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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 271 records · Page 15
All sourcesNASA NTRSDOE OSTI
NASA NTRS1992

Method of forming variable cross-sectional shaped three-dimensional fabrics

Method of weaving a variable cross-sectional shaped three-dimensional fabric which utilizes different weft yarn insertion from at least one side of the warp layers for selectively inserting weft yarns into different portions of the fabric cross-sectional profile defined by the warp yarn layers during the weaving process. If inserted from both sides of the warp yarn layers, the weft yarns may be inserted simultaneously or alternately from each side of the warp yarn layers. The vertical yarn is then inserted into the fabric by reciprocation of a plurality of harnesses which separate the vertical yarn into a plurality of vertical yarn systems as required by the shape of the three-dimensional fabric being formed.

Mohamed, Mansour H.↗
NASA NTRS2003

High density pixel array and laser micro-milling method for fabricating array

A pixel array device is fabricated by a laser micro-milling method under strict process control conditions. The device has an array of pixels bonded together with an adhesive filling the grooves between adjacent pixels. The array is fabricated by moving a substrate relative to a laser beam of predetermined intensity at a controlled, constant velocity along a predetermined path defining a set of grooves between adjacent pixels so that a predetermined laser flux per unit area is applied to the material, and repeating the movement for a plurality of passes of the laser beam until the grooves are ablated to a desired depth. The substrate is of an ultrasonic transducer material in one example for fabrication of a 2D ultrasonic phase array transducer. A substrate of phosphor material is used to fabricate an X-ray focal plane array detector.

Wiener-Avnear, Eliezer↗
NASA NTRS2007

Electron Beam Freeform Fabrication in the Space Environment

This viewgraph presentation describes the effect of microgravity on the fabrication of electron beam freeform (EBF) in aerospace environments. The contents include: 1) Electron Beam Freeform Fabrication (EBF3) Process Description; 2) Portable Electron Beam Freeform Fabrication System at NASA LaRC; 3) Electron Beam Freeform Fabrication in the Space Environment; 4) Effect of Gravity on Surface Tension; 5) Effect of Deposit Height on Cooling Path; 6) Microgravity Testing Aboard JSC's C-9; 7) Typical Test Flight Plates; 8) Direction and Height Trials for Process Control; 9) Effect of Wire Entry Direction into Molten Pool; 10) Microstructure of Single Layer EBF Deposits; 11) 0-g Deposit with Incorrect Standoff Distance; 12) Successful Demonstration of EBF in 0-g; and 13) Conclusion.

Taminger, Karen M.↗
NASA NTRS2009

Pre-Flight Characterization of Samples for the MISSE-7 Spacesuit Fabric Exposure Experiment

A series of six sample spacesuit pressure garment assembly (PGA) fabric samples were prepared for the Materials International Space Station Experiment 7 (MISSE-7) flight experiment to test the effects of damage by lunar dust on the susceptibility of the fabrics to radiation damage. These included pristine Apollo-era fluorinated ethylene-propylene (FEP) fabric, Apollo-era FEP fabric that had been abraded with JSC-1A lunar simulant, and a piece of Alan Bean s Apollo 12 PGA sectioned from near the left knee. Also included was a sample of pristine orthofabric, and orthofabric that had been abraded to two different levels with JSC-1A. The samples were characterized using optical microscopy, field emission scanning electron microscopy, and atomic force microscopy. Two sets of six samples were then loaded in space environment exposure hardware, one of which was stored as control samples. The other set was affixed to the MISSE-7 experiment package, and will be mounted on the International Space Station, and exposed to the wake-side low Earth orbit environment. It will be retrieved after an exposure of approximately 12 months, and returned for post flight analysis.

