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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 271 records · Page 15
All sourcesNASA NTRSDOE OSTI
DOE OSTI2021

Assessment of Electrode Contamination Mitigation at 0.5 MA Scale

The Z Machine at Sandia National Laboratories uses current pulses with peaks up to 27 MA to drive target implosions and generate high energy density conditions of interest for stockpile stewardship programs pertinent to the NNSA program portfolio . Physical processes in the region near the Z Machine target create electrode plasmas which seed parasitic current loss that reduce the performance and output of a Z experiment. Electrode surface contaminants (hydrogen, water, hydrocarbons) are thought to be the primary constituent of electrode plasmas which contribute to loss mechanisms. The Sandia team explore d in situ heating and plasma discharge techniques by integrating requisite infrastructure into Sandia's Mykonos LTD accelerator, addressing potential impacts to accelerator operation, and reporting on the impact of these techniques on electrode plasma formation and shot performance. The in situ discharge cleaning utilizes the electrodes of the accelerator to excite an argon-oxygen plasma to sputter and chemically react contaminants from electrode surfaces. Insulating breaks are required to isolate the plasma in electrode regions where loss processes are most likely to occur. The shots on Mykonos validate that these breaks do not perturb experiment performance, reducing the uncertainty on the largest unknown about the in situ cleaning system. Preliminary observations with electrical and optical diagnostics suggest that electrode plasma formation is delayed, and overall inventory has been substantively reduced. In situ heating embeds cartridge heaters into accelerator electrodes and employs a thermal bakeout to rapidly desorb contaminants from electrode surfaces. For the first time, additively manufactured (AM) electrode assemblies were used on a low impedance accelerator to integrate cooling channels and manage thermal gradients. Challenges with poor supplier fabrication to specifications, load alignment, thermal expansion and hardware movement and warpage appears to have introduced large variability in observed loss, though, preventing strong assertions of loss reduction via in situ heating. At this time, an in situ discharge cleaning process offers the lowest risk path to reduce electrode contaminant inventories on Z, though we recommend continuing to develop both approaches. Additional engineering and testing are required to improve the implementation of both systems. .

70 PLASMA PHYSICS AND FUSION TECHNOLOGY↗
DOE OSTI2025

Developing affordable and efficient heating devices for enhanced live cell imaging in confocal microscopy

Temperature control is crucial for live cell imaging, particularly in studies involving plant responses to high ambient temperatures and thermal stress. This study presents the design, development, and testing of two cost-effective heating devices tailored for confocal microscopy applications: an aluminum heat plate and a wireless mini-heater. The aluminum heat plate, engineered to integrate seamlessly with the standard 160 mm × 110 mm microscope stage, supports temperatures up to 36°C, suitable for studies in the range of non-stressful warm temperatures (e.g., 25-27°C forArabidopsis thaliana) and moderate heat stress (e.g., 30-36°C forA. thaliana). We also developed a wireless mini-heater that offers rapid, precise heating directly at the sample slide, with a temperature increase rate over 30 times faster than the heat plate. The wireless heater effectively maintained target temperatures up to 50°C, ideal for investigating severe heat stress and heat shock responses in plants. Both devices performed well in controlled studies, including the real-time analysis of heat shock protein accumulation and stress granule formation inA. thaliana. Our designs are effective and affordable, with total construction costs lower than $300. This accessibility makes them particularly valuable for small laboratories with limited funding. Future improvements could include enhanced heat uniformity, humidity control to mitigate evaporation, and more robust thermal management to minimize focus drift during extended imaging sessions. These modifications would further solidify the utility of our heating devices in live cell imaging, offering researchers reliable, budget-friendly tools for exploring plant thermal biology.

