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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 253 records · Page 14

Particle transport constraints via Bayesian spectral fitting of multiple atomic lines

Optimized operation of fusion devices demands detailed understanding of plasma transport, a problem that must be addressed with advances in both measurement and data analysis techniques. In this work, we adopt Bayesian inference methods to determine experimental particle transport, leveraging opportunities from high-resolution He-like ion spectra in a tokamak plasma. The Bayesian spectral fitting code is used to analyze resonance (w), forbidden (z), intercombination (x, y), and satellite (k, j) lines of He-like Ca following laser blow-off injections on Alcator C-Mod. This offers powerful transport constraints since these lines depend differently on electron temperature and density, but also differ in their relation to Li-like, He-like, and H-like ion densities, often the dominant Ca charge states over most of the C-Mod plasma radius. Using synthetic diagnostics based on the AURORA package, we demonstrate improved effectiveness of impurity transport inferences when spectroscopic data from a progressively larger number of lines are included.

47 OTHER INSTRUMENTATION↗

Particle transport constraints via Bayesian spectral fitting of multiple atomic lines

Optimized operation of fusion devices demands detailed understanding of plasma transport, a problem that must be addressed with advances in both measurement and data analysis techniques. In this work, we adopt Bayesian inference methods to determine experimental particle transport, leveraging opportunities from high-resolution He-like ion spectra in a tokamak plasma. The Bayesian spectral fitting code is used to analyze resonance (w), forbidden (z), intercombination (x, y), and satellite (k, j) lines of He-like Ca following laser blow-off injections on Alcator C-Mod. This offers powerful transport constraints since these lines depend differently on electron temperature and density, but also differ in their relation to Li-like, He-like, and H-like ion densities, often the dominant Ca charge states over most of the C-Mod plasma radius. Using synthetic diagnostics based on the AURORA package, we demonstrate improved effectiveness of impurity transport inferences when spectroscopic data from a progressively larger number of lines are included.

70 PLASMA PHYSICS AND FUSION TECHNOLOGY↗

PROS: An IRAF based system for analysis of x ray data

PROS is an IRAF based software package for the reduction and analysis of x-ray data. The use of a standard, portable, integrated environment provides for both multi-frequency and multi-mission analysis. The analysis of x-ray data differs from optical analysis due to the nature of the x-ray data and its acquisition during constantly varying conditions. The scarcity of data, the low signal-to-noise ratio and the large gaps in exposure time make data screening and masking an important part of the analysis. PROS was developed to support the analysis of data from the ROSAT and Einstein missions but many of the tasks have been used on data from other missions. IRAF/PROS provides a complete end-to-end system for x-ray data analysis: (1) a set of tools for importing and exporting data via FITS format -- in particular, IRAF provides a specialized event-list format, QPOE, that is compatible with its IMAGE (2-D array) format; (2) a powerful set of IRAF system capabilities for both temporal and spatial event filtering; (3) full set of imaging and graphics tasks; (4) specialized packages for scientific analysis such as spatial, spectral and timing analysis -- these consist of both general and mission specific tasks; and (5) complete system support including ftp and magnetic tape releases, electronic and conventional mail hotline support, electronic mail distribution of solutions to frequently asked questions and current known bugs. We will discuss the philosophy, architecture and development environment used by PROS to generate a portable, multimission software environment. PROS is available on all platforms that support IRAF, including Sun/Unix, VAX/VMS, HP, and Decstations. It is available on request at no charge.

Conroy, M. A.↗

Power ??ctronics Directions for the Future

This paper will discuss the results of the ??ctronics roadmaps developed for the New Millennium Program. The roadmaps will place into perspective the future directions power ??ctronics will need to take in order to be compatible with the 3-D Avionics packages for future spacecraft architectures for the New Millennium Flight Projects.

Electronics roadmaps New Millennium 3-D Avionics f↗

Development of Thick-Film Thermoelectric Microcoolers Using Electrochemical Deposition

Advanced thermoelectric microdevices integrated into thermal management packages and low power, electrical source systems are of interest for a variety of space and terrestrial applications. By shrinking the size of the thermoelements, or legs, of these devices, it becomes possible to handle much higher heat fluxes, as well as operate at much lower currents and higher voltages that are more compatible with electronic components. The miniaturization of state-of-the-art thermoelectric module technology based on Bi2Te3 alloys is limited due to mechanical and manufacturing constraints for both leg dimensions (100-200 gm thick minimum) and the number of legs (100-200 legs maximum). We are investigating the development of novel microdevices combining high thermal conductivity substrate materials such as diamond, thin film metallization and patterning technology, and electrochemical deposition of thick thermoelectric films. It is anticipated that thermoelectric microcoolers with thousands of thermocouples and capable of pumping more than 200 W/sq cm over a 30 to 60 K temperature difference can be fabricated. In this paper, we report on our progress in developing an electrochemical deposition process for obtaining 10-50 microns thick films of Bi2Te3 and its solid solutions. Results presented here indicate that good quality n-type Bi2Te3, n-type Bi2Te(2.95)Se(0.05) and p-type Bi(0.5)Sb(1.5)Te3 thick films can be deposited by this technique. Some details about the fabrication of the miniature thermoelements are also described.

