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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 289 records · Page 16
All sourcesNASA NTRSDOE OSTI
DOE OSTI2024

Design of High-Power Polyphase PCB Coil Systems for Wireless Power Transfer

Printed circuit board (PCB) coils have been proposed prior for implementation as inductive wireless charging coils to minimize size and cost. Utilization of PCBs can allow for a reduced cost, improved manufacturability, and a wide range of geometric customization options. To circumvent material limitations on insulation and thermal performance, parallel paths can be implemented to divide the current per path accordingly. Within this paper, an unconventional high-power PCB coil is designed employing all possible techniques for wiring with axial and radial parallel paths with equivalent transposition to minimize circulating currents. Design studies are simulated in 3D finite element analysis (FEA) to evaluate imbalance between phases with and without transposition. Two experimental prototype coils were fabricated with measurements for self-inductance and mutual inductance between phases. These measurements were validated to be sufficiently consistent with FEA results. Additionally, a method is proposed for a two-step optimization of coupling coefficient and coil losses.

Lewis, Donovin D.↗
DOE OSTI2020

Contoured PPM-EMAT Design for Ultrasonic Communication On Metallic Pipe Channels

Ultrasonic guided waves can be used as the carriers of information in ultrasonic communication for pipe or plate channels. Permanent Periodic Magnet (PPM) Electromagnetic Acoustic Transducer (EMAT) can potentially provide unique capabilities for a communication system as a non-contact transmitter and receiver, which can selectively generate different modes of shear-horizontal (SH) waves. The SH wave shows the potentials in achieving high bitrate without error in ultrasonic communication. However, when a steel pipe is used as the communication channel, especially one with a radius comparable to the size of the transducer, no guided wave signal can be excited or detected by existing PPM-EMAT's with flat coupling surface. In this paper, a 3D printed magnet holder is designed which can shape the magnet array. Also, the transmitter/receiver coils are made of flexible printed circuit which can fit over the curvature of the pipe channels. The contoured PPM-EMAT transmitter and receiver can conform to the surface of the steel pipe channel in order to generate and detect torsional waves. Experimental tests of signal transmission with PPM-EMAT on a 160cm-long stainless steel pipe determine the optimal frequency for communication to be 916KHz. Information transmission experimental results confirm the validity of contoured PPM-EMAT for communication with a bitrate of 5kbps.

Huang, Xin↗
DOE OSTI2020

Sensing Service Transformer Secondary Currents using Planar Magnetic Pick-up Coils

The rapid deployment of distributed energy resources (DERs) is creating stresses on utility assets in the distribution networks. The service transformer, which is the most commonly used utility asset is often not monitored, since the cost of available sensing solutions is as high as the transformer itself. This paper presents a method to use an array of printed circuit board coils to intelligently monitor North American pole top service transformers. The approach, uses a novel, self-calibrating algorithm to infer the fixed geometry of the installation, by recording data over an extended period of time. The proposed method can enable rapid installation of a non-intrusive sensor that can be used to monitor loading levels of the distribution transformer. Furthermore, these sensors can help in planning, prognostics and advanced situational awareness for utilities.

24 POWER TRANSMISSION AND DISTRIBUTION↗
DOE OSTI2024

High-Power Polyphase PCB-Type Inductive Coupler for Wireless Electric Vehicle Charging

The cost and manufacturing difficulty of traditionally wound coils for wireless charging of electric vehicles has led to the exploration of alternative manufacturing for scalable deployment at a range of rated powers. A rotating-field polyphase wireless coupler is developed with balanced fully pitched coils which are not possible with conventional Litz wire. The usage of printed circuit board (PCB) technology is proposed for the innovative construction at large dimensions due to reduced cost, increased ease of manufacturability, and potential geometric customization compared to would coils. Design considerations specific to PCBs are detailed for wireless power transfer coils including advantages such as the potential for many turns and transposition with planar interconnections. A design procedure is developed which may be used to investigate the frequency to power to dimension correlation and limits associated with PCB coils. Designs are simulated in 3D electromagnetic finite element analysis (FEA) for the polyphase coil to evaluate the coupling between coils with varying geometric parameters at 100mm and 500mm outer diameters. A discussion is included on methods to increase PCB power ratings through a mixture of layer stacking, connections, and material selection.

