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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Expendable disks substituted for costly pyrotechnic devices for testing actuators. Burst-disk device produces rush of pressurized gas similar to pyrotechnic device. Designed to reduce cost of testing pyrotechnically driven emergency actuators (parachute-deploying mechanisms in original application).
This paper discusses the implementation of considerations resulting from a study investigating the cost change experienced by historical NASA science missions. The study investigated historical milestone and monthly status report documentation followed by interviews with key project personnel. The reasons for cost change were binned as being external to NASA, external to the project and internal to the project relative to the project's planning and execution. Based on the results of the binning process and the synthesis of project meetings and interviews, ten considerations were made with the objective to decrease the potential for cost change in future missions. Although no one magic bullet consideration was discovered, the considerations taken as a whole should help reduce cost and schedule change in future NASA missions.
The insulating tiles used on the Space Shuttler Orbiter, principally AETB (Alumina Enhanced Thermal Barrier), have been seen by new vehicle developers in the aerospace industry as a fast-track approach for fielding a reusable thermal protection system (TPS) given the extensive use by both the Orbiter program and the current Orion vehicle. NASA has, and is, supporting the industry through technology transfer and commercial crew and payloads programs. However, the reusable TPS community is rapidly encountering challenges rooted in Orbiter’s and Orion’s dependence on legacy material and processes. With the aim of alleviating these issues, improving availability of reusable TPS, and strengthening the nation’s space economy, ongoing efforts at NASA Ames have focused on understanding process-property relationships in AETB as well as novel materials and technologies for reusable TPS. The first portion of this talk will address the effects of raw materials and processing conditions on the properties of AETB-8, including the raw materials used, mixing and casting parameters, and thermal history. Understanding these relationships, and how they extend to aerothermal performance, is instrumental in alleviating supply chain constraints and improving manufacturability. The implications of these finding on development of novel TPS materials and systems will be discussed. AETB will likely continue to fill a niche of relatively high performance with associated costs. There exists, therefore, a gap in developed reusable TPS for a lower cost, moderate performing material system. The later portion of this talk will touch on current development efforts at Ames focusing on reduced cost and ease of integration, which are being pursued in addition to AETB and higher performing systems. In addition to summarizing these efforts, an outlook for these projects and collaborations will be given.
The insulating tiles used on the Space Shuttler Orbiter, principally AETB (Alumina Enhanced Thermal Barrier), have been seen by new vehicle developers in the aerospace industry as a fast-track approach for fielding a reusable thermal protection system (TPS) given the extensive use by both the Orbiter program and the current Orion vehicle. NASA has, and is, supporting the industry through technology transfer and commercial crew and payloads programs. However, the reusable TPS community is rapidly encountering challenges rooted in Orbiter’s and Orion’s dependence on legacy material and processes. With the aim of alleviating these issues, improving availability of reusable TPS, and strengthening the nation’s space economy, ongoing efforts at NASA Ames have focused on understanding process-property relationships in AETB as well as novel materials and technologies for reusable TPS. The first portion of this talk will address the effects of raw materials and processing conditions on the properties of AETB-8, including the raw materials used, mixing and casting parameters, and thermal history. Understanding these relationships, and how they extend to aerothermal performance, is instrumental in alleviating supply chain constraints and improving manufacturability. The implications of these finding on development of novel TPS materials and systems will be discussed. AETB will likely continue to fill a niche of relatively high performance with associated costs. There exists, therefore, a gap in developed reusable TPS for a lower cost, moderate performing material system. The later portion of this talk will touch on current development efforts at Ames focusing on reduced cost and ease of integration, which are being pursued in addition to AETB and higher performing systems. In addition to summarizing these efforts, an outlook for these projects and collaborations will be given.
For Deep Space Missions, the Radio-Frequency (RF) communications link provides both communications and navigation services. In this article we discuss the increased efficiency and reduced cost that can result from the potential consolidation of the two services into one suite of equipment, and the utilization of guaranteed delivery standard protocols to improve the communications service.