Plant Sciences↗
DOE OSTI2026

A Physics-Informed Reinforcement Learning Framework for Economic-Thermal Co-Optimization of Crypto Mining Data Centers: Preprint

The rapid expansion of cryptocurrency mining has created a new class of high-density data centers characterized by extreme thermal flux and high sensitivity to volatile economic markets. Traditional thermal management strategies, typically reliant on rule-based control, maintain static setpoints that fail to account for fluctuating electricity prices and cryptocurrency values - factors critical to mining profitability. To address this, we present a physics-informed reinforcement learning (PIRL) framework for economic-thermal co-optimization in crypto mining data centers. This framework consists of a proximal policy optimization (PPO) agent, a virtual testbed powered by high-fidelity physics-based models, and an interactive frontend dashboard. The PPO agent is trained using the virtual testbed and strict hardware safety limits. This physics-informed approach allows the agent to learn a stochastic policy that dynamically balances mining revenue against operational costs by co-optimizing HVAC cooling setpoints and IT computational hashrate. The simulation results demonstrate that the integrated framework achieved an 8.62% increase in net operational profit compared to traditional baseline strategies while strictly adhering to safety-critical temperature constraints (coolant supply temperature < 32 degrees C). This work provides a scalable template for the deployment of reinforcement learning in mission critical facilities where economic volatility and physical safety must be managed simultaneously.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗
DOE OSTI2020

An All-Ceramic, Anisotropic, and Flexible Aerogel Insulation Material

To exploit the high-temperature superinsulation potential of anisotropic thermal management materials, the incorporation of ceramic aerogel into the aligned structural networks is indispensable. Yet, the long-standing obstacle to exploring ultralight superinsulation ceramic aerogels is the inaccessibility of its mechanical elasticity, stability, and anisotropic thermal insulation. Here, we report a recoverable, flexible ceramic fiber-aerogel composite with anisotropic lamellar structure, where the interfacial cross-linking between ceramic fiber and aerogel is important in its superinsulation performance. The resulting ultralight aerogel composite exhibits a density of 0.05 g/cm 3 , large strain recovery (over 50%), and low thermal conductivity (0.0224 W m –1 K –1 ), while its hydrophobicity is achieved by in situ trichlorosilane coating with the water contact angle of 135°. The hygroscopic tests of such aerogel composites demonstrate a reversible thermal insulation. The mechanical elasticity and stability of the anisotropic composites, with its soundproof performance, shed light on the low-cost superelastic aerogel manufacturing with scalability for energy saving building applications.

36 MATERIALS SCIENCE↗
DOE OSTI2021

Printing thermoelectric inks toward next-generation energy and thermal devices

The ability of thermoelectric (TE) materials to convert thermal energy to electricity and vice versa highlights them as a promising candidate for sustainable energy applications. Despite considerable increases in the figure of merit zT of thermoelectric materials in the past two decades, there is still a prominent need to develop scalable synthesis and flexible manufacturing processes to convert high-efficiency materials into high-performance devices. Scalable printing techniques provide a versatile solution to not only fabricate both inorganic and organic TE materials with fine control over the compositions and microstructures, but also manufacture thermoelectric devices with optimized geometric and structural designs that lead to improved efficiency and system-level performances. In this review, we aim to provide a comprehensive framework of printing thermoelectric materials and devices by including recent breakthroughs and relevant discussions on TE materials chemistry, ink formulation, flexible or conformable device design, and processing strategies, with an emphasis on additive manufacturing techniques. Additionally, we review recent innovations in the flexible, conformal, and stretchable device architectures and highlight state-of-the-art applications of these TE devices in energy harvesting and thermal management. Perspectives of emerging research opportunities and future directions are also discussed. While this review centers on thermoelectrics, the fundamental ink chemistry and printing processes possess the potential for applications to a broad range of energy, thermal and electronic devices.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
DOE OSTI2023

SiC Microchannel Heat Sinks for High Heat Flux Dissipation of 1 kW/cm 2

Thermal management has become a major barrier in the development of high-power micro-devices. Microchannel heat sinks (MCHS) are a promising method to dissipate high heat fluxes from high power density devices. Reducing the thermal resistance will reduce the temperature increase of the electronic device, allowing for higher powers to be achieved while maintaining a safe operating temperature. This paper reports on the use of silicon carbide (Sic) microchannels to dissipate high heat fluxes up to 1 kW/cm 2 over a footprint of 0.25 cm 2 . The use of high aspect ratio and decreased hydraulic diameter channels has allowed for very low thermal resistances to be achieved at higher heat duties compared to previous studies. The experiments performed resulted in heater temperatures of less than 60 °C and thermal resistances as low as 0.024 cm 2 . ° $C$/W between the heater surface and fluid inlet temperature. In conclusion, the demonstrated thermal performance of the SiC MCHS is an encouraging means for dissipating heat from high power density microelectronic devices.

