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At least 289 records · Page 16

The NASA Electronic Parts and Packaging (NEPP) Program: Insertion of New Electronics Technologies

This viewgraph presentation gives an overview of NASA Electronic Parts and Packaging (NEPP) Program's new electronics technology trends. The topics include: 1) The Changing World of Radiation Testing of Memories; 2) Even Application-Specific Tests are Costly!; 3) Hypothetical New Technology Part Qualification Cost; 4) Where we are; 5) Approaching FPGAs as a More Than a "Part" for Reliability; 6) FPGAs Beget Novel Radiation Test Setups; 7) Understanding the Complex Radiation Data; 8) Tracking Packaging Complexity and Reliability for FPGAs; 9) Devices Supporting the FPGA Need to be Considered; 10) Summary of the New Electronic Technologies and Insertion into Flight Programs Workshop; and 11) Highlights of Panel Notes and Comments

LaBel, Kenneth A.↗

A Hard X-Ray Telescope Science Enhancement Package for the Constellation X-Ray Mission

Details of a hard-x-ray science enhancement package for the Constellation-X mission are presented. A scientific case is made for the inclusion of such an instrument on the planned mission and a detailed design is presented that will satisfy science requirements yet fall within the ground rules for enhancement packages: a cost of less than $100M and a mass of no more than 100 kg.

Ramsey, Brian↗

Chip packaging technique

A hermetically sealed package for at least one semiconductor chip is provided which is formed of a substrate having electrical interconnects thereon to which the semiconductor chips are selectively bonded, and a lid which preferably functions as a heat sink, with a hermetic seal being formed around the chips between the substrate and the heat sink. The substrate is either formed of or includes a layer of a thermoplastic material having low moisture permeability which material is preferably a liquid crystal polymer (LCP) and is a multiaxially oriented LCP material for preferred embodiments. Where the lid is a heat sink, the heat sink is formed of a material having high thermal conductivity and preferably a coefficient of thermal expansion which substantially matches that of the chip. A hermetic bond is formed between the side of each chip opposite that connected to the substrate and the heat sink. The thermal bond between the substrate and the lid/heat sink may be a pinched seal or may be provided, for example by an LCP frame which is hermetically bonded or sealed on one side to the substrate and on the other side to the lid/heat sink. The chips may operate in the RF or microwave bands with suitable interconnects on the substrate and the chips may also include optical components with optical fibers being sealed into the substrate and aligned with corresponding optical components to transmit light in at least one direction. A plurality of packages may be physically and electrically connected together in a stack to form a 3D array.

Jayaraj, Kumaraswamy↗

Comparative Packaging Study

This viewgraph presentation describes a comparative packaging study for use on long duration space missions. The topics include: 1) Purpose; 2) Deliverables; 3) Food Sample Selection; 4) Experimental Design Matrix; 5) Permeation Rate Comparison; and 6) Packaging Material Information.

Perchonok, Michele↗

Alternative Packaging for Back-Illuminated Imagers

An alternative scheme has been conceived for packaging of silicon-based back-illuminated, back-side-thinned complementary metal oxide/semiconductor (CMOS) and charge-coupled-device image-detector integrated circuits, including an associated fabrication process. This scheme and process are complementary to those described in "Making a Back-Illuminated Imager With Back-Side Connections" (NPO-42839), NASA Tech Briefs, Vol. 32, No. 7 (July 2008), page 38. To avoid misunderstanding, it should be noted that in the terminology of imaging integrated circuits, "front side" or "back side" does not necessarily refer to the side that, during operation, faces toward or away from a source of light or other object to be imaged. Instead, "front side" signifies that side of a semiconductor substrate upon which the pixel pattern and the associated semiconductor devices and metal conductor lines are initially formed during fabrication, and "back side" signifies the opposite side. If the imager is of the type called "back-illuminated," then the back side is the one that faces an object to be imaged. Initially, a back-illuminated, back-side-thinned image-detector is fabricated with its back side bonded to a silicon handle wafer. At a subsequent stage of fabrication, the front side is bonded to a glass wafer (for mechanical support) and the silicon handle wafer is etched away to expose the back side. The frontside integrated circuitry includes metal input/output contact pads, which are rendered inaccessible by the bonding of the front side to the glass wafer. Hence, one of the main problems is to make the input/output contact pads accessible from the back side, which is ultimately to be the side accessible to the external world. The present combination of an alternative packaging scheme and associated fabrication process constitute a solution of the problem.