Gaier, James R.↗
NASA NTRS2007

Rapid Fabrication of Carbide Matrix/Carbon Fiber Composites

Composites of zirconium carbide matrix material reinforced with carbon fibers can be fabricated relatively rapidly in a process that includes a melt infiltration step. Heretofore, these and other ceramic matrix composites have been made in a chemical vapor infiltration (CVI) process that takes months. The finished products of the CVI process are highly porous and cannot withstand temperatures above 3,000 F (approx.1,600 C). In contrast, the melt-infiltration-based process takes only a few days, and the composite products are more nearly fully dense and have withstood temperatures as high as 4,350 F (approx.2,400 C) in a highly oxidizing thrust chamber environment. Moreover, because the melt- infiltration-based process takes much less time, the finished products are expected to cost much less. Fabrication begins with the preparation of a carbon fiber preform that, typically, is of the size and shape of a part to be fabricated. By use of low-temperature ultraviolet-enhanced chemical vapor deposition, the carbon fibers in the preform are coated with one or more interfacial material(s), which could include oxides. The interfacial material helps to protect the fibers against chemical attack during the remainder of the fabrication process and against oxidation during subsequent use; it also enables slippage between the fibers and the matrix material, thereby helping to deflect cracks and distribute loads. Once the fibers have been coated with the interfacial material, the fiber preform is further infiltrated with a controlled amount of additional carbon, which serves as a reactant for the formation of the carbide matrix material. The next step is melt infiltration. The preform is exposed to molten zirconium, which wicks into the preform, drawn by capillary action. The molten metal fills most of the interstices of the preform and reacts with the added carbon to form the zirconium carbide matrix material. The zirconium does not react with the underlying fibers because they are protected by the interfacial material(s). The success of the melt-infiltration step depends on interface material selection and uniform coating of the fibers, infiltration with the correct amount of carbon, and careful control of temperature and rate of heating.

Williams, Brian E.↗
NASA NTRS2007

Process for High-Rate Fabrication of Alumina Nanotemplates

An anodizing process, at an early stage of development at the time of reporting the information for this article, has shown promise as a means of fabricating alumina nanotemplates integrated with silicon wafers. Alumina nanotemplates are basically layers of alumina, typically several microns thick, in which are formed approximately regular hexagonal arrays of holes having typical diameters of the order of 10 to 100 nm. Interest in alumina nanotemplates has grown in recent years because they have been found to be useful as templates in the fabrication of nanoscale magnetic, electronic, optoelectronic, and other devices. The present anodizing process is attractive for the fabrication of alumina nanotemplates integrated with silicon wafers in two respects: (1) the process involves self-ordering of the holes; that is, the holes as formed by the process are spontaneously arranged in approximately regular hexagonal arrays; and (2) the rates of growth (that is, elongation) of the holes are high enough to make the process compatible with other processes used in the mass production of integrated circuits. In preparation for fabrication of alumina nanotemplates in this process, one first uses electron-beam evaporation to deposit thin films of titanium, followed by thin films of aluminum, on silicon wafers. Then the alumina nanotemplates are formed by anodizing the aluminum layers, as described below. In experiments in which the process was partially developed, the titanium films were 200 A thick and the aluminum films were 5 m thick. The aluminum films were oxidized to alumina, and the arrays of holes were formed by anodizing the aluminum in aqueous solutions of sulfuric and/or oxalic acid at room temperature (see figure). The diameters, spacings, and rates of growth of the holes were found to depend, variously, on the composition of the anodizing solution, the applied current, or the applied potential, as follows: In galvanostatically controlled anodizing, regardless of the chemical composition of the solution, relatively high current densities (50 to 100 mA/cm2) resulted in arrays of holes that were more nearly regular than were those formed at lower current densities. . The rates of elongation of the holes were found to depend linearly on the applied current density: the observed factor of proportionality was 1.2 (m/h)/(mA/cm2). For a given fixed current density and room temperature, the hole diameters were found to depend mainly on the chemical compositions of the anodizing solutions. The holes produced in sulfuric acid solutions were smaller than those produced in oxalic acid solutions. The arrays of holes produced in sulfuric acid were more ordered than were those produced in oxalic acid. . The breakdown voltage was found to decrease logarithmically with increasing concentration of sulfuric acid. The breakdown voltage was also found to decrease with temperature and to be accompanied by a decrease in hole diameter. The hole diameter was found to vary linearly with applied potential, with a slope of 2.1 nm/V. This slope differs from slopes (2.2 and 2.77 nm/V) reported for similar prior measurements on nanotemplates made from bulk aluminum. The differences among these slopes may be attributable to differences among impurities and defects in bulk and electron-beam-evaporated aluminum specimens.

