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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 271 records · Page 15

Ceramic Heat Pipe for Thermal Management of a High Frequency Inductor

As the power density of electric machines and power electronics continues to increase to meet the demands of more electric aircraft, the thermal management of these devices becomes increasingly important. Ideally, the thermal management solution of the device should have high thermal conductivity and be electrically insulating so that it can be directly integrated with the device in question. Technical ceramics are a class of materials that meet these two requirements. Direct liquid cooling by submerging electric components in a dielectric fluid is an alternate option, but adds system complexity and may incur pumping loss. In this work, the thermal management solution for a high frequency inductor is presented. A conventional wicked heat pipe is designed that is made from a solid ceramic case with a sintered ceramic wick. This heat pipe can provide structural support for the core and windings and is electrically insulating, so it does not incur any additional eddy current losses from the high frequency magnetic fields. It does not require additional pumping power, because conventional wicked heat pipes are passive devices. In this paper, the manufacturing process of the ceramic heat pipe is also presented. It is shown that the sintering of large diameter spherical ceramic particles is difficult due to their high specific surface area and low surface free energy. To overcome this difficulty, a flux material was used to initiate liquid phase sintering. The results of the sintering trials show that for the 120 μm diameter α-Al2O3powder selected for the wick, the combination of 1650°C sintering temperature and the addition of 5 wt% talc sintered the porous matrix together sufficiently for use as a heat pipe wic

High-frequency Inductor↗

Ceramic Heat Pipe for Thermal Management of a High Frequency Inductor

As the power density of electric machines and power electronics continues to increase to meet the demands of more electric aircraft, the thermal management of these devices becomes increasingly important. Ideally, the thermal management solution of the device should have high thermal conductivity and be electrically insulating so that it can be directly integrated with the device in question. Technical ceramics are a class of materials that meet these two requirements. Direct liquid cooling by submerging electric components in a dielectric fluid is an alternate option, but adds system complexity and may incur pumping loss. In this work, the thermal management solution for a high frequency inductor is presented. A conventional wicked heat pipe is designed that is made from a solid ceramic case with a sintered ceramic wick. This heat pipe can provide structural support for the core and windings and is electrically insulating, so it does not incur any additional eddy current losses from the high frequency magnetic fields. It does not require additional pumping power, because conventional wicked heat pipes are passive devices. In this paper, the manufacturing process of the ceramic heat pipe is also presented. It is shown that the sintering of large diameter spherical ceramic particles is difficult due to their high specific surface area and low surface free energy. To overcome this difficulty, a flux material was used to initiate liquid phase sintering. The results of the sintering trials show that for the 120 μm diameter α-Al2O3 powder selected for the wick, the combination of 1650°C sintering temperature and the addition of 5 wt% talc sintered the porous matrix together sufficiently for use as a heat pipe wick.

High frequency inductor↗

Innovative Technology Transfer Partnerships

The National Aeronautics and Space Administration (NASA) seeks to license its Advanced Tire and Strut Pressure Monitor (TSPM) technology. The TSPM is a handheld system to accurately measure tire and strut pressure and temperature over a wide temperature range (20 to 120 OF), as well as improve personnel safety. Sensor accuracy, electronics design, and a simple user interface allow operators quick, easy access to required measurements. The handheld electronics, powered by 12-VAC or by 9-VDC batteries, provide the user with an easy-to-read visual display of pressure/temperature or the streaming of pressure/temperature data via an RS-232 interface. When connected to a laptop computer, this new measurement system can provide users with automated data recording and trending, eliminating the chance for data hand-recording errors. In addition, calibration software allows for calibration data to be automatically utilized for the generation of new data conversion equations, simplifying the calibration processes that are so critical to reliable measurements. The design places a high-accuracy pressure sensor (also used as a temperature sensor) as close to the tire or strut measurement location as possible, allowing the user to make accurate measurements rapidly, minimizing the amount of high-pressure volumes, and allowing reasonable distance between the tire or strut and the operator. The pressure sensor attaches directly to the pressure supply/relief valve on the tire and/or strut, with necessary electronics contained in the handheld enclosure. A software algorithm ensures high accuracy of the device over the wide temperature range. Using the pressure sensor as a temperature sensor permits measurement of the actual temperature of the pressurized gas. This device can be adapted to create a portable calibration standard that does not require thermal conditioning. This allows accurate pressure measurements without disturbing the gas temperature. In-place calibration can save considerable time and money and is suitable in many process applications throughout industry.

