LSS values are higher for the bonded Ti-6Al-4V than for the bonded composite, however, the LSS decreases dramatically between 5000 and 10,000 h of 204 C thermal exposure. Longer periods of thermal exposure up to 20,000 h results in further decreases in the LSSs. Although the bonded composite retained useful strengths for exposures up to 5000 h, based on the poor results of the bonded Ti-6Al-4V beyond 5000 h, the 422 adhesive bonded composites would most likely also produce poor strengths beyond 5000 h exposure. Adhesive bonded composite lap shear specimens exposed to boiling water for 72 h exhibited greatly reduced strengths at all test temperatures. The percent retained after water boil for each test temperature was essentially the same for both systems.

Progar, Donald J.↗

NASA NTRS1988

Evaluation of a thermoplastic polyimide (422) for bonding GR/PI composite

A hot-melt processable copolyimide previously studied and characterized as an adhesive for bonding Ti-6Al-4V was used to bond Celion 6000/LARC-160 composite. Comparisons are made for the two adherend systems. A bonding cycle was determined for the composite bonding and lap shear specimens were prepared which were thermally exposed in a forced-air oven for up to 5000 h at 204 C. The lap shear strengths (LSSs) were determined at RT, 177, and 204 C. After thermal exposure at RT, 177, and 204 C the LSS decreased significantly; however, a slight increase was noted for the 204 C tests. Initially the LSS values are higher for the bonded Ti-6Al-4V than for the bonded composite, however, the LSS decreases dramatically between 5000 and 10,000 h of 204 C thermal exposure. Longer periods of thermal exposure up to 20,000 h results in further decreases in the LSSs. Although the bonded composite retained useful strengths for exposures up to 5000 h, based on the por results of the bonded Ti-6Al-4V beyond 5000 h, the 422 adhesive bonded composites would most likely also produce poor strengths beyond 5000 h exposure. Adhesive bonded composite lap shear specimens exposed to boiling water for 72 h exhibited greatly reduced strengths at all test temperatures. The percent retained after water boil for each test temperature was essentially the same for both systems.

Progar, Donald J.↗

DOE OSTI2026

Thermokinetic mixing compounding for polymer composites – a comprehensive review

High-speed thermokinetic mixers (K-mixers) represent an advanced compounding technology that employs intense shear and friction to convert kinetic energy directly into thermal energy. This mechanism enables rapid mixing cycles, often under one minute, facilitating exceptional filler dispersion while minimizing the material’s thermal history. This is particularly effective for compounding challenging materials, including heat-sensitive biopolymers, wet filler feedstocks, and nanofillers prone to agglomeration. As the first comprehensive review of this technology, this article synthesizes the fundamental principles of thermokinetic mixing (K-mixing) and surveys recent advances in polymer composite fabrication. We contrast the working principles of K-mixers with conventional twin-screw extrusion, highlighting distinct advantages in dispersing nanoscale fillers, exfoliating layered materials, and processing wet cellulosic feedstocks and ultra-high filler loadings (e.g., 85 wt%). Furthermore, strategies to optimize filler–matrix interfacial bonding under rapid-processing constraints, such as the kinetic selection of compatibilizers and fiber surface treatments, are evaluated. Finally, we analyze key structure-processing-property relationships and outline future directions in scaling up, reactive processing, and hybrid material development.

Zhang, Xuefeng [University of Maine]↗

NASA NTRS2007

Automated Hybridization of X-ray Absorber Elements-A Path to Large Format Microcalorimeter Arrays

