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At least 289 records · Page 16

Repeatability of mixed-mode adhesive debonding

The repeatability of debond growth rates in adhesively bonded subjected to constant-amplitude cyclic loading was studied. Debond growth rates were compared from two sets of cracked-lap-shear specimens that were fabricated by two different manufacturers and tested in different laboratories. The fabrication method and testing procedures were identical for both sets of specimens. The specimens consisted of aluminum adherends bonded with FM-73 adhesive. Critical values of strain-energy-release rate were also determined from specimens that were monotonically loaded to failure. The test results showed that the debond growth rates for the two sets of specimens were within a scatter band which is similar to that observed in fatigue crack growth in metals. Cyclic debonding occurred at strain-energy-release rates that were more than an order of magnitude less than the critical strain-energy-release rate in static tests.

Everett, R. A., Jr.↗

Repeatability of mixed-mode adhesive debonding

The repeatability of debond growth rates in adhesively bonded subjected to constant-amplitude cyclic loading was studied. Debond growth rates were compared from two sets of cracked-lap-shear specimens that were fabricated by two different manufacturers and tested in different laboratories. The fabrication method and testing procedures were identical or both sets of specimens. The specimens consisted of aluminum adherends bonded with FM-73 adhesive. Critical values of strain-energy-release rate were also determined from specimens that were monotonically loaded to failure. The test results showed that the debond growth rates for the two sets of specimens were within a scatter band which is similar to that observed in fatigue crack growth in metals. Cyclic debonding occurred at strain-energy-release rates that were more than an order of magnitude less than the critical strain-energy-release rate in static tests.

Everett, R. A., Jr.↗

Theoretical and Experimental Evaluation of the Bond Strength Under Peeling Loads

Reliable applications of adhesively bonded joints require understanding of the stress distribution along the bond-line and the stresses that are responsible for the joint failure. To properly evaluate factors affecting peel strength, effects of defects such as voids on the stress distribution in the overlap region must be understood. In this work, the peel stress distribution in a single lap joint is derived using a strength of materials approach. The bonded joint is modeled as Euler-Bernoulli beams, bonded together with an adhesive. which is modeled as an elastic foundation which can resist both peel and shear stresses. It is found that for certain adhesive and adherend geometries and properties, a central void with the size up to 50 percent of the overlap length has negligible effect on the peak peel and shear stresses. To verify the solutions obtained from the model, the problem is solved again by using the finite element method and by treating the adherends and the adhesive as elastic materials. It is found that the model used in the analysis not only predicts the correct trend for the peel stress distribution but also gives rather surprisingly close results to that of the finite element analysis. It is also found that both shear and peel stresses can be responsible for the joint performance and when a void is introduced, both of these stresses can contribute to the joint failure as the void size increases. Acoustic emission (AE) activities of aluminum-adhesive-aluminum specimens with different void sizes were monitored. The AE ringdown counts and energy were very sensitive and decreased significantly with the void size. It was observed that the AE events were shifting towards the edge of the overlap where the maximum peeling and shearing stresses were occurring as the void size increased.

Nayeb-Hashemi, Hamid↗

Surface characterization in composite and titanium bonding

The failure surface analysis of adhesively bonded carbon fiber composites is described. The emphasis is on the bonding of composites when the surface has been made intentionally resin-rich. Also discussed is surface analysis of both commercially available and pretreated carbon fibers. The interaction of the fibers with polysulfone is described.

Devilbiss, T. A.↗

Attaching Strain Gages to Composite Materials

Polyurethane adhesive bonds strain gages reliably to graphite/epoxy composites. Adhesive easy to apply, used over wide temperature range (ambient to cryogenic), and applied in short time. Tests on gages bonded to composite with adhesive demonstrated reliability of attachment.

Penn, B.↗

RSRM nozzle fixed housing cooldown test

Flight 5 aft segments with nozzles were exposed to -17 F temperatures while awaiting shipment to KSC in February, 1989. No records were found which show that any previous nozzles were exposed to air temperatures as low as those seen by the Flight 5 nozzles. Thermal analysis shows that the temperature of the fixed housing, and forward and aft exit cone components dropped as low as -10 F. Structural analysis of the nozzles at these low temperatures show the forward and aft exit cone adhesive bonds to have a positive margin of safety, based on a 2.0 safety factor. These analyses show the normal and shear stresses in the fixed housing bond as low values. However, the hoop and meridinal stresses were predicted to be in the 4000 psi range; the failure stress allowable of EA913NA adhesive at -7 F. If the bonds did break in directions perpendicular to the surfaces, called bond crazing, no normal bond strength would be lost. Testing was conducted in two phases, showing that no degradation to the adhesive bonds occurred while the Flight 5 nozzles were subjected to subzero temperatures. The results of these tests are documented. Phase 1 testing cooled a full-scale RSRM insulated fixed housing to -13 F, with extensive bondline inspections. Phase 2 testing cooled the witness panel adhesive tensile buttions to -13 F, with failure strengths recorded before, during, and after the cooldown.

