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At least 253 records · Page 14

Lithium Polymer Electrolytes and Solid State NMR

Research is being done at the Glenn Research Center (GRC) developing new kinds of batteries that do not depend on a solution. Currently, batteries use liquid electrolytes containing lithium. Problems with the liquid electrolyte are (1) solvents used can leak out of the battery, so larger, more restrictive, packages have to be made, inhibiting the diversity of application and decreasing the power density; (2) the liquid is incompatible with the lithium metal anode, so alternative, less efficient, anodes are required. The Materials Department at GRC has been working to synthesize polymer electrolytes that can replace the liquid electrolytes. The advantages are that polymer electrolytes do not have the potential to leak so they can be used for a variety of tasks, small or large, including in the space rover or in space suits. The polymers generated by Dr. Mary Ann Meador's group are in the form of rod -coil structures. The rod aspect gives the polymer structural integrity, while the coil makes it flexible. Lithium ions are used in these polymers because of their high mobility. The coils have repeating units of oxygen which stabilize the positive lithium by donating electron density. This aids in the movement of the lithium within the polymer, which contributes to higher conductivity. In addition to conductivity testing, these polymers are characterized using DSC, TGA, FTIR, and solid state NMR. Solid state NMR is used in classifying materials that are not soluble in solvents, such as polymers. The NMR spins the sample at a magic angle (54.7') allowing the significant peaks to emerge. Although solid state NMR is a helpful technique in determining bonding, the process of preparing the sample and tuning it properly are intricate jobs that require patience; especially since each run takes about six hours. The NMR allows for the advancement of polymer synthesis by showing if the expected results were achieved. Using the NMR, in addition to looking at polymers, allows for participation on a variety of other projects, including aero-gels and carbon graphite mat en als. The goals of the polymer electrolyte research are to improve the physical properties of the polymers. This includes improving conductivity, durability, and expanding the temperature range over which it is effective. Currently, good conductivity is only present at high temperatures. My goals are to experiment with different arrangements of rods and coils to achieve these desirable properties. Some of my experiments include changing the number of repeat units in the polymer, the size of the diamines, and the types of coil. Analysis of these new polymers indicates improvement in some properties, such as lower glass transition temperature; however, they are not as flexible as desired. With further research we hope to produce polymers that encompass all of these properties to a high degree.

Berkeley, Emily R.↗

Development of an advanced spacecraft tandem mass spectrometer

The purpose of this research was to apply current advanced technology in electronics and materials to the development of a miniaturized Tandem Mass Spectrometer that would have the potential for future development into a package suitable for spacecraft use. The mass spectrometer to be used as a basis for the tandem instrument would be a magnetic sector instrument, of Nier-Johnson configuration, as used on the Viking Mars Lander mission. This instrument configuration would then be matched with a suitable second stage MS to provide the benefits of tandem MS operation for rapid identification of unknown organic compounds. This tandem instrument is configured with a newly designed GC system to aid in separation of complex mixtures prior to MS analysis. A number of important results were achieved in the course of this project. Among them were the development of a miniaturized GC subsystem, with a unique desorber-injector, fully temperature feedback controlled oven with powered cooling for rapid reset to ambient conditions, a unique combination inlet system to the MS that provides for both membrane sampling and direct capillary column sample transfer, a compact and ruggedized alignment configuration for the MS, an improved ion source design for increased sensitivity, and a simple, rugged tandem MS configuration that is particularly adaptable to spacecraft use because of its low power and low vacuum pumping requirements. The potential applications of this research include use in manned spacecraft like the space station as a real-time detection and warning device for the presence of potentially harmful trace contaminants of the spacecraft atmosphere, use as an analytical device for evaluating samples collected on the Moon or a planetary surface, or even use in connection with monitoring potentially hazardous conditions that may exist in terrestrial locations such as launch pads, environmental test chambers or other sensitive areas. Commercial development of the technology could lead to a new family of environmental test instruments that would be small and portable, yet would give quick analyses of complex samples.