In the design of microcalorimeters, it is often desirable to produce the X-ray absorber separately from the detector element. In this case, the attachment of the absorber to the detector element with the required thermal and mechanical characteristics is a major challenge. In such arrays, the attachment has been done by hand. This process is not easily extended to the large format arrays required for future X- ray astronomy missions such as the New x-ray Telescope or NeXT. In this paper we present an automated process for attaching absorber tiles to the surface of a large-scale X-ray detector array. The absorbers are attached with stycast epoxy to a thermally isolating polymer structure made of SU-8. SU-8 is a negative epoxy based photo resist produced by Microchem. We describe the fabrication of the X-ray absorbers and their suspension on a handle die in an adhesive matrix. We describe the production process for the polymer isolators on the detector elements. We have developed a new process for the alignment, and simultaneous bonding of the absorber tiles to an entire detector array. This process uses equipment and techniques used in the flip-chip bonding industry and approaches developed in the fabrication of the XRS-2 instrument. XRS-2 was an X-ray spectrometer that was launched on the Suzaku telescope in July 10, 2005. We describe the process and show examples of sample arrays produced by this process. Arrays with up to 300 elements have been bonded. The present tests have used dummy absorbers made of Si. In future work, we will demonstrate bonding of HgTe absorbers.

Moseley, S.↗

NASA NTRSDate not supplied

Recent Advances in LIBS for Real-Time Detection of Silicone Contaminants on CFRP Surfaces

Laser induced breakdown spectroscopy (LIBS) is a materials characterization technique that has been advanced and refined to provide in situ, real-time quality control of carbon fiber reinforced polymer (CFRP) surfaces. As part of an effort to improve process control for adhesive bonding, a LIBS system was designed and assembled at NASA Langley Research Center (LaRC) to enable detection of ultralow concentrations of silicone contamination on CFRP adherends. The LIBS instrument provides high sensitivity detection and quasi-nondestructive surface characterization of CFRP adherends prior to adhesive bonding. This review focuses on the advancements at LaRC using LIBS as a quality control tool for the detection of silicone contaminants for improved adhesive bonding reliability of CFRP materials. This work describes how the LIBS technique was advanced by analyzing the laser parameters, studying the laser-matter interactions, and performing time-resolved measurements to determine the optimal plasma conditions for elemental detection. In addition, LIBS results were compared to X-ray photoelectron spectroscopy data to enable quantitative analysis from analytical calibration curves. Examples are shown of how to perform surface mapping of silicone contamination. Finally, a brief discussion is also presented on LIBS instrumentation, recommendations for laser parameters and instrumentation components, and LIBS technique maturity.

Surface characterization, Carbon fiber reinforced ↗

NASA NTRS1972

Energy pulse bonding

To eliminate many of the present termination problems a technique called energy pulse bonding (EPB) was developed. The process demonstrated the capability of: (1) joining conductors without prior removal of insulations, (2) joining conductors without danger of brittle intermetallics, (3) increased joint temperature capability, (4) simultaneous formation of several bonds, (5) capability of higher joint density, and (6) a production oriented process. The following metals were successfully bonded in the solid state: copper, beryllium copper, phosphor bronze, aluminum, brass, and Kovar.

Smith, G. C.↗

NASA NTRSDate not supplied

Joining Composite Parts With Off-Stoichiometric Matrix Reflow

Adhesive bonding is an attractive alternative to fasteners for composite part assembly. In addition to superior performance, it reduces weight and eliminates costly manufacturing processes. However, current adhesive bonding methods are highly susceptible to contamination flaws, and it is difficult to verify bonds because nondestructive testing to quantify bond strength is still under development. In aerospace applications, this often results in fasteners being added to provide redundant load paths. Co-cured parts can provide an alternative because they can be inspected using traditional nondestructive evaluation techniques such as ultrasound. However, co-curing can only be accomplished for a limited range of geometries. NASA’s Adhesive Free Bonding of Composites (AERoBOND) is an alternative method for bonding composite parts. The goal of this study was to further develop and understand the capabilities of this novel bonding technique.

Charles T. Dolph↗

NASA NTRS1999

Microwave Induced Direct Bonding of Single Crystal Silicon Wafers

We have heated polished doped single-crystal silicon wafers in a single mode microwave cavity to temperatures where surface to surface bonding occurred. The absorption of microwaves and heating of the wafers is attributed to the inclusion of n-type or p-type impurities into these substrates. A cylindrical cavity TM (sub 010) standing wave mode was used to irradiate samples of various geometry's at positions of high magnetic field. This process was conducted in vacuum to exclude plasma effects. This initial study suggests that the inclusion of impurities in single crystal silicon significantly improved its microwave absorption (loss factor) to a point where heating silicon wafers directly can be accomplished in minimal time. Bonding of these substrates, however, occurs only at points of intimate surface to surface contact. The inclusion of a thin metallic layer on the surfaces enhances the bonding process.