Lewis, Donovin D.↗
DOE OSTI2021

Flexible Fabric-Based IDC Sensors for Conformal Curved Surface Applications

Interdigital capacitor (IDC) sensors are attractive in-situ sensors that can be used to measure permittivity variations in materials. Such sensors could be powerful enablers for cable insulation aging detection. Since insulation aging is correlated with a change in its material permittivity an IDC can measure that change via its measured capacitance. A new thin, flexible fabric-based IDC sensor is introduced for application on conformal curved surfaces such as an electrical cable surface. A multielectrode IDC and its backplane were fabricated using conductive copper polyester taffeta fabrics that were adhesively bonded to nonconductive polyester fabric. The sensor because of its soft flexible structure eliminates the problem of sensor conductor damage which is common for printed circuit board (PCB) type sensors when conformed to the surface of a cable. It also significantly reduces the airgap between the electrodes and the surface that they must contact in order to measure the capacitance. Airgap reduction and consistency are important in order to accurately predict permittivity variations in cable insulation material due to aging. Both PCB-based sensors and the new fabric-based sensors were built and tested on unaged cables and cables that underwent accelerated aging. Results demonstrate the proposed advantages of the novel fabric-based IDC sensor.

interdigital capacitor sensor, IDC, NDE, PCB senso↗
DOE OSTI2023

High-temperature Superconducting Interconnects for Ultra-low Temperature, High-field Environments

Coplanar (with the ground) 20 cm long waveguides are manufactured from the YBCO-on-Kapton material. We investigate the effect of parasitic ground plane resonances on the performance of these waveguides. Here, it is concluded that dense rows stitching vias are essential for isolating the lines to a level below 60 dB at 6 GHz. We demonstrate a metalized via technology that is compatible with both the traditional Flexible Printed Circuit (FPC) process and the epitaxial YBCO material. Stitching via fence with the via period 10 mm is shown as effective in suppressing parasitic resonances at 77 K.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
DOE OSTI2024

Field Harmonic Measurement of High-Gradient Permanent Magnet Quadrupoles for NSLS- II Upgrade

The National Synchrotron Light Source II (NSLS-II) is preparing for a major upgrade based on a new lattice concept, known as “Complex Bend,” to replace its existing double bend achromat (DBA) lattice. Here, this novel lattice will use high-gradient permanent magnet quadrupoles (PMQs) with small apertures in the range of 16–22 mm. A prototype complex bend branch with PMQs has been installed in the NSLS-II linac to evaluate the lattice's performance. An accurate and precise magnetic measurement system is required for field harmonic characterization and magnetic tuning of these PMQs. As part of this project a Rotating-Coil bench, based on a Printed Circuit Board (PCB) coil with a 12 mm diameter, has been configured to measure nine PMQs with bore diameter of 12.7 mm. This PCB coil has an active length of 270 mm, and is able to measure fields up to the 15th harmonic of the main field at a reference radius of 5 mm, while maintaining field quality levels within 10 ppm of the main field. This article presents the PCB coil setup, the harmonic measurement results and their temperature dependencies and repeatability. Simulation results on compensation of undesired multipoles using “IDBuilder”, a genetic algorithm-based optimizer code for magnetic tuning is included for field harmonic corrections.