Drew, Russell C.↗

Overview of Multi-Layer Metal Insulation Development for Small Stirling Convertors at NASA GRC

The small Stirling convertor currently under development at the NASA Glenn Research Center (GRC) is designed to produce one watt of electrical power from eight watts of heat. Previous radioisotope power systems (RPS) made use of the General-Purpose Heat Source (GPHS) which produces 250 watts of heat but is unsuitable for a one-watt Stirling convertor. The only heat source available is the Light-Weight Radioisotope Heating Unit (LWRHU) which produces one watt of heat and is primarily used to provide heat to electronics and instrumentation to maintain their appropriate operating temperature. Unfortunately, the LWRHU has a heat flux of 272 W/m-squared compared to the GPHS heat flux of 6000 W/m-squared which greatly increases the demands on the insulation to ensure that enough of the heat produced is available to the convertor and not lost to the environment. An analysis was performed that showed that the insulation must have a thermal conductivity of 0.005 W/m·K or better for the system to function. A multi-layer metal insulation package was designed and a prototype was fabricated and tested to investigate the feasibility of this design. The prototype did not meet the requirements; however, the improved thermal model generated using the test data will allow for a second iteration to be developed that has a much higher confidence and meets the performance requirements.

Goodell, Daniel D.↗

Overview of MultiLayer Metal Insulation Development for Small Stirling Convertors at NASA Glenn Research Center

A small Stirling convertor is currently under development at the NASA Glenn Research Center to produce one watt of electrical power from eight watts of heat. Previous radioisotope power systems made use of the General-Purpose Heat Source (GPHS) which produces 250 watts of heat but is unsuitable for a one-watt Stirling convertor. The only other qualified heat source available is the Light-Weight Radioisotope Heating Unit (LWRHU), which produces one watt of heat and is primarily used to provide heat to electronics and instrumentation to maintain their appropriate operating temperature. Unfortunately, the LWRHU has a heat flux of 272 W/meters squared compared to the GPHS heat flux of 6000 W/m2 which greatly increases the demands on the insulation to ensure that enough of the heat produced is available to the convertor and not lost to the environment. An analysis was performed that showed that the insulation must have an effective thermal conductivity of 0.005 W/m·K or better for the system to function. A multi-layer metal insulation package was designed and a prototype was fabricated and tested to investigate the feasibility of this design. While the prototype did not meet the requirements perfectly, the lessons learned are being used to generate an improved thermal model using the test data so that a second iteration can developed that will meet the performance requirements with a much higher confidence.

Daniel D Goodell↗

COTS MEMS Flow-Measurement Probes

As an alternative to conventional tubing instrumentation for measuring airflow, designers and technicians at Glenn Research Center have been fabricating packaging components and assembling a set of unique probes that contain commercial off-the-shelf (COTS) microelectromechanical systems (MEMS) sensor chips. MEMS sensor chips offer some compelling advantages over standard macroscopic measurement devices. MEMS sensor technology has matured through mass production and use in the automotive and aircraft industries. At present, MEMS are the devices of choice for sensors in such applications as tire-pressure monitors, altimeters, pneumatic controls, cable leak detectors, and consumer appliances. Compactness, minimality of power demand, rugged construction, and moderate cost all contribute to making MEMS sensors attractive for instrumentation for future research. Conventional macroscopic flow-measurement instrumentation includes tubes buried beneath the aerodynamic surfaces of wind-tunnel models or in wind-tunnel walls. Pressure is introduced at the opening of each such tube. The pressure must then travel along the tube before reaching a transducer that generates an electronic signal. The lengths of such tubes typically range from 20 ft (approx.= 6 m) to hundreds of feet (of the order of 100 m). The propagation of pressure signals in the tubes damps the signals considerably and makes it necessary to delay measurements until after test rigs have reached steady-state operation. In contrast, a MEMS pressure sensor that generates electronic output can take readings continuously under dynamic conditions in nearly real time. In order to use stainless-steel tubing for pressure measurements, it is necessary to clean many tubes, cut them to length, carefully install them, delicately deburr them, and splice them. A cluster of a few hundred 1/16-in.- (approx.=1.6-mm-) diameter tubes (such clusters are common in research testing facilities) can be several inches (of the order of 10 cm) in diameter and could weigh enough that two technicians are needed to handle it. Replacing hard tubing with electronic chips can eliminate much of the bulk. Each sensor would fit on the tip of a 1/16-in. tube with room to spare. The Lucas NovaSensor P592 piezoresistive silicon pressure sensor was chosen for this project because of its cost, availability, and tolerance to extreme ambient conditions. The sensor chip is 1 mm square by 0.6 mm thick (about 0.039 by 0.039 by 0.024 in.) and includes 0.12-mm (approx.=0.005-in.) wire connection tabs. The figure shows a flow-angularity probe that was built by use of three such MEMS chips. It is planned to demonstrate this MEMS probe as an alternative to a standard tube-type "Cobra" probe now used routinely in wind tunnels and aeronautical hardware. This MEMS probe could be translated across a flow field by use of a suitable actuator, so that its accuracy and the shortness of its response time could be exploited to obtain precise dynamic measurements of a sort that cannot be made by use of conventional tubing-based instrumentation.