Pain, Bedabrata↗

Flexible Packaging Concept for a Space Suit Portable Life Support Subsystem

Neither the Shuttle Extravehicular Mobility Unit (EMU), the space suit currently used for space shuttle and International Space Station (ISS) missions, nor the Apollo EMU, the space suit successfully used on previous lunar missions, will satisfy the requirements for the next generation Constellation Program (CxP) lunar suit. The CxP system or Constellation Space Suit Element (CSSE) must be able to tolerate more severe environmental and use conditions than any previous system. These conditions include missions to the severely cold lunar poles and up to 100 Extravehicular Activity (EVA) excursions without ground maintenance. Much effort is focused on decreasing the mass and volume of the Portable Life Support Subsystem (PLSS) over previous suit designs in order to accommodate the required increase in functionality. This paper documents the progress of a conceptual packaging effort of a flexible backpack for the CSSE PLSS. The flexible backpack concept relies on a foam protection system to absorb, distribute, and dissipate the energy from falls on the lunar surface. Testing and analysis of the foam protection system concept that was conducted during this effort indicates that this method of system packaging is a viable solution.

Thomas, Gretchen↗

MEMS Direct Chip Attach Packaging Methodologies and Apparatuses for Harsh Environments

Methods of bulk manufacturing high temperature sensor subassembly packages are disclosed and claimed. Sensors are sandwiched between a top cover and a bottom cover so as to enable the peripheries of the top covers, sensors and bottom covers to be sealed and bound securely together are disclosed and claimed. Sensors are placed on the bottom covers leaving the periphery of the bottom cover exposed. Likewise, top covers are placed on the sensors leaving the periphery of the sensor exposed. Individual sensor sub-assemblies are inserted into final packaging elements which are also disclosed and claimed. Methods of directly attaching wires or pins to contact pads on the sensors are disclosed and claimed. Sensors, such as pressure sensors and accelerometers, and headers made out of silicon carbide and aluminum nitride are disclosed and claimed. Reference cavities are formed in some embodiments disclosed and claimed herein where top covers are not employed.

Okojie, Robert S.↗

Satellite Data Simulator Unit: A Multisensor, Multispectral Satellite Simulator Package

Several multisensor simulator packages are being developed by different research groups across the world. Such simulator packages [e.g., COSP , CRTM, ECSIM, RTTO, ISSARS (under development), and SDSU (this article), among others] share overall aims, although some are targeted more on particular satellite programs or specific applications (for research purposes or for operational use) than others. The SDSU or Satellite Data Simulator Unit is a general-purpose simulator composed of Fortran 90 codes and applicable to spaceborne microwave radiometer, radar, and visible/infrared imagers including, but not limited to, the sensors listed in a table. That shows satellite programs particularly suitable for multisensor data analysis: some are single satellite missions carrying two or more instruments, while others are constellations of satellites flying in formation. The TRMM and A-Train are ongoing satellite missions carrying diverse sensors that observe clouds and precipitation, and will be continued or augmented within the decade to come by future multisensor missions such as the GPM and Earth-CARE. The ultimate goals of these present and proposed satellite programs are not restricted to clouds and precipitation but are to better understand their interactions with atmospheric dynamics/chemistry and feedback to climate. The SDSU's applicability is not technically limited to hydrometeor measurements either, but may be extended to air temperature and humidity observations by tuning the SDSU to sounding channels. As such, the SDSU and other multisensor simulators would potentially contribute to a broad area of climate and atmospheric sciences. The SDSU is not optimized to any particular orbital geometry of satellites. The SDSU is applicable not only to low-Earth orbiting platforms as listed in Table 1, but also to geostationary meteorological satellites. Although no geosynchronous satellite carries microwave instruments at present or in the near future, the SDSU would be useful for future geostationary satellites with a microwave radiometer and/or a radar aboard, which could become more feasible as engineering challenges are met. In this short article, the SDSU algorithm architecture and potential applications are reviewed in brief.