Bolieau, D. J.↗

Ultrasonic Characterization of Interfaces in Composite Bonds

The inverse determination of imperfect interfaces from reflection spectra of normal and oblique incident ultrasonic waves in adhesive bonds of multidirectional composites is investigated. The oblique measurements are complicated by the highly dispersed nature of oblique wave spectra at frequencies above 3MHz. Different strategies for bond property reconstruction, including a modulation method, are discussed. The relation of measured interfacial spring density to the physico-chemical model of a composite interface described by polymer molecular bonds to emulate loss of molecular strength on an adhesive composite interface is discussed. This potentially relates the interfacial (adhesion) strength (number of bonds at the adhesive substrate interface) to the spring constant (stiffness) area density (flux), which is an ultrasonically measurable parameter.

Wang, N.↗

Development of the weldbond process for joining titanium

High quality resistance spot welds were produced by welding through epoxy adhesive on titanium alloys. Weldbond joints were consistently stronger than those of either mechanical fasteners, structural adhesive bonds, or mechanical fasteners with adhesive at the joint interface. Weldbond joints and/or spot weld joints showed superior strength at all temperature ranges as compared to other joints tested.

Fields, D.↗

Low-cost ultrasonic lamb-wave transducer

Transducer propagates Lamb wave through thin aluminum sheet material. Model includes two elements that measure effects of damping and loading which, in turn, are indirectly equated to bond integrity. Transducer has been used to evaluate bond integrity of aluminum facing adhesively bonded to aluminum facing. Because of versatility, it is now possible to inspect many objects of different configurations that could not be reached with earlier transducers.

Kammerer, C. C.↗

Thermophysical and flammability characterization of phosphorylated epoxy adhesives

Some of the thermophysical and flammability properties of a phosphorylated epoxy adhesive, which has potential applications in aircraft interior panels, are described. The adhesive consists of stoichiometric ratios of bis(3-glycidyloxphenyl)methylphosphine oxide and bis(3-aminophenyl)methylphosphine oxide containing approximately 7.5% phosphorus. Preliminary data are presented from adhesive bonding studies conducted utilizing this adhesive with polyvinyl fluoride (PVF) film and phenolic-glass laminates. Limiting oxygen index and smoke density data are presented and compared with those of the tetraglycidyl methylene dianiline epoxy resin-adhesive system currently used in aircraft interiors. Initial results indicate that the phosphorylated epoxy compound has excellent adhesive properties when used with PVF film and that desirable fire-resistant properties are maintained.

Kourtides, D. A.↗

Nonlinear analysis of bonded joints with thermal effects

Nonlinear results are presented for adhesive bonded joints. It is shown that adhesive nonlinearities are only significant in the predicted adhesive shear stresses. Adherend nonlinearities and temperature dependent properties are shown to have little effect upon the adhesive stress predictions under mechanical and thermal loadings.

Humphreys, E. A.↗

A critical study of the role of the surface oxide layer in titanium bonding

Scanning electron microscope/X-ray photoelectron spectroscopy (SEM/XPS) analysis of fractured adhesively bonded Ti 6-4 samples is discussed. The text adhesives incuded NR 056X polyimide, polypheylquinoxaline (PPQ), and LARC-13 polyimide. Differentiation between cohesive and interfacial failure was based on the absence of presence of a Ti 2p XPS photopeak. In addition, the surface oxide layer on Ti-(6A1-4V) adherends is characterized and bond strength and durability are addressed. Bond durability in various environmental conditions is discussed.

Dias, S.↗

Criterion for mixed mode fracture in composite bonded joints

A study was undertaken to characterize the debond growth mechanism of adhesively bonded composite joints under mode I, mixed mode I-II, and mode II static loadings. The bonded system consisted of graphite-epoxy composite adherends bonded with a toughened epoxy adhesive. The mode I, mode II and mixed mode I-II fracture energies of the tested adhesives were found to be equal to each other. The criterion for mixed mode fracture in composite bonded joints was found.

Mall, S.↗

Experimental investigation of graphite/polyimide sandwich panels in edgewise compression

The local and general buckling of graphite/polyimide sandwich panels simply supported along all four edges and loaded in uniaxial edgewise compression is investigated. Material properties of sandwich panel constituents (adhesive and facings) were determined from flatwise tension and sandwich beam flexure tests. An adhesive bond study resulted in the selection of a suitable cure cycle for FM 34 polyimide film adhesive and, a bonding technique using a liquid cell edge version of that adhesive resulted in considerable mass savings. Tensile and compressive material properties of the facings, quasiisotropic, symmetric, laminates (0, +45,90,-45)s of Celion/PMR-15, were determined at 116, R.T., and 589 K (-250, R.T., and 600 F) usng the sandwich beam flexure test method. Results indicate the Gr/PI is a usable structural material for short term use at temperatures as high as 589 K (600 F). Buckling specimens were 1006.5 sq cm. 156 sq in., had quasiisotropic symmetric facings (0, + or - 45,90)s and a glass/polyimide honeycomb core (HRH-327-3/8-4).

Camarda, C. J.↗