Myung, Nosang↗
NASA NTRS2007

Design and Fabrication of High-Efficiency CMOS/CCD Imagers

An architecture for back-illuminated complementary metal oxide/semiconductor (CMOS) and charge-coupled-device (CCD) ultraviolet/visible/near infrared- light image sensors, and a method of fabrication to implement the architecture, are undergoing development. The architecture and method are expected to enable realization of the full potential of back-illuminated CMOS/CCD imagers to perform with high efficiency, high sensitivity, excellent angular response, and in-pixel signal processing. The architecture and method are compatible with next-generation CMOS dielectric-forming and metallization techniques, and the process flow of the method is compatible with process flows typical of the manufacture of very-large-scale integrated (VLSI) circuits. The architecture and method overcome all obstacles that have hitherto prevented high-yield, low-cost fabrication of back-illuminated CMOS/CCD imagers by use of standard VLSI fabrication tools and techniques. It is not possible to discuss the obstacles in detail within the space available for this article. Briefly, the obstacles are posed by the problems of generating light-absorbing layers having desired uniform and accurate thicknesses, passivation of surfaces, forming structures for efficient collection of charge carriers, and wafer-scale thinning (in contradistinction to diescale thinning). A basic element of the present architecture and method - the element that, more than any other, makes it possible to overcome the obstacles - is the use of an alternative starting material: Instead of starting with a conventional bulk-CMOS wafer that consists of a p-doped epitaxial silicon layer grown on a heavily-p-doped silicon substrate, one starts with a special silicon-on-insulator (SOI) wafer that consists of a thermal oxide buried between a lightly p- or n-doped, thick silicon layer and a device silicon layer of appropriate thickness and doping. The thick silicon layer is used as a handle: that is, as a mechanical support for the device silicon layer during micro-fabrication.

Pain, Bedabrata↗
NASA NTRS2011

Polyimide Composites Properties of RTM370 Fabricated by Vacuum Assisted Resins Transfer Molding (VARTM)

RTM370 imide resin based on 2,3,3 ,4 -biphenyl dianhydride ( a-BPDA), 3,4 -oxydianinline (3,4 -ODA) with 4-phenylethynylphthalic (PEPA) endcap has shown to exhibit high Tg (370 C) and low melt viscosity (10-30 poise) at 280 C with a pot-life of 1-2 h. Previously, RTM370 resin has been fabricated into composites with T650-35 carbon fabrics by resin transfer molding (RTM) successfully. RTM370 composites exhibit excellent mechanical properties up to 327 C (620 F), and outstanding property retention after aging at 288 C (550 F) for 1000 hrs. In this presentation, RTM 370 composites will be fabricated by vacuum assisted resins transfer molding (VARTM), using vacuum bags without mold. The mechanical properties of RTM370 composites fabricated by VARTM will be compared to those of RTM370 made by RTM.

Chuang, Kathy C.↗
NASA NTRS2011

Processing and Characterization of PETI Composites Fabricated by High Temperature VARTM

The use of composites as primary structures on aerospace vehicles has increased dramatically over the past decade. As these advanced structures increase in size and complexity, their production costs have grown significantly. A major contributor to these manufacturing costs is the requirement of elevated processing pressures, during the thermal cure, to create fully consolidated composites. For certain composite parts, high temperature vacuum assisted resin transfer molding (HT-VARTM) can offer reduced fabrication costs compared to conventional autoclave techniques. The process has been successfully used with phenylethynyl terminated imide (PETI) resins developed by NASA LaRC. In the current study, two PETI resins, LARC(TradeMark) PETI-330 and LARC(TradeMark) PETI-8 have been used to make test specimens using HT-VARTM. Based on previous work at NASA LaRC, larger panels with a quasi-isotropic lay-up were fabricated. The resultant composite specimens exhibited void contents <3% by volume depending on the type of carbon fabric preform used. Mechanical properties of the panels were determined at both room and elevated temperatures. These included open-hole compressive (OHC) and short beam shear (SBS) properties. Limited process modeling efforts were carried out including infusion times, composite panel size limitations and fabric permeability characterization. Work has also been carried out to develop new PETI based resins specifically geared towards HT-VARTM. The results of this work are presented herein.