Fleurial, J.-P.↗

A High Power Density Power System Electronics for NASA's Lunar Reconnaissance Orbiter

A high power density, modular and state-of-the-art Power System Electronics (PSE) has been developed for the Lunar Reconnaissance Orbiter (LRO) mission. This paper addresses the hardware architecture and performance, the power handling capabilities, and the fabrication technology. The PSE was developed by NASA s Goddard Space Flight Center (GSFC) and is the central location for power handling and distribution of the LRO spacecraft. The PSE packaging design manages and distributes 2200W of solar array input power in a volume less than a cubic foot. The PSE architecture incorporates reliable standard internal and external communication buses, solid state circuit breakers and LiIon battery charge management. Although a single string design, the PSE achieves high reliability by elegantly implementing functional redundancy and internal fault detection and correction. The PSE has been environmentally tested and delivered to the LRO spacecraft for the flight Integration and Test. This modular design is scheduled to flight in early 2009 on board the LRO and Lunar Crater Observation and Sensing Satellite (LCROSS) spacecrafts and is the baseline architecture for future NASA missions such as Global Precipitation Measurement (GPM) and Magnetospheric MultiScale (MMS).

Hernandez-Pellerano, A.↗

Development of a uninterrupted power system: ac and dc to dc converter

This program covered the design, fabrication and testing of an advanced development model uninterrupted power system. The input and output requirements imposed on the power processor were specified such that the unit is electrically interchangeable with existing power systems used by the Federal Aviation Administration in installations which have a history of failure due to electrical transient conditions. Input power is from either of two single-phase ac power sources or batteries with electronic selection and transfer between power sources. Battery reconditioning is automatic when either ac source is present. The output power is rated at 84OW; the nominal output is 24V at 35A. Within the 84OW limit, the regulated output voltage is adjustable from 22V to 30Vdc. Protection against continuous overloading or short circuit is provided. The unit is packaged in a standard 19-inch rack mount configuration with 7-inch panel height. Controls are on the front panel with power input and output through connectors on the rear surface. Cooling is by free convection from fin areas located on the side and rear panels. The packaged unit weighs 52.8 lbs., which can be reduced significantly if a three-phase ac power source is used.

Cronin, D. L.↗

Sports Training

Practitioners of martial arts have long seen a need for a precise method of measuring the power of a karate kick or a boxer's punch in training and competition. Impax sensor is a piezoelectric film less than one thousandth of an inch thick, yet extremely durable. They give out a voltage impulse when struck, the greater the force of impact, the higher the voltage. The impulse is transmitted to a compact electronics package where voltage is translated into a force-pounds reading shown on a digital display. Impax, manufactured by Impulse Technology, Inc. is used by martial arts instructors, practitioners, U.S. Olympic Committee Training Center, football blocking sleds, and boxers as well as police defensive tactics, providing a means of evaluating the performance of recruits.

Source record↗

Commercial Sensor Survey Fiscal Year 2009 master compendium radiation test report

The NASA Electronic Parts and Packaging (NEPP) Program Sensor Technology Commercial Sensor Survey task is geared toward benefiting future NASA space missions with low-cost, short-duty-cycle, visible-wavelength imaging needs. Such applications could include imaging for educational outreach purposes or short surveys of spacecraft, planetary, or lunar surfaces. Under the task, inexpensive, low-power, commercial grade CMOS sensors were surveyed in fiscal year 2007 (FY07), and three sensors were selected and tested for total ionizing dose (TID) and displacement damage dose (DDD) tolerance in fiscal year 2008 (FY08). The selected sensors had to meet selection criteria chosen to support small, low-mass cameras that produce good resolution color images. The commercial CMOS sensors tested under the task in FY08 showed very promising response to typical outreach and survey camera TID and DDD levels. In fiscal year 2009 (FY09), the survey was broadened to include two additional, similar sensor products. This compendium provides results for all radiation testing performed on the Micron and OmniVision sensors that were selected for radiation tolerance testing in FY08 and FY09.

