Novel Reel-to-Reel REBCO Coated Conductor Quality Control System for Fusion Electricity Generation Applications
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A capacitive type proximity sensor having substantial range and sensitivity between a machine and an intruding object in the immediate vicinity of the machine and having a steerable sensing field has an outer electrical conductor on the machine forming one electrode of a sensor capacitor, the other electrode is the object. The outer conductor is a thin sheet of conductive material with a pair (or more) of intermediate electrical conductors located between the outer conductor and the machine. The pair of intermediate electrical conductors are in close proximity to each other and together form a surface having a size substantially larger than the outer conductor to act as a shield for reducing the parasitic capacitance between the outer conductor and the machine and to steer the sensor field. The pair of intermediate conductors are thin sheets of conductive material substantially wider than the first conductor. The outer and pair of intermediate conductors are attached to a surface on the machine in electrical isolation and with no gaps between the conductors and no gap between the surface and the pair of intermediate conductors. The outer and pair of intermediate conductors are also in conformance with each other and the surface of the machine, and the surface of the machine acts as a ground plane. Variable gain voltage follower circuits are used for coupling, in phase, the instantaneous voltage at the outer electrical conductor to the pair of intermediate electrical conductors and a signal generator is coupled to the outer conductor and is responsive to the capacitance of the sensor capacitor for generating a control signal to the machine.
A capacitive type proximity sensor having improved range and sensitivity between a surface and an intruding object in the vicinity of the surface having a voltage source, a number of outer electrical conductors on the surface with each forming one electrode of a number of sensor capacitors, the other electrode for each sensor capacitor being the object is described. The outer conductors are made from thin sheets of conductive material covered with insulation. An intermediate electrical conductor is located between the outer conductors and the surface and is of a size larger than the outer conductors to act as a shield for reducing the parasitic capacitance between the outer conductors and the surface. The intermediate conductor is also made from a thin sheet of conductive material covered with insulation. The outer conductors and the intermediate conductor are attached to the surface with no gap between the insulation on the conductors and no gap between the surface and the insulation on intermediate conductor, the outer conductors and the intermediate conductor conjoining with each other and with the surface, with the surface acting as a ground plane. A current-measuring voltage follower circuit is connected to the voltage source for coupling in phase and amplitude the instantaneous voltage at the voltage source to the outer electrical conductors and the intermediate electrical conductor. This circuit is responsive to the change in capacitance of the sensor capacitors and generates a number of output signals.
A capacitive type proximity sensor having improved range and sensitivity between a surface and an intruding object in the vicinity of the surface having a voltage source, a number of outer electrical conductors on the surface with each forming one electrode of a number of sensor capacitors, the other electrode for each sensor capacitor being the object. The outer conductors are made from thin sheets of conductive material covered with insulation. An intermediate electrical conductor is located between the outer conductors and the surface and is of a size larger than the outer conductors to act as a shield for reducing the parasitic capacitance between the outer conductors and the surface. The intermediate conductor is also made from a thin sheet of conductive material covered with insulation. The outer conductors and the intermediate conductor are attached to the surface with no gap between the insulation on the conductors and no gap between the surface and the insulation on intermediate conductor, the outer conductors and the intermediate conductor conjoining with each other and with the surface, with the surface acting as a ground plane. A current-measuring voltage follower circuit is connected to the voltage source for coupling in phase and amplitude the instantaneous voltage at the voltage source to the outer electrical conductors and the intermediate electrical conductor. This circuit is responsive to the change in capacitance of the sensor capacitors and generates a number of output signals.
A novel feed structure, for an antenna having a resonant electric field structure, comprising a patch element, an integrated circuit attached to the patch element, at least one inner conductor electrically connected to and terminating at the integrated circuit on a first end of the at least one inner conductor, wherein the at least one inner conductor extends through and is not electrically connected to the patch element, and wherein the at least one inner conductor is available for electrical connectivity on a second end of the at least one inner conductor, and an outer conductor electrically connected to and terminating at the patch element on a first end of the outer conductor, wherein the outer conductor is available for electrical connectivity on a second end of the outer conductor, and wherein the outer conductor concentrically surrounds the at least one inner conductor from the second end of the at least one inner conductor available for electrical connectivity to the first end of the outer conductor terminating at the patch element.