Ghose, Sayata↗
NASA NTRS2004

Sensor for Monitoring Nanodevice-Fabrication Plasmas

The term plasma process diagnostics (PPD) refers to a spectroscopic technique and sensing hardware that have been proposed for monitoring plasma processes used to fabricate electronic devices that feature sizes as small as several nanometers. Nanometer dimensions are characteristic of the quantum level of miniaturization, where single impurity atoms or molecules can drastically change the local properties of the nanostructures. Such changes may be purposely used in nanoscale design but may also be extremely damaging or cause improper operation of the fabricated devices. Determination of temperature and densities of reactants near the developing features is important, since the structural synthesis is affected by characteristics of the local microenvironment. Consequently, sensors capable of nonintrusive monitoring with high sensitivity and high resolution are essential for real-time atomistic control of reaction kinetics and minimizing trace contamination in plasma processes used to fabricate electronic nanodevices. Such process-monitoring sensors are required to be compact, multiparametric, and immune to the harsh environments of processing plasmas. PPD is intended to satisfy these requirements. The specific technique used to implement plasma diagnostics with a PPD sensor would be an advanced version of continuous-wave cavity-ringdown spectroscopy (CW-CRDS) capable of profiling spectral line broadenings in order to derive both Doppler and Stark components. CRDS is based on measurements of the rate of absorption of laser light in an optical resonator. The ultimate sensitivity results from a very long absorption path length within the cavity and immunity to variations in incident laser intensity. The proposed version of this technique would involve the use of multiplexing tunable laser diodes and an actively modulated high-reflectivity optical resonator, thus offering a synergistic combination of simplicity, compactness, high sensitivity, and high resolution. The multiplexing capabilities of diode lasers could be utilized to make the PPD sensor a single, simple, compact, and inexpensive tool for the acquisition of multiparametric data. A PPD sensor would be capable of continuous measurement of such physical parameters as gas temperature, gas velocity, electron number density, and absolute densities of reacting chemical species. A laser beam can be easily adjusted to analyze the immediate vicinity of the growing nanostructures (or features etched down) in real time. The absorption enhancement in an optical cavity would afford the sensitivity needed for measurement of the temperature and densities of species at concentrations significantly lower than measurable by other nonintrusive techniques. It is anticipated that fully developed PPD sensors would enable simultaneous measurement of local temperature and determination of plasma species responsible for the synthesis and functionalization of nanodevices. These sensors would also enable tracking the pathways and origins of damaging contaminants, thereby providing feedback for adjustment of processes to optimize them and reduce contamination. The PPD sensors should also be useful for optimization of conventional microelectronics manufacturing plasma processes. Going beyond plasma processes for fabrication of electronic devices, PPD sensors could be used for monitoring of atoms, molecules, ions, radicals, clusters, and particles in a variety of other settings, including outer space. Because of their high sensitivity, such sensors could also prove useful for detecting traces of illegal drugs and explosives.

Bolshakov, Alexander↗
NASA NTRS2003

Miniature Inchworm Actuators Fabricated by Use of LIGA

Miniature inchworm actuators that would have relatively simple designs have been proposed for applications in which there are requirements for displacements of the order of microns or tens of microns and for the ability to hold their positions when electric power is not applied. The proposed actuators would be members of the class of microelectromechanical systems (MEMS), but would be designed and fabricated following an approach that is somewhat unusual for MEMS. Like other MEMS actuators, the proposed inchworm actuators could utilize thermoplastic, bimetallic, shape-memory-alloy, or piezoelectric actuation principles. The figure depicts a piezoelectric inchworm actuator according to the proposal. As in other inchworm actuators, linear motion of an extensible member would be achieved by lengthening and shortening the extensible member in synchronism with alternately clamping and releasing one and then the other end of the member. In this case, the moving member would be the middle one; the member would be piezoelectric and would be shortened by applying a voltage to it. The two outer members would also be piezoelectric; the release of the clamps on the upper or lower end would be achieved by applying a voltage to the electrodes on the upper or lower ends, respectively, of these members. Usually, MEMS actuators cannot be fabricated directly on the side walls of silicon wafers, yet the geometry of this actuator necessitates such fabrication. The solution, according to the proposal, would be to use the microfabrication technique known by the German acronym LIGA - "lithographie, galvanoformung, abformung," which means lithography, electroforming, molding. LIGA involves x-ray lithography of a polymer film followed by selective removal of material to form a three-dimensional pattern from which a mold is made. Among the advantages of LIGA for this purpose are that it is applicable to a broad range of materials, can be used to implement a variety of designs, including those of structures >1 mm high, affords submicron precision, and is amenable to mass production at relatively low unit cost. Fabrication of the proposed actuators would involve some technological risks - in particular, in the integration of electrode connection lines and placement of actuator elements. It will also be necessary to perform an intensive study of the feasibility of growing piezoelectric crystals onto LIGA molds.

