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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 271 records · Page 15

Automated inspection of solder joints for surface mount technology

Researchers at NASA/GSFC evaluated various automated inspection systems (AIS) technologies using test boards with known defects in surface mount solder joints. These boards were complex and included almost every type of surface mount device typical of critical assemblies used for space flight applications: X-ray radiography; X-ray laminography; Ultrasonic Imaging; Optical Imaging; Laser Imaging; and Infrared Inspection. Vendors, representative of the different technologies, inspected the test boards with their particular machine. The results of the evaluation showed limitations of AIS. Furthermore, none of the AIS technologies evaluated proved to meet all of the inspection criteria for use in high-reliability applications. It was found that certain inspection systems could supplement but not replace manual inspection for low-volume, high-reliability, surface mount solder joints.

Savage, Robert M.↗

A Multilayered Thin Film Insulator for Harsh Environments

The status of work to develop a reliable high temperature dielectric thin film for use with thin film sensors is presented. The use of thin films to electrically insulate thin film sensors on engine components minimizes the intrusiveness of the sensor and allows a more accurate measurement of the environment. A variety of insulating films were investigated for preventing electrical shorting caused by insulator failure between the sensor and the component. By alternating layers of sputtered high temperature ceramics, a sequence of insulating layers was devised that prevents pinholes from forming completely through the insulator and maintains high electrical resistivity at high temperatures. The major technical challenge remaining is to optimize the fabrication of the insulator with respect to composition to achieve a reliable high temperature insulating film. Data from the testing of various potentially insulating thin film systems is presented and their application to thin film sensors is also discussed.

Wrbanek, John D.↗

Commercial Parts Technology Qualification Processes

Many high-reliability systems, including space systems, use selected commercial parts (including Plastic Encapsulated Microelectronics or PEMs) for unique functionality, small size, low weight, high mechanical shock resistance, and other factors. Predominantly this usage is subjected to certain 100% tests (typically called screens) and certain destructive tests usually (but not always) performed on the flight lot (typically called qualification tests). Frequently used approaches include those documented in EEE-INST-002 and JPL DocID62212 (which are sometimes modified by the particular aerospace space systems manufacturer). In this study, approaches from these documents and several space systems manufacturers are compared to approaches from a launch systems manufacturer (SpaceX), an implantable medical electronics manufacturer (Medtronics), and a high-reliability transport system process (automotive systems). In the conclusions section, these processes are outlined for all of these cases and presented in tabular form. Then some simple comparisons are made. In this introduction section, the PEM technology qualification process is described, as documented in EEE-INST-002 (written by the Goddard Space Flight Center, GSFC), as well as the somewhat modified approach employed at the Jet Propulsion Laboratory (JPL). Approaches used at several major NASA contractors are also described

Cooper, Mark S.↗

Solar powered Stirling cycle electrical generator

Under NASA's Civil Space Technology Initiative (CSTI), the NASA Lewis Research Center is developing the technology needed for free-piston Stirling engines as a candidate power source for space systems in the late 1990's and into the next century. Space power requirements include high efficiency, very long life, high reliability, and low vibration. Furthermore, system weight and operating temperature are important. The free-piston Stirling engine has the potential for a highly reliable engine with long life because it has only a few moving parts, non-contacting gas bearings, and can be hermetically sealed. These attributes of the free-piston Stirling engine also make it a viable candidate for terrestrial applications. In cooperation with the Department of Energy, system designs are currently being completed that feature the free-piston Stirling engine for terrestrial applications. Industry teams were assembled and are currently completing designs for two Advanced Stirling Conversion Systems utilizing technology being developed under the NASA CSTI Program. These systems, when coupled with a parabolic mirror to collect the solar energy, are capable of producing about 25 kW of electricity to a utility grid. Industry has identified a niche market for dish Stirling systems for worldwide remote power application. They believe that these niche markets may play a major role in the introduction of Stirling products into the commercial market.

Shaltens, Richard K.↗

Fast Risetime Reverse Bias Pulse Failures in SiC PN Junction Diodes

SiC-based high temperature power devices are being developed for aerospace systems which will require high reliability. One behavior crucial to power device reliability. To date, it has necessarily been assumed to date is that the breakdown behavior of SiC pn junctions will be similar to highly reliable silicon-based pn junctions. Challenging this assumption, we report the observation of anomalous unreliable reverse breakdown behavior in moderately doped (2-3 x 10(exp 17) cm(exp -3)) small-area 4H- and 6H-SiC pn junction diodes at temperatures ranging from 298 K (25 C) to 873 K (600 C). We propose a mechanism in which carrier emission from un-ionized dopants and deep level defects leads to this unstable behavior. The fundamental instability mechanism is applicable to all wide bandgap semiconductors whose dopants are significantly un-ionized at typical device operating temperatures.

Neudeck, Philip G.↗

Powering the Moon: From Artemis Technology Demonstrations to a Lunar Economy

The National Aeronautics and Space Administration (NASA) is working towards developing and demonstrating new technologies, capabilities, and business approaches that are needed for future human deep space exploration missions. This includes collaborating with commercial and international partners to establish the first long-term presence on the Moon under the Artemis mission. Artemis lunar surface operations begin with robotically exploring the lunar south polar region for locations suitable for harvesting lunar surface resources. Over time, activities will expand beyond robotic operations, increasing the need for highly reliable and available electrical power. Beyond Artemis, there are interests in full commercial lunar surface activities. A lunar microgrid is being proposed to deliver highly reliable and available electrical power on the lunar surface and meet the power needs. Microgrids are of interest in terrestrial applications due to their ability to integrate a variety of renewable power sources. A similar approach can be taken for the lunar surface. A lunar microgrid would offer the ability to integrate various power sources to maximize power availability, including nuclear, solar arrays, batteries, and regenerative fuel cells. Microgrids are flexible and can be designed to allow for islanded operation, where power is utilized near the loads to minimize power distribution losses, or in a power sharing mode where power is transmitted longer distances. This capability is crucial during failures where overall power availability is reduced. Microgrids will also allow for the power system to grow and evolve over time, meeting the need to expand beyond initial lunar surface activities.

Jeffrey Csank↗

Report on phase 1 of the Microprocessor Seminar

Proceedings of a seminar on microprocessors and associated large scale integrated (LSI) circuits are presented. The potential for commonality of device requirements, candidate processes and mechanisms for qualifying candidate LSI technologies for high reliability applications, and specifications for testing and testability were among the topics discussed. Various programs and tentative plans of the participating organizations in the development of high reliability LSI circuits are given.

Source record↗

An assessment of the real-time application capabilities of the SIFT computer system

The real-time capabilities of the SIFT computer system, a highly reliable multicomputer architecture developed to support the flight controls of a relaxed static stability aircraft, are discussed. The SIFT computer system was designed to meet extremely high reliability requirements and to facilitate a formal proof of its correctness. Although SIFT represents a significant achievement in fault-tolerant system research it presents an unusual and restrictive interface to its users. The characteristics of the user interface and its impact on application system design are assessed.

Butler, R. W.↗

Body of Knowledge (BOK) for Leadless Quad Flat No-Lead/Bottom Termination Components (QFN/BTC) Package Trends and Reliability

Bottom terminated components and quad flat no-lead (BTC/QFN) packages have been extensively used by commercial industry for more than a decade. Cost and performance advantages and the closeness of the packages to the boards make them especially unique for radio frequency (RF) applications. A number of high-reliability parts are now available in this style of package configuration. This report presents a summary of literature surveyed and provides a body of knowledge (BOK) gathered on the status of BTC/QFN and their advanced versions of multi-row QFN (MRQFN) packaging technologies. The report provides a comprehensive review of packaging trends and specifications on design, assembly, and reliability. Emphasis is placed on assembly reliability and associated key design and process parameters because they show lower life than standard leaded package assembly under thermal cycling exposures. Inspection of hidden solder joints for assuring quality is challenging and is similar to ball grid arrays (BGAs). Understanding the key BTC/QFN technology trends, applications, processing parameters, workmanship defects, and reliability behavior is important when judicially selecting and narrowing the follow-on packages for evaluation and testing, as well as for the low risk insertion in high-reliability applications.

Ghaffarian, Reza↗

Body of Knowledge (BOK) for Leadless Quad Flat No-Lead/bottom Termination Components (QFN/BTC) Package Trends and Reliability

Bottom terminated components and quad flat no-lead (BTC/QFN) packages have been extensively used by commercial industry for more than a decade. Cost and performance advantages and the closeness of the packages to the boards make them especially unique for radio frequency (RF) applications. A number of high-reliability parts are now available in this style of package configuration. This report presents a summary of literature surveyed and provides a body of knowledge (BOK) gathered on the status of BTC/QFN and their advanced versions of multi-row QFN (MRQFN) packaging technologies. The report provides a comprehensive review of packaging trends and specifications on design, assembly, and reliability. Emphasis is placed on assembly reliability and associated key design and process parameters because they show lower life than standard leaded package assembly under thermal cycling exposures. Inspection of hidden solder joints for assuring quality is challenging and is similar to ball grid arrays (BGAs). Understanding the key BTC/QFN technology trends, applications, processing parameters, workmanship defects, and reliability behavior is important when judicially selecting and narrowing the follow-on packages for evaluation and testing, as well as for the low risk insertion in high-reliability applications.

MLF↗

Conceive, Believe and Achieve; A Path to Miniaturization, COTS Infusion, and Size Weight and Power Realization for Flight

JPL along with other aerospace agencies such as the US Air Force Space Pro-grams and a packaging technology innovator, i3 Electronics, Inc., are evaluating the use of state-of-the-art (SOA) commercial off-the-shelf (COTS) and alternative packaging technologies for future high performance and high reliability space applications. Utilization of SOA COTS technologies have resulted in large scale reduction in electronics volume, weight, power, cost and schedule with outstanding electrical performance and high reliability. We will share JPL’s joint design, architectural approach, alternative substrate materials selection, associated processes, and mission assurance role in identifying reliability and qualification risks, as part of the three year Heterogeneous Packaging/Device Integration effort under the guidance and leadership of JPL’s Mission Assurance Directorate.

Hunter, Don J.↗

2nd & 3rd Generation Vehicle Subsystems

This paper contains viewgraph presentation on the "2nd & 3rd Generation Vehicle Subsystems" project. The objective behind this project is to design, develop and test advanced avionics, power systems, power control and distribution components and subsystems for insertion into a highly reliable and low-cost system for a Reusable Launch Vehicles (RLV). The project is divided into two sections: 3rd Generation Vehicle Subsystems and 2nd Generation Vehicle Subsystems. The following topics are discussed under the first section, 3rd Generation Vehicle Subsystems: supporting the NASA RLV program; high-performance guidance & control adaptation for future RLVs; Evolvable Hardware (EHW) for 3rd generation avionics description; Scaleable, Fault-tolerant Intelligent Network or X(trans)ducers (SFINIX); advance electric actuation devices and subsystem technology; hybrid power sources and regeneration technology for electric actuators; and intelligent internal thermal control. Topics discussed in the 2nd Generation Vehicle Subsystems program include: design, development and test of a robust, low-maintenance avionics with no active cooling requirements and autonomous rendezvous and docking systems; design and development of a low maintenance, high reliability, intelligent power systems (fuel cells and battery); and design of a low cost, low maintenance high horsepower actuation systems (actuators).

Source record↗

Space Radiation Effects and Reliability Consideration for the Proposed Jupiter Europa Orbiter

The proposed Jupiter Europa Orbiter (JEO) mission to explore the Jovian moon Europa poses a number of challenges. The spacecraft must operate for about seven years during the transit time to the vicinity of Jupiter, and then endure unusually high radiation levels during exploration and orbiting phases. The ability to withstand usually high total dose levels is critical for the mission, along with meeting the high reliability standards for flagship NASA missions. Reliability of new microelectronic components must be sufficiently understood to meet overall mission requirements.The proposed Jupiter Europa Orbiter (JEO) mission to explore the Jovian moon Europa poses a number of challenges. The spacecraft must operate for about seven years during the transit time to the vicinity of Jupiter, and then endure unusually high radiation levels during exploration and orbiting phases. The ability to withstand usually high total dose levels is critical for the mission, along with meeting the high reliability standards for flagship NASA missions. Reliability of new microelectronic components must be sufficiently understood to meet overall mission requirements.

semiconductor devices↗

A concatenated coded modulation scheme for error control

A concatenated coded modulation scheme for error control in data communications is presented. The scheme is achieved by concatenating a Reed-Solomon outer code and a bandwidth efficient block inner code for M-ary PSK modulation. Error performance of the scheme is analyzed for an AWGN channel. It is shown that extremely high reliability can be attained by using a simple M-ary PSK modulation inner code and relatively powerful Reed-Solomon outer code. Furthermore, if an inner code of high effective rate is used, the bandwidth expansion required by the scheme due to coding will be greatly reduced. The proposed scheme is particularly effective for high speed satellite communication for large file transfer where high reliability is required. Also presented is a simple method for constructing block codes for M-ary PSK modulation. Some short M-ary PSK codes with good minimum squared Euclidean distance are constructed. These codes have trellis structure and hence can be decoded with a soft decision Viterbi decoding algorithm.

Kasami, Tadao↗

A concatenated coded modulation scheme for error control

A concatenated coded modulation scheme for error control in data communications is presented. The scheme is achieved by concatenating a Reed-Solomon outer code and a bandwidth efficient block inner code for M-ary PSK modulation. Error performance of the scheme is analyzed for an AWGN channel. It is shown that extremely high reliability can be attained by using a simple M-ary PSK modulation inner code and relatively powerful Reed-Solomon outer code. Furthermore, if an inner code of high effective rate is used, the bandwidth expansion required by the scheme due to coding will be greatly reduced. The proposed scheme is particularly effective for high speed satellite communications for large file transfer where high reliability is required. Also presented is a simple method for constructing block codes for M-ary PSK modulation. Some short M-ary PSK codes with good minimum squared Euclidean distance are constructed. These codes have trellis structure and hence can be decoded with a soft-decision Viterbi decoding algorithm.

