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At least 271 records · Page 15

Optical Absorption Spectroscopy Probes Water Wire and Its Ordering in a Hydrogen-Bond Network

Water wires, quasi-one-dimensional chains composed of hydrogen-bonded (H-bonded) water molecules, play a fundamental role in numerous chemical, physical, and physiological processes. Yet direct experimental detection of water wires has been elusive so far. Based on advanced many-body theory that includes electron-hole interactions, we report that optical absorption spectroscopy can serve as a sensitive probe of water wires and their ordering. In both liquid and solid water, the main peak of the spectrum is discovered to be a charge-transfer exciton. In water, the charge-transfer exciton is strongly coupled to the H-bonding environment where the exciton is excited between H-bonded water molecules with a large spectral intensity. In regular ice, the spectral weight of the charge-transfer exciton is enhanced by a collective excitation occurring on proton-ordered water wires, whose spectral intensity scales with the ordering length of water wire. The spectral intensity and excitonic interaction strength reaches its maximum in ice XI, where the long-range ordering length yields the most pronounced spectral signal. Our findings suggest that water wires, which widely exist in important physiological and biological systems and other phases of ice, can be directly probed by this approach. Published by the American Physical Society 2025

Tang, Fujie (ORCID:0000000197615359)↗

Revealing the Reaction Path of UVC Bond Rupture in Cyclic Disulfides with Ultrafast X-ray Scattering

Disulfide bonds are ubiquitous molecular motifs that influence the tertiary structure and biological functions of many proteins. Yet it is well known that the disulfide bond is photolabile when exposed to UVC radiation. The deep-UV induced S-S bond fragmentation kinetics on very fast time scales are especially pivotal to fully understand the photostability and photodamage repair mechanisms in proteins. In 1,2-dithiane, the smallest saturated cyclic molecule that mimics biologically active species with S-S bonds, we investigate the photochemistry upon 200 nm excitation by femtosecond time-resolved X-ray scattering in the gas phase using an X-ray free electron laser. In the femtosecond time domain, we discover a very fast reaction that generates molecular fragments with one and two sulfur atoms. On picosecond and nanosecond timescales, a complex network of reactions unfolds that, ultimately, completes the sulfur dissociation from the parent molecule.

74 ATOMIC AND MOLECULAR PHYSICS↗

Mechanical Characterization of the NIF Ignition Target TMPSA Bonding Flexure

The Thermo-Mechanical Package Sub-Assembly (TMPSA) provides a critical mechanical, thermal, and electrical interface between a silicon arm and a TMP aluminum can in a NIF ignition target. During assembly, sixteen silicon pads are bonded to the aluminum using a fixture that positions the components and applies a repeatable prescribed displacement through a compliant flexure. The flexure converts fixture interference into displacement and reaction force. Because bondline thickness variation must be maintained within +/-4 µm, consistent flexure behavior is important to the assembly process. With a recent string of TMPSAs exhibiting low bond strength, the flexures were inspected. Despite being manufactured to the same specifications, flexures were found to exhibit variation in measured stiffness. Additionally, the measured stiffness values did not always follow the presumed beam mechanics model. This work addresses two questions: whether the bonding fixture is working as intended, and whether the previously made stiffness measurements are accurate representations of the use case. The flexures are analyzed using Euler-Bernoulli beam theory, measured beam dimensions, finite element analysis, and tolerance stack-up calculations. The analysis shows that the fixed-guided beam mechanics model appropriately represents the flexure during TMPSA bonding, but the chisel-tip stiffness measurement method introduces a deformation to the inner ring of the flexure that is not represented during use. The measured stiffness values should therefore be interpreted as test-condition stiffness values rather than direct measurements of operational flexure stiffness. The discrepancy is therefore attributed primarily to the measurement boundary condition rather than to failure of the fixed-guided beam model. Recommendations are provided for GD&T, dimensional inspection, and a representative stiffness testing method to better control bondline variation.

