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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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287 records · Page 16
All sourcesNASA NTRSDOE OSTI
NASA NTRS2009

Radial Breathing Modes in Cosmochemistry and Meteoritics

One area of continuing interest in cosmochemistry and meteoritics (C&M) is the identification of the nature of Q-phase, although some researchers in C&M are not reporting relevant portions of Raman spectral data. Q is the unidentified carrier of noble gases in carbonaceous chondrites (CCs). Being carbonaceous, the focus has been on any number of Q-candidates arising from the sp2 hybridization of carbon (C). These all derive from various forms of graphene, a monolayer of C atoms packed into a two-dimensional (2D) hexagonal honeycomb lattice that is the basic building block for graphitic materials of all other dimensions for sp2 allotropes of C. As a basic lattice, 2D graphene can be curled into fullerenes (0D), wrapped into carbon nanotubes or CNTs (1D), and stacked into graphite (3D). These take such additional forms as scroll-like carbon whiskers, carbon fibers, carbon onions, GPCs (graphite polyhedral crystals) [6], and GICs (graphite intercalation compounds). Although all of these have been observed in meteoritics, the issue is which can explain the Q-abundances. In brief, one or more of the 0D-3D sp2 hybridization forms of C is Q. For some Q-candidates, the radial breathing modes (RBMs) are the most important Raman active vibrational modes that exist, and bear a direct relevance to solving this puzzle. Typically in C&M they are ignored when present. Their importance is addressed here as smoking-gun signatures for certain Q-candidates and are very relevant to the ultimate identification of Q.

Wilson, T.L.↗
NASA NTRS2010

Metal Vapor Arcing Risk Assessment Tool

The Tin Whisker Metal Vapor Arcing Risk Assessment Tool has been designed to evaluate the risk of metal vapor arcing and to help facilitate a decision toward a researched risk disposition. Users can evaluate a system without having to open up the hardware. This process allows for investigating components at risk rather than spending time and money analyzing every component. The tool points to a risk level and provides direction for appropriate action and documentation.

Hill, Monika C.↗
NASA NTRS2010

NASA-DoD Lead-Free Electronics Project

Original Equipment Manufacturers (OEMs), depots, and support contract ors have to be prepared to deal with an electronics supply chain that increasingly provides parts with lead-free finishes, some labeled no differently and intermingled with their SnPb counterparts. Allowance of lead-free components presents one of the greatest risks to the r eliability of military and aerospace electronics. The introduction of components with lead-free terminations, termination finishes, or cir cuit boards presents a host of concerns to customers, suppliers, and maintainers of aerospace and military electronic systems such as: 1. Electrical shorting due to tin whiskers 2. Incompatibility of lead-f ree processes and parameters (including higher melting points of lead -free alloys) with other materials in the system 3. Unknown material properties and incompatibilities that could reduce solder joint reli ability As the transition to lead-free becomes a certain reality for military and aerospace applications, it will be critical to fully un derstand the implications of reworking lead-free assemblies.

Kessel, Kurt↗
NASA NTRS2010

Environmental Regulations as Drivers of Materials Obsolescence

This slide presentation reviews the operations of the Principal Center for Regulatory Risk Analysis and Communication (RRAC-PC) and the impact of environmental regulations in making some materials obsolete. The center is NASA's resource for identifying and managing risks associated with changing environmental regulations. To this end the center acts as an regulatory early warning system, to review track and analyze emerging regulations, collaborate with the technical community on regulatory risk analysis and interpretation and to represent NASA's interests to the regulatory agencies. Regulations frequently result in making some materials unavailable forcing a change to another material. Processes may also be changed due to environmental regulations. For example some items that were sprayed with a chemical may now have to be painted or dipped with the chemical. Sometimes a regulation changes the use of a certain product, which does not affect the usage on Earth, but has significant implications in space. An example of this is the use of lead-free solders of basically tin, which don't appear to have any problem on Earth, but in space applications tin whiskers have resulted in several confirmed satellite failures.