Kohler, Jeff↗

Non-Micropipe Dislocations in 4H-SiC Devices: Electrical Properties and Device Technology Implications

It is well-known that SiC wafer quality deficiencies are delaying the realization of outstandingly superior 4H-SiC power electronics. While efforts to date have centered on eradicating micropipes (i.e., hollow core super-screw dislocations with Burgers vectors greater than or equal to 2c), 4H-SiC wafers and epilayers also contain elementary screw dislocations (i.e., Burgers vector = 1c with no hollow core) in densities on the order of thousands per sq cm, nearly 100-fold micropipe densities. While not nearly as detrimental to SiC device performance as micropipes, it has recently been demonstrated that elementary screw dislocations somewhat degrade the reverse leakage and breakdown properties of 4H-SiC p(+)n diodes. Diodes containing elementary screw dislocations exhibited a 5% to 35% reduction in breakdown voltage, higher pre-breakdown reverse leakage current, softer reverse breakdown I-V knee, and microplasmic breakdown current filaments that were non-catastrophic as measured under high series resistance biasing. This paper details continuing experimental and theoretical investigations into the electrical properties of 4H-SiC elementary screw dislocations. The nonuniform breakdown behavior of 4H-SiC p'n junctions containing elementary screw dislocations exhibits interesting physical parallels with nonuniform breakdown phenomena previously observed in other semiconductor materials. Based upon experimentally observed dislocation-assisted breakdown, a re-assessment of well-known physical models relating power device reliability to junction breakdown has been undertaken for 4H-SiC. The potential impact of these elementary screw dislocation defects on the performance and reliability of various 4H-SiC device technologies being developed for high-power applications will be discussed.

Neudeck, Philip G.↗

Integration Tests of the 4 kW-class High Voltage Hall Accelerator Power Processing Unit with the HiVHAc and the SPT-140 Hall Effect Thrusters

NASAs Science Mission Directorate is sponsoring the development of a 4 kW-class Hall propulsion system for implementation in NASA science and exploration missions. The main components of the system include the High Voltage Hall Accelerator (HiVHAc), an engineering model power processing unit (PPU) developed by Colorado Power Electronics, and a xenon flow control module (XFCM) developed by VACCO Industries. NASA Glenn Research Center is performing integrated tests of the Hall thruster propulsion system. This presentation presents results from integrated tests of the PPU and XFCM with the HiVHAc engineering development thruster and a SPT-140 thruster provided by Space System Loral. The results presented in this paper demonstrate thruster discharge initiation, open-loop and closed-loop control of the discharge current with anode flow for both the HiVHAc and the SPT-140 thrusters. Integrated tests with the SPT-140 thruster indicated that the PPU was able to repeatedly initiate the thrusters discharge, achieve steady state operation, and successfully throttle the thruster between 1.5 and 4.5 kW. The measured SPT-140 performance was identical to levels reported by Space Systems Loral.

Hall Thrusters↗

Integration Tests of the 4 kW-Class High Voltage Hall Accelerator Power Processing Unit with the HiVHAc and the SPT-140 Hall Effect Thrusters

NASA's Science Mission Directorate is sponsoring the development of a 4 kW-class Hall propulsion system for implementation in NASA science and exploration missions. The main components of the system include the High Voltage Hall Accelerator (HiVHAc), an engineering model power processing unit (PPU) developed by Colorado Power Electronics, and a xenon flow control module (XFCM) developed by VACCO Industries. NASA Glenn Research Center is performing integrated tests of the Hall thruster propulsion system. This paper presents results from integrated tests of the PPU and XFCM with the HiVHAc engineering development thruster and a SPT-140 thruster provided by Space System Loral. The results presented in this paper demonstrate thruster discharge initiation along with open-loop and closed-loop control of the discharge current with anode flow for both the HiVHAc and the SPT-140 thrusters. Integrated tests with the SPT-140 thruster indicated that the PPU was able to repeatedly initiate the thruster's discharge, achieve steady state operation, and successfully throttle the thruster between 1.5 and 4.5 kW. The measured SPT-140 performance was identical to levels reported by Space Systems Loral.

Power Processing Unit↗

Breakdown Degradation Associated with Elementary Screw Dislocations in 4H-SiC P(+)N Junction Rectifiers