42 ENGINEERING↗

Reliability improvement of 1 mil aluminum wire bonds for semiconductors, technical performance summary

The reliability of semiconductor devices as influenced by the reliability of wire bonds used in the assembly of the devices is investigated. The specific type of failure dealt with involves fracture of wire bonds as a result of repeated flexure of the wire at the heel of the bond when the devices are operated in an on-off mode. The mechanism of failure is one of induced fracture of the wire. To improve the reliability of a chosen transistor, one-mil diameter wires of aluminum with various alloy additions were studied using an accelerated fatigue testing machine. In addition, the electroprobe was used to study the metallurgy of the wires as to microstructure and kinetics of the growth of insoluble phases. Thermocompression and ultrasonic bonding techniques were also investigated.

Source record↗

Non-classical adhesive-bonded joints in practical aerospace construction

Solutions are derived for adhesive-bonded joints of non-classical geometries. Particular attention is given to bonded doublers and to selective reinforcement by unidirectional composites. Non-dimensionalized charts are presented for the efficiency limit imposed on the skin as the result of the eccentricity in the load path through the doubler. It is desirable to employ a relativly large doubler to minimize the effective eccentricity in the load path. The transfer stresses associated with selective reinforcement of metal structures by advanced composites are analyzed. Reinforcement of bolt holes in composites by bonded metal doublers is covered quantitatively. Also included is the adhesive joint analysis for shear flow in a multi-cell torque box, in which the bond on one angle becomes more critical sooner than those on the others, thereby restricting the strength to less than the total of each maximum strength when acting alone. Adhesive plasticity and adherend stiffness and thermal imbalances are included. A simple analysis/design technique of solution in terms of upper and lower bounds on an all-plastic adhesive analysis is introduced.

Hart-Smith, L. J.↗

Polyimide weld bonding for titanium alloy joints

Two weld bonding processes were developed for joining titanium alloy; one process utilizes a weld-through technique and the other a capillary-flow technique. The adhesive used for the weld-through process is similar to the P4/A5F system. A new polyimide laminating resin, BFBI/BMPM, was used in the capillary-flow process. Static property information was generated for weld-bonded joints over the temperature range of 219 K (-65 F) to 561 K (+550 F) and fatigue strength information was generated at room temperature. Significant improvement in fatigue strength was demonstrated for weld-bonded joints over spot-welded joints. A demonstration was made of the applicability of the weld-through weld-bonding process for fabricating stringer stiffened skin panels.

Vaughan, R. W.↗

The relationship between reliability and bonding techniques in hybrid microcircuits

Differential thermal expansion was shown to be responsible for many observed failures in ceramic chip capacitors mounted on alumina substrates. It is shown that the mounting techniques used in bonding the capacitors have a marked effect upon the thermally induced mechanical stress and thus the failure rate. A mathematical analysis was conducted of a composite model of the capacitor-substrate system to predict the magnitude of thermally induced stresses. It was experimentally observed that the stresses in more compliant bonding systems such as soft lead tin and indium solders are significantly lower than those in hard solder and epoxy systems. The marked dependence upon heating and cooling rate was proven to be a determining factor in the prediction of failure solder systems. It was found that the harder or higher melting solders are less susceptible to thermal cycling effects but that they are more likely to fail during initial processing operations. Strain gage techniques were used to determine thermally induced expansion stresses of the capacitors and the alumina substrates. The compliance of the different bonding mediums was determined. From the data obtained, several recommendations are made concerning the optimum bonding system for the achievement of maximum reliability.

Caruso, S. V.↗

Cyclic debonding of unidirectional composite bonded to aluminum sheet for constant-amplitude loading

Cyclic debonding rates were measured during constant-amplitude loading of specimens made of graphite/epoxy bonded to aluminum and S-glass/epoxy bonded to aluminum. Both room-temperature and elevated-temperature curing adhesives were used. Debonding was monitored with a photoelastic coating technique. The debonding rates were compared with three expressions for strain-energy release rate calculated in terms of the maximum stress, stress range, or a combination of the two. The debonding rates were influenced by both adherent thickness and the cyclic stress ratio. For a given value of maximum stress, lower stress ratios and thicker specimens produced faster debonding. Microscopic examination of the debonded surfaces showed different failure mechanisms both for identical adherends bonded with different adhesive and, indeed, even for different adherends bonded with identical adhesives. The expressions for strain-energy release rate correlated the data for different specimen thicknesses and stress ratios quite well for each material system, but the form of the best correlating expression varied among material systems. Empirical correlating expressions applicable to one material system may not be appropriate for another system.