36 MATERIALS SCIENCE↗
DOE OSTI2026

Magnetic Measurements of Fermilab Rapid-Cycling Booster Gradient Magnets

Fermilab is upgrading its Booster synchrotron to increase ramp rate and intensity. This is part of the Proton Improvement Plan (PIP-II) that will allow the Main Injector to achieve proton beam power of 1.2 MW within the next few years. This upgrade includes running the 55-year-old Booster magnets at 20 Hz instead of the usual 15 Hz, and construction of some shorter and wider aperture versions of these combined-function gradient magnets. Magnetic measurements were performed to characterize the present 15 Hz AC performance, and then again with 20 Hz ramp cycle to ensure performance and compatibility in this new operating regime. A 3 m-long curved flat-coil was developed for these measurements using Printed Circuit Board (PCB) technology. The probe also has a separate 0.5 m-long body-field probe, allowing integral, body, and end fields to be measured across 100 mm of the magnet aperture. The sampling rate for these measurements during the AC cycle was 200 kHz, and field resolution was better than 0.01%. Details of the probe, measurements, and results are presented.

DiMarco, J. [Fermilab] (ORCID:0000000228400036)↗
DOE OSTI2022

A PCB-Embedded 1.2 kV SiC MOSFET Half-Bridge Package for a 22 kW AC–DC Converter

This article presents the design and analysis of a double-side-cooled printed circuit board (PCB) embedded silicon carbide (SiC) MOSFET half-bridge package with low loop inductances and an integrated gate driver. The 1.2 kV SiC MOSFET dies used in the half-bridge package are embedded in the PCB using AT&S's patented technique. The dies are cooled and electrically connected to traces in the PCB through copper-filled microvias. The design methodology accounts for both electrical and thermal performance, limiting the power-loop inductance to 2.3 nH and the maximum package temperature to less than the 175 °C limit. The integration of the gate drive circuitry allows for a high power density and 2.2 nH gate-loop inductances. At 0.12 K/W, the measured junction-to-case thermal resistance with double-sided cooling is 57% lower than that of a TO-247 package. Under similar operating conditions, the PCB-embedded half-bridge package also achieves a 5.6 times lower voltage overshoot and a 0.5% higher peak efficiency than a TO-247-based half-bridge. This article reports the first demonstration of PCB-embedded 1.2 kV SiC MOSFET packages in buck, boost, and ac–dc converters. Furthermore, the prototype three-phase ac–dc converter for an electric vehicle on-board charger is composed of six PCB-embedded half-bridge packages and achieves an efficiency of 98.2% and a power density of 182 W/in 3 .

42 ENGINEERING↗
DOE OSTI2023

PCB-on-DBC GaN Power Module Design with High-Density Integration and Double-Sided Cooling

Lateral gallium nitride (GaN) high-electron-mobility transistors (HEMTs) present better electrical characteristics compared to silicon or silicon carbide devices such as high switching speed and low gate charge, but also present additional challenges on the module design. Here, this paper discusses a high-density GaN power module with double-sided cooling, low inductance, on-package decoupling capacitors, and integrated gate drivers. The GaN dies as well as the gate drive are sandwiched between the printed circuit board (PCB) and direct bonded copper (DBC) substrate to achieve compact loop and double-sided cooling effect. Design considerations and thermal performance are analyzed. A module assembly procedure is presented utilizing the layer-by-layer attachment process. Finally, a 2.7 cm x 1.8 cm half-bridge GaN power module is fabricated and tested, achieving a low power-loop inductance of 1.03 nH, and the overshoot voltage of the switching waveform is less than 5% under a 400-V/25-A double-pulse test. The thermal resistance is 0.32 K/W, verified by simulation and experimental results. The design and assembly process can be generalized and applied to high power applications to achieve high power density and high performance.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
DOE OSTI2022

Proposed Material Properties, Allowable Stresses, and Design Curves of Diffusion Bonded Alloy 800H for the ASME Code Section III Division 5