Thorbourn, Dennis O.↗

Compact Low Power Avionics for the Europa Lander Concept and Other Missions to Ocean Worlds

This paper presents the results of NASA’s game-changing technology development entitled “Ultra Low Temperature Electronics” which represents a paradigm shift in spacecraft avionics development. The project has developed compact avionics technologies to address the Command & Data Handling (CDH), Power and Motor Control needs for mission concepts to ocean worlds such as a potential Europa Lander. We addressed this need by developing the key technologies necessary to develop a next generation compact avionics package. The key technologies that we developed significantly reduce the size, weight, power, and cost (SWAP-C) of the avionics package. These technologies will also allow extreme-environment missions to last longer in their environment by reducing the power and energy requirement to keep the avionics warm.

Bolotin, Gary↗

Venus High Temperature Atmospheric Dropsonde and Extreme-Environment Seismometer (HADES)

The atmospheric composition and geologic structure of Venus have been identified by the US National Research Council's Decadal Survey for Planetary Science as priority targets for scientific exploration, however the high temperature and pressure at the surface, along with the highly corrosive chemistry of the Venus atmosphere, present significant obstacles to spacecraft design that have severely limited past and proposed landed missions. Following the methodology of the NASA Innovative Advanced Concepts (NIAC) proposal regime and the Collaborative Modeling and Parametric Assessment of Space Systems (COMPASS) design protocol, this paper presents a conceptual study and initial feasibility analysis for a Discovery-class Venus lander capable of an extended-duration mission at ambient temperature and pressure, incorporating emerging technologies within the field of high temperature electronics in combination with novel configurations of proven, high Technology Readiness Level (TRL) systems. Radioisotope Thermal Power (RTG) systems and silicon carbide (SiC) communications and data handling are examined in detail, and various high-temperature instruments are proposed, including a seismometer and an advanced photodiode imager. The study combines this technological analysis with proposals for a descent instrument package and a relay orbiter to demonstrate the viability of an integrated atmospheric and in-situ geologic exploratory mission that differs from previous proposals by greatly reducing the mass, power requirements, and cost, while achieving important scientific goals.

HADES↗

A perspective on the electro-thermal co-design of ultra-wide bandgap lateral devices

Fundamental research and development of ultra-wide bandgap (UWBG) semiconductor devices are under way to realize next-generation power conversion and wireless communication systems. Devices based on aluminum gallium nitride (AlxGa1-xN, x is the Al composition), ..beta..-phase gallium oxide (..beta..-Ga2O3), and diamond give promise to the development of power switching devices and radio frequency power amplifiers with higher performance and efficiency than commercial wide bandgap semiconductor devices based on gallium nitride (GaN) and silicon carbide (SiC). However, one of the most critical challenges for the successful deployment of UWBG device technologies is to overcome adverse thermal effects that impact the device performance and reliability. Overheating of UWBG devices originates from the projected high power density operation and poor intrinsic thermal properties of AlxGa1-xN and ..beta..-Ga2O3. This Perspective delineates the need and process for the "electro-thermal co-design" of laterally configured UWBG electronic devices and provides a comprehensive review of current state-of-the-art thermal characterization methods, device thermal modeling practices, and both device- and package-level thermal management solutions.

71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSIC↗

System Miniaturization Via Heterogeneous Integration of Electronic Devices for Deep Space Missions

The scientific devices designed for each of the Outer Planets Program Focuses will likely be groundbreaking not only with respect to their scientific role but also regarding the electronics required to perform such investigations. In the past, the performance of packaged electronics was limited by the components themselves, with minimal influence of the packaging technology. The rapid development of integrated circuit technology, however, has drastically increased the importance of packaging technology in the ultimate performance of devices. If not carefully considered in the overall design, the packaging may become the limiting factor in the operation of the system. Although industry is responsible for several significant accomplishments in the field of electronics packaging, deep space/outer planet missions must take into account additional requirements such as extremely low temperatures, high radiation levels, hermetic sealing, and severe size and weight limitations. Therefore, the present investigation has been designed to meet the needs of NASA's sensor intensive outer planets program by combining (using flip chip technology) an array of devices (including analog, digital, power volt-age, passives, and MEMS) into a miniaturized heterogeneous system and utilizing optical buses to enable autonomy. Additional information is contained in the original extended abstract.