Redding, Chip↗

Prototype Motor Controllers Demonstrated for the James Webb Space Telescope Cryogenic Environment

NASA is in the process of designing the James Webb Space Telescope. This telescope will investigate images of objects in deep space (stars, galaxies, etc.) by using light in the infrared region of the light spectrum. To make such observations, the telescope must have light sensors that operate at very cold temperatures, near absolute zero. To achieve this low-temperature tolerance, designers must place the light sensors behind a Sun shield that will prevent sunlight, and its heat, from reaching the sensors. In this cold region inside the telescope, electric motors and some motor controls must operate at temperatures near 40 K (40 degrees above absolute zero). These motors will be used to position light filters needed by the telescope. There are motors that operate at the low temperatures, but there is little technology for low-temperature motor-control electronics. The drawing shows how the motors and their controls are positioned behind the Sun shield. Simplified version of the layout of the motor and control electronics that are located, as dictated by mission requirements, in the cold zone of the James Webb Space Telescope. A Sun shield provides protection and isolation of these electronics from the heat of the rays of the sun. Room temperature compoenets (control computer, motor select command, motor phase drive, power supply, parallel to serial, and sun shield) as well as 40-kelvin components (motor select, serial to parallel, and motors) are shown. The Low Temperature Electronics Group at the NASA Glenn Research Center has been working to develop motor control electronics that will operate at a temperature of 40 K. The group conducted tests to determine which electronic components will operate at such very low temperatures. Then, components that were determined to operate successfully at the low temperatures were used to design low-temperature motor-controller circuits. A prototype motor controller circuit was built, evaluated, and demonstrated to operate at 70 K. Next, Glenn researchers plan to determine circuit performance at much colder temperatures--down to 40 K. This low-temperature program was supported by the James Webb Space Telescope Electrical Systems Design Group at the NASA Goddard Space Flight Center and by the NASA Electronic Parts and Packaging Program at NASA Headquarters and the Jet Propulsion Laboratory.

Patterson, Richard L.↗

Overview of Multi-Layer Metal Insulation Development for Small Stirling Convertors at NASA GRC

The small Stirling convertor currently under development at the NASA Glenn Research Center (GRC) is designed to produce one watt of electrical power from eight watts of heat. Previous radioisotope power systems (RPS) made use of the General-Purpose Heat Source (GPHS) which produces 250 watts of heat but is unsuitable for a one-watt Stirling convertor. The only heat source available is the Light-Weight Radioisotope Heating Unit (LWRHU) which produces one watt of heat and is primarily used to provide heat to electronics and instrumentation to maintain their appropriate operating temperature. Unfortunately, the LWRHU has a heat flux of 272 W/m-squared (watts per square meter) compared to the GPHS heat flux of 6000 W/m-squared which greatly increases the demands on the insulation to ensure that enough of the heat produced is available to the convertor and not lost to the environment. An analysis was performed that showed that the insulation must have a thermal conductivity of 0.005 W/m squared -K (watts per square meter per Kelvin) or better for the system to function. A multi-layer metal insulation package was designed and a prototype was fabricated and tested to investigate the feasibility of this design. The prototype did not meet the requirements; however, the improved thermal model generated using the test data will allow for a second iteration to be developed that has a much higher confidence and meets the performance requirements.

