Conductive plastics
Electrically conductive plastics fabrication and applications limitations, discussing plastic matrix materials loaded with various conductive fillers
Litant, I.↗
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Utah FORGE 5-2419: Temperature Testing of Proppants for EGS and Stimulation of Electromagnetic Fracture Mapping Using Electrically-Conducive Proppants - 2024 Annual Workshop Presentation
This is a presentation on the Temperature Testing of Proppants for EGS and Stimulation of Electromagnetic Fracture Mapping Using Electrically-Conducive Proppants by Stevens Institute of Technology, presented by Cheng Chen. This video slide presentation discusses well controlled laboratory experiments testing the high-temperature performance of electrically-conductive and non-electrically-conductive proppants in maintaining fractures hydraulic and electrical conductivities to understand and quantify the thermal-hydrologic-mechanical-chemical mechanisms that regulate the observed behaviors. This will be tested using proppant/fracture imaging via borehole electromagnetic measurements. This presentation was featured in the Utah FORGE R&D Annual Workshop on August 15, 2024.
15 GEOTHERMAL ENERGY↗
Thermal and electrical contact conductance studies
Prediction of electrical and thermal contact resistance for pressed, nominally flat contacts is complicated by the large number of variables which influence contact formation. This is reflected in experimental results as a wide variation in contact resistances, spanning up to six orders of magnitude. A series of experiments were performed to observe the effects of oxidation and surface roughness on contact resistance. Electrical contact resistance and thermal contact conductance from 4 to 290 K on OFHC Cu contacts are reported. Electrical contact resistance was measured with a 4-wire DC technique. Thermal contact conductance was determined by steady-state longitudinal heat flow. Corrections for the bulk contribution ot the overall measured resistance were made, with the remaining resistance due solely to the presence of the contact.
Vansciver, S. W.↗
Thermal conductivity and electrical resistivity of porous material
Thermal conductivity and electrical resistivity of porous materials, including 304L stainless steel Rigimesh, 304L stainless steel sintered spherical powders, and OFHC sintered spherical powders at different porosities and temperatures are reported and correlated. It was found that the thermal conductivity and electrical resistivity can be related to the solid material properties and the porosity of the porous matrix regardless of the matrix structure. It was also found that the Wiedermann-Franz-Lorenz relationship is valid for the porous materials under consideration. For high conductivity materials, the Lorenz constant and the lattice component of conductivity depend on the material and are independent of the porosity. For low conductivity, the lattice component depends on the porosity as well.
Koh, J. C. Y.↗
Apparatus for use in determining surface conductivity at microwave frequencies
An apparatus is provided for use in determining surface conductivity of a flat or shaped conductive material at microwave frequencies. A plate has an electrically conductive surface with first and second holes passing through the plate. An electrically conductive material under test (MUT) is maintained in a spaced apart relationship with the electrically conductive surface of the plate by one or more non-conductive spacers. A first coupling loop is electrically shielded within the first hole while a second coupling loop is electrically shielded within the second hole. A dielectric resonator element is positioned between the first and second coupling loops, while also being positioned closer to the MUT than the electrically conductive surface of the plate. Microwave energy at an operating frequency f is supplied from a signal source to the first coupling loop while microwave energy received at the second coupling loop is measured. The apparatus is capable of measuring the Q-factor of the dielectric resonator situated in the cavity existing between the electrically conductive surface of the plate and the MUT. Surface conductivity of the electrically conductive surface can be determined via interpolation using: 1) the measured Q-factor with the electrically conductive surface in place, and 2) the measured Q-factor when the MUT is replaced with reference standards having known surface conductivities.
Hearn, Chase P.↗
Apparatus for Use in Determining Surface Conductivity at Microwave Frequencies
An apparatus is provided for use in determining surface conductivity of a flat or shaped conductive material at microwave frequencies. A plate has an electrically conductive surface with first and second holes passing through the plate. An electrically conductive material under test (MUT) is maintained in a spaced apart relationship with the electrically conductive surface of the plate by one or more nonconductive spacers. A first coupling loop is electrically shielded within the first hole while a second coupling loop is electrically shielded within the second hole. A dielectric resonator element is positioned between the first and second coupling loops, while also being positioned closer to the MUT than the electrically conductive surface of the plate. Microwave energy at an operating frequency f is supplied from a signal source to the first coupling loop while microwave energy received at the second coupling loop is measured. The apparatus is capable of measuring the Q-factor of the dielectric resonator situated in the 'cavity' existing between the electrically conductive surface of the plate and the MUT. Surface conductivity of the electrically conductive surface can be determined via interpolation using: 1 ) the measured Q-factor with the electrically conductive surface in place, and 2) the measured Q-factor when the MUT is replaced with reference standards having known surface conductivities.