Budraa, N. K.↗

NASA NTRS1983

Laminating Polyimide Films

Thermoplastic polyimide adhesive is used to bond polyimide sheets into flexible laminates. Films are first primed with polyimide adhesive, then bonded together under heat and pressure. Adhesive is cast on separate surface, then sandwiched between polyimide and/or metal films for final assembly. Objectives of process are to improve bonding of high-temperature polyimide film, prepare flexible, large-area, void-free laminates from polyimide film, and laminate polyimide film not only to itself but to metal surfaces.

St. Clair, A. K.↗

NASA NTRS2012

Research and Development of External Occultor Technology for the Direct Observation of Extrasolar Planetary Systems : JPL Starshades Project

Our group conducted work during the Summer of 2012 assembling and developing JPL's Starshades Project under the Technology Development for Exoplanet Missions(TDEM) initiative created by NASA, specifically TDEM stage 2. The goal of the work conducted at JPL by our group was to construct four occultor petals, the main optical components of the Starshade, for the analysis of joint deployment characteristics and of mechanical strain. A Starshade is an optical structure measuring approximately 30 meters in diameter that uses the effects of light diffraction off sheer edges, light scattering, and negative interference between waves to negate all on-axis light in a telescope's image, providing very high contrast that allows planets orbiting a target star to be observed. We completed our engineering goals in the time span of 10 weeks, during which the assembly processes of manufacture, alignment, and structural bonding took place. The Starshade technology and construction process is further discussed in the body of this paper.

exoplanet missions↗

NASA NTRS2012

Research and development of external occultor technology for the direct observation of extrasolar planetary systems : JPL Starshades Project

Our group conducted work during the Summer of 2012 assembling and developing JPL's Starshades Project under the Technology Development for Exoplanet Missions(TDEM) initiative created by NASA, specically TDEM stage 2. The goal of the work conducted at JPL by our group was to construct four occultor petals, the main optical components of the Starshade, for the analysis of joint deployment characteristics and of mechanical strain. A Starshade is an optical structure measuring approximately 30 meters in diameter that uses the effects of light difraction of sheer edges, light scattering, and negative interference between waves to negate all on-axis light in a telescope's image, providing very high contrast that allows planets orbiting a target star to be observed. We completed our engineering goals in the time span of 10 weeks, during which the assembly processes of manufacture, alignment, and structural bonding took place. The Starshade technology and construction process is further discussed in the body of this paper.

Stadeler, Herbert Franz Mehnert↗

NASA NTRS1972

Proceedings of the Symposium on Welding, Bonding, and Fastening

Various technological processes to achieve lightweight reliable joining systems for structural elements of aircraft and spacecraft are considered. Joining methods, combinations of them, and nondestructive evaluation and quality assurance are emphasized.

Stein, B. A.↗

NASA NTRS2003

Bond Sensitivity to Silicone Contamination

Currently during fabrication of the Space Shuttle booster rocket motors, the use of silicone and silicone-containing products is prohibited in most applications. Many shop aids and other materials containing silicone have the potential, if they make contact with a bond surface, to transfer some of the silicone to the substrates being bonded. Such transfer could result in a reduction of the bond strength or even failure of the subsequent bonds. This concern is driving the need to understand the effect of silicones and the concentration needed to affect a given bond-line strength. Additionally, as silicone detection methods used for materials acceptance improve what may have gone unnoticed earlier is now being detected. Thus, realistic silicone limits for process materials (below which bond performance is satisfactory) are needed rather than having an absolute no silicone permitted policy.

