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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 289 records · Page 16
All sourcesNASA NTRSDOE OSTI
NASA NTRS2016

Virtex-5 CN Package Daisy Chain Evaluation Test Report

The board-level temperature cycling reliability of Xilinx Virtex-5 (V5) CN package was investigated. V5s were temperature cycled under two conditions, 0 to +100 C (0/100) and -55 to +100 C (-55/100). During the 0/100 test, no part out of 8 parts failed up to 6586 cycles. During the -55/100 test, one part out of 8 parts failed at 1236 cycle, and there were no additional failures up to 1705 cycles. The failure mode of the part that failed at 1236 cycles indicated that most likely the failure was not a solder fatigue failure, and therefore no obvious solder fatigue failure was observed throughout the tests.

Suh, Jong-ook↗
NASA NTRS2019

Cracking Problems in Low-Voltage Chip Ceramic Capacitors

Cracking remains the major reason of failures in multilayer ceramic capacitors (MLCCs) used in in space electronics. Due to a tight quality control of space-grade components, the probability that as manufactured capacitors have cracks is relatively low, and cracking is often occurs during assembly, handling and the following testing of the systems. Majority of capacitors with cracks are revealed during the integration and testing period, but although extremely rarely, defective parts remain undetected and result in failures during the mission. This situation is aggravated by manual soldering and rework that are often used during low volume production of circuit boards for space. Although failures of MLCCs are often attributed to the post-manufacturing stresses, in many cases they are due to a combination of certain deviations in the manufacturing processes that result in hidden defects in the parts and excessive stresses during assembly and use. This report gives an overview of design, manufacturing and testing processes of MLCCs focusing on elements related to cracking problems. The existing and new screening and qualification procedures and techniques are briefly described and assessed by their effectiveness in revealing cracks. The capability of different test methods to simulate stresses resulting in cracking, mechanisms of failures in capacitors with cracks, and possible methods of selecting the most robust to manual soldering stresses capacitors are discussed.

testing↗
NASA NTRS2016

A Tale of Three Capacitor Problems

This talk will make a connection among several capacitor-related anomalies and failures that tie to some of the following conditions: reverse bias installation, cracked ceramic, and to minimal extent, elevated equivalent series resistance (ESR). In particular, we will briefly discuss anomalies we have experienced (1) in ground testing involving ceramic capacitors that had been hand soldered or had had touched-up solder joints, (2) in reverse-biased capacitors that have been operating for years on-orbit but that have experienced failures in ground operation and testing, and (3) in ceramic capacitors that exhibited an on-orbit latent defect resulting from cracks, and how these have come together. The talk will provide some lessons learned for recognizing and understanding anomalous behavior involving capacitors.

Anomalies↗
NASA NTRS2019

High Temperature Superconductor Lead Assemblies for XRISM

The RESOLVE instrument on the upcoming XRISM mission is a rebuild of the SXS instrument that successfully demonstrated high resolution X-ray spectroscopy on the Hitomi mission using a microcalorimeter array at 50 mK. As with SXS, the RESOLVE instrument requires High Temperature Superconductor (HTS) lead assemblies to carry high current to the Adiabatic Demagnetization Refrigerator (ADR) while meeting a very stringent heat conductance budget. For the RESOLVE HTS lead assemblies, we have used new materials and processes to improve the stability and consistency of solder joints to the HTS material. We have also designed a new thermal strap that eliminates stress concentrations on the HTS tapes. We present the results of testing on the engineering model and flight model units, as well as the results of long term testing on prototype solder joints.

Canavan, Edgar R.↗
NASA NTRS2012

3D X-ray CT for BGA/CGA Workmanship Defect Detection

Commercial-off-the-shelf (COTS) advanced microelectronic technologies in high-reliability versions are now being considered for use in a number of National Aeronautics and Space Administration (NASA) electronic systems. One of the key drawbacks of advanced electronic packages with hidden solder joint interconnections, such as the column grid array (CGA), is that inspection can be challenging—whether visually or using X-rays. In general, inspection for solder joint integrity is poor, except for identifying shorts. The new, advanced X-ray systems, especially the 3D computer tomography version, may be able to provide the three-dimensional features that are extremely difficult to resolve under the 2D systems.This report presents both 2D and 3D X-ray images along with their representative optical photomicrographs for a number of advanced electronics package assemblies including 3D stack and CGA assemblies before and after thermal cycling.