Roderick, G. L.↗

Preliminary evaluation of a novel polyimide adhesive for bonding titanium and reinforced composites

A novel polyimide has been developed which shows promise as an adhesive for bonding titanium-to-titanium, titanium-to-polyimide composite and composite-to-composite with excellent lap shear strengths at room temperature and moderate strengths at 288 C. The adhesive is a high molecular weight polyimide made from commercially available monomers. The use of an ether as the solvent for the polymerization and for application of the polyamic acid enhanced the adhesive properties of the polyimide. At room temperature, P13N/glass composite bonded to titanium or to itself failed primarily in the surface layer of the composite, whereas at 260 C the failure was primarily cohesive. Failure of the P13N/unidirectional HT-S graphite composite-to-titanium bonded composites occurred in the composite regardless of the test temperature. Preliminary shear results with cross-plied P13N/HT-S graphite composite-to-composite specimens showed failure in the bonded surface fibers.

Progar, D. J.↗

Two-electron bond-orbital model. I

The one-electron bond-orbital model of Harrison (1973) for tetrahedrally coordinated solids is modified to a two-electron model using a generalization of Falicov and Harris' (1969) method for treating the hydrogen molecule. Expressions for nuclear-exchange and pseudodipolar interactions are obtained in terms of bond-orbital model parameters. The eigenfunctions and eigenvalues of the Hamiltonian are employed along with standard perturbation theory to calculate the energy shifts resulting from the application of an external electric field and induced by the magnetic interaction between the nuclear spins and the bond-electron spins. The quantitative predictions of the derived formulas are examined for real semiconductors involving elements and compounds from periodic groups III, IV, and V. It is concluded that the present two-electron model makes it possible to assess the quantitative effects of electron correlation in the anion-cation bond for both nonmagnetic properties (electric susceptibility, dielectric constant) and magnetic properties (nuclear-exchange and pseudodipolar interactions) of various materials.

Huang, C.↗

On a model of calculating bond strength

Diffusion bonding is a fabricating process to join the fibers and a matrix together forming a composite. The efficiency of the bonding process depends on temperature, time, and pressure. Based on a simplified pair potential model, an expression for the bond-energy at the fiber-matrix interface is formulated in terms of the above-mentioned three parameters. From this expression and the mean atomic distance, the bond-strength between the fibers and the matrix can be calculated.

Yue, A. S.↗

Gas interaction effects on lunar bonded particles and their implications

Results are reported for an experimental investigation of gas-interaction effects on different Apollo 11 and Apollo 12 lunar-soil samples containing bonded particles. In the experiments, lunar fines were exposed to pure O2, pure water vapor, HCl, NH3, N2, HCOOH, and CH3NH2, in order to observe whether bonded particles would separate. In addition, repeated gas adsorption/desorption measurements were performed to determine the nature and reactive properties of the particle surfaces, and surface areas were measured for comparison with analogous terrestrial samples to determine whether the surface areas of highly radiation-damaged particles were larger or smaller. It is found that N2 is apparently ineffective in separating bonded particles and that the ratio of Apollo 11 to Apollo 12 bonded particles separated by a particular gas exposure ranges from 2.5 to 3.0. Possible reasons for differences in material surface properties at the two Apollo sites are considered, and it is concluded that material from a certain depth at some other site was transported to the Apollo 12 site and mixed with the original material in recent years (considerably less than 2000 years ago).