Goodell, Daniel↗

Electrical and Dielectric Characterizations of HTCC Electronic Packages for High Temperature Harsh Environment Applications

A prototype high temperature co-fired ceramic (HTCC) alumina packaging system composed of a 32-I/Os package and a compatible circuit board was previously developed and demonstrated for long term operation in 500 °C environments. The electrical / dielectric parasitic parameters of that chip level package were characterized and reported. This co-fired packaging system with platinum (Pt) conductor has successfully facilitated tests of silicon carbide (SiC) analog and digital integrated circuits (ICs) developed at NASA GRC at 500°C for up to 10,000 hours in ambient oven environment and 60 earth days in Venus surface environment with simulated temperature, pressure, and chemical constituents. Based on these previous results, this paper introduces new designs of Pt-HTCC packages with 16, 24, and 44 I/Os for packaging a new generation SiC ICs with 8, 24, 56, 62, and 72 I/Os to be tested in high temperature harsh environments. The package with 44 I/Os is specifically designed for the new SiC ICs with 56, 62, and 72-I/Os and electrical connection needs, the power pads of this package are consolidated, and an array of I/O pads distributed on separated vertical levels (inside the package) is used to control the overall package dimensions and mitigate the parasitic effects at high temperatures. This paper will present the detailed design of these chip-level packages and results of electrical and dielectric characterization of these newly fabricated chip-level Pt-HTCC packages.

High temperature↗

Electrical and Dielectric Characterizations of HTCC Electronic Packages for High Temperature Harsh Environment Applications

A prototype high temperature co-fired ceramic (HTCC) alumina packaging system composed of a 32-I/Os package and a compatible circuit board was previously developed and demonstrated for long term operation in 500 °C environments. The electrical / dielectric parasitic parameters of that chip level package were characterized and reported. This co-fired packaging system with platinum (Pt) conductor has successfully facilitated tests of silicon carbide (SiC) analog and digital integrated circuits (ICs) developed at NASA GRC at 500°C for up to 10,000 hours in ambient oven environment and 60 earth days in Venus surface environment with simulated temperature, pressure, and chemical constituents. Based on these previous results, this paper introduces new designs of Pt-HTCC packages with 16, 24, and 44 I/Os for packaging a new generation SiC ICs with 8, 24, 56, 62, and 72 I/Os to be tested in high temperature harsh environments. The package with 44 I/Os is specifically designed for the new SiC ICs with 56, 62, and 72-I/Os and electrical connection needs, the power pads of this package are consolidated, and an array of I/O pads distributed on separated vertical levels (inside the package) is used to control the overall package dimensions and mitigate the parasitic effects at high temperatures. This paper will present the detailed design of these chip-level packages and results of electrical and dielectric characterization of these newly fabricated chip-level Pt-HTCC packages.

High temperature↗

Evaluation of Silicon-on-Insulator HTOP-01 Operational Amplifier for Wide Temperature Operation