Masunaga, Hirohiko↗

Monitoring Volcanoes by Use of Air-Dropped Sensor Packages

Sensor packages that would be dropped from airplanes have been proposed for pre-eruption monitoring of physical conditions on the flanks of awakening volcanoes. The purpose of such monitoring is to gather data that could contribute to understanding and prediction of the evolution of volcanic systems. Each sensor package, denoted a volcano monitoring system (VMS), would include a housing with a parachute attached at its upper end and a crushable foam impact absorber at its lower end (see figure). The housing would contain survivable low-power instrumentation that would include a Global Positioning System (GPS) receiver, an inclinometer, a seismometer, a barometer, a thermometer, and CO2 and SO2 analyzers. The housing would also contain battery power, control, data-logging, and telecommunication subsystems. The proposal for the development of the VMS calls for the use of commercially available sensor, power, and telecommunication equipment, so that efforts could be focused on integrating all of the equipment into a system that could survive impact and operate thereafter for 30 days, transmitting data on the pre-eruptive state of a target volcano to a monitoring center. In a typical scenario, VMSs would be dropped at strategically chosen locations on the flanks of a volcano once the volcano had been identified as posing a hazard from any of a variety of observations that could include eyewitness reports, scientific observations from positions on the ground, synthetic-aperture-radar scans from aircraft, and/or remote sensing from aboard spacecraft. Once dropped, the VMSs would be operated as a network of in situ sensors that would transmit data to a local monitoring center. This network would provide observations as part of an integrated volcano-hazard assessment strategy that would involve both remote sensing and timely observations from the in situ sensors. A similar strategy that involves the use of portable sensors (but not dropping of sensors from aircraft) is already in use in the Volcano Disaster Assistance Program (VDAP), which was developed by the U.S. Geological Survey and the U.S. Office of Foreign Disaster Assistance to respond to volcanic crises around the world. The VMSs would add a greatly needed capability that would enable VDAP response teams to deploy their volcano-monitoring equipment in a more timely manner with less risk to personnel in the field.

Kedar, Sharon↗

Instrument Package Manipulation Through the Generation and Use of an Attenuated-Fluent Gas Fold

This document discusses a technique that provides a means for suspending large, awkward loads, instrument packages, components, and machinery in a stable, controlled, and precise manner. In the baseplate of the test machine, a pattern of grooves and ports is installed that when pressurized generates an attenuated- fluent gas fold providing a low-cost, near-zero-coefficient-of-friction lubrication boundary layer that supports the object evenly, and in a predictable manner. Package movement control requires minimal force. Aids to repeatable travel and positional accuracy can be added via the addition of simple guide bars and stops to the floor or object being moved. This allows easily regulated three-axis motions. Loads of extreme weight and size can be moved and guided by a single person, or by automated means, using minimal force. Upon removal of the attenuated fluent gas fold, the object returns to a stable resting position without impact forces affecting the object.

Breen, Daniel P.↗

Web: A Wireless Experiment Box for the Dextre Pointing Package ELC Payload

The Wireless Experiment Box (WEB) was proposed to work with the International Space Station (ISS) External Wireless Communication (EWC) system to support high-definition video from the Dextre Pointing Package (DPP). DPP/WEB was a NASA GSFC proposed ExPRESS Logistics Carrier (ELC) payload designed to flight test an integrated suite of Autonomous Rendezvous and Docking (AR&D) technologies to enable a wide spectrum of future missions across NASA and other US Government agencies. The ISS EWC uses COTS Wireless Access Points (WAPs) to provide high-rate bi-directional communications to ISS. In this paper, we discuss WEB s packaging, operation, antenna development, and performance testing.

Bleier, Leor Z.↗

WEB - A Wireless Experiment Box for the Dextre Pointing Package ELC Payload

The Wireless Experiment Box (WEB) was proposed to work with the International Space Station (ISS) External Wireless Communication (EWC) system to support high-definition video from the Dextre Pointing Package (DPP). DPP/WEB was a NASA GSFC proposed ExPRESS Logistics Carrier (ELC) payload designed to flight test an integrated suite of Autonomous Rendezvous and Docking (AR&D) technologies to enable a wide spectrum of future missions across NASA and other US Government agencies. The ISS EWC uses COTS Wireless Access Points (WAPs) to provide high-rate bi-directional communications to ISS. In this paper, we discuss WEB s packaging, operation, antenna development, and performance testing.