Mukherjee, N. R.↗

Polyimide adhesives for weld-bonding titanium

Two weld bonding processes were developed for joining titanium alloy; one process utilizes a weld-through technique and the other a capillary-flow technique. The adhesive used for the weld-through process is similar to the P4/A5F system and a new adhesive system, CP/CFA, was used in the capillary-flow process. Static property information was generated for weld-bonded joints over the temperature range of 219K (-65 F) to 561K (550 F) and fatigue strength information was generated at room temperature. Significant improvement in fatigue strength was demonstrated for weld-bonded joints over spot-welded joints. A demonstration was made of the applicability of weld-bonding for fabricating stringer stiffened skin panels.

Vaughan, R. W.↗

Effects of yttrium, aluminum, and chromium concentrations in bond coatings on the performance of zirconia-yttria thermal barriers

A cyclic furnace study was conducted between 990 - 280 C and 1095 - 280 C to evaluate the effects of yttrium, chromium, and aluminum concentrations in nickel base alloy bond coatings and also the effect of the bond coating thickness on the performance of yttria-stabilized zirconia thermal barrier coatings. The presence and the concentration of yttrium is very critical. Without yttrium, rapid oxidation of Ni-Al, Ni-Cr, and Ni-Cr-Al bond coatings causes zirconia thermal barrier coatings to fail very rapidly. Concentrations of chrominum and aluminum in Ni-Cr-Al-Y bond coating have a very significant effect on the thermal barrier coating life. This effect, however, is not as great as that due to yttrium. Furthermore, the thickness and the thickness uniformity also have a very significant effect on the life of the thermal barrier system.

Stecura, S.↗

The Structure and Properties of Diffusion Assisted Bonded Joints in 17-4 PH, Type 347, 15-5 PH and Nitronic 40 Stainless Steels

Diffusion assisted bonds are formed in 17-4 PH, 15-5 PH, type 347 and Nitronic 40 stainless steels using electrodeposited copper as the bonding agent. The bonds are analyzed by conventional metallographic, electron microprobe analysis, and scanning electron microscopic techniques as well as Charpy V-notch impact tests at temperatures of 77 and 300 K. Results are discussed in terms of a postulated model for the bonding process.

Wigley, D. A.↗

Screening of high temperature adhesives for large area bonding

High temperature-resistant adhesive systems were screened for processability, mechanical and physical properties, operational capability at 589 K (600 F), and the ability to produce large area bonds of high quality in fabricating Space Shuttle components. The adhesives consisted primarily of polyimide systems, including FM34B-18, NR-150B2 (DuPont), PMR-15, LARC-13, LARC-160, Thermid 600, and AI-1130L (AMOCA). The processing studies included preparation of polyimide resins, fabrication of film adhesives, development of lay-up and cure procedures, fabrication of honeycomb sandwich panels, and fabrication of mid-plane bonded panels in joints up to 30.5 cm (12 in.) wide. The screening program included tests for tack and drape properties, reticulation and filleting characteristics, ability to produce void-free or low porosity bonds in mid-plane bonded panels, out-time stability, lap shear strength, climbing drum peel strength, and glass transition temperature (Tg). This paper describes the processing methods developed and the test results.

Stenersen, A. A.↗

Calculation of activation energies for hydrogen-atom abstractions by radicals containing carbon triple bonds

Activation energies are calculated by the bond-energy-bond-order (BEBO) and the bond-strength-bond-length (BSBL) methods for the reactions of C2H radicals with H2, CH4, and C2H6 and for the reactions of CN radicals with H2 and CH4. The BSBL technique accurately predicts the activation energies for these reactions while the BEBO method yields energies averaging 9 kcal higher than those observed. A possible reason for the disagreement is considered.

Brown, R. L.↗

Cyclic debonding of adhesively bonded composites

The fatigue behavior of a simple composite to composite bonded joint was analyzed. The cracked lap shear specimen subjected to constant amplitude cyclic loading was studied. Two specimen geometries were tested for each bonded system: (1) a strap adherend of 16 plies bonded to a lap adherend of 8 plies; and (2) a strap adherend of 8 plies bonded to a lap adherend of 16 plies. In all specimens the fatigue failure was in the form of cyclic debonding with some 0 deg fiber pull off from the strap adherend. The debond always grew in the region of adhesive that had the highest mode (peel) loading and that region was close to the adhesive strap interface.

Mall, S.↗