Scroggins, Sharon↗
NASA NTRS2011

NASA TEERM Hexavalent Chrome Alternatives Projects

The overall objective of the Hex Chrome Free Coatings for Electronics project is to evaluate and test pretreatment coating systems not containing hexavalent chrome in avionics and electronics housing applications. This objective will be accomplished by testing strong performing coating systems from prior NASA and DoD testing or new coating systems as determined by the stakeholders. The technical stakeholders have agreed that this protocol will focus specifically on Class 3 coatings. Original Equipment Manufacturers (OEMs), depots, and support contractors have to be prepared to deal with an electronics supply chain that increasingly provides parts with lead-free finishes, some labeled no differently and intermingled with their SnPb counterparts. Allowance of lead-free components presents one of the greatest risks to the reliability of military and aerospace electronics. The introduction of components with lead-free terminations, termination finishes, or circuit boards presents a host of concerns to customers, suppliers, and maintainers of aerospace and military electronic systems such as: 1. Electrical shorting due to tin whiskers 2. Incompatibility of lead-free processes and parameters (including higher melting points of lead-free alloys) with other materials in the system 3. Unknown material properties and incompatibilities that could reduce solder joint reliability

Kessel, Kurt R.↗
NASA NTRS2011

NASA-DoD Lead-Free Electronics Project. DRAFT Joint Test Report

The use of conventional tin-lead (SnPb) in circuit board manufacturing is under ever-increasing political scrutiny due to increasing regulations concerning lead. The "Restriction of Hazardous Substances" (RoHS) directive enacted by the European Union (EU) and a pact between the United States National Electronics Manufacturing Initiative (NEMI), Europe's Soldertec at Tin Technology Ltd. and the Japan Electronics and Information Technology Industries Association (JEITA) are just two examples where worldwide legislative actions and partnerships/agreements are affecting the electronics industry. As a result, many global commercial-grade electronic component suppliers are initiating efforts to transition to lead-free (Pb-free) in order to retain their worldwide market. Pb-free components are likely to find their way into the inventory of aerospace or military assembly processes under current government acquisition reform initiatives. Inventories "contaminated" by Pb-free will result in increased risks associated with the manufacturing, product reliability, and subsequent repair of aerospace and military electronic systems. Although electronics for military and aerospace applications are not included in the RoHS legislation, engineers are beginning to find that the commercial industry's move towards RoHS compliance has affected their supply chain and changed their parts. Most parts suppliers plan to phase out their non-compliant, leaded production and many have already done so. As a result, the ability to find leaded components is getting harder and harder. Some buyers are now attempting to acquire the remaining SnPb inventory, if it's not already obsolete. Original Equipment Manufacturers (OEMs), depots, and support contractors have to be prepared to deal with an electronics supply chain that increasingly provides more and more parts with Pb-free finishes-some labeled no differently than their Pb counterparts-while at the same time providing the traditional Pb parts. The longer the transition period, the greater the likelihood of Pb-free parts inadvertently being mixed with Pb parts and ending up on what are supposed to be Pb systems. As a result, OEMs, depots, and support contractors need to take action now to either abate the influx of Pb-free parts, or accept it and deal with the likely interim consequences of reduced reliability due to a wide variety of matters, such as Pb contamination, high temperature incompatibility, and tin whiskering. Allowance of Pb-free components produces one of the greatest risks to the reliability of a weapon system. This is due to new and poorly understood failure mechanisms, as well as unknown long-term reliability. If the decision is made to consciously allow Pb-free solder and component finishes into SnPb electronics, additional effort (and cost) will be required to make the significant number of changes to drawings and task order procedures. This project is a follow-on effort to the Joint Council on Aging Aircraft/Joint Group on Pollution Prevention (JCAA/JG-PP) Pb-free Solder Project which was the first group to test the reliability of Pb-free solder joints against the requirements of the aerospace and military community.

Kessel, Kurt↗
NASA NTRS2011

NASA-DoD Lead-Free Electronics Project

Original Equipment Manufacturers (OEMs). depots. and support contractors have to be prepared to deal with an electronics supply chain thaI increasingly provides parts with lead-free finishes. some labeled no differently and intenningled with their SnPb counterparts. Allowance oflead-free components presents one of the greatest risks to the reliability of military and aerospace electronics. The introduction of components with lead-free lenninations, tennination finishes, or circuit boards presents a host of concerns to customers. suppliers, and maintainers of aerospace and military electronic systems such as: 1. Electrical shorting due to tin whiskers; 2. Incompatibility oflead-free processes and parameters (including higher melting points of lead-free alloys) with other materials in the system; and 3. Unknown material properties and incompatibilities that could reduce solder joint re liability.

