Electrically conductive palladium-containing polyimide films
Palladium addition makes light, flexible film with low resistivity to relieve space charging. Polyimide film is prepared in four steps: preparation of polyamic acid in polar solvent; addition of soluable palladium complex salt; fabrication of film of "palladium polyamic acid" solution; and thermal imidization of film to palladium-containing polyimide by 300 C heating. Lowered resistivities were achieved without loss in film flexibility or increase in film weight.