Yang, Eui-Hyeok↗
NASA NTRS2003

Better VPS Fabrication of Crucibles and Furnace Cartridges

An experimental investigation has shown that by (1) vacuum plasma spraying (VPS) of suitable refractory metal alloys on graphite mandrels, and then (2) heat-treating the VPS alloy deposits under suitable conditions, it is possible to fabricate improved crucibles and furnace cartridges that could be used at maximum temperatures between 1,400 and 1,600 C and that could withstand chemical attack by the materials to be heated in the crucibles and cartridges. Taken by itself, the basic concept of fabricating furnace cartridges by VPS of refractory materials onto graphite mandrels is not new; taken by itself, the basic concept of heat treatment of VPS deposits for use as other than furnace cartridges is also not new; however, prior to this investigation, experimental crucibles and furnace cartridges fabricated by VPS had not been heat treated and had been found to be relatively weak and brittle. Accordingly, the investigation was directed toward determining whether certain combinations of (1) refractory alloy compositions, (2) VPS parameters, and (3) heat-treatment parameters could result in VPS-fabricated components with increased ductility.

Holmes, Richard R.↗
NASA NTRS2011

Composite Properties of RTM370 Polyimide Fabricated by Vacuum Assisted Resin Transfer Molding (VARTM)

RTM370 imide resin based on 2,3,3?,4?-biphenyl dianhydride (a-BPDA), 3,4'-oxydianinline (3,4'-ODA) with the 4-phenylethynylphthalic (PEPA) endcap has been shown to exhibit a high cured T(sub g) (370 C) and low melt viscosity (10-30 poise) at 280 C with a pot-life of 1-2 h. Previously, RTM370 resin has been successfully fabricated into composites reinforced with T650-35 carbon fabrics by resin transfer molding (RTM). RTM370 composites exhibit excellent mechanical properties up to 327?C (620?F), and outstanding property retention after aging at 288?C (550?F) for 1000 h. In this work, RTM370 composites were fabricated by vacuum assisted resin transfer molding (VARTM), using vacuum bags on a steel plate. The mechanical properties of RTM370 composites fabricated by VARTM are compared to those prepared by RTM.

Chuang, Kathy C.↗
NASA NTRS2011

The Design, Fabrication, and Testing of Composite Heat Exchange Coupons

Several heat exchanger (HX) test panels were designed, fabricated and tested at the NASA Glenn Research Center to explore the fabrication and performance of several designs for composite heat exchangers. The development of these light weight, high efficiency air-liquid test panels was attempted using polymer composites and carbon foam materials. The fundamental goal of this effort was to demonstrate the feasibility of the composite HX for various space exploration and thermal management applications including Orion CEV and Altair. The specific objectives of this work were to select optimum materials, designs, and to optimize fabrication procedures. After fabrication, the individual design concept prototypes were tested to determine their thermal performance and to guide the future development of full-size engineering development units (EDU). The overall test results suggested that the panel bonded with pre-cured composite laminates to KFOAM Grade L1 scored above the other designs in terms of ease of manufacture and performance.