Ghaffarian, Reza↗
NASA NTRS2020

Comparing Cumulative Flight Thermal Fatigue to Ground Test Results for Memory Components on the Mars Curiosity Rover

This paper explores the methods used to examine Mars Curiosity Rover’s flight temperature data to the Package Qualification and Verification (PQV) accelerated thermal cycle life test data in response to flight anomalies. The redundant Rover Compute Element (RCE-A, B) has experienced an inability to mount the flash memory several times. The leading cause of these anomalies is likely the loss of electrical connectivity, which is theorized to be due to cracks on the memory component solder joints by thermal cycle fatigue. To investigate this theory, the number of thermal cycles accumulated in flight was compared to PQV accelerated thermal cycle life test data. The goal of this study was to inform mission operations of the risk associated with thermal cycling damage on the RCE. However, since the RCE-B does not have continuous temperature data from the Platinum Resistance Thermometer (PRT) closest to the flash memory, a model was made to correlate continuous data from two other nearby sensors on the RCE-B to the noncontiguous sensor. Using the Rainflow Counting Algorithm, the reconstituted data was converted into the number of equivalent thermal cycles. The Coffin-Manson Equation was used to compare flight thermal cycles to the PQV test. The accelerated life test showed cracking on the memory component solder joints after 500 cycles of 80°C temperature excursions. This study found that the RCE-A and RCE-B have undergone an equivalent of 144 and 430 cycles of 80°C temperature excursions during flight, respectively.

Berger, Lindsey N↗
NASA NTRS2021

Comparing Cumulative Flight Thermal Fatigue to Ground Test Results for Memory Components on the Mars Curiosity Rover

This paper explores the methods used to examine Mars Curiosity Rover’s flight temperature data in relation to the Package Qualification and Verification (PQV) accelerated thermal cycle life test data in response to flight anomalies. The redundant Rover Compute Element (RCE-A, B) has experienced an inability to mount the flash memory several times. The leading cause of these anomalies is likely the loss of electrical connectivity, which is theorized to be due to cracks on the memory component solder joints by thermal cycle fatigue. To investigate this theory, the number of thermal cycles accumulated in flight was compared to PQV accelerated thermal cycle life test data. The goal of this study was to inform mission operations of the risk associated with thermal cycling damage on the RCE. However, since the RCE-B does not have continuous temperature data from the Platinum Resistance Thermometer (PRT) closest to the flash memory, a model was made to correlate continuous data from two other nearby sensors on the RCE-B to the noncontiguous sensor. Using the Rainflow Counting Algorithm, the reconstituted data was converted into the number of equivalent thermal cycles. The Coffin-Manson Equation was used to compare flight thermal cycles to the PQV test. The accelerated life test showed cracking on the memory component solder joints after 500 cycles of 80°C temperature excursions. This study found that the RCE-A and RCE-B have undergone an equivalent of 144 and 430 cycles of 80°C temperature excursions during flight, respectively.

Bell, Charles↗
NASA NTRS2000

Dimpled ball grid array process development for space flight applications

A 472 dimpled ball grid array (D-BGA) package has not been used in past space flight environments, therefore it was necessary to develop a process that would yield robust and reliable solder joints. The process developing assembly, inspection and rework techniques, were verified by conducting environmental tests. Since the 472 D-BGA packages passed the above environmental tests within the specifications, the process was successfully developed for space flight electronics.

solder joints↗
NASA NTRS1998

Key Factors on CSP Assembly Reliability

Although the weakest link of CSP assembly reliability has been often internal package failure, solder joint fatigue is still considered to be the key factor for reliability.

CSP assembly reliability solder joints↗
NASA NTRS1997

Reliability Investigation of Ball Grid Array Assemblies for Space Flight Applications

JPL, in a partnership with an industrial consortium, is currently engaged in the investigation of reliability and quality issues if ball grid array (BGA) packages as they may be applied to space flight electronics. Performing tests to determine the solder joint reliability of assemblies using BGAs under temperature cycling has proved to be a real challenge for test engineers.

Ball grid array printed wiring assemblies reliabil↗
NASA NTRS2014

Body of Knowledge (BOK) for Leadless Quad Flat No-Lead/bottom Termination Components (QFN/BTC) Package Trends and Reliability

Bottom terminated components and quad flat no-lead (BTC/QFN) packages have been extensively used by commercial industry for more than a decade. Cost and performance advantages and the closeness of the packages to the boards make them especially unique for radio frequency (RF) applications. A number of high-reliability parts are now available in this style of package configuration. This report presents a summary of literature surveyed and provides a body of knowledge (BOK) gathered on the status of BTC/QFN and their advanced versions of multi-row QFN (MRQFN) packaging technologies. The report provides a comprehensive review of packaging trends and specifications on design, assembly, and reliability. Emphasis is placed on assembly reliability and associated key design and process parameters because they show lower life than standard leaded package assembly under thermal cycling exposures. Inspection of hidden solder joints for assuring quality is challenging and is similar to ball grid arrays (BGAs). Understanding the key BTC/QFN technology trends, applications, processing parameters, workmanship defects, and reliability behavior is important when judicially selecting and narrowing the follow-on packages for evaluation and testing, as well as for the low risk insertion in high-reliability applications.