Abstract Increased interest in compact heat exchangers (CHXs) to serve as intermediate heat exchangers of very high temperature reactors resulted in significant research and development on their design, analysis, and construction. Printed circuit heat exchangers are a type of CHXs with high thermal efficiency and compactness achieved through diffusion bonding a stack of etched plates with millimeter scaled channels. The diffusion bonding process changes the microstructural and mechanical properties of the wrought metal plates. The current nonnuclear design code ASME section VIII, division 1 captures the material property change through a “joint efficiency factor.” However, the current nuclear design code ASME section III, division 5 does not address or support the diffusion bonded material properties. Hence, there is a need to develop allowable stresses, isochronous curves, and fatigue life curves for various diffusion bonded alloys. In this study, Alloy 800H material was selected to establish the diffusion bonded material properties under tension, creep, fatigue, and creep-fatigue loads at elevated temperatures in the range 550–760 °C. A set of tests on diffusion bonded Alloy 800H (DB 800H) were performed and the acquired data are used in developing allowable stresses Sy, Su, Sr, Sm, St, Smt, So, isochronous curves and fatigue life curves according to the ASME section III, division 5 requirements. This paper also presents detailed procedures used in developing the ASME code section III division 5 design provisions for diffusion bonded Alloy 800H.

Engineering↗
DOE OSTI2023

Multi-Objective Optimization of a Bi-Metal High-Temperature Recuperator for Application in Concentrating Solar Power

Supercritical CO 2 closed Brayton cycles are a major candidate for future power cycle designs in concentrating solar power applications, with high-temperature recuperators playing an essential role in realizing their high thermal efficiency. Here, printed circuit heat exchangers (PCHEs) are often chosen for this role due to their thermal-hydraulic and mechanical performance at high temperatures and pressures, all while remaining compact. However, PCHEs can be costly because of the high-performance materials demanded in these applications, and the heat exchanger internal geometry is restricted by their manufacturing process. Additively manufactured heat exchangers can address both of these shortcomings. This work proposes a modular bi-metal high-temperature recuperator with integrated headers to be produced with additive manufacturing. Beginning with existing PCHE channel geometries, a 1D heat exchanger model is developed. Then, multi-objective optimization is used to maximize the heat transfer effectiveness of a lab-scale device while limiting its size. Two distinct channel geometries emerge from the optimization. Optimal designs achieve up to 88% effectiveness with negligible pressure drop. Deterioration of effectiveness due to axial conduction of heat in the heat exchanger walls is found to be a notable problem for lab-scale PCHEs, and the optimal designs obtained here minimize its detrimental effects. A sensitivity analysis reveals that the effectiveness of the recuperator is much less sensitive to variation in mass flowrate in off-design operation when axial conduction is significant, while increasing the length of the device easily increases effectiveness.

14 SOLAR ENERGY↗
DOE OSTI2026

TRIZ-Based Design Improvement for Facilitating Transmission Control Unit Remanufacturing

Design for Remanufacturing (DfRem) centers on enhancing product design and operations to facilitate remanufacturing while increasing both economic and environmental sustainability. DfRem requires a comprehensive understanding of product characteristics, production conditions, and operational constraints. Thus, DfRem requires a systematic methodology to identify and implement alternative designs. Among many critical steps in remanufacturing, disassembly is essential because it directly supports remanufacturing by separation of product components for cleaning, inspection, and other subsequent process steps. This study proposes a TRIZ-based framework to improve product design for disassembly in support of remanufacturing. The framework is applied to a transmission control unit (TCU) case study. The current TCU design prevents remanufacturing due to the sealant-based component joinery, which complicates disassembly and risks damaging the printed circuit board (PCB). After defining technical contradictions for the TCU product design and reviewing the suggested TRIZ principles to solve the conflicts, a cantilever snap-fit design alternative is developed. The economic feasibility of the snap-fit design is assessed by comparing the current and snap-fit design costs for three life cycles. The cost analysis demonstrates that the cost of the snap-fit design remains the same as the current design. Additionally, the snap-fit design offers substantial cost savings for three life cycles compared to the current design. We demonstrate how snap-fit design supports both environmental and economic sustainability.