Kessel, Kurt↗
NASA NTRS2003

MoSi2-Base Composites

Addition of 30 to 50 vol% of Si3N4 particulate to MoSi2 eliminated its low temperature catastrophic failure, improved room temperature fracture toughness and the creep resistance. The hybrid composite SCS-6/MoSi2-Si3N4 did not show any matrix cracking and exhibited excellent mechanical and environmental properties. Hi-Nicalon continuous fiber reinforced MoSi2-Si3N4 also showed good strength and toughness. A new MoSi2-base composite containing in-situ whisker-type (Beta)Si3N4 grains in a MoSi2 matrix is also described.

Hebsur, Mohan G.↗
NASA NTRS2013

In-situ Formation of Reinforcement Phases in Ultra High Temperature Ceramic Composites

A tough ultra-high temperature ceramic (UHTC) composite comprises grains of UHTC matrix material, such as HfB.sub.2, ZrB.sub.2 or other metal boride, carbide, nitride, etc., surrounded by a uniform distribution of acicular high aspect ratio reinforcement ceramic rods or whiskers, such as of SiC, is formed from uniformly mixing a powder of the UHTC material and a pre-ceramic polymer selected to form the desired reinforcement species, then thermally consolidating the mixture by hot pressing. The acicular reinforcement rods may make up from 5 to 30 vol % of the resulting microstructure.

Stackpoole, Margaret M↗
NASA NTRS2015

Analyses of Magnetic Resonance Imaging of Cerebrospinal Fluid Dynamics Pre and Post Short and Long-Duration Space Flights

Preliminary results are based on analyses of data from 17 crewmembers. The initial analysis compares pre to post-flight changes in total cerebral blood flow (CBF) and craniospinal CSF flow volume. Total CBF is obtained by summation of the mean flow rates through the 4 blood vessels supplying the brain (right and left internal carotid and vertebral arteries). Volumetric flow rates were obtained using an automated lumen segmentation technique shown to have 3-4-fold improved reproducibility and accuracy over manual lumen segmentation (6). Two cohorts, 5 short-duration and 8 long-duration crewmembers, who were scanned within 3 to 8 days post landing were included (4 short-duration crewmembers with MRI scans occurring beyond 10 days post flight were excluded). The VIIP Clinical Practice Guideline (CPG) classification is being used initially as a measure for VIIP syndrome severity. Median CPG scores of the short and long-duration cohorts were similar, 2. Mean preflight total CBF for the short and long-duration cohorts were similar, 863+/-144 and 747+/-119 mL/min, respectively. Percentage CBF changes for all short duration crewmembers were 11% or lower, within the range of normal physiological fluctuations in healthy individuals. In contrast, in 4 of the 8 long-duration crewmembers, the change in CBF exceeded the range of normal physiological fluctuation. In 3 of the 4 subjects an increase in CBF was measured. Large pre to post-flight changes in the craniospinal CSF flow volume were found in 6 of the 8 long-duration crewmembers. Box-Whisker plots of the CPG and the percent CBF and CSF flow changes for the two cohorts are shown in Figure 4. Examples of CSF flow waveforms for a short and two long-duration (CPG 0 and 3) are shown in Figure 5. Changes in CBF and CSF flow dynamics larger than normal physiological fluctuations were observed in the long-duration crewmembers. Changes in CSF flow were more pronounced than changes in CBF. Decreased CSF flow dynamics were observed in a subject with VIIP signs. Study limitations include a slightly longer landing-to-MRI scan period for the short-duration cohort and limited sensitivity of the subjective discrete ordinal CPG scale. This limitation can be overcome by using imaging based parametric measures of VIIP severity such as globe deformation measures.

Alperin, Noam↗
NASA NTRS2015

Application of Pinniped Vibrissae to Aeropropulsion

Vibrissae of Phoca Vitulina (Harbor Seal) and Mirounga Angustirostris (Elephant Seal) possessundulations along their length. Harbor Seal Vibrissae were shown to reduce vortex induced vibrations and reduce dragcompared to appropriately scaled cylinders and ellipses. Samples of Harbor Seal vibrissae, Elephant Seal vibrissae andCalifornia Sea Lion vibrissae were collected from the Marine Mammal Center in California. CT scanning, microscopy and3D scanning techniques were utilized to characterize the whiskers. Computational fluid dynamics simulations of thewhiskers were carried out to compare them to an ellipse and a cylinder. Leading edge parameters from the whiskerswere used to create a 3D profile based on a modern power turbine blade. The NASA SW-2 facility was used to performwind tunnel cascade testing on the 'Seal Blades'. Computational Fluid Dynamics simulations were used to studyincidence angles from -37 to +10 degrees on the aerodynamic performance of the Seal Blade. The tests and simulationswere conducted at a Reynolds number of 100,000. The Seal Blades showed consistent performance improvements overthe baseline configuration. It was determined that a fuel burn reduction of approximately 5 could be achieved for a fixedwing aircraft. Noise reduction potential is also explored

vortex induced vibration↗
DOE OSTI2021

Methods for producing metal carbide materials

Methods of producing silicon carbide, and other metal carbide materials. The method comprises reacting a carbon material (e.g., fibers, or nanoparticles, such as powder, platelet, foam, nanofiber, nanorod, nanotube, whisker, graphene (e.g., graphite), fullerene, or hydrocarbon) and a metal or metal oxide source material (e.g., in gaseous form) in a reaction chamber at an elevated temperature ranging up to approximately 2400° C. or more, depending on the particular metal or metal oxide, and the desired metal carbide being produced. A partial pressure of oxygen in the reaction chamber is maintained at less than approximately 1.01×102 Pascal, and overall pressure is maintained at approximately 1 atm.

Garnier, John E.↗
DOE OSTI2022

Catalyst comprising Pt, Ni, and Cr

Catalysts comprising nanostructured elements comprising microstructured whiskers having an outer surface at least partially covered by a catalyst material comprising at least 90 atomic percent collectively Pt, Ni, and Cr, wherein the Pt is present in a range from 32.4 to 35.8 atomic percent, the Ni is present in a range from 57.7 to 63.7 atomic percent, and the Cr is present in a range from 0.5 to 10.0 atomic percent, and wherein the total atomic percent of Pt, Ni, and Cr equals 100. Catalyst described herein are useful, for example, in fuel cell membrane electrode assemblies.

Steinbach, Andrew J. L.↗
DOE OSTI2023

Multi-layered diamond-like carbon coating for electronic components

A multi-layer coating on an outer surface of a substrate includes a first layer applied directly to the outer surface of the substrate. The first layer includes diamond-like carbon (DLC) configured to mitigate metal whisker formation. A second layer is applied on a top surface of the first layer. The second layer is a conformal coating that includes a second material configured to bind to the top surface of the first layer and fill any microfractures that may form in the first layer. Optionally, a third layer is applied on a top surface of the second layer and includes DLC configured to protect the second layer from oxidation and degradation.

Selter, Thomas Matthew↗
DOE OSTI2025

Cutoff and Emergence of Dart Leaders in an Unbranched Positive Leader Simulation

Channel cutoff is the process by which an active lightning channel cools down, goes dark, and loses its ability to effectively conduct electricity. Current cutoff precedes several lightning phenomena, notably dart leaders and return strokes, but the process by which a hot, highly‐conducting leader channel can undergo current cutoff is poorly understood. In this work, we present self‐consistent simulations of positive leader propagation, which include coupled treatment of electrodynamics and plasma physics. The unstable positive leader spontaneously undergoes channel cutoff and creates the conditions for the emission of dart leaders, that is, it accumulates a packet of negative charge at the intersection between cutoff and conducting channel segments. A residual conductivity in the cutoff section facilitates the conversion of the electric field enhancement into a traveling wave, which retraces and reionizes the channel. This is critical for allowing the frail positive leader to keep propagating.

58 GEOSCIENCES↗