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At least 289 records · Page 16

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NASA NTRS1983

On the nature of the bonding in Cu2 - An ab initio viewpoint

The bonding in Cu2 has been calculatively investigated. A CASSCF calculation is performed where the two 4s electrons are distributed in all possible ways among the 4s and 4p orbitals. The CAS results have a 3d population of 9.99. The corresponding orbitals between the CAS core orbitals at r(e) and the atomic SCF core orbitals show an overlap of 13.9992 out of a possible 14, with all of the change in sigma space. Thus, the CAS results show virtually no change in the d orbitals relative to the atom and can be considered as showing only a single bond. The reduction in 3d population, the decrease in r(e), and the increase in D(e) upon correlating the 3d shell indicates that the 3d electrons are slightly involved in the bonding, but there is no indication of the formation of a triple bond.

Bauschlicher, C. W., Jr.↗

NASA NTRS1985

Rapid Adhesive Bonding for Metals and Composites

Toroidal induction heater is key element in rapid bonding technique. Rapid adhesive bonding equipment features toroid induction heater for quick bonding of composites and metals. Process avoids damaging composites that cannot withstand high temperatures for long time intervals. Process scaled up for production. Technique suited to bonding of end tabs onto material test specimens.

Stein, B. A.↗

NASA NTRS1984

Effect of preforming adherends on static and fatigue strength of bonded composite single-lap joints

An analytical and experimental investigation was conducted on bonded composite single-lap joints with the adherends performed to reduce the angle between the line of action of the applied in-plane force and the bondline. A classical closed-form solution was used to analyze the composite joints with various preform angles and overlap lengths. The adherends of the test specimens were preformed before bonding, during the layup and curing process. Static tests were conducted for preform angles of 0, 5, 10, and 15 deg and overlap lengths of 0.75, 1.75, 2.75, and 3.75 in. A limited fatigue study was conducted for specimens with a 2.75-in. overlap and a preform angle of 5 deg. Results of the analysis showed that preforming the adherends of bonded composite single-lap joints significantly reduced the shear and peel stress concentrations in the adhesive. Experimental results showed that preforming the adherends significantly increased their static and fatigue strength and thus increased the load level for which bonded composite single-lap joints can be designed.

Sawyer, J. W.↗

NASA NTRS1984

Influence of aluminum oxide film on thermocompression bonding of gold wire to evaporated aluminum film

The influence of Al surface condition on the thermocompression bonding of Au wires to Al electrodes for integrated electric circuits was studied. Au wires were connected to Al electrodes by nail-head bonding after various Al surface treatments. Bonding was evaluated by measuring the wire pull strength and fraction of the number of failures at Au-Al bonds to the total number of failures. Dependence of the fraction on applied load was derived theoretically with a parameter named critical load to take into consideration the differences in Al surface condition. The relation also held explicately for various surface treatments. Characterization of the Al surface was carried out by electron microscopy for chemical analysis.

Iwata, S.↗

NASA NTRS1985

Characterization of mode 1 and mixed-mode failure of adhesive bonds between composite adherends

A combined experimental and analytical investigation of an adhesively bonded composite joint was conducted to characterize both the static and fatigue beyond growth mechanism under mode 1 and mixed-mode 1 and 2 loadings. Two bonded systems were studied: graphite/epoxy adherends bonded with EC 3445 and FM-300 adhesives. For each bonded system, two specimen types were tested: a double-cantilever-beam specimen for mode 1 loading and a cracked-lapshear specimen for mixed-mode 1 and 2 loading. In all specimens tested, failure occurred in the form of debond growth. Debonding always occurred in a cohesive manner with EC 3445 adhesive. The FM-300 adhesive debonded in a cohesive manner under mixed-mode 1 and 2 loading, but in a cohesive, adhesive, or combined cohesive and adhesive manner under mode 1 loading. Total strain-energy release rate appeared to be the driving parameter for debond growth under static and fatigue loadings.

Mall, S.↗

NASA NTRS1985

On the similarity of the bonding in NiS and NiO

The bonding in NiS is found to be quite similar to that in NiO, having an ionic contribution arising from the donation of the Ni 4s electron to the S atom and a covalent component arising from bonds between the Ni 3d and the S 3p. The one-electron d bonds are found to be of equal strength for NiO and NiS, but the two-electron d bonds are weaker for NiS.

Bauschlicher, C. W., Jr.↗

NASA NTRS1986

Criterion for mixed mode fracture in composite bonded joints

A study was undertaken to characterize the debond growth mechanism of adhesively bonded composite joints under mode I, mixed mode I-II, and mode II static loadings. The bonded system consisted of graphite-epoxy composite adherends bonded with a toughened epoxy adhesive. The mode I, mode II and mixed mode I-II fracture energies of the tested adhesives were found to be equal to each other. The criterion for mixed mode fracture in composite bonded joints was found.

Mall, S.↗

NASA NTRS1986

Transition metal-ligand bonding. II

The nature of the bonding of CO, H2O, and NH3 to transition metal atoms is analyzed using the constrained-space-orbital-variation (CSOV) technique. The cooperative effects for Ni(CO)2 are found to be different than those for Ni(H2O)2. The bonding between neutral systems and the positive ions is found to be quite different; NiCO(+) has little pi bonding, while NiCO has strong pi bonding. The positive ion of NiH2O is far more strongly bound than the neutral, while for NiCO the positive ion and neutral are bound by about the same energy.

Bauschlicher, C. W., Jr.↗

NASA NTRS1986

On the bonding in Fe2(CO)9

The present paper is concerned with an analysis of the bonding in Fe2(CO)9, taking into account the results of self-consistent-field (SCF) calculations. The basis sets used are the same as those employed in the study of Fe(CO)5 conducted by Bauschlicher and Bagus (1985). The Fe basis set starts with the 14s9p5d primitive set optimized by Wachters (1970), which is contracted to 8s4p5d. An SCF wave function, consisting of only the core electrons, was determined, and then electrons were slowly added to the virtual orbitals with the lowest eigenvalues. The conducted calculations show no direct Fe-Fe bonding, but rather bonding resulting from the bridging CO's. The bonding is found to involve both the 5 sigma and 2 pi(asterisk) orbitals of the bridging CO's.

Bauschlicher, C. W., Jr.↗

NASA NTRS1986

Characterization of mode I and mixed-mode failure of adhesive bonds between composite adherends

Mall, S.↗

NASA NTRS1986

Advanced thermal barrier system bond coatings for use on nickel-, cobalt- and iron-base alloy substrates

New and improved Ni-, Co-, and Fe-base bond coatings have been identified for the ZrO2-Y2O3 thermal barrier coatings to be used on Ni-, Co-, and Fe-base alloy substrates. These bond coatings were evaluated in a cyclic furnace between 1120 and 1175 C. It was found that MCrAlYb (where M = Ni, Co, or Fe) bond coating thermal barrier systems have significantly longer lives than MCrAlY bond coating thermal barrier systems. The longest life was obtained with the FeCrAlYb thermal barrier system followed by NiCrAlYb and CoCrAlYb thermal barrier systems in that order.

Stecura, S.↗

NASA NTRS1986

Criterion for mixed mode fracture in composite bonded joints

A study was undertaken to characterize the debond growth mechanism of adhesively bonded composite joints under mode I, mixed mode I-II, and mode II static loadings. The bonded system consisted of graphite/epoxy (T300/5208) composite adherends bonded with a toughened epoxy (EC 3445) adhesive. The mode I, mode II and mixed-mode I-II fracture energies of the tested adhesive were found to be equal to each other. Furthermore, the criterion for mixed mode fracture in composite bonded joints was determined.

Mall, S.↗

NASA NTRS1988

Fibre-matrix bond strength studies of glass, ceramic, and metal matrix composites

An indentation test technique for compressively loading the ends of individual fibers to produce debonding has been applied to metal, glass, and glass-ceramic matrix composites; bond strength values at debond initiation are calculated using a finite-element model. Results are correlated with composite longitudinal and interlaminar shear behavior for carbon and Nicalon fiber-reinforced glasses and glass-ceramics including the effects of matrix modifications, processing conditions, and high-temperature oxidation embrittlement. The data indicate that significant bonding to improve off-axis and shear properties can be tolerated before the longitudinal behavior becomes brittle. Residual stress and other mechanical bonding effects are important, but improved analyses and multiaxial interfacial failure criteria are needed to adequately interpret bond strength data in terms of composite performance.