Electronics capable of operation under extreme temperatures are required in many of NASA space exploration missions. Aerospace and military applications, as well as some terrestrial industries constitute environments where electronic systems are anticipated to be exposed to extreme temperatures and wide-range thermal swings. Electronics that are able to withstand and operate efficiently in such harsh environments would simplify, if not eliminate, traditional thermal control elements and their associated structures for proper ambient operation. As a result, overall system mass would be reduced, design would be simplified, and reliability would be improved. Electronic parts that are built utilizing silicon-on-insulator (SOI) technology are known to offer better radiation-tolerance compared to their conventional silicon counterparts, provide faster switching, and consume less power. They also exhibit reduced leakage current and, thus, they are often tailored for high temperature operation. These attributes make SOI-based devices suitable for use in harsh environments where extreme temperatures and wide thermal swings are anticipated. A new operational amplifier, based on silicon-on-insulator technology and geared for high temperature well-logging applications, was recently introduced by Honeywell Corporation. This HTOP-01 dual precision operational amplifier is a low power device, operates on a single supply, and has an internal oscillator and an external clocking option [1]. It is rated for operation from -55 C to +225 C with a maximum output current capability of 50 mA. The amplifier chip is designed as a 14-pin, hermetically-sealed device in a ceramic package. Table I shows some of the device manufacturer s specifications.

Patterson, Richard↗

Demonstration of a Submillimeter-Wave HEMT Oscillator Module at 330 GHz

In this work, radial transitions have been successfully mated with a HEMT-based MMIC (high-electron-mobility-transistor-based monolithic microwave integrated circuit) oscillator circuit. The chip has been assembled into a WR2.2 waveguide module for the basic implementation with radial E-plane probe transitions to convert the waveguide mode to the MMIC coplanar waveguide mode. The E-plane transitions have been directly integrated onto the InP substrate to couple the submillimeter-wave energy directly to the waveguides, thus avoiding wire-bonds in the RF path. The oscillator demonstrates a measured 1.7 percent DC-RF efficiency at the module level. The oscillator chip uses 35-nm-gate-length HEMT devices, which enable the high frequency of oscillation, creating the first demonstration of a packaged waveguide oscillator that operates over 300 GHz and is based on InP HEMT technology. The oscillator chip is extremely compact, with dimensions of only 1.085 x 320 sq mm for a total die size of 0.35 sq mm. This fully integrated, waveguide oscillator module, with an output power of 0.27 mW at 330 GHz, can provide low-mass, low DC-power-consumption alternatives to existing local oscillator schemes, which require high DC power consumption and large mass. This oscillator module can be easily integrated with mixers, multipliers, and amplifiers for building high-frequency transmit and receive systems at submillimeter wave frequencies. Because it requires only a DC bias to enable submillimeter wave output power, it is a simple and reliable technique for generating power at these frequencies. Future work will be directed to further improving the applicability of HEMT transistors to submillimeter wave and terahertz applications. Commercial applications include submillimeter-wave imaging systems for hidden weapons detection, airport security, homeland security, and portable low-mass, low-power imaging systems

Radisic, Vesna↗

Die Attachment for -120 C to +20 C Thermal Cycling of Microelectronics for Future Mars Rovers: An Overview

Active thermal control for electronics on Mars Rovers imposes a serious penalty in weight, volume, power consumption, and reliability. Thus, we propose that thermal control be eliminated for future Rovers. From a functional standpoint there is no reason that the electronics could not operate over the entire temperature range of the Martian environment, which can vary from a low of approximately equal -90 C to a high of approximately equal +20 C during the Martian night and day. The upper end of this range is well within that for conventional electronics. Although the lower end is considerably below that for which conventional--even high-reliability electronics is designed or tested, it is well established that electronic devices can operate to such low temperatures. The primary concern is reliability of the overall electronic system, especially in regard to the numerous daily temperature cycles that it would experience over the duration of a mission on Mars. Accordingly, key reliability issues have been identified for elimination of thermal control on future Mars Rovers. One of these is attachment of semiconductor die onto substrates and into packages. Die attachment is critical since it forms a mechanical, thermal and electrical interface between the electronic device and the substrate or package. This paper summarizes our initial investigation of existing information related to this issue, in order to form an opinion whether die attachment techniques exist, or could be developed with reasonable effort, to withstand the Mars thermal environment for a mission duration of approximately I year. Our conclusion, from a review of literature and personal contacts. is that die attachment can be made sufficiently reliable to satisfy the requirements of future Mars Rovers. Moreover, it appears that there are several possible techniques from which to choose and that the requirements could be met by judicious selection from existing methods using hard solders, soft solders, or organic adhesives. Thus from the standpoint of die attachment. it appears feasible to eliminate thermal control for Rover electronics. We recommend that this be further investigated and verified for the specific hardware and thermal conditions appropriate to Mars Rovers.