Hearn, Chase P.↗
RFID-Enabled Angular Position Sensing System
An angular position sensing system includes a first support with ring-shaped elements disposed thereon and spaced apart from one another in a curvilinear arrangement. Each ring-shaped element includes an electrically-conductive ring and an RFID integrated circuit electrically coupled to its electrically-conductive ring. A second support has an antenna coupled thereto that defines an electrically-conductive path commensurate in size and shape to at least a portion of the electrically-conductive ring. An interrogator transmits a signal to the antenna wherein electric current is generated along the antenna's electrically-conductive path and electromagnetic energy emanates from the antenna. Any ring-shaped element and its RFID integrated circuit energized by the electromagnetic energy generates in response a data transmission for receipt by the interrogator. A processor coupled to the interrogator derives information related to an angular position of one of the first support and second support using the data transmission.
Fink, Patrick W.↗
Gasket Assembly for Sealing Mating Surfaces
A pair of substantially opposed mating surfaces are joined to each other and sealed in place by means of an electrically-conductive member which is placed in proximity to the mating surfaces. The electrically-conductive member has at least one element secured thereto which is positioned to contact the mating surfaces, and which softens when the electrically-conductive member is heated by passing an electric current therethrough. The softened element conforms to the mating surfaces, and upon cooling of the softened element the mating surfaces are joined together in an effective seal. Of particular significance is an embodiment of the electrically-conductive member which is a gasket having an electrically-conductive gasket base and a pair of the elements secured to opposite sides of the gasket base. This embodiment is positioned between the opposed mating surfaces to be joined to each other. Also significant is an embodiment of the electrically-conductive member which is an electrically-conductive sleeve having an element secured to its inner surface. This embodiment surrounds cylindrical members the bases of which are the substantially opposed mating surfaces to be joined, and the element on the inner surface of the sleeve contacts the outer surfaces of the cylindrical members.
Bryant, Melvin A., III↗
In-Situ Wire Damage Detection System
An in-situ system for detecting damage in an electrically conductive wire. The system includes a substrate at least partially covered by a layer of electrically conductive material forming a continuous or non-continuous electrically conductive layer connected to an electrical signal generator adapted to delivering electrical signals to the electrically conductive layer. Data is received and processed to identify damage to the substrate or electrically conductive layer. The electrically conductive material may include metalized carbon fibers, a thin metal coating, a conductive polymer, carbon nanotubes, metal nanoparticles or a combination thereof.
Williams, Martha K.↗
Semiconductor to Metal Transition in the Solids/Melts of Te and Pseudo-Binary of Hg1-xCdxTe for x = 0, 0.1 and 0.2
This paper reports the experimentally measured thermal and electrical conductivities from which the Lorenz numbers as functions of temperature were derived for the solids and melts of elemental Te and samples of Hg1-xCdxTe of x = 0, 0.1 and 0.2. The structural changes in the vicinity of the solid-liquid phase transition of elemental Te and various Hg1-xCdxTe solid solutions were assessed by closely examining these experimental properties and the derived Lorenz numbers. The values of Lorenz numbers for the solids of these samples were higher than the value of L0, i.e., the Lorenz number for the free electron gas derived by Sommerfeld, implying the characteristics of non-degenerate semiconductor. With the increasing value of x, or the larger bandgap, the materials become more non-degenerate with larger deviation from L0. As the solids started to melt, the measured values of Lorenz number for all samples started to decrease and eventually reached and maintained at values close to L0 at higher temperatures. The trend of the Lorenz number indicates that the transition from non-degenerate semiconductor of the solid samples to metal or degenerate semiconductor when the samples temperature reached above their liquidus temperatures.
thermal conductivity↗
Electrochemical Deposition Of Conductive Copolymers
Experiments show electrically conductive films are deposited on glassy carbon or indium tin oxide substrates by electrochemical polymerization of N-{(3-trimethoxy silyl) propyl} pyrrole or copolymerization with pyrrole. Copolymers of monomer I and pyrrole exhibit desired electrical conductivity as well as desired adhesion and other mechanical properties. When fully developed, new copolymerization process useful in making surface films of selectable conductivity.
