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At least 289 records · Page 16

Effects of yttrium, aluminum, and chromium concentrations in bond coatings on the performance of zirconia-yttria thermal barriers

A cyclic furnace study was conducted between 990 - 280 C and 1095 - 280 C to evaluate the effects of yttrium, chromium, and aluminum concentrations in nickel base alloy bond coatings and also the effect of the bond coating thickness on the performance of yttria-stabilized zirconia thermal barrier coatings. The presence and the concentration of yttrium is very critical. Without yttrium, rapid oxidation of Ni-Al, Ni-Cr, and Ni-Cr-Al bond coatings causes zirconia thermal barrier coatings to fail very rapidly. Concentrations of chrominum and aluminum in Ni-Cr-Al-Y bond coating have a very significant effect on the thermal barrier coating life. This effect, however, is not as great as that due to yttrium. Furthermore, the thickness and the thickness uniformity also have a very significant effect on the life of the thermal barrier system.

Stecura, S.↗

The Structure and Properties of Diffusion Assisted Bonded Joints in 17-4 PH, Type 347, 15-5 PH and Nitronic 40 Stainless Steels

Diffusion assisted bonds are formed in 17-4 PH, 15-5 PH, type 347 and Nitronic 40 stainless steels using electrodeposited copper as the bonding agent. The bonds are analyzed by conventional metallographic, electron microprobe analysis, and scanning electron microscopic techniques as well as Charpy V-notch impact tests at temperatures of 77 and 300 K. Results are discussed in terms of a postulated model for the bonding process.

Wigley, D. A.↗

Screening of high temperature adhesives for large area bonding

High temperature-resistant adhesive systems were screened for processability, mechanical and physical properties, operational capability at 589 K (600 F), and the ability to produce large area bonds of high quality in fabricating Space Shuttle components. The adhesives consisted primarily of polyimide systems, including FM34B-18, NR-150B2 (DuPont), PMR-15, LARC-13, LARC-160, Thermid 600, and AI-1130L (AMOCA). The processing studies included preparation of polyimide resins, fabrication of film adhesives, development of lay-up and cure procedures, fabrication of honeycomb sandwich panels, and fabrication of mid-plane bonded panels in joints up to 30.5 cm (12 in.) wide. The screening program included tests for tack and drape properties, reticulation and filleting characteristics, ability to produce void-free or low porosity bonds in mid-plane bonded panels, out-time stability, lap shear strength, climbing drum peel strength, and glass transition temperature (Tg). This paper describes the processing methods developed and the test results.

Stenersen, A. A.↗

Calculation of activation energies for hydrogen-atom abstractions by radicals containing carbon triple bonds

Activation energies are calculated by the bond-energy-bond-order (BEBO) and the bond-strength-bond-length (BSBL) methods for the reactions of C2H radicals with H2, CH4, and C2H6 and for the reactions of CN radicals with H2 and CH4. The BSBL technique accurately predicts the activation energies for these reactions while the BEBO method yields energies averaging 9 kcal higher than those observed. A possible reason for the disagreement is considered.

Brown, R. L.↗

Cyclic debonding of adhesively bonded composites

The fatigue behavior of a simple composite to composite bonded joint was analyzed. The cracked lap shear specimen subjected to constant amplitude cyclic loading was studied. Two specimen geometries were tested for each bonded system: (1) a strap adherend of 16 plies bonded to a lap adherend of 8 plies; and (2) a strap adherend of 8 plies bonded to a lap adherend of 16 plies. In all specimens the fatigue failure was in the form of cyclic debonding with some 0 deg fiber pull off from the strap adherend. The debond always grew in the region of adhesive that had the highest mode (peel) loading and that region was close to the adhesive strap interface.

Mall, S.↗

On the nature of the bonding in Cu2 - An ab initio viewpoint

The bonding in Cu2 has been calculatively investigated. A CASSCF calculation is performed where the two 4s electrons are distributed in all possible ways among the 4s and 4p orbitals. The CAS results have a 3d population of 9.99. The corresponding orbitals between the CAS core orbitals at r(e) and the atomic SCF core orbitals show an overlap of 13.9992 out of a possible 14, with all of the change in sigma space. Thus, the CAS results show virtually no change in the d orbitals relative to the atom and can be considered as showing only a single bond. The reduction in 3d population, the decrease in r(e), and the increase in D(e) upon correlating the 3d shell indicates that the 3d electrons are slightly involved in the bonding, but there is no indication of the formation of a triple bond.