Grande, D. H.↗

NASA NTRS1989

Strength of hot isostatically pressed and sintered reaction bonded silicon nitrides containing Y2O3

The hot isostatic pressing of reaction bonded Si3N4 containing Y2O3 produced specimens with greater room temperature strengths than those by high pressure nitrogen sintering of the same material. Average room temperature bend strengths for hot isostatically pressed reaction bonded silicon nitride and high pressure nitrogen sintered reaction bonded silicon nitride were 767 and 670 MPa, respectively. Values of 472 and 495 MPa were observed at 1370 C. For specimens of similar but lower Y2O3 content produced from Si3N4 powder using the same high pressure nitrogen sintering conditions, the room temperature strength was 664 MPa and the 1370 C strength was 402 MPa. The greater strengths of the reaction bonded silicon nitride materials in comparison to the sintered silicon nitride powder material are attributed to the combined effect of processing method and higher Y2O3 content.

William A Sanders↗

NASA NTRS1988

Adhesively bonded joints: Testing, analysis, and design; Proceedings of the International Symposium, Baltimore, MD, Sept. 10-12, 1986

The papers contained in this volume provide an overview of the state of the art of testing, analysis, and design of adhesively bonded joints. The papers are grouped in the following sections: mechanical testing, stress analysis, failure mechanisms, and design and durability. Specific topics discussed include determination and verification of elastic parameters for adhesives; factors influencing elastic stresses in double cantilever beam specimens; special mixed finite elements for interfacial stress analysis of adhesively bonded joints; debonding characteristics of adhesively bonded woven Kevlar composites; and environmental durability of adhesively bonded joints.

Johnson, W. S.↗

NASA NTRS1988

Debonding characteristics of adhesively bonded woven Kevlar composites

The fatigue damage mechanism of an adhesively bonded joint between fabric reinforced composite adherends was investigated with cracked-lap-shear specimens. Two bonded systems were studied: fabric Kevlar 49/5208 epoxy adherends bonded together with either EC 3445 or FM-300 adhesive. For each bonded system, two specimen geometries were tested. In all specimens tested, fatigue damage occurred in the form of cyclic debonding; however, the woven Kevlar specimens gave significantly slower debond growth rates and higher fracture toughness than previously found in the nonwoven adherend specimens. The surfaces for the woven adherends were not smooth; rather, they had regular crests (high spots) and troughs (low spots) due to the weave pattern. Radiographs of the specimens and examination of their failure surfaces revealed that fiber bridging occurred between the crests of the two adherends in the debonded region. The observed improvements in debond growth resistance and static fracture toughness are attributed to this bridging.

Mall, S.↗

NASA NTRS1989

Superplastic forming and diffusion bonding of rapidly solidified, dispersion strengthened aluminum alloys for elevated temperature structural applications

Rapidly solidified alloys, based upon the Al-Fe-V-Si system and designed for elevated temperature applications, were evaluated for superplasticity and diffusion bonding behavior. Alloys with 8, 16, 27, and 36 volume percent silicide dispersoids were produced; dispersoid condition was varied by rolling at 300, 400, and 500 C (572, 752, and 932 F). Superplastic behavior was evaluated at strain rates from 1 x 10(exp -6)/s to 8.5/s at elevated temperatures. The results indicate that there was a significant increase in elongation at higher strain rates and at temperatures above 600 C (1112 F). However, the exposure of the alloys to temperatures greater than 600 C (1112 F) resulted in the coarsening of the strengthening dispersoid and the degradation of mechanical properties. Diffusion bonding was possible using low gas pressure at temperatures greater than 600 C (1112 F) which also resulted in degraded properties. The bonding of Al-Fe-V-Si alloys to 7475 aluminum alloy was performed at 516 C (960 F) without significant degradation in microstructure. Bond strengths equal to 90 percent that of the base metal shear strength were achieved. The mechanical properties and microstructural characteristics of the alloys were investigated.

Ting, E. Y.↗

NASA NTRS1989

NDE of adhesive bonds and bondlines; Proceedings of the 1989 ASNT Fall Conference, Valley Forge, PA, Oct. 9-13, 1989

The conference presents papers on the Solid Propulsion Integrity Program, the NDE methodology of adhesive bond strength determination, and an interface layer model for ultrasonic inspection of adhesive bonds. Also considered are pulse/echo ultrasonic methods for inspecting bondlines, ultrasonic detection of kissing bonds in adhesive joints, and the NDE needs and requirements for SRM bondline inspection. Thermographic stress analysis of bonded joints is discussed as well as the filmless and real-time applications of holography.

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