Nagasubramanian, Ganesan↗
Embedded Heaters for Joining or Separating Plastic Parts
A proposed thermal-bonding technique would make it possible to join or separate thermoplastic parts quickly and efficiently. The technique would eliminate the need for conventional welding or for such conventional fastening components as bolted flanges or interlocking hooks. The technique could be particularly useful in the sign industry (in which large quantities of thermoplastics are used) or could be used to join plastic pipes. A thin sheet of a suitable electrically conductive material would be formed to fit between two thermoplastic parts to be joined (see figure). The electrically conductive sheet and the two parts would be put together tightly, then an electrical current would be sent through the conductor to heat the thermoplastic locally. The magnitude of the current and the heating time would be chosen to generate just enough heat to cause the thermoplastic to adhere to both sides of the electrically conductive sheet. Optionally, the electrically conductive sheet could contain many small holes to provide purchase or to increase electrical resistance to facilitate the generation of heat. After thermal bonding, the electrically conductive sheet remains as an integral part of the structure. If necessary, the electrically conductive sheet can be reheated later to separate the joined thermoplastic parts.
Bryant, Melvin A., III↗
Shockwave Consolidation of Nanostructured Thermoelectric Materials
Nanotechnology based thermoelectric materials are considered attractive for developing highly efficient thermoelectric devices. Nano-structured thermoelectric materials are predicted to offer higher ZT over bulk materials by reducing thermal conductivity and increasing electrical conductivity. Consolidation of nano-structured powders into dense materials without losing nanostructure is essential towards practical device development. Using the gas atomization process, amorphous nano-structured powders were produced. Shockwave consolidation is accomplished by surrounding the nanopowder-containing tube with explosives and then detonating. The resulting shock wave causes rapid fusing of the powders without the melt and subsequent grain growth. We have been successful in generating consolidated nano-structured bismuth telluride alloy powders by using the shockwave technique. Using these consolidated materials, several types of thermoelectric power generating devices have been developed. Shockwave consolidation is anticipated to generate large quantities of nanostructred materials expeditiously and cost effectively. In this paper, the technique of shockwave consolidation will be presented followed by Seebeck Coefficient and thermal conductivity measurements of consolidated materials. Preliminary results indicate a substantial increase in electrical conductivity due to shockwave consolidation technique.
Prasad, Narasimha S.↗
Analysis of Advanced Thermoelectric Materials and Their Functional Limits
The world's demand for energy is increasing dramatically, but the best energy conversion systems operate at approximately 30% efficiency. One way to decrease energy loss is in the recovery of waste heat using thermoelectric (TE) generators. A TE generator is device that generates electricity by exploiting heat flow across a thermal gradient. The efficiency of a TE material for power generation and cooling is determined by the dimensionless Figure of Merit (ZT): ZT = S(exp. 2)sigmaT/κ: where S is the Seebeck coefficient, sigma is the electrical conductivity, T is the absolute temperature, and κ is the thermal conductivity. The parameters are not physically independent, but intrinsically coupled since they are a function of the transport properties of electrons. Traditional research on TE materials has focused on synthesizing bulk semiconductor-type materials that have low thermal conductivity and high electrical conductivity affording ZT values of 1. The optimization of the σ/κ ratio is difficult to achieve using current material formats, as these material constants are complementary. Recent areas of research are focusing on using nanostructural artifacts that introduce specific dislocations and boundary conditions that scatter the phonons. This disrupts the physical link between thermal (phonon) and electrical (electron) transport. The result is that κ is decreased without decreasing σ. These material formats give ZT values of up to 2 which represent approximately 18% energy gain from waste heat recovery. The next challenge in developing the next generation of TE materials with superior performance is to tailor the interconnected thermoelectric physical parameters of the material system. In order to approach this problem, the fundamental physics of each parameter S, sigma, and κ need to be physically understood in their context of electron/phonon interaction for the construction of new high ZT thermoelectric devices. Is it possible to overcome the physical limit imposed by of the effect of phonon lattice oscillation and energetic electrons towards thermal conductivity? Is the Seebeck coefficient, based on the difference in voltage over temperature gradient ( deltaV/deltaT), an intrinsic parameter of each material? All these parameters were manipulated using nano-bridge and twin-lattice structural concepts at the NASA Langley Research Center. This talk will review the current trend of TE research to optimize the ZT and discuss about new approaches on increasing ZT within functional limits of each parameter.
Kim, Hyun Jung↗
Generation of dynamo magnetic fields in the primordial solar nebula
The present treatment of dynamo-generