Fully conjugated block copolymers enhance thermal stability of polymer blend solar cells
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Printing techniques have been instrumental in developing flexible and stretchable electronics, including organic light-emitting diode displays, organic thin film transistor arrays, electronic skins, organic electrochemical transistors for biosensors and neuromorphic computing, as well as flexible solar cells with low-cost processes such as inkjet printing, ultrasonic nozzle, roll-to-roll coating. The rise of additive manufacturing provides even more opportunities to print electronics in automated and customizable ways. In this work, we will review the current technologies of printing electronics (including printed batteries, supercapacitors, fuel cells, and sensors), especially with 3D printing. In this age of ongoing AI revolution, the application of AI algorithms is discussed in terms of combining them with 3D printing and electronics printing for a future with automated optimization, sustainable design, and customizable and scalable manufacturing.
Tungsten monophosphide (WP) has been reported to superconduct below 0.8 K, and theoretical work has predicted an unconventional Cooper pairing mechanism. Here we present data for WP single crystals grown by means of chemical vapor transport (CVT) of WO3, P, and I2. In comparison to synthesis using WP powder as a starting material, this technique results in samples with substantially decreased low-temperature scattering and favors a more three-dimensional morphology. We also find that the resistive superconducting transitions in these samples begin above 1 K. Variation in Tc is often found in strongly correlated superconductors, and its presence in WP could be the result of influence from a competing order and/or a non-s-wave gap.
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Cr 2 O 3 emerges as a prominent candidate material for spintronics and magnetoelectronic applications. However, a comprehensive understanding of its temperature-dependent spin dynamics remains elusive, impeding the engineering of novel spintronics based on this material. Here, we delve into this through a combination of inelastic neutron scattering experiments and atomistic simulations. Our results unveiled the emergence of paramagnons above and below 𝑇 𝑁 . We demonstrated a significant softening of linear magnons upon heating in the antiferromagnetic state. Further analysis revealed that this softening primarily originated from four-magnon interactions, while thermal expansion played a minor role.
Here, the chance observation of a novel traveling wave in a canal led over time to the formulation of a nonlinear wave equation—the Korteweg–de Vries equation—that describes strikingly robust disturbances now called solitons. The figure of an isolated soliton corresponds to a reflectionless potential that supports a single bound state in the one-dimensional Schrödinger equation. An appropriate combination of individual solitons yields a symmetric reflectionless potential that supports multiple bound states. Thus, the KdV equation opens the path to solving the inverse scattering problem for a collection of bound states. Applied to the quarkonium spectra, this formalism allows the construction of reflectionless approximations to the confining potentials that account for the force between quarks, and to tests of the flavor-independence of the interquark interaction.
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We report on a first-principles numerical study of magnetic reconnection in plasmas with different initial ion-to-electron temperature ratios. In cases where this ratio is significantly below unity, we observe intense wave activity in the diffusion region, driven by the ion-acoustic instability. Our analysis shows that the dominant macroscopic effect of this instability is to drive substantial ion heating. In contrast to earlier studies reporting significant anomalous resistivity, we find that anomalous contributions due to the ion-acoustic instability are minimal. These results shed light on the dynamical impact of this instability on reconnection processes, offering new insights into the fundamental physics governing collisionless reconnection.
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