Mars Sample Return (MSR) has for many years been considered one of the most ambitious as well as most scientifically interesting of the suite of desired future planetary missions. This paper defines low- cost MSR mission concepts based on several exciting new technologies planned for space missions launching over the next 10 years. Key to reducing cost is use of advanced spacecraft & electronics technology.
THe Dependent Pressure Vessel (DPV) Nickel-Hydrogen (NiH2) design is being developed as an advanced battery for military and commercial, aerospace and terrestrial applications. The DPV cell design offers high specific energy and energy density as well as reduced cost, while retaining the established Individual Pressure Vessel (IPV) technology flight heritage and database. This advanced DPV design also offers a more efficient mechanical, electrical and thermal cell and battery configuration and a reduced part count. The DPV battery design promotes compact, minimum volume packaging and weight efficiency, and delivers cost and weight savings with minimal design risk.
Frequency dividers constitute essential elements in designing phase-locked loop circuits and microwave systems. In addition, they are used in providing required clocking signals to microprocessors and can be utilized as digital counters. In some applications, particularly space missions, electronics are often exposed to extreme temperature conditions. Therefore, it is required that circuits designed for such applications incorporate electronic parts and devices that can tolerate and operate efficiently in harsh temperature environments. While present electronic circuits employ COTS (commercial-off- the-shelf) parts that necessitate and are supported with some form of thermal control systems to maintain adequate temperature for proper operation, it is highly desirable and beneficial if the thermal conditioning elements are eliminated. Amongst these benefits are: simpler system design, reduced weight and size, improved reliability, simpler maintenance, and reduced cost. Devices based on silicon-on-insulator (SOI) technology, which utilizes the addition of an insulation layer in the device structure to reduce leakage currents and to minimize parasitic junctions, are well suited for high temperatures due to reduced internal heating as compared to the conventional silicon devices, and less power consumption. In addition, SOI electronic integrated circuits display good tolerance to radiation by virtue of introducing barriers or lengthening the path for penetrating particles and/or providing a region for trapping incident ionization. The benefits of these parts make them suitable for use in deep space and planetary exploration missions where extreme temperatures and radiation are encountered. Although designed for high temperatures, very little data exist on the operation of SOI devices and circuits at cryogenic temperatures. In this work, the performance of a divide-by-two frequency divider circuit built using COTS SOI logic gates was evaluated over a wide temperature range and thermal cycling to determine suitability for use in space exploration missions and terrestrial fields under extreme temperature conditions.
Several 20 cm diameter silicon ingots, up to 6.3 kg. were cast with good crystallinity. The graphite heat zone can be purified by heating it to high temperatures in vacuum. This is important in reducing costs and purification of large parts. Electroplated wires with 45 um synthetic diamonds and 30 um natural diamonds showed good cutting efficiency and lifetime. During slicing of a 10 cm x 10 cm workpiece, jerky motion occurred in the feed and rocking mechanisms. This problem is corrected and modifications were made to reduce the weight of the bladeheat by 50%.
The use of composites in aircraft structures is often limited by material and manufacturing costs which, for some designs and applications, are prohibitively high. To increase the frequency of application of composites in primary airframe components alternative manufacturing processes are sought that reduce cost and/or enhance structural efficiency. One alternative process involves the use of THERM-Xsm as the pressure transfer medium during autoclave curing. THERM-Xsm, a silicon-based flow able polymer which behaves like a liquid under autoclave presssure, transmits quasi-hydrostatic pressure to all contacting surfaces of the part to be cured. Once the autoclave pressure is relieved, THERM-Xsm reverts back to the powdery solid state and can be reused many times. The THERM-Xsm process to be evaluated is depicted and consists of (1) enclosing the tool and part to be cured by a set of frames that create a box, (2) pouring THERM-Xsm powder onto the part and filling the box, and (3) placing a vacuum bag over the box assembly. In this program, a separating non-porous film (Teflon) was placed between the part to be cured and THERM-Xsm powder to avoid any contamination. The use of THERM-Xsm has two significant advantages over conventional manufacturing procedures. First, it eliminates complicated hard tooling since it guarantees uniform pressure transfer and thus, good compaction at complex structural details (such as frame-stiffener intersections and corners). Second, it greatly simplifies vacuum bagging, since once the part to be cured is covered by THERM-Xsm powder, the vacuum bag need only conform to a relatively flat shape reducing significantly the number of pleats required. A program is on-going at Sikorsky Aircraft to evaluate the structural performance of complex composite fuselage structures made with this THERM-Xsm process and to quantify the impact of THERM-Xsm on manufacturing labor hours and cost. The program involves fuselage panel optimization analysis, a building block test program where structural details representative of the full-scale article are analyzed and tested, and static and fatigue test/analysis of the full-scale test articles. The main results of this program are reported.