DelCastillo, L.↗

Compact Ku-Band T/R Module for High-Resolution Radar Imaging of Cold Land Processes

Global measurement of terrestrial snow cover is critical to two of the NASA Earth Science focus areas: (1) climate variability and change and (2) water and energy cycle. For radar backscatter measurements, Ku-band frequencies, scattered mainly within the volume of the snowpack, are most suitable for the SWE (snow-water equivalent) measurements. To isolate the complex effects of different snowpack (density and snowgrain size), and underlying soil properties and to distinctly determine SWE, the space-based synthetic aperture radar (SAR) system will require a dual-frequency (13.4 and 17.2 GHz) and dual polarization approach. A transmit/receive (T/R) module was developed operating at Ku-band frequencies to enable the use of active electronic scanning phased-array antenna for wide-swath, high-resolution SAR imaging of terrestrial snow cover. The T/R module has an integrated calibrator, which compensates for all environmental- and time-related changes, and results in very stable power and amplitude characteristics. The module was designed to operate over the full frequency range of 13 to 18 GHz, although only the two frequencies, 13.4 GHz and 17.2 GHz, will be used in this SAR radar application. Each channel of the transmit module produces > 4 W (35 dbm) over the operating bandwidth of 20 MHz. The stability requirements of <0.1 dB receive gain accuracy and <0.1 dB transmit power accuracy over a wide temperature range are achieved using a self-correction scheme, which does real-time amplitude calibration so that the module characteristics are continually corrected. All the calibration circuits are within the T/R module. The timing and calibration sequence is stored in a control FPGA (field-programmable gate array) while an internal 128K 8bit high-speed RAM (random access memory) stores all the calibration values. The module was designed using advanced components and packaging techniques to achieve integration of the electronics in a 2 x6.5x1-in. (5x17x2.5-cm) package. The module size allows 4 T/R modules to feed the 16 16-element subarray on an antenna panel. The T/R module contains four transmit channels and eight receive channels (horizontal and vertical polarizations).

Andricos, Constantine↗

Electronic structure with direct diagonalization on a D-wave quantum annealer

Quantum chemistry is regarded to be one of the first disciplines that will be revolutionized by quantum computing. Although universal quantum computers of practical scale may be years away, various approaches are currently being pursued to solve quantum chemistry problems on near-term gate-based quantum computers and quantum annealers by developing the appropriate algorithm and software base. This work implements the general Quantum Annealer Eigensolver (QAE) algorithm to solve the molecular electronic Hamiltonian eigenvalue-eigenvector problem on a D-Wave 2000Q quantum annealer. The approach is based on the matrix formulation, efficiently uses qubit resources based on a power-of-two encoding scheme and is hardware-dominant relying on only one classically optimized parameter. We demonstrate the use of D-Wave hardware for obtaining ground and excited electronic states across a variety of small molecular systems. The approach can be adapted for use by a vast majority of electronic structure methods currently implemented in conventional quantum-chemical packages. The results of this work will encourage further development of software such as qbsolv which has promising applications in emerging quantum information processing hardware and has expectation to address large and complex optimization problems intractable for classical computers.

97 MATHEMATICS AND COMPUTING↗

Thermal microstructure measurement system

A thermal microstructure measurement system (TMMS) operates autonomously h its own internal power supply and telemeters data to a platform. A thermal array is mounted on a cross-braced frame designed to orient itself normal to existing currents with fixed sensor positioning bars protruding from the cross bars. A plurality of matched thermistors, conductivity probes and inclinometers are mounted on the frame. A compass and pressure transducer are contained in an electronics package suspended below the array. The array is deployed on a taut mooring below a subsurface float. Data are digitized, transmitted via cable to a surface buoy and then telemetered to the platform where the data is processed via a computer, recorded and/or displayed. The platform computer also sends commands to the array via telemetry.

Carver, Michael J.↗

Wide Bandgap Reliability and Application Guidelines

Wide Bandgap (WBG) semiconductors, such as silicon carbide (SiC) and gallium nitride (GaN) have emerged as promising technologies due to the advantages they offer over silicon (Si). Under the NASA Electronic Parts and Packaging (NEPP) Program, Glenn Research Center (GRC) supports a task called "Wide Bandgap Reliability and Application Guidelines." This presentation summarizes the work performed under this task, to be presented at the 2020 NEPP Electronics Technology Workshop in June 2020.

Wide Bandgap Semiconductors↗

Machine Learning Based Software Package for Reproducible Data Analysis for Electron Microscopy

Advances in hardware and computation technologies are enabling large hyperspectral imaging during Electron Microscopy (EM), resulting in datasets being produced at rapidly increasing spatial and temporal resolutions. This presents exciting opportunities for microstructure analysis, but also poses great challenges in data analysis. Under this STTR program, QuesTek Innovations LLC, a leader in the field of integrated computational materials engineering (ICME), collaborated with Lawrence Livermore National Laboratory and Argonne National Laboratory. The team developed an open-source machine learning (ML) powered tool for EM data analysis of multiple systems and data types, and collected EM data for ML model development using the cutting-edge PicoProbe equipment at Argonne National Laboratory.

Lin, Yu↗