Bleier, Leor Z.↗

Flight Hardware Packaging Design for Stringent EMC Radiated Emission Requirements

This packaging design approach can help heritage hardware meet a flight project's stringent EMC radiated emissions requirement. The approach requires only minor modifications to a hardware's chassis and mainly concentrates on its connector interfaces. The solution is to raise the surface area where the connector is mounted by a few millimeters using a pedestal, and then wrapping with conductive tape from the cable backshell down to the surface-mounted connector. This design approach has been applied to JPL flight project subsystems. The EMC radiated emissions requirements for flight projects can vary from benign to mission critical. If the project's EMC requirements are stringent, the best approach to meet EMC requirements would be to design an EMC control program for the project early on and implement EMC design techniques starting with the circuit board layout. This is the ideal scenario for hardware that is built from scratch. Implementation of EMC radiated emissions mitigation techniques can mature as the design progresses, with minimal impact to the design cycle. The real challenge exists for hardware that is planned to be flown following a built-to-print approach, in which heritage hardware from a past project with a different set of requirements is expected to perform satisfactorily for a new project. With acceptance of heritage, the design would already be established (circuit board layout and components have already been pre-determined), and hence any radiated emissions mitigation techniques would only be applicable at the packaging level. The key is to take a heritage design with its known radiated emissions spectrum and repackage, or modify its chassis design so that it would have a better chance of meeting the new project s radiated emissions requirements.

Lortz, Charlene L.↗

Reliability of CGA/LGA/HDI Package Board/Assembly (Revision A)

This follow-up report presents reliability test results conducted by thermal cycling of five CGA assemblies evaluated under two extreme cycle profiles, representative of use for high-reliability applications. The thermal cycles ranged from a low temperature of 55 C to maximum temperatures of either 100 C or 125 C with slow ramp-up rate (3 C/min) and dwell times of about 15 minutes at the two extremes. Optical photomicrographs that illustrate key inspection findings of up to 200 thermal cycles are presented. Other information presented include an evaluation of the integrity of capacitors on CGA substrate after thermal cycling as well as process evaluation for direct assembly of an LGA onto PCB. The qualification guidelines, which are based on the test results for CGA/LGA/HDI packages and board assemblies, will facilitate NASA projects' use of very dense and newly available FPGA area array packages with known reliably and mitigation risks, allowing greater processing power in a smaller board footprint and lower system weight.

Ghaffarian, Reza↗

Reliability of Semiconductor Laser Packaging in Space Applications

A typical set up used to perform lifetime tests of packaged, fiber pigtailed semiconductor lasers is described, as well as tests performed on a set of four pump lasers. It was found that two lasers failed after 3200, and 6100 hours under device specified bias conditions at elevated temperatures. Failure analysis of the lasers indicates imperfections and carbon contamination of the laser metallization, possibly from improperly cleaned photo resist. SEM imaging of the front facet of one of the lasers, although of poor quality due to the optical fiber charging effects, shows evidence of catastrophic damage at the facet. More stringent manufacturing controls with 100% visual inspection of laser chips are needed to prevent imperfect lasers from proceeding to packaging and ending up in space applications, where failure can result in the loss of a space flight mission.

Gontijo, Ivair↗

Evaluation of Solid Rocket Motor Component Data Using a Commercially Available Statistical Software Package

Commercially available software packages today allow users to quickly perform the routine evaluations of (1) descriptive statistics to numerically and graphically summarize both sample and population data, (2) inferential statistics that draws conclusions about a given population from samples taken of it, (3) probability determinations that can be used to generate estimates of reliability allowables, and finally (4) the setup of designed experiments and analysis of their data to identify significant material and process characteristics for application in both product manufacturing and performance enhancement. This paper presents examples of analysis and experimental design work that has been conducted using Statgraphics®(Registered Trademark) statistical software to obtain useful information with regard to solid rocket motor propellants and internal insulation material. Data were obtained from a number of programs (Shuttle, Constellation, and Space Launch System) and sources that include solid propellant burn rate strands, tensile specimens, sub‐scale test motors, full‐scale operational motors, rubber insulation specimens, and sub‐scale rubber insulation analog samples. Besides facilitating the experimental design process to yield meaningful results, statistical software has demonstrated its ability to quickly perform complex data analyses and yield significant findings that might otherwise have gone unnoticed. One caveat to these successes is that useful results not only derive from the inherent power of the software package, but also from the skill and understanding of the data analyst.

Stefanski, Philip L.↗

Radiation-Resistant Photon-Counting Detector Package Providing Sub-ps Stability for Laser Time Transfer in Space

We are reporting on a design, construction and performance of photon-counting detector packages based on silicon avalanche photodiodes. These photon-counting devices have been optimized for extremely high stability of their detection delay. The detectors have been designed for future applications in fundamental metrology and optical time transfer in space. The detectors have been qualified for operation in space missions. The exceptional radiation tolerance of the detection chip itself and of all critical components of a detector package has been verified in a series of experiments.

radiation hardness↗