Kasami, Tadao↗

A concatenated coded modulation scheme for error control

A concatenated coded modulation scheme for error control in data communications is presented. The scheme is achieved by concatenating a Reed-Solomon outer code and a bandwidth efficient block inner code for M-ary PSK modulation. Error performance of the scheme is analyzed for an AWGN channel. It is shown that extremely high reliability can be attained by using a simple M-ary PSK modulation inner code and a relatively powerful Reed-Solomon outer code. Furthermore, if an inner code of high effective rate is used, the bandwidth expansion required by the scheme due to coding will be greatly reduced. The proposed scheme is very effective for high speed satellite communications for large file transfer where high reliability is required. A simple method is also presented for constructing codes for M-ary PSK modulation. Some short M-ary PSK codes with good minimum squared Euclidean distance are constructed. These codes have trellis structure and hence can be decoded with a soft decision Viterbi decoding algorithm. Furthermore, some of these codes are phase invariant under multiples of 45 deg rotation.

Lin, Shu↗

A concatenated coded modulation scheme for error control (addition 2)

A concatenated coded modulation scheme for error control in data communications is described. The scheme is achieved by concatenating a Reed-Solomon outer code and a bandwidth efficient block inner code for M-ary PSK modulation. Error performance of the scheme is analyzed for an AWGN channel. It is shown that extremely high reliability can be attained by using a simple M-ary PSK modulation inner code and a relatively powerful Reed-Solomon outer code. Furthermore, if an inner code of high effective rate is used, the bandwidth expansion required by the scheme due to coding will be greatly reduced. The proposed scheme is particularly effective for high-speed satellite communications for large file transfer where high reliability is required. This paper also presents a simple method for constructing block codes for M-ary PSK modulation. Some short M-ary PSK codes with good minimum squared Euclidean distance are constructed. These codes have trellis structure and hence can be decoded with a soft-decision Viterbi decoding algorithm. Furthermore, some of these codes are phase invariant under multiples of 45 deg rotation.

Lin, Shu↗

New Directions in Space Operations Services in Support of Interplanetary Exploration

To gain access to the necessary operational processes and data in support of NASA's Lunar/Mars Exploration Initiative, new services, adequate levels of computing cycles and access to myriad forms of data must be provided to onboard spacecraft and ground based personnel/systems (earth, lunar and Martian) to enable interplanetary exploration by humans. These systems, cycles and access to vast amounts of development, test and operational data will be required to provide a new level of services not currently available to existing spacecraft, on board crews and other operational personnel. Although current voice, video and data systems in support of current space based operations has been adequate, new highly reliable and autonomous processes and services will be necessary for future space exploration activities. These services will range from the more mundane voice in LEO to voice in interplanetary travel which because of the high latencies will require new voice processes and standards. New services, like component failure predictions based on data mining of significant quantities of data, located at disparate locations, will be required. 3D or holographic representation of onboard components, systems or family members will greatly improve maintenance, operations and service restoration not to mention crew morale. Current operational systems and standards, like the Internet Protocol, will not able to provide the level of service required end to end from an end point on the Martian surface like a scientific instrument to a researcher at a university. Ground operations whether earth, lunar or Martian and in flight operations to the moon and especially to Mars will require significant autonomy that will require access to highly reliable processing capabilities, data storage based on network storage technologies. Significant processing cycles will be needed onboard but could be borrowed from other locations either ground based or onboard other spacecraft. Reliability will be a key factor with onboard and distributed backup processing an absolutely necessary requirement. Current cluster processing/Grid technologies may provide the basis for providing these services. An overview of existing services, future services that will be required and the technologies and standards required to be developed will be presented. The purpose of this paper will be to initiate a technological roadmap, albeit at a high level, of current voice, video, data and network technologies and standards (which show promise for adaptation or evolution) to what technologies and standards need to be redefined, adjusted or areas where new ones require development. The roadmap should begin the differentiation between non manned and manned processes/services where applicable. The paper will be based in part on the activities of the CCSDS Monitor and Control working group which is beginning the process of standardization of the these processes. Another element of the paper will be based on an analysis of current technologies supporting space flight processes and services at JSC, MSFC, GSFC and to a lesser extent at KSC. Work being accomplished in areas such as Grid computing, data mining and network storage at ARC, IBM and the University of Alabama at Huntsville will be researched and analyzed.

Bradford, Robert N.↗