It is well-known that SiC wafer quality deficiencies are delaying the realization of outstandingly superior 4H-SiC power electronics. While efforts to date have centered on eradicating micropipes (i.e., hollow core super-screw dislocations with Burgers vector greater than 2c), 4H-SiC wafers and epilayers also contain elementary screw dislocations (i.e., Burgers vector = lc with no hollow core) in densities on the order of thousands per sq cm, nearly 100-fold micropipe densities. This paper describes an initial study into the impact of elementary screw dislocations on the reverse-bias current-voltage (I-V) characteristics of 4H-SiC p(+)n diodes. First, Synchrotron White Beam X-ray Topography (SWBXT) was employed to map the exact locations of elementary screw dislocations within small-area 4H-SiC p(+)n mesa diodes. Then the high-field reverse leakage and breakdown properties of these diodes were subsequently characterized on a probing station outfitted with a dark box and video camera. Most devices without screw dislocations exhibited excellent characteristics, with no detectable leakage current prior to breakdown, a sharp breakdown I-V knee, and no visible concentration of breakdown current. In contrast devices that contained at least one elementary screw dislocation exhibited a 5% to 35% reduction in breakdown voltage, a softer breakdown I-V knee, and visible microplasmas in which highly localized breakdown current was concentrated. The locations of observed breakdown microplasmas corresponded exactly to the locations of elementary screw dislocations identified by SWBXT mapping. While not as detrimental to SiC device performance as micropipes, the undesirable breakdown characteristics of elementary screw dislocations could nevertheless adversely affect the performance and reliability of 4H-SiC power devices.

Neudeck, P. G.↗

Diaphragm Pump With Resonant Piezoelectric Drive

A diaphragm pump driven by a piezoelectric actuator is undergoing development. This pump is intended to be a prototype of lightweight, highly reliable pumps for circulating cooling liquids in protective garments and high-power electronic circuits, and perhaps for some medical applications. The pump would be highly reliable because it would contain no sliding seals or bearings that could wear, the only parts subject to wear would be two check valves, and the diaphragm and other flexing parts could be designed, by use of proven methods, for extremely long life. Because the pump would be capable of a large volumetric flow rate and would have only a small dead volume, its operation would not be disrupted by ingestion of gas, and it could be started reliably under all conditions. The prior art includes a number piezoelectrically actuated diaphragm pumps. Because of the smallness of the motions of piezoelectric actuators (typical maximum strains only about 0.001), the volumetric flow rates of those pumps are much too small for typical cooling applications. In the pump now undergoing development, mechanical resonance would be utilized to amplify the motion generated by the piezoelectric actuator and thereby multiply the volumetric flow rate. The prime mover in this pump would be a stack of piezoelectric ceramic actuators, one end of which would be connected to a spring that would be part of a spring-and-mass resonator structure. The mass part of the resonator structure would include the pump diaphragm (see Figure 1). Contraction of the spring would draw the diaphragm to the left, causing the volume of the fluid chamber to increase and thereby causing fluid to flow into the chamber. Subsequent expansion of the spring would push the diaphragm to the right, causing the volume of the fluid chamber to decrease, and thereby expelling fluid from the chamber. The fluid would enter and leave the chamber through check valves. The piezoelectric stack would be driven electrically to make it oscillate at the resonance frequency of the spring and- mass structure. This frequency could be made high enough (of the order of 400 Hz) that the masses of all components could be made conveniently small. The resonance would amplify the relatively small motion of the piezoelectric stack (a stroke of the order of 10 m) to a diaphragm stroke of the order of 0.5 mm. The exact amplification factor would depend on the rate of damping of oscillations; this, in turn, would depend on details of design and operation, including (but not limited to) the desired pressure rise and volumetric flow rate. In order to obtain resonance with large displacement, the damping rate must be low enough that the energy imparted to the pumped fluid on each stroke is much less than the kinetic and potential energy exchanged between the mass and spring during each cycle of oscillation. To minimize the power demand of the pump, a highly efficient drive circuit would be used to excite the piezoelectric stack. This circuit (see Figure 2) would amount to a special-purpose regenerative, switching power supply that would operate in a power-source mode during the part of an oscillation cycle when the excitation waveform was positive and in a power-recovery mode during the part of the cycle when the excitation waveform was negative. The circuit would include a voltage-boosting dc-to-dc converter that would convert between a supply potential of 24 Vdc and the high voltage needed to drive the piezoelectric stack. Because of the power-recovery feature, the circuit would consume little power. It should be possible to build the circuit as a compact unit, using readily available components.

Izenson, Michael G.↗

Thermal testing of the Ranger Block III SPACECRAFT in the JPL 25 ft. space simulator

