GDOEII FeedHorn – Corrugated Feedhorn Arrays by Additive Manufacturing
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An opto-electronic probe system is disclosed. The probe system has a probe element including at least one microelectrode, with the probe element being implantable in tissue of an anatomy to receive electrical signals generated within the anatomy. A subsystem is included for at least one of generating excitation signals to be used in stimulating the anatomy, or for receiving electrical signals received from the anatomy. An interface portion is included which is in communication with the subsystem for communicating at least one of electrical signals or optical signals indicative of the electrical signals received by the microelectrode.
A radiation detector includes a photodetector and a scintillator coupled thereto. The scintillator is formed of a scintillator material comprising an organic glass scintillator (OGS) material and at least one of a polymer additive or a plasticizer additive. The scintillator emits light when radiation is received at the scintillator, and the light is received by the photodetector. The radiation detector can further include a frame that has an interior cavity that holds the scintillator in position with respect to the photodetector, such that the light emitted by the scintillator is transmitted to the photodetector. The scintillator can be formed by casting amorphous scintillator material in the interior cavity of the frame. The frame can then be coupled to the photodetector to form the radiation detector.
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While pulse tube cryocoolers enabled the rapid expansion of dilution refrigerator technology over the past two decades, the transition to large-scale quantum systems is now driving a reassessment of the DR’s higher-temperature-stage cooling strategies and how these systems can be effectively scaled in a modular way. Quasi-wet architectures based on centralized cryoplants and forced-flow helium distribution offer compelling advantages in energy efficiency, operational cost, and scalability. With appropriate redundancy, standardized interfaces, and optimized distribution system designs, these architectures will provide a practical and robust path forward for the next generation of quantum computing infrastructure.
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This is the required paper summarizing the poster presentation material to be presented at The 25th European Microelectronics & Packaging Conference (EMPC 2025) (16 – 18 September 2025). The paper will be associated with the conference presentation in the conference proceedings