One year study program was divided into three tasks: to identify costs factors involved in packaged electronic subsystems as function of LSI density and reliability; to select most promising factors that might be modified to reduce costs in high-density packaging; and to investigate cost-saving beam tape technology for producing high-volume discrete-device packages. Results are published in 67 page report.
In the coming decade, the drive to increase the scientific returns on capital investment and to reduce costs will force automation to be implemented in many of the scientific tasks that have traditionally been manually overseen. Thus, spacecraft autonomy will become an even greater part of mission operations. While recent missions have made great strides in the ability to autonomously monitor and react to changing health and physical status of spacecraft, little progress has been made in responding quickly to science driven events. The new generation of space-based telescopes/observatories will see deeper, with greater clarity, and they will generate data at an unprecedented rate. Yet, while onboard data processing and storage capability will increase rapidly, bandwidth for downloading data will not increase as fast and can become a significant bottleneck and cost of a science program. For observations of inherently variable targets and targets of opportunity, the ability to recognize early if an observation will not meet the science goals of variability or minimum brightness, and react accordingly, can have a major positive impact on the overall scientific returns of an observatory and on its operational costs. If the observatory can reprioritize the schedule to focus on alternate targets, discard uninteresting observations prior to downloading, or download them at a reduced resolution its overall efficiency will be dramatically increased. We are investigating and developing tools for a science goal monitoring (SGM) system. The SGM will have an interface to help capture higher-level science goals from scientists and translate them into a flexible observing strategy that SGM can execute and monitor. SGM will then monitor the incoming data stream and interface with data processing systems to recognize significant events. When an event occurs, the system will use the science goals given it to reprioritize observations, and react appropriately and/or communicate with ground systems - both human and machine - for confirmation and/or further high priority analyses.
Parametric cost models are used to plan missions, compare concepts and justify technology investments. This paper reviews an on-going effort to develop cost modes for space telescopes. This paper summarizes the methodology used to develop cost models and documents how changes to the database have changed previously published preliminary cost models. While the cost models are evolving, the previously published findings remain valid: it costs less per square meter of collecting aperture to build a large telescope than a small telescope; technology development as a function of time reduces cost; and lower areal density telescopes cost more than more massive telescopes.
Electronic systems are required to operate under extreme temperatures in NASA planetary exploration and deep space missions. Electronics on-board spacecraft must also tolerate thermal cycling between extreme temperatures. Thermal management means are usually included in today s spacecraft systems to provide adequate temperature for proper operation of the electronics. These measures, which may include heating elements, heat pipes, radiators, etc., however add to the complexity in the design of the system, increases its cost and weight, and affects its performance and reliability. Electronic parts and circuits capable of withstanding and operating under extreme temperatures would reflect in improvement in system s efficiency, reducing cost, and improving overall reliability. Semiconductor chips based on silicon-on-insulator (SOI) technology are designed mainly for high temperature applications and find extensive use in terrestrial well-logging fields. Their inherent design offers advantages over silicon devices in terms of reduced leakage currents, less power consumption, faster switching speeds, and good radiation tolerance. Little is known, however, about their performance at cryogenic temperatures and under wide thermal swings. Experimental investigation on the operation of SOI, N-channel field effect transistors under wide temperature range was reported earlier [1]. This work examines the performance of P-channel devices of these SOI transistors. The electronic part investigated in this work comprised of a Cissoid s CHT-PMOS30, high temperature P-channel MOSFET (metal-oxide semiconductor field-effect transistor) device [2]. This high voltage, medium-power transistor is designed for geothermal well logging applications, aerospace and avionics, and automotive industry, and is specified for operation in the temperature range of -55 C to +225 C. Table I shows some specifications of this transistor [2]. The CHT-PMOS30 device was characterized at various temperatures over the range of -190 C to +225 C in terms of its voltage/current characteristic curves. The test temperatures included +22, -50, -100, -150, -175, -190, +50, +100, +150, +175, +200, and +225 C. Limited thermal cycling testing was also performed on the device. These tests consisted of subjecting the transistor to a total of twelve thermal cycles between -190 C and +225 C. A temperature rate of change of 10 C/min and a soak time at the test temperature of 10 minutes were used throughout this work. Post-cycling measurements were also performed at selected temperatures. In addition, re-start capability at extreme temperatures, i.e. power switched on while the device was soaking for a period of 20 minutes at the test temperatures of -190 C and +225 C, was investigated.