Caldwell, G. A.↗

NASA NTRS1993

Manufacturing scale-up of composite fuselage crown panels

The goal of the Boeing effort under the NASA ACT program is to reduce manufacturing costs of composite fuselage structure. Materials, fabrication of complex subcomponents and assembly issues are expected to drive the costs of composite fuselage structure. Several manufacturing concepts for the crown section of the fuselage were evaluated through the efforts of a Design Build Team (DBT). A skin-stringer-frame intricate bond design that required no fasteners for the panel assembly was selected for further manufacturing demonstrations. The manufacturing processes selected for the intricate bond design include Advanced Tow Placement (ATP) for multiple skin fabrication, resin transfer molding (RTM) of fuselage frames, innovative cure tooling, and utilization of low-cost material forms. Optimization of these processes for final design/manufacturing configuration was evaluated through the fabrication of several intricate bond panels. Panels up to 7 ft. by 10 ft. in size were fabricated to simulate half scale production parts. The qualitative and quantitative results of these manufacturing demonstrations were used to assess manufacturing risks and technology readiness for production.

Willden, Kurtis↗

NASA NTRS2008

Ultra-Thin, Flexible Electronics

Thinned die can be used to realize ultra-thin flexible electronics for applications such as conformal and wearable electronics. Three techniques have been developed to achieve this goal using thinned die: die flip chip bonded onto flexible substrates, die laminated onto LCP films, and die embedded in polyimide. A key to achieving each of these techniques is the thinning of die to a thickness of 50 microns or thinner. Conventional CMP processing can be used to thin to 50 microns. At 50 microns, the active die become flexible and must be handled by temporarily bonding them to a holder die, for further processing. Once bonded face down to the holder die, the active die can be further thinned by DRIE etching the exposed backside. The thinned die can then been packaged in or on the flexible substrate.

electronics packaging↗

NASA NTRS1986

Flat-plate solar array project. Volume 7: Module encapsulation

The objective of the Encapsulation Task was to develop, demonstrate, and qualify photovoltaic (PV) module encapsulation systems that would provide 20 year (later decreased to 30 year) life expectancies in terrestrial environments, and which would be compatible with the cost and performance goals of the Flat-Plate Solar Array (FSA) Project. The scope of the Encapsulation Task included the identification, development, and evaluation of material systems and configurations required to support and protect the optically and electrically active solar cell circuit components in the PV module operating environment. Encapsulation material technologies summarized include the development of low cost ultraviolet protection techniques, stable low cost pottants, soiling resistant coatings, electrical isolation criteria, processes for optimum interface bonding, and analytical and experimental tools for evaluating the long term durability and structural adequacy of encapsulated modules. Field testing, accelerated stress testing, and design studies have demonstrated that encapsulation materials, processes, and configurations are available that meet the FSA cost and performance goals.

Cuddihy, E.↗

NASA NTRS1985

Explosive Welding in the 1990's

Explosive bonding is a unique joining process with the serious potential to produce composite materials capable of fulfilling many of the high performance materials capable of fulfilling many of the high performance materials needs of the 1990's. The process has the technological versatility to provide a true high quality metallurgical compatible and incompatible systems. Metals routinely explosively bonded include a wide variety of combinations of reactive and refractory metals, low and high density metals and their alloys, corrosion resistant and high strength alloys, and common steels. The major advantage of the process is its ability to custom design and engineer composites with physical and/or mechanical properties that meet a specific or unusual performance requirement. Explosive bonding offers the designer unique opportunities in materials selection with unique combinations of properties and high integrity bonds that cannot be achieved by any other metal joining process. The process and some applications are discussed.

Lalwaney, N. S.↗

NASA NTRS1984

Repair techniques for celion/LARC-160 graphite/polyimide composite structures

The large stiffness-to-weight and strength-to-weight ratios of graphite composite in combination with the 600 F structural capability of the polyimide matrix can reduce the total structure/TPS weight of reusable space vehicles by 20-30 percent. It is inevitable that with planned usage of GR/PI structural components, damage will occur either in the form of intrinsic flaw growth or mechanical damage. Research and development programs were initiated to develop repair processes and techniques specific to Celion/LARC-160 GR/PI structure with emphasis on highly loaded and lightly loaded compression critical structures for factory type repair. Repair processes include cocure and secondary bonding techniques applied under vacuum plus positive autoclave pressure. Viable repair designs and processes are discussed for flat laminates, honeycomb sandwich panels, and hat-stiffened skin-stringer panels. The repair methodology was verified through structural element compression tests at room temperature and 315 C (600 F).

Jones, J. S.↗