In January, 1964, a test program was begun on the thermal design of the Ranger Block III Spacecraft. The tests were performed i n the newly operational JPL 25' Space Simulator over a period of 6 months . The objectives of these tests were two-fold: A. To evaluate the 25' Space Simulator as a facility for proving the thermal design of spacecrafts, and B. To verify .the thermal design of the Ranger Block III spacecraft. These two objectives are complimentary in the test series performed and are difficult to separate into distinct categories. An important part of the first objective was to learn what type of test preparation, instrumentation, and analysis was required for the meaningful evaluation of test data from the 25' Space Simulator tests. Although some experience had been gained in testing of components and incomplete spacecrafts in smaller solar simulation chambers during the early part of the Ranger program, we knew little about testing of a complete spacecraft in the 25' Space Simulator when this test program began. Test analysis requires that the energy absorbed by various spacecraft components be known. This requires a knowledge of the area of solar absorption or sunlit area, the solar energy flux density on the area, and the effective absorptance of that area. Most of the problems encountered were associated with the determination of the last two quantities since the sunlit area may be obtained directly by inspection of spacecraft surfaces. This paper will present a discussion of our experiences during the Ranger Block III thermal test series on the Thermal Test Model (TCM). The TCM was thermally equivalent to the flight type Ranger spacecraft except for the lack of an antenna dish and solar panels. Flight type structural hardware was used with surface finishes equivalent to those of the flight spacecraft. Aluminum blocks simulated the spacecraft electronics thermal masses with resistance heaters simulating the electronic power dissipation. The discussion will be presented in a semi-chronological order and will be divided into the following areas: 1. Determination of solar simulation flux density on spacecraft surfaces. 2. Problems related to decollimation of the solar simulation source. 3. Determination of effective absorptance in the solar simulation spectrum.

SPACE SIMULATOR↗

Water-filled heat pipe useful at moderate temperatures

Heat pipe is used in the primary heat exchanger for nuclear power plants, as a heat sink for high-power electronic devices, and in a closed-cycle heat rejection mechanism for cryogenic storage tanks. It serves simultaneously as a heat transfer device and as a structural member.

Mc Kinney, B. G.↗

Optical computing.

Applications of the optical computer include an approach for increasing the sharpness of images obtained from the most powerful electron microscopes and fingerprint/credit card identification. The information-handling capability of the various optical computing processes is very great. Modern synthetic-aperture radars scan upward of 100,000 resolvable elements per second. Fields which have assumed major importance on the basis of optical computing principles are optical image deblurring, coherent side-looking synthetic-aperture radar, and correlative pattern recognition. Some examples of the most dramatic image deblurring results are shown.

Stroke, G. W.↗

The Atmosphere Explorer power subsystem

The present work describes the design and in-flight performance of the power subsystem for the first three Atmosphere Explorer (AE) spacecraft. The subsystem provides all electrical power to the spacecraft loads and consists of a solar array, three batteries, and a power supply electronics unit. Power from the solar array is supplied to the spacecraft loads through an unregulated power bus, which varies between -26 and -38 V. Loads which are normally on only during data collection phases of an orbit are fed from a tightly regulated -24.5 V bus. Power subsystem performance during the first three months in orbit has been nominal, except for an anomally in the shunt limiter protection circuitry. A malfunctioning shunt control amplifier was reconnected via ground command.

Obenschain, A.↗

Evolution of the 1-mlb mercury ion thruster subsystem

The developmental history, performance, and major lifetests of each component of the present 1-mlb (4.5 mN) thruster system are traced over the past 10 years. The 1-mlb thruster subsystem consists of an 8 cm diameter ion thruster mounted on 2 axis gimbals, a mercury propellant tank, a power electronics unit, a controller/digital interface unit, and necessary electrical harnesses plus propellant tankage and feed lines.

Kerslake, W. R.↗

A view toward future fluid dynamics computing

Advances in computational fluid dynamics are paced by simulation methodology and computer resources. Examples of three-dimensional fluid dynamic simulations are presented to illustrate recent developments in equation modeling and numerical methods and to point out the need for increased computer power. Electronic technology dictates that to fill this need, computers will be based on parallel processing principles. The identification of parallelism in three dimensions is illustrated by examining an implicit, approximate-factorization approach to the Navier-Stokes equations. Finally, two computer concepts aimed at satisfying the demands of the three-dimensional Reynolds averaged Navier-Stokes simulations are discussed.

Bailey, F. R.↗

Electromechanical flight control actuator

The feasibility of using an electromechanical actuator (EMA) as the primary flight control equipment in aerospace flight is examined. The EMA motor design is presented utilizing improved permanent magnet materials. The necessary equipment to complete a single channel EMA using the single channel power electronics breadboard is reported. The design and development of an improved rotor position sensor/tachometer is investigated.

Source record↗

Conductive surge testing of circuits and systems

Techniques are given for conductive surge testing of powered electronic equipment. The correct definitions of common and normal mode are presented. Testing requires not only spike-surge generators with a suitable range of open-circuit voltage and short-circuit current waveshapes, but also appropriate means, termed couplers, for connecting test surges to the equipment under test. Key among coupler design considerations is minimization of fail positives resulting from reduction in delivered surge energy due to the coupler. Back-filters and the lines on which they are necessary, are considered as well as ground-fault and ground potential rise. A method for monitoring delivered and resulting surge waves is mentioned.

Richman, P.↗