Bauschlicher, C. W., Jr.↗

Rapid Adhesive Bonding for Metals and Composites

Toroidal induction heater is key element in rapid bonding technique. Rapid adhesive bonding equipment features toroid induction heater for quick bonding of composites and metals. Process avoids damaging composites that cannot withstand high temperatures for long time intervals. Process scaled up for production. Technique suited to bonding of end tabs onto material test specimens.

Stein, B. A.↗

Effect of preforming adherends on static and fatigue strength of bonded composite single-lap joints

An analytical and experimental investigation was conducted on bonded composite single-lap joints with the adherends performed to reduce the angle between the line of action of the applied in-plane force and the bondline. A classical closed-form solution was used to analyze the composite joints with various preform angles and overlap lengths. The adherends of the test specimens were preformed before bonding, during the layup and curing process. Static tests were conducted for preform angles of 0, 5, 10, and 15 deg and overlap lengths of 0.75, 1.75, 2.75, and 3.75 in. A limited fatigue study was conducted for specimens with a 2.75-in. overlap and a preform angle of 5 deg. Results of the analysis showed that preforming the adherends of bonded composite single-lap joints significantly reduced the shear and peel stress concentrations in the adhesive. Experimental results showed that preforming the adherends significantly increased their static and fatigue strength and thus increased the load level for which bonded composite single-lap joints can be designed.

Sawyer, J. W.↗

Influence of aluminum oxide film on thermocompression bonding of gold wire to evaporated aluminum film

The influence of Al surface condition on the thermocompression bonding of Au wires to Al electrodes for integrated electric circuits was studied. Au wires were connected to Al electrodes by nail-head bonding after various Al surface treatments. Bonding was evaluated by measuring the wire pull strength and fraction of the number of failures at Au-Al bonds to the total number of failures. Dependence of the fraction on applied load was derived theoretically with a parameter named critical load to take into consideration the differences in Al surface condition. The relation also held explicately for various surface treatments. Characterization of the Al surface was carried out by electron microscopy for chemical analysis.

Iwata, S.↗

Characterization of mode 1 and mixed-mode failure of adhesive bonds between composite adherends

A combined experimental and analytical investigation of an adhesively bonded composite joint was conducted to characterize both the static and fatigue beyond growth mechanism under mode 1 and mixed-mode 1 and 2 loadings. Two bonded systems were studied: graphite/epoxy adherends bonded with EC 3445 and FM-300 adhesives. For each bonded system, two specimen types were tested: a double-cantilever-beam specimen for mode 1 loading and a cracked-lapshear specimen for mixed-mode 1 and 2 loading. In all specimens tested, failure occurred in the form of debond growth. Debonding always occurred in a cohesive manner with EC 3445 adhesive. The FM-300 adhesive debonded in a cohesive manner under mixed-mode 1 and 2 loading, but in a cohesive, adhesive, or combined cohesive and adhesive manner under mode 1 loading. Total strain-energy release rate appeared to be the driving parameter for debond growth under static and fatigue loadings.

Mall, S.↗

On the similarity of the bonding in NiS and NiO

The bonding in NiS is found to be quite similar to that in NiO, having an ionic contribution arising from the donation of the Ni 4s electron to the S atom and a covalent component arising from bonds between the Ni 3d and the S 3p. The one-electron d bonds are found to be of equal strength for NiO and NiS, but the two-electron d bonds are weaker for NiS.

Bauschlicher, C. W., Jr.↗

Criterion for mixed mode fracture in composite bonded joints

A study was undertaken to characterize the debond growth mechanism of adhesively bonded composite joints under mode I, mixed mode I-II, and mode II static loadings. The bonded system consisted of graphite-epoxy composite adherends bonded with a toughened epoxy adhesive. The mode I, mode II and mixed mode I-II fracture energies of the tested adhesives were found to be equal to each other. The criterion for mixed mode fracture in composite bonded joints was found.