Kirschman, Randall K.↗

Universal Controller for Spacecraft Mechanisms

An electronic control unit has been fabricated and tested that can be replicated as a universal interface between the electronic infrastructure of a spacecraft and a brushless-motor (or other electromechanical actuator) driven mechanism that performs a specific mechanical function within the overall spacecraft system. The unit includes interfaces to a variety of spacecraft sensors, power outputs, and has selectable actuator control parameters making the assembly a mechanism controller. Several control topologies are selectable and reconfigurable at any time. This allows the same actuator to perform different functions during the mission life of the spacecraft. The unit includes complementary metal oxide/semiconductor electronic components on a circuit board of a type called rigid flex (signifying flexible printed wiring along with a rigid substrate). The rigid flex board is folded to make the unit fit into a housing on the back of a motor. The assembly has redundant critical interfaces, allowing the controller to perform time-critical operations when no human interface with the hardware is possible. The controller is designed to function over a wide temperature range without the need for thermal control, including withstanding significant thermal cycling, making it usable in nearly all environments that spacecraft or landers will endure. A prototype has withstood 1,500 thermal cycles between 120 and +85 C without significant deterioration of its packaging or electronic function. Because there is no need for thermal control and the unit is addressed through a serial bus interface, the cabling and other system hardware are substantially reduced in quantity and complexity, with corresponding reductions in overall spacecraft mass and cost.

Levanas, Greg↗

Nano Icy Moons Propellant Harvester

As one of just a few bodies identified in the solar system with a liquid ocean, Europa has become a top priority in the search for life outside of Earth. However, cost estimates for exploring Europa have been prohibitively expensive, with estimates of a NASA Flagship class orbiter and lander approaching $5 billion. ExoTerra's NIMPH offers an affordable solution that can not only land, but return a sample from the surface to Earth. NIMPH combines solar electric propulsion (SEP) technologies being developed for the asteroid redirect mission and microsatellite electronics to reduce the cost of a full sample return mission below $500 million. A key to achieving this order-of-magnitude cost reduction is minimizing the initial mass of the system. The cost of any mission is directly proportional to its mass. By keeping the mission within the constraints of an Atlas V 551 launch vehicle versus an SLS, we can significantly reduce launch costs. To achieve this we reduce the landed mass of the sample return lander, which is the largest multiplier of mission mass, and shrink propellant mass through high efficiency SEP and gravity assists. The NIMPH projects first step in reducing landed mass focuses on development of a micro-In Situ Resource Utilization (micro-ISRU) system. ISRU allows us to minimize landed mass of a sample return mission by converting local ice into propellants. The project reduces the ISRU system to a CubeSat-scale package that weighs just 1.74 kg and consumes just 242 W of power. We estimate that use of this ISRU vs. an identical micro-lander without ISRU reduces fuel mass by 45 kg. As the dry mass of the lander grows for larger missions, these savings scale exponentially. Taking full advantage of the micro-ISRU system requires the development of a micro-liquid oxygen-liquid hydrogen engine. The micro-liquid oxygen-liquid hydrogen engine is tailored for the mission by scaling it to match the scale of the micro-lander and the low gravity of the target moon. We also tailor the engine for a near stoichiometric mixture ratio of 7.5. Most high-performance liquid oxygen-liquid hydrogen engines inject extra liquid hydrogen to lower the average molecular weight of the exhaust, which improves specific impulse. However, this extra liquid hydroden requires additional power and processing time on the surface for the ISRU to create. This increases mission cost, and on missions within high radiation environments such as Europa, increases radiation shielding mass. The resulting engine weighs just 1.36 kg and produces 71.5 newton of thrust at 364 s specific impulse. Finally, the mission reduces landed mass by taking advantage of the SEP modules solar power to beam energy to the surface using a collimated laser. This allows us to replace an 45 kg MMRTG with a 2.5 kg resonant array. By using the combination of ISRU, a liquid oxygen-liquid hydrogen engine, and beamed power, we reduce the initial mass of the lander to just 51.5 kg. When combined with an SEP module to ferry the lander to Europa the initial mission mass is just 6397 kg - low enough to be placed on an Earth escape trajectory using an Atlas V 551 launch vehicle. By comparison, we estimate a duplicate lander using an MMRTG and semi-storable propellants such as liquid oxygen-methane would result in an order of magnitude increase in initial lander mass to 445 kg. Attempting to perform the trajectory with a 450 s liquid oxygen-liquid hydrogen engine would increase initial mass to approximately 135,000 kg. Using an Atlas V 1 U.S. Dollar per kg rate to Earth escape value of $27.7k per kg, just the launch savings are over $3.5 billion.

