Nanoscale interfacial melting enables bonding during high velocity microparticle impacts
Melting during high-velocity particle impact has been understood to be typically detrimental to bonding by lowering the strength at the interface and promoting rebound before solidification can occur. Here we establish a possible remedy to this challenge: by dramatically restricting the volume of molten material, its resolidification is accelerated, effectively forming a nanoscale, braze-type joint during impact. In-situ single particle impact imaging is combined with post-mortem structural and chemical analyses to reveal a regime where adhesion is governed not by extensive plastic deformation, but by the kinetics of melt layer resolidification. Furthermore, these findings redefine the role of melting in impact-based processes, establishing transient melting and rapid solidification as a viable strategy for engineering successful adhesion events.