42 ENGINEERING↗
DOE OSTI2026

Tracking Thermal Transport in Colloidal Quantum Dot Films Using in Situ Time-Resolved X-ray Diffraction

Colloidal quantum dots (QDs) and their thin films are increasingly used in electronic and photonic devices replacing traditional bulk semiconductors. However, thermal properties of QDs remain underexplored relative to device development efforts. This study shows the use of time-resolved X-ray diffraction as a contact-free method to probe the thermal response of QDs in environments representative of the active layer in QD optoelectronic devices, providing in situ insights for future thermal management strategies. Through the extraction of Debye–Waller factors on a subnanosecond time scale, we directly capture the heating and cooling of core/shell CdSe/CdS QDs following pulsed optical excitation. In a QD thin film that actively provides optical gain, the thermal conductivity is found to be as low as 0.13 W m –1 K –1 , because of the poor heat flow between close-packed QD solids. For QDs dispersed in liquids, interfacial thermal conductance dominates thermal relaxation, with a conductance of 15 MW m –2 K –1 .

36 MATERIALS SCIENCE↗
DOE OSTI2023

Hierarchical Cellulose Superinsulation Membrane

The environment-friendly components coupled with the ability to mimic the simplicity and originality of nature necessitate advanced sustainable materials with structural capabilities for energy-efficient applications. The use of feedstock deriving from plant-based, renewable organic material to produce nanofibril that embodies enhanced insulating properties and high mechanical strength constitutes an efficient development strategy. In this work, a free-standing, hierarchical superinsulation membrane by leveraging the principle of the bottom-up method is reported. The electrospun cellulose nanofibrils/aerogel-based core layer provides exceptional thermal properties with its thermal conductivity of 10.2 mW m –1 K –1 . The lightweight, flexible, and durable paper-like membrane features a tensile strength of 11.3 MPa and a bending rigidity in the order of 4.6 cN mm –1 . The hydrophobic superinsulation membrane material also exhibits a ΔT of ≈25 °C under continuous sunlight illumination and allows thermal runaway mitigation of rechargeable lithium-ion batteries. All the aforementioned properties position this hybrid superinsulation membrane as a promising material for energy-saving thermal management applications.

36 MATERIALS SCIENCE↗
DOE OSTI2021

Flow Assisted Evaporative Cooling for Electric Motor

This paper examines a novel concept of flow assisted latent heat driven two-phase evaporative cooling (EC) confined in-between slot liner and active-winding of electric motor. Wicking micro-structure enhanced PDMS liner axially sucks coolant in the form of thin film between the PDMS liner and active-winding and eventually enables thin film evaporation on the outer surface of the active-winding. Therefore, EC based thermal management eliminates contact resistance between the winding and slot-liner and, enhances the heat extraction from the winding without compromising the electro-magnetic performance. Two-way coupled electro-magnetic (EM) – computational fluid dynamics/heat transfer (CFD/HT) and EM - lumped parameter thermal network (LPTN) models have been developed to assess the electro-thermal performance of the EC under steady and transient conditions. Taking a case study of a 125 kW jacket cooled BMW i3 motor and dielectric coolant FC-84, EC is shown to be capable of handling a maximum steady state rms current density of 26 A/mm2 at a evaporative heat transfer coefficient of 5,000 W/m2.K, which is about 78.7% higher compared to the traditional jacket cooling (JC). In case of EC, a maximum steady state and transient rms current density of 30 A/mm2 (106.2% higher compared to the JC), and 40.8 A/mm2 have been realized by using high thermal conductivity epoxy (1.9 W/m.K) impregnation material. Thermal performance of the EC is also assessed and compared with JC over a dynamic drive cycle. Lastly, a motorette testing has been performed to demonstrate the applicability of the proposed EC method and to validate the developed modeling framework.