liquid↗

Deployable Propulsion, Power and Communication Systems for Solar System Exploration

NASA is developing thin-film based, deployable propulsion, power, and communication systems for small spacecraft that could provide a revolutionary new capability allowing small spacecraft exploration of the solar system. By leveraging recent advancements in thin films, photovoltaics, and miniaturized electronics, new mission-level capabilities will be enabled aboard lower-cost small spacecraft instead of their more expensive, traditional counterparts, enabling a new generation of frequent, inexpensive deep space missions. Specifically, thin-film technologies are allowing the development and use of solar sails for propulsion, small, lightweight photovoltaics for power, and omnidirectional antennas for communication. Like their name implies, solar sails 'sail' by reflecting sunlight from a large, lightweight reflective material that resembles the sails of 17th and 18th century ships and modern sloops. Instead of wind, the sail and the ship derive their thrust by reflecting solar photons. Solar sail technology has been discussed in the literature for quite some time, but it is only since 2010 that sails have been proven to work in space. Thin-film photovoltaics are revolutionizing the terrestrial power generation market and have been found to be suitable for medium-term use in the space environment. When mounted on the thin-film substrate, these photovoltaics can be packaged into very small volumes and used to generate significant power for small spacecraft. Finally, embedded antennas are being developed that can be adhered to thin-film substrates to provide lightweight, omnidirectional UHF and X-band coverage, increasing bandwidth or effective communication ranges for small spacecraft. Taken together, they may enable a host of new deep space destinations to be reached by a generation of spacecraft smaller and more capable than ever before.

Johnson, Les↗

Modular 5-kW Power-Processing Unit Being Developed for the Next-Generation Ion Engine

The NASA Glenn Research Center is developing a 5- to 10-kW ion engine for a broad range of mission applications. Simultaneously, a 5-kW breadboard power-processing unit (PPU) is being designed and fabricated by Boeing Electron Dynamic Devices, Torrance, California, under contract with Glenn. The beam supply, which processes up to 90 percent of the power into this unit, consists of four 1.1-kW power modules connected in parallel, equally sharing the output current. The modular design allows scalability to higher powers as well as the possibility of implementing an N + 1 redundant beam supply. A novel phaseshifted/pulse-width-modulated, dual full-bridge topology was chosen for this module design for its efficient switching characteristics. A breadboard version of the beam power supply module was assembled. Efficiencies ranging between 91.6 and 96.9 percent were measured for an input voltage range of 80 to 160 V, an output voltage range of 800 to 1500 V, and output powers from 0.3 to 1.0 kW. This beam supply could result in a PPU with a total efficiency between 93 and 95 percent at a nominal input voltage of 100 V. This is up to a 4-percent improvement over the state-of-the-art PPU used for the Deep Space 1 mission. A flight-packaged PPU is expected to weigh no more than 15 kg, which represents a 50-percent reduction in specific mass from the Deep Space 1 design. This will make 5-kW ion propulsion very attractive for many planetary missions.