Quade, Derek J.↗
NASA NTRS2012

Fabrication of an Absorber-Coupled MKID Detector

Absorber-coupled microwave kinetic inductance detector (MKID) arrays were developed for submillimeter and far-infrared astronomy. These sensors comprise arrays of lambda/2 stepped microwave impedance resonators patterned on a 1.5-mm-thick silicon membrane, which is optimized for optical coupling. The detector elements are supported on a 380-mm-thick micro-machined silicon wafer. The resonators consist of parallel plate aluminum transmission lines coupled to low-impedance Nb microstrip traces of variable length, which set the resonant frequency of each resonator. This allows for multiplexed microwave readout and, consequently, good spatial discrimination between pixels in the array. The transmission lines simultaneously act to absorb optical power and employ an appropriate surface impedance and effective filling fraction. The fabrication techniques demonstrate high-fabrication yield of MKID arrays on large, single-crystal membranes and sub-micron front-to-back alignment of the micro strip circuit. An MKID is a detector that operates upon the principle that a superconducting material s kinetic inductance and surface resistance will change in response to being exposed to radiation with a power density sufficient to break its Cooper pairs. When integrated as part of a resonant circuit, the change in surface impedance will result in a shift in its resonance frequency and a decrease of its quality factor. In this approach, incident power creates quasiparticles inside a superconducting resonator, which is configured to match the impedance of free space in order to absorb the radiation being detected. For this reason MKIDs are attractive for use in large-format focal plane arrays, because they are easily multiplexed in the frequency domain and their fabrication is straightforward. The fabrication process can be summarized in seven steps: (1) Alignment marks are lithographically patterned and etched all the way through a silicon on insulator (SOI) wafer, which consists of a thin silicon membrane bonded to a thick silicon handle wafer. (2) The metal microwave circuitry on the front of the membrane is patterned and etched. (3) The wafer is then temporarily bonded with wafer wax to a Pyrex wafer, with the SOI side abutting the Pyrex. (4) The silicon handle component of the SOI wafer is subsequently etched away so as to expose the membrane backside. (5) The wafer is flipped over, and metal microwave circuitry is patterned and etched on the membrane backside. Furthermore, cuts in the membrane are made so as to define the individual detector array chips. (6) Silicon frames are micromachined and glued to the silicon membrane. (7) The membranes, which are now attached to the frames, are released from the Pyrex wafer via dissolution of the wafer wax in acetone.

Brown, Ari↗
NASA NTRS2012

Post-Flight Characterization of Samples for the MISSE-7 Spacesuit Fabric Exposure Experiment

Six samples of pristine and dust-abraded outer layer spacesuit fabrics were included in the Materials International Space Station Experiment-7, in which they were exposed to the wake side low Earth orbit environment (LEO) on the International Space Station (ISS) for 18 months in order to determine whether abrasion by lunar dust increases radiation degradation. The fabric samples were characterized using optical microscopy, field emission scanning electron microscopy, and tensile testing before and after exposure on the ISS. Comparison of pre- and post-flight characterizations showed that wake side LEO environment darkened and reddened all six fabrics, increasing their integrated solar absorptance by 7 to 38 percent. There was a decrease in the ultimate tensile strength and elongation to failure of lunar dust abraded Apollo spacesuit fibers by a factor of four and increased the elastic modulus by a factor of two. The severity of the degradation of the fabric samples over this short exposure time demonstrates the necessity to find ways to prevent or mitigate radiation damage to spacesuits when planning extended missions to the Moon.

Gaier, James R.↗
NASA NTRS2012

Development of a Fluid Structures Interaction Test Technique for Fabrics

Application of fluid structures interaction (FSI) computational techniques to configurations of interest to the entry, descent and landing (EDL) community is limited by two factors - limited characterization of the material properties for fabrics of interest and insufficient experimental data to validate the FSI codes. Recently ILC Dover Inc. performed standard tests to characterize the static stress-strain response of four candidate fabrics for use in EDL applications. The objective of the tests described here is to address the need for a FSI dataset for CFD validation purposes. To reach this objective, the structural response of fabrics was measured in a very simple aerodynamic environment with well controlled boundary conditions. Two test series were undertaken. The first series covered a range of tunnel conditions and the second focused on conditions that resulted in fabric panel buckling.

Zilliac, Gregory G.↗
NASA NTRS2015

Application of Optical Measurement Techniques During Fabrication and Testing of Liquid Rocket Nozzles

This paper presents a series of optical measurement techniques that were developed for use during large-scale fabrication and testing of nozzle components. A thorough understanding of hardware throughout the fabrication cycle and hotfire testing is critical to meet component design intent. Regeneratively cooled nozzles and associated tooling require tight control of tolerances during the fabrication process to ensure optimal performance. Additionally, changes in geometry during testing can affect performance of the nozzle and mating components. Structured light scanning and digital image correlation techniques were used to collect data during the fabrication and test of nozzles, in addition to other engine components. This data was used to analyze deformations data during machining, heat treatment, assembly and testing operations. A series of feasibility experiments were conducted for these techniques that led to use on full scale nozzles during the J-2X upper stage engine program in addition to other engine development programs. This paper discusses the methods and results of these measurement techniques throughout the nozzle life cycle and application to other components.

Gradl, Paul R.↗