A technique is described for use in determining the reliability of microscopic conductors deposited on an uneven surface of an integrated circuit device. A wafer containing integrated circuit chips is formed with a test area having regions of different heights. At the time the conductors are formed on the chip areas of the wafer, an elongated serpentine assay conductor is deposited on the test area so the assay conductor extends over multiple steps between regions of different heights. Also, a first test conductor is deposited in the test area upon a uniform region of first height, and a second test conductor is deposited in the test area upon a uniform region of second height. The occurrence of high resistances at the steps between regions of different height is indicated by deriving the measured length of the serpentine conductor using the resistance measured between the ends of the serpentine conductor, and comparing that to the design length of the serpentine conductor. The percentage by which the measured length exceeds the design length, at which the integrated circuit will be discarded, depends on the required reliability of the integrated circuit.
A limit and position sensing system includes a sensor assembly and an emitter. The sensor assembly includes first and second electrical conductors arranged in opposing parallel planes. The first electrical conductor is coiled outwardly from either end thereof in a clockwise fashion to form a first coil region and a second coil region. The second electrical conductor forms a single coil with portions of the single coil's rings lying between the first end and second end of the first electrical conductor being parallel to an axis of the first electrical conductor's plane. Ferromagnetic material is aligned with the first and second electrical conductors and spans beyond (a) the first and second ends of the first electrical conductor, and (b) the portions of the rings of the second electrical conductor's single coil that lie between the first end and second end of the first electrical conductor. The emitter is spaced apart from the sensor assembly and transmits a periodic electromagnetic wave towards the sensor assembly.
A technique is described for use in determining the reliability of microscopic conductors deposited on an uneven surface of an integrated circuit device. A wafer containing integrated circuit chips is formed with a test area having regions of different heights. At the time the conductors are formed on the chip areas of the wafer, an elongated serpentine assay conductor is deposited on the test area so the assay conductor extends over multiple steps between regions of different heights. Also, a first test conductor is deposited in the test area upon a uniform region of first height, and a second test conductor is deposited in the test area upon a uniform region of second height. The occurrence of high resistances at the steps between regions of different height is indicated by deriving the measured length of the serpentine conductor using the resistance measured between the ends of the serpentine conductor, and comparing that to the design length of the serpentine conductor. The percentage by which the measured length exceeds the design length, at which the integrated circuit will be discarded, depends on the required reliability of the integrated circuit.
A method for making monolithic optical circuits, with related optical devices as required or desired, on a supporting surface (10) consists of coating the supporting surface with reflecting metal or cladding resin, spreading a layer of liquid radiation senstivie plastic (12) on the surface, exposing the liquid plastic with a mask (14) to cure it in a desired pattern of light conductors (16, 18, 20), washing away the unexposed liquid plastic, and coating the conductors thus formed with reflective metal or cladding resin. The index of refraction for the cladding (22) is selected to be lower than for the conductors so that light in the conductors will be reflected by the interface with the cladding. For multiple level conductors, as where one conductor must cross over another, the process may be repeated to fabricate a bridge with columns (24, 26) of conductors to the next level, and conductor (28) between the columns. For more efficient transfer of energy over the bridge, faces at 45.degree. may be formed to reflect light up and across the bridge.
A method for making monolithic optical circuits, with related optical devices as required or desired, on a supporting surface (10) consists of coating the supporting surface with reflecting metal or cladding resin, spreading a layer of liquid radiation sensitive plastic (12) on the surface, exposing the liquid plastic with a mask (14) to cure it in a desired pattern of light conductors (16, 18, 20), washing away the unexposed liquid plastic, and coating the conductors thus formed with reflective metal or cladding resin. The index of refraction for the cladding (22) is selected to be lower than for the conductors so that light in the conductors will be reflected by the interface with the cladding. For multiple level conductors, as where one conductor must cross over another, the process may be repeated to fabricate a bridge with columns (24, 26) of conductors to the next level, and conductor (28) between the columns. For more efficient transfer of energy over the bridge, faces at 45.degree. may be formed to reflect light up and across the bridge.
Disclosed are non-linear transmission lines using ferromagnetic materials to generate ferromagnetic resonance oscillations. In one aspect, a non-linear transmission line apparatus is disclosed. The apparatus includes an outer conductor having a first side and a second internally facing side, and an inner conductor positioned internal to the non-linear transmission line apparatus. The apparatus further includes a ferromagnetic material surrounding the inner conductor, wherein the ferromagnetic material comprises nanoparticles of an ε-polymorph of iron oxide expressed as ε-Fe2O3. The apparatus also includes a first dielectric material positioned between the outer conductor and the inner conductor, the dielectric material in contact with both the ferromagnetic material and with the second internally facing side of the outer conductor, wherein the outer conductor, the inner conductor, the dielectric material and the ferromagnetic material form the nonlinear transmission line.
An electro-expulsive system has one or more overlapped conductors, each comprising a flexible ribbon conductor, which is folded back on itself. The conductors are embedded in an elastomeric material. Large current pulses are fed to the conductors from power storage units. As a result of the antiparallel currents, the opposed segments of a conductor are forcefully separated and the elastomeric material is distended. Voids in the elastomer aid the separation of the conductor segments. The distention is almost instantaneous when a current pulse reaches the conductor and the distention tends to remove any solid body on the surface of the elastomeric material.
Data analyses of the Space Experiments with Particle Accelerators (SEPAC) data and computer modeling were conducted to investigate spacecraft environmental effects associated with injection of electron beams, plasma clouds, and neutral gas clouds from the Shuttle orbiter. The data analysis indicates that Extremely Low Frequency oscillations from 150 to 200 Hz were seen in the Langmuir probe current when the beam was fired in a continuous mode. The strongest oscillations occurred when the ambient pressure was augmented by neutral gas releases from the SEPAC plasma accelerator magnetoplasma-dynamic (MPD) arcjet. To understand the dependence of spacecraft charging potential on beam density and other plasma parameters, a two-dimensional electrostatic particle code was used to simulate the injection of electron beams from an infinite conductor into a plasma. The simulations show that the conductor charging potential depends critically on the reflection coefficient of the conductor surface, which is defined as the percentage of incident particles reflected by the conductor. The ionization effects on spacecraft charging were examined by including interactions of electrons with neutral gas. The simulations show that the conductor charging potential decreases with increasing neutral background density due to the production of secondary electrons near the conductor surface. The simulations also indicate that the beam radius is generally proportional to the beam electron gyroradius when the conductor is charged to a large potential. It appears that the charge buildup at the beam stagnation point causes the beam radial expansion. A survey of the simulation results suggests that the ratio of the beam radius to the beam electron gyroradius increases with the square root of beam density and decreases inversely with beam injection velocity. These results are useful for explaining the spacecraft charging phenomena observed during SEPAC experiments from Spacelab 1.
The modeling features used in a steady-state heat transfer problem using SINDA/FLUINT are described. The problem modeled is a 125 feet long, 3 inch diameter pipe, filled with liquid oxygen flow driven by a given pressure gradient. The pipe is fully insulated in five sections. Three sections of 1 inch thick spray-on foam and two sections of vacuum jacket. The model evaluates friction, turns losses and convection heat transfer between the fluid and the pipe wall. There is conduction through the foam insulation with temperature dependent thermal conductivity. The vacuum space is modeled with radiation and gas molecular conduction, if present, in the annular gap. Heat is transferred between the outer surface and surrounding ambient by natural convection and radiation; and, by axial conduction along the pipe and through the vacuum jacket spacers and welded seal flanges. The model makes extensive use of SINDA/FLUINT basic capabilities such as the GEN option for nodes and conductors (to generate groups of nodes or conductors), the SIV option (to generate single, temperature varying conductors), the SIM option (for multiple, temperature varying conductors) and the M HX macros for fluids (to generate strings of lumps, paths, and ties representing a diabatic duct). It calls subroutine CONTRN (returns the relative location in the G-array of a network conductor, given an actual conductor number) enabling an extensive manipulation of conductor (calculates an assignment of their values) with DO loops. Models like this illustrate to the new and even to the old SINDA/FLUINT user, features of the program that are not so obvious or known, and that are extremely handy when trying to take advantage of both, the automation of the DATA headers and make surgical modifications to specific parameters of the thermal or fluid elements in the OPERATIONS portion of the model.
A superconducting magnet is formed having composite conductors arrayed in coils having turns which lie on a surface defining substantially a frustum of a cone. The conical angle with respect to the central axis is preferably selected such that the magnetic pressure on the coil at the widest portion of the cone is substantially zero. The magnet structure is adapted for use as an energy storage magnet mounted in an earthen trench or tunnel where the strength the surrounding soil is lower at the top of the trench or tunnel than at the bottom. The composite conductor may be formed having a ripple shape to minimize stresses during charge up and discharge and has a shape for each ripple selected such that the conductor undergoes a minimum amount of bending during the charge and discharge cycle. By minimizing bending, the working of the normal conductor in the composite conductor is minimized, thereby reducing the increase in resistance of the normal conductor that occurs over time as the conductor undergoes bending during numerous charge and discharge cycles.
A wireless tamper detection sensor is defined by a perforated electrical conductor. The conductor is shaped to form a geometric pattern between first and second ends thereof such that the conductor defines an open-circuit that can store and transfer electrical and magnetic energy. The conductor resonates in the presence of a time-varying magnetic field to generate a harmonic response. The harmonic response changes when the conductor experiences a change in its geometric pattern due to severing of the conductor along at least a portion of the perforations. A magnetic field response recorder is used to wirelessly transmit the time-varying magnetic field and wirelessly detecting the conductor's harmonic response.
An antenna includes a first electrical conductor that is shaped to form a spiral between its first and second ends that remain electrically unconnected such that the first electrical conductor so-shaped is maintained as an unconnected single-component open-circuit having inductance and capacitance. In the presence of a time-varying electromagnetic field, the first electrical conductor so-shaped resonates to generate a harmonic electromagnetic field response having a frequency, amplitude and bandwidth. A second electrical conductor includes a loop portion overlapping at least a portion of the spiral. The second electrical conductor is electrically isolated from the first electrical conductor. A radio frequency transceiver capable of transmitting and receiving electromagnetic energy is electrically coupled to the second electrical conductor.
Power lines, poles, and towers are the backbone of the United States (U.S.) electric-power grid. These transmission and distribution networks route electricity from generator to loads. The characteristics of these routes are rapidly changing -- trending towards decentralized renewable generation, electric heating, vehicle charging, and large data-center loads. Coupled with aging infrastructure and the increased frequency of extreme weather events, there is concern about the future reliability and transmission capacity of conductors and adjacent components. This scan report seeks to provide an overview of mechanical solutions to challenges caused by extreme weather events associated with components of transmission and distribution infrastructure, including conductor heat sag, ice accumulation, wind, and wildfire. Many options could increase transmission capacity or reliability, and these are at various stages of technological readiness. Some have only been lab tested, while some have been widely deployed in the U.S. or overseas for decades. The solution categories and providers featured in this report are intended to be comprehensive at the time of publication and to serve as a reference for decision-makers concerned about transmission and distribution reliability. There are two other categories of large, complex solutions, which are not covered in this report: replacing existing conductors with advanced conductors and implementing digital grid enhancing technologies. A separate scan report titled “Advanced Conductor Scan Report,” which discusses advanced carbon-core conductors, was published by the Idaho National Laboratory (INL) in 2023. Information on digital technologies, such as dynamic line ratings, power-flow controllers, and other power electronics and communications-based devices, can be found on the Grid- Enhancing Technologies landing page. Mechanical grid-enhancing technologies, or solutions covered in this report, often do not require full equipment replacement and do not rely on digital components. Mechanical technologies are overlooked because they may be older, simpler, or seemingly “more obvious” than digital or carbon-core technologies. However, it is wise to consider mechanical solutions in a thorough evaluation of grid enhancing technology solutions.