42 ENGINEERING↗
DOE OSTI2022

Robust silane self-assembled monolayer coatings on plasma-engineered copper surfaces promoting dropwise condensation

Dropwise condensation is well known to result in better heat transfer performance owing to efficient condensate/droplet removal, which can be harnessed in various industrial heat/mass transfer applications such as power generation and conversion, water harvesting/desalination, and electronics thermal management. The key to enhancing condensation via the dropwise mode is thin low surface energy coatings (<100 nm) with low contact angle hysteresis. Ultrathin (<5 nm) silane self-assembled monolayers (or SAMs) have been widely studied to promote dropwise condensation due to their minimal thermal resistance and scalable integration processes. Such thin coatings typically degrade within an hour during condensation of water vapor. After coating failure, water vapor condensation transitions to the inefficient filmwise mode with poor heat transfer performance. We enhance silane SAM quality and durability during water vapor condensation on copper compared to state-of-the-art silane coatings on metal surfaces. We achieve this via (i) surface polishing to sub-10 nm levels, (ii) pure oxygen plasma surface treatment, and (iii) silane coating integration with the copper substrate in an anhydrous/moisture-free environment. The resulting silane SAM has low contact angle hysteresis (≈20°) and promotes efficient dropwise condensation of water for >360 hours without any visible sign of coating failure/degradation in the absence of non-condensable gases. We further demonstrate enhanced heat transfer performance (≈5-7× increase over filmwise condensation) over an extended period of time. Surface characterization data post-condensation leads us to propose that in the absence of non-condensable gases in the vapor environment, the silane SAM degrades due to reduction and subsequent dissolution of copper oxide at the oligomer-substrate interface. The experiments also indicate that the magnitude of surface subcooling (or condensation rate) affects the rate of coating degradation. Finally, this work identifies a pathway to durable dropwise promoter coatings that will enable efficient heat transfer in industrial applications.

42 ENGINEERING↗
DOE OSTI2021

Low Thermal Resistance (0.5 K/W) Ga 2 O 3 Schottky Rectifiers With Double-Side Packaging

The low thermal conductivity of Ga 2 O 3 has arguably been the most serious concern for Ga 2 O 3 power and RF devices. Despite many simulation studies, there is no experimental report on the thermal resistance of a large-area, packaged Ga 2 O 3 device. This work fills this gap by demonstrating a 15-A double-side packaged Ga 2 O 3 Schottky barrier diode (SBD) and measuring its junction-to-case thermal resistance (R θJC ) in the bottom-side- and junction-side-cooling configurations. The R θJC characterization is based on the transient dual interface method, i.e., JEDEC 51-14 standard. The R θJC of the junction- and bottom-cooled Ga 2 O 3 SBD was measured to be 0.5 K/W and 1.43 K/W, respectively, with the former R θJC lower than that of similarly-rated commercial SiC SBDs. This low R θJC is attributable to the heat extraction directly from the Schottky junction instead of through the Ga 2 O 3 chip. Here, the R θJC lower than that of commercial SiC devices proves the viability of Ga 2 O 3 devices for high-power applications and manifest the significance of proper packaging for their thermal management.

42 ENGINEERING↗
DOE OSTI2022

Thermochemical characterization of intumescent materials and their application in FEM models using Aria

Intumescent materials are in wide use as protective coatings in fire protection or thermal management applications. These materials undergo chemical reactions occurring from approximately 300°C to 900°C, which outgas and expand the material, providing an appreciable increase in insulative performance. However, the complicated chemical mechanisms and large changes in materials properties complicate the incorporation of these materials into predictive thermal models. This document serves to outline the thermochemical characterization of select intumescent materials, the extraction of relevant parameters, and the incorporation of these parameters into the ChemEQ reaction model implemented in Aria. This work was performed in 2016 and documented in a draft SAND report in March 2017. In 2022, the draft SAND report was discovered and put through R&A.

36 MATERIALS SCIENCE↗
DOE OSTI2022

Thermal conductivity of multilayer polymer-nanocomposite thin films

The development of electrical insulators that are thermally conducting is critical for thermal management applications in many advanced electronics and electrical devices. Here, we synthesized polymer nanocomposite (PNC) films composed of polymers [polyethylenimine, poly(vinylamine), poly(acrylic acid), and poly(ethylene oxide)] and dielectric fillers (montmorillonite clay and hexagonal boron nitride) by layer-by-layer technique. The cross-plane thermal conductivity (k⊥) of the film was measured by the 3ω method. The effect of various factors such as film growth, filler type, filler volume fraction, polymer chemical structures, and temperature on the thermal conductivity is reported. The k⊥ of PNCs with thickness from 37 nm to 1.34 μm was found to be in the range of 0.11 to 0.21 ± 0.02 W m−1 K−1. The k⊥ values were found to be lower than the constituent polymer matrix. The experimental result is compared with existing theoretical models of nanocomposite systems to get insight into heat transfer behavior in such layered films composed of dielectrics and polymers.