Pinero, Luis R.↗

Characterization of radiation-induced damage in high performance polymers by electron paramagnetic resonance imaging spectroscopy

The potential for long-term human activity beyond the Earth's protective magnetosphere is limited in part by the lack of detailed information on the effectiveness and performance of existing structural materials to shield the crew and spacecraft from highly penetrating space radiations. The two radiations of greatest concern are high energy protons emitted during solar flares and galactic cosmic rays which are energetic ions ranging from protons to highly oxidized iron. Although the interactions of such high-energy radiations with matter are not completely understood at this time, the effects of the incident radiation are clearly expected to include the formation of paramagnetic spin centers via ionization and bond-scission reactions in the molecular matrices of structural materials. Since this type of radiation damage is readily characterized by Electron Paramagnetic Resonance (EPR) spectroscopy, the NASA Langley Research Center EPR system was repaired and brought on-line during the 1991 ASEE term. A major goal of the 1992 ASEE term was to adapt the existing core of the LaRC EPR system to meet the requirements for EPR Imaging--a powerful new technique which provides detailed information on the internal structure of materials by mapping the spatial distribution of unpaired spin density in bulk media. Major impetus for this adaptation arises from the fact that information derived from EPRI complements other methods such as scanning electron microscopy which primarily characterize surface phenomena. The modification of the EPR system has been initiated by the construction of specially designed, counterwound Helmholtz coils which will be mounted on the main EPR electromagnet. The specifications of the coils have been set to achieve a static linear magnetic field gradient of 10 gauss/mm/amp along the principal (Z) axis of the Zeeman field. Construction is also in progress of a paramagnetic standard in which the spin distribution is known in all three dimensions. This sample will be used to assess the linearity of the magnetic field gradient and to ensure authentic image reconstruction. A second major task was to secure the computer capability to enable image reconstruction from projection data generated by the magnetic field gradients. To this end, commercially available and public domain software packages which perform inverse Fourier Transform and convoluted (filtered) back projection functions are being integrated into the existing EPR data processing system.

Suleman, Naushadalli K.↗

Thermal Cycle Reliability of PBGA/CCGA 717 I/Os

Status of thermal cycle test results for a nonfunctional daisy-chained peripheral ceramic column grid array (CCGA) and its plastic ball grid array (PBGA) version. both having 560 I/Os. were presented in last year's conference. Test results included environmental data for three different thermal cycle regimes (-55 C/125 C, -55 C/100 C, and -50 C /75 C). Update information on these - especially failure type for assemblies with high and low solder volumes-were presented. The thermal cycle test procedure followed those recommended IPC-9701 for tin-lead solder joint assemblies. Revision A of this specification covers guideline thermal cycle requirements for Pb-free solder joints. Some background information discussed during release of this specification with its current guideline recommendations were also presented. In a recent reliability investigation a fully populated CCGA with 717 I/Os was also considered for assembly reliability. evaluation. The functional package is a field-programmable gate array that has much higher processing power than its previous version. This new package is smaller in dimension, has no interposer, and has a thinner column wrapped with copper for reliability improvement. This paper will also present thermal cycle test results for this package assembly and its plastic version with 728 I/Os. both of which were exposed to three different cycle regimes. Two cycle profiles were those specified by IPC- 9701A for tin-lead, i.e. -55 to 100 C and -55 to 125 C and one was a cycle profile specified by Mil-Std-883, i.e.. -65 C/150 C which is generally used for ceramic hybrid packages. Per IPC-9701 A, test vehicles were built using daisy chain packages and were continuously monitored. The effects of many process and assembly variables-including corner staking commonly used for improving resistance to mechanical loading such as drop and vibration loads--were also considered as part of the test matrix. Optical photomicrographs were taken at various thermal cycle intervals to document damage progress and behavior. Representative samples of these along with cross-sectional photomicrographs at higher magnification taken by scanning electron microscopy (SEM) to determine crack propagation and failure analyses for packages are also presented.

staking↗