A lightweight and inexpensive coverlayer developed for space suits is described. Material selection, procurement, and testing, pattern design, and prototype fabrication are discussed. By using the minimum required cross section necessary for earth orbital mission, by utilizing the lightest weight materials possible, and by decreasing the use of weight costly taping a lightweight and economical thermal micrometeroid garment was developed. Simplification of manufacturing techniques and use of off-the-shelf materials helped to reduce costs.
A parametric cost model for mercury ion propulsion modules is presented. A detailed work breakdown structure is included. Cost estimating relationships were developed for the individual subsystems and the nonhardware items (systems engineering, software, etc.). Solar array and power processor unit (PPU) costs are the significant cost drivers. Simplification of both of these subsystems through applications of advanced technology (lightweight solar arrays and high-efficiency, self-radiating PPUs) can reduce costs. Comparison of the performance and cost of several chemical propulsion systems with the Hg ion module are also presented. For outer-planet missions, advanced solar electric propulsion (ASEP) trip times and O2/H2 propulsion trip times are comparable. A three-year trip time savings over the baselined NTO/MMH propulsion system is possible with ASEP.
Commercial fuselage structures contain significant challenges in attempting to save manufacturing costs with advanced composite technology. Assembly issues, materials costs, and fabrication of elements with complex geometry are each expected to drive the cost of composite fuselage structure. Key technologies, such as large crown panel fabrication, were pursued for low cost. An intricate bond panel design and manufacturing concept were selected based on the efforts of the Design Build Team. The manufacturing processes selected for the intricate bond design include multiple large panel fabrication with Advanced Tow Placement (ATP) process, innovative cure tooling concepts, resin transfer molding of long fuselage frames, and use of low cost materials forms. The process optimization for final design/manufacturing configuration included factory simulations and hardware demonstrations. These efforts and other optimization tasks were instrumental in reducing costs by 18 pct. and weight by 45 pct. relative to an aluminum baseline. The qualitative and quantitative results of the manufacturing demonstrations were used to assess manufacturing risks and technology readiness.
Commercial fuselage structures contain significant challenges in attempting to save manufacturing costs with advanced composite technology. Assembly issues, material costs, and fabrication of elements with complex geometry are each expected to drive the cost of composite fuselage structures. Boeing's efforts under the NASA ACT program have pursued key technologies for low-cost, large crown panel fabrication. An intricate bond panel design and manufacturing concepts were selected based on the efforts of the Design Build Team (DBT). The manufacturing processes selected for the intricate bond design include multiple large panel fabrication with the Advanced Tow Placement (ATP) process, innovative cure tooling concepts, resin transfer molding of long fuselage frames, and utilization of low-cost material forms. The process optimization for final design/manufacturing configuration included factory simulations and hardware demonstrations. These efforts and other optimization tasks were instrumental in reducing cost by 18 percent and weight by 45 percent relative to an aluminum baseline. The qualitative and quantitative results of the manufacturing demonstrations were used to assess manufacturing risks and technology readiness.