42 ENGINEERING↗
DOE OSTI2025

Computational Modeling of a 3D Printed Recuperator and Subsequent Experimental Loop for Supercritical Carbon Dioxide Cycles

Oak Ridge National Laboratory (ORNL), in collaboration with mechanical-thermal energy storage (mTES) provider EarthEn, a US Department of Energy (DOE) Lab-Embedded Entrepreneurship Program (LEEP) recipient at ORNL’s Innovation Crossroads 2023, is utilizing a state-of-the-art patented 3D printing technique to design an additively manufactured (AM) supercritical CO2 (sCO2) recuperator (REC) for EarthEn’s charge/discharge cycle. The AM REC will be printed at ORNL’s Manufacturing Demonstration Facility using Inconel Alloy 718 and tested on a closed-loop, ∼100 kW scale experimental facility that is under construction. The testing will compare the printed design against a commercial-off-the-shelf Printed Circuit Heat Exchanger (PCHE) REC. The design of the sCO2 facility is guided by a Modelica-based system model which is primarily dependent on the open-source TRANSFORM library developed at ORNL and uses the open-source CoolProp library for thermophysical properties of sCO2 via the External Media library. It is envisioned that an iterative process will be followed between the physical loop and the system model wherein the initial experimental data will be used to tune the model, which in turn will be used to guide future loop operation. Simultaneously, the AM REC is being designed using computer-aided design models, and it is also being analyzed for hydraulic and thermomechanical response using commercial computational fluid dynamics software, Simcenter STAR-CCM+, on highperformance computing resources.1

See, Nate [ORNL] (ORCID:0000000178581202)↗
DOE OSTI2025

Production, quality assurance and quality control of the SiPM Tiles for the DarkSide-20k Time Projection Chamber

The DarkSide-20k dark matter direct detection experiment will employ a 21 m 2 silicon photomultiplier (SiPM) array, instrumenting a dual-phase 50 tonnes liquid argon Time Projection Chamber (TPC). SiPMs are arranged into modular photosensors called Tiles, each integrating 24 SiPMs onto a printed circuit board (PCB) that provides signal amplification, power distribution, and a single-ended output for simplified readout. Tiles are further grouped into Photo-Detector Units (PDUs). This paper details the production of the Tiles and the Quality Assurance and Quality Control (QA-QC) protocol established to ensure their performance and uniformity. The production and QA-QC of the Tiles are carried out at Nuova Officina Assergi (NOA), an ISO-6 clean room facility at LNGS. This process includes wafer-level cryogenic characterisation, precision die attaching, wire bonding, and extensive electrical and optical validation of each Tile. The overall production yield exceeds 83.5%, matching the requirements of the DarkSide-20k production plan. These results validate the robustness of the Tile design and its suitability for operation in a cryogenic environment.

Acerbi, F. [Fondazione Bruno Kessler]↗
DOE OSTI2021

RF mixing modules for superconducting qubit room temperature control systems v1.0

We have developed a series of compact RF mixing boards by integrating I/Q quadrature mixing, IF(intermediate frequency)/LO(local oscillator)/RF power level adjustments, and DC (direct current) bias fine tuning on a 40 mm × 80 mm 4-layer PCB (printed circuit board) board with EMI (electromagnetic interference) shielding.

Huang, Gang↗
DOE OSTI2024

TTW (Transition to Wire Device) [SWR-25-02]

The Transition to Wire (TTW) hardware project is a method for connecting solar research samples with fragile interconnects to robust, weatherproof and consistent commercial connectors. The Transition to Wire device is a printed circuit board designed to facilitate the transition from tab ribbon or other unsecured electrical contacts on research samples to either wires or a connector. The four pin connector provides a kelvin (4 wire) connection at the solder pad where the sample connects.

McDanold, Byron↗