Physics↗
DOE OSTI2022

3D-printed electrically conductive silicon carbide

The development of electrically conductive ceramics could achieve robust mechanical strength as well as practically high conductivity, offering applications in structural electrodes, conductors, catalyst supports, etc. However, its operating temperature is limited due to the intrinsic dense structures inevitably hindering the thermal management capability, thus resulting in a temperature-dependent electrical behavior in high-temperature environments. In this work, we report an additive manufacturing protocol through vat photopolymerization 3D printing to fabricate the architectured conductive silicon carbide (SiC) ceramics that simultaneously possess high electrical conductivity as well as low thermal conductivity, and demonstrate electric reliability under high-temperature environments above 600°C. The percolation of graphene into the ceramic scaffold establishes a uniform conductive network, exhibiting its electrical conductivity up to 1000 S m –1 . The bulk density of the 3D-printed ceramic is measured from 0.366 g cm –3 to 0.897 g cm –3 , with thermal conductivity ranging from 62 mW m –1 K –1 to 88 mW m –1 K –1 . Furthermore, the mechanical performance of conductive ceramic can be effectively reinforced by densifying the microstructures via spark plasma sintering treatment. The proposed additive manufacturing strategy widens the potential of ceramics as a structural and functional material, offering a promising pathway toward high-temperature electronics applications.

36 MATERIALS SCIENCE↗
DOE OSTI2022

Enhancing thermal conductivity and toughness of cellulose nanofibril/boron nitride nanosheet composites

Generally, the thermal conductivity (TC) of composite based on cellulose nanofibrils (CNF) is improved by adding thermal conductive filler, which inevitably leads to the loss of its mechanical properties. Here, in this work, it is the first to simultaneously improve the toughness and TC of CNF/boron nitride nanosheets (BNNS) composite from the perspective of thermal conductive filler addition and CNF crystal change. The hydrophilic-modified BNNSs were successfully prepared by xylose-assisted ball-milling prior to adding into CNF. Compared with that of CNF film (1.34 W/(m·K)), the in-plane TC of CNF/BNNS composite (12.68 W/(m·K)) increased significantly by 846 % with loading 30 % BNNS. Afterwards, both toughness (8.0 MJ·m -3 , increased ~250 %) and TC (14.7 W/(m·K), increased ~16 %) of CNF/BNNS composite were further enhanced significantly by mercerization with 12.5 % NaOH solution. The simultaneously improvement of toughness and TC is unprecedented in related studies, which contributes to the effective preparation of thermal management materials.

36 MATERIALS SCIENCE↗
DOE OSTI2022

Processing of phase change materials by fused deposition modeling: Toward efficient thermal energy storage designs

We report that recently, several efforts have emerged that employ additive manufacturing techniques to integrate phase change material (PCM) thermal energy storage into geometrically complex designs for advanced thermal management. In this work, we contribute to this emerging research by reporting on the production of a composite nylon-based filament for fused deposition modeling incorporating encapsulated PCMs for 3D printing heat sink geometries. Microencapsulated PCM (MEPCM) with a 6 degrees C transition temperature was selected as the material for thermal energy storage. This transition temperature was selected due to its suitability to provide thermal energy storage to target air-conditioning applications in buildings. In an attempt to improve the thermal conductivity of the composite, fine boron nitride fillers were added, although the effect on improvement was found to be negligible in the overall composite mixture. The nylon-MEPCM ratio in the filaments was optimized, and filaments containing up to 40 wt% MEPCM were successfully synthesized, which were found optimal for 3D printing complex heat sink and other geometries. Thermal and mechanical properties of the filaments were characterized, including latent heat of fusion, thermal conductivity, phase change temperature, tensile strength, and more. Thermal infrared imaging of heat sink geometries printed using the MEPCM filaments undergoing thermal discharging was also conducted. This work presents the most promising result to date in the open literature for a 3D-printed PCM composite in the combination of size, energy density, and geometric complexity of printed parts.

25 ENERGY STORAGE↗