MLF↗
NASA NTRS2016

NASA Collaborative Approach Mitigates Environmentally-Driven Obsolescence

National Aeronautics and Space Administration (NASA) missions, like Department of Defense (DoD) organizations, require the rigorous testing and qualification of critical materials. Obsolescence supply risks created by environmental requirements can affect the cost, schedule and performance of NASA missions and the resilience of critical infrastructure. The NASA Technology Evaluation for Environmental Risk Mitigation (TEERM) Principal Center helps to identify obsolescence supply risks driven by environmental requirements and works proactively with NASA Centers and Programs, the DoD, the European Space Agency (ESA) and other agencies and partners to identify and evaluate environmentally friendly alternatives. TEERM tracks environmental regulations, identifies the potential loss of material availability and works with NASA programs and Centers to evaluate potential impacts through a risk assessment approach. TEERM collaborative projects identify, demonstrate and evaluate commercially viable alternative technologies and materials. A major focus during the Space Shuttle Program was the need to replace ozone depleting substances that were used in spray foam and cleaning applications. The potential obsolescence of coatings containing hexavalent chromium and the risks associated with lead free solder were also of concern for the Space Shuttle and present ongoing risks to new programs such as the Space Launch System. One current project teams NASA and ESA in the evaluation and testing of individual coatings and coating systems as replacements for hexavalent chromium coatings in aerospace applications. The proactive, collaborative approach used by TEERM helps reduce the cost burden on any one team partner, reduces duplication of effort, and enhances the technical quality and overall applicability of the testing and analysis.

environmentall-driven obsolescence↗
NASA NTRS2000

Chip Scale Package Issues

Availability of board solder joint reliability information is critical to the wider implementation of Chip Scale Packages (CSPs).

solder↗
DOE OSTI2025

Predictive dynamic wetting, fluid–structure interaction simulations for braze run-out

Brazing and soldering are metallurgical joining techniques that use a wetting molten metal to create a joint between two faying surfaces. Here, the quality of the brazing process depends strongly on the wetting properties of the molten filler metal, namely the surface tension and contact angle, and the resulting joint can be susceptible to various defects, such as run-out and underfill, if the material properties or joining conditions are not suitable. In this work, we implement a finite element simulation to predict the formation of such defects in braze processes. This model incorporates both fluid–structure interaction through an arbitrary Eulerian–Lagrangian technique and free surface wetting through conformal decomposition finite element modeling. Upon validating our numerical simulations against experimental run-out studies on a silver-Kovar system, we then use the model to predict run-out and underfill in systems with variable surface tension, contact angles, and applied pressure. Finally, we consider variable joint/surface geometries and show how different geometrical configurations can help to mitigate run-out. This work aims to understand how brazing defects arise and validate a coupled wetting and fluid–structure interaction simulation that can be used for other industrial problems.

36 MATERIALS SCIENCE↗
DOE OSTI2024

Friction stir processing on a strontium modified, thin-wall, vacuum-assisted high-pressure die-cast Aural-5 alloy to improve tensile and fatigue performance

Here, this study explores the application of friction stir processing (FSP) to enhance the material properties of Sr-modified Aural-5 alloy, with a focus on improved tensile and fatigue properties. Aural-5 is a well-known vacuum-assisted high-pressure die-cast (HPDC) Al-Si7-Mg alloy used in the automotive industry to reduce vehicle weight, enhance fuel efficiency, and lower carbon emissions. This alloy modifies its material chemistry with Sr for fine fibrous networks of eutectic silicon and manganese (Mn) to reduce die soldering. It has significantly less iron (Fe) content resulting in the elimination of detrimental needle-shaped Fe-bearing ß-phase intermetallic and improving ductility. The initial microstructure of as-received HPDC Aural-5 exhibits shrinkage porosity in the middle section, a dendritic microstructure with fibrous Al-Si eutectic colonies, a shear-band structure beneath the die-wall, large dendritic externally solidified crystals (ESCs), needle-shaped Mg 2 Si phase and significant second-phase particulates. Some of those microstructural features, such as porosity, ESCs, needle-shaped Mg 2 Si phase, and large second-phase particles, serve as initiation sites for cracks under mechanical loading, resulting in adverse effects on tensile properties, particularly ductility. FSP effectively transforms the microstructure into a wrought configuration with uniform particle distribution by eliminating porosity and disintegrating dendrites, eutectic colonies, ESCs, second-phase particles, and shear-band structures. FSP-driven microstructure modification enhances yield strength and tensile ductility by ~30% and ~35%, respectively. The fatigue life of the material in a bending mode configuration (stress ratio R = 0.1) after FSP exhibits enhancements ranging from 2.0 to 3.9 times that of the original HPDC Aural-5 alloy, depending on the applied stress level.

36 MATERIALS SCIENCE↗