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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 271 records · Page 15

LEED structures due to interaction of CO and O2 with /0001/ and /1,0,-1,0/ Re at 20 C to 920 C.

Clean Re surfaces were produced by the Ar(+) ion bombardment technique. Results reported previously by Farnsworth and Zehner (1969) for the adsorption of CO and molecular oxygen on the (0001) Re surface were confirmed. The exposure of a (0001) Re surface to CO at elevated crystal temperatures produced no additional structures. Neither increased surface defect densities nor excitation of the adsorbate enhanced the adsorption characteristics of CO or molecular oxygen on the surfaces studied.

Zehner, D. M.↗

Comments on 'The magnetic field of Mars - Implications from gas dynamic modeling' by C. T. Russell, J. C. Luhmann, J. R. Spreiter, and S. S. Stahara

The Russell et al. (1984) claim that gas dynamic modeling allows a determination of interplanetary and magnetosheath field configurations resembling the Mars 3 magnetic field observations during the January 21, 1972 encounter, and their proposal of a draped magnetic field pattern model for these data, are presently disputed. Extensive use is made of Martian magnetic field analyses undertaken by Dolginov between 1973 and 1984, which are held to prove the existence of an intrinsic Martian magnetic field. Russell replies that the Russell et al. analysis of the variation in the Mars 2, 3, and 5 data suggests the presence of both zero-level and sensor polarity errors in these data. The rejection of an intrinsic Martian magnetic field is accordingly reaffirmed, pending the availability of less ambiguous data.

Dolginov, Sh. SH.↗

A SIFT ion-molecule study of some reactions in Titan's atmosphere. reactions of N(+), N(2)(+), and HCN(+) with CH(4), C(2)H(2), and C(2)H(4)

The results of a study of the ion-molecule reactions of N(+), N(2)(+), and HCN(+) with methane, acetylene, and ethylene are reported. These studies were performed using the FA-SIFT at the University of Canterbury. The reactions studied here are important to understanding the ion chemistry in Titan's atmosphere. N(+) and N(2)(+) are the primary ions formed by photo-ionization and electron impact in Titan's ionosphere and drive Titan's ion chemistry. It is therefore very important to know how these ions react with the principal trace neutral species in Titan's atmosphere: Methane, acetylene, and ethylene. While these reactions have been studied before the product channels have been difficult to define as several potential isobaric products make a definitive answer difficult. Mass overlap causes difficulties in making unambiguous species assignments in these systems. Two discriminators have been used in this study to resolve the mass overlap problem. They are deuterium labeling and also the differences in reactivities of each isobar with various neutral reactants. Several differences have been found from the products in previous work. The HCN(+) ion is important in both Titan's atmosphere and in the laboratory.

Extraterrestrial Environment/chemistry↗

The Local Variability of Interstellar Abundances: Observations of C 17O and C 18O in Three Dark Clouds

The abundance ratios of carbon monoxide with isotopes 17 and 18 were mapped in three nearby molecular clouds (B335, L134, and rho Oph), two of which are active star-forming regions. It is suggested that there may be a spatial variability of the two oxygen isotopes resulting from local enrichment and that this may have major implications for galactic nuclear evolution.

dark clouds isotopic abundances interstellar abund↗

Reliability of Sn/Pb and Lead-Free (SnAgCu) Solders of Surface Mounted Miniaturized Passive Components for Extreme Temperature (-185 C to +125 C) Space Missions

Surface mount electronic package test boards have been assembled using tin/lead (Sn/Pb) and lead-free (Pb-free or SnAgCu or SAC305) solders. The soldered surface mount packages include ball grid arrays (BGA), flat packs, various sizes of passive chip components, etc. They have been optically inspected after assembly and subsequently subjected to extreme temperature thermal cycling to assess their reliability or future deep space, long-term, extreme temperature environmental missions. In this study, the employed temperature range (-185oC to +125oC) covers military specifications (-55oC to +100oC), extreme old Martian (-120oC to +115oC), asteroid Nereus (-180oC to +25oC) and JUNO (-150oC to +120oC) environments. The boards were inspected at room temperature and at various intervals as a function of extreme temperature thermal cycling and bake duration. Electrical resistance measurements made at room temperature are reported and the tests to date have shown some change in resistance as a function of extreme temperature thermal cycling and some showed increase in resistance. However, the change in interconnect resistance becomes more noticeable with increasing number of thermal cycles. Further research work will be carried out to understand the reliability of packages under extreme temperature applications (-185oC to +125oC) via continuously monitoring the daisy chain resistance for BGA, Flat-packs, lead less chip packages, etc. This paper will describe the experimental reliability results of miniaturized passive components (01005, 0201, 0402, 0603, 0805, and 1206) assembled using surface mounting processes with tin-lead and lead-free solder alloys under extreme temperature environments.

extreme temperatures,↗

Experimentally Observed Electrical Durability of 4H-SiC JFET ICs Operating from 500 C to 700 C

Prolonged 500 degrees Celsius to 700 degrees Celsius electrical testing data from 4H-SiC junction field effect transistor (JFET) integrated circuits (ICs) are combined with post-testing microscopic studies in order to gain more comprehensive understanding of the durability limits of the present version of NASA Glenn's extreme temperature microelectronics technology. The results of this study support the hypothesis that T ≥ 500 degrees Celsius durability-limiting IC failure initiates with thermal-stress-related crack formation where dielectric passivation layers overcoat micron-scale vertical features including patterned metal traces.

high temperature↗