Mall, S.↗

Transition metal-ligand bonding. II

The nature of the bonding of CO, H2O, and NH3 to transition metal atoms is analyzed using the constrained-space-orbital-variation (CSOV) technique. The cooperative effects for Ni(CO)2 are found to be different than those for Ni(H2O)2. The bonding between neutral systems and the positive ions is found to be quite different; NiCO(+) has little pi bonding, while NiCO has strong pi bonding. The positive ion of NiH2O is far more strongly bound than the neutral, while for NiCO the positive ion and neutral are bound by about the same energy.

Bauschlicher, C. W., Jr.↗

On the bonding in Fe2(CO)9

The present paper is concerned with an analysis of the bonding in Fe2(CO)9, taking into account the results of self-consistent-field (SCF) calculations. The basis sets used are the same as those employed in the study of Fe(CO)5 conducted by Bauschlicher and Bagus (1985). The Fe basis set starts with the 14s9p5d primitive set optimized by Wachters (1970), which is contracted to 8s4p5d. An SCF wave function, consisting of only the core electrons, was determined, and then electrons were slowly added to the virtual orbitals with the lowest eigenvalues. The conducted calculations show no direct Fe-Fe bonding, but rather bonding resulting from the bridging CO's. The bonding is found to involve both the 5 sigma and 2 pi(asterisk) orbitals of the bridging CO's.

Bauschlicher, C. W., Jr.↗

Characterization of mode I and mixed-mode failure of adhesive bonds between composite adherends

A combined experimental and analytical investigation of an adhesively bonded composite joint was conducted to characterize both the static and fatigue beyond growth mechanism under mode 1 and mixed-mode 1 and 2 loadings. Two bonded systems were studied: graphite/epoxy adherends bonded with EC 3445 and FM-300 adhesives. For each bonded system, two specimen types were tested: a double-cantilever-beam specimen for mode 1 loading and a cracked-lapshear specimen for mixed-mode 1 and 2 loading. In all specimens tested, failure occurred in the form of debond growth. Debonding always occurred in a cohesive manner with EC 3445 adhesive. The FM-300 adhesive debonded in a cohesive manner under mixed-mode 1 and 2 loading, but in a cohesive, adhesive, or combined cohesive and adhesive manner under mode 1 loading. Total strain-energy release rate appeared to be the driving parameter for debond growth under static and fatigue loadings.

Mall, S.↗

Advanced thermal barrier system bond coatings for use on nickel-, cobalt- and iron-base alloy substrates

New and improved Ni-, Co-, and Fe-base bond coatings have been identified for the ZrO2-Y2O3 thermal barrier coatings to be used on Ni-, Co-, and Fe-base alloy substrates. These bond coatings were evaluated in a cyclic furnace between 1120 and 1175 C. It was found that MCrAlYb (where M = Ni, Co, or Fe) bond coating thermal barrier systems have significantly longer lives than MCrAlY bond coating thermal barrier systems. The longest life was obtained with the FeCrAlYb thermal barrier system followed by NiCrAlYb and CoCrAlYb thermal barrier systems in that order.

Stecura, S.↗

Criterion for mixed mode fracture in composite bonded joints

A study was undertaken to characterize the debond growth mechanism of adhesively bonded composite joints under mode I, mixed mode I-II, and mode II static loadings. The bonded system consisted of graphite/epoxy (T300/5208) composite adherends bonded with a toughened epoxy (EC 3445) adhesive. The mode I, mode II and mixed-mode I-II fracture energies of the tested adhesive were found to be equal to each other. Furthermore, the criterion for mixed mode fracture in composite bonded joints was determined.

Mall, S.↗

Fibre-matrix bond strength studies of glass, ceramic, and metal matrix composites

An indentation test technique for compressively loading the ends of individual fibers to produce debonding has been applied to metal, glass, and glass-ceramic matrix composites; bond strength values at debond initiation are calculated using a finite-element model. Results are correlated with composite longitudinal and interlaminar shear behavior for carbon and Nicalon fiber-reinforced glasses and glass-ceramics including the effects of matrix modifications, processing conditions, and high-temperature oxidation embrittlement. The data indicate that significant bonding to improve off-axis and shear properties can be tolerated before the longitudinal behavior becomes brittle. Residual stress and other mechanical bonding effects are important, but improved analyses and multiaxial interfacial failure criteria are needed to adequately interpret bond strength data in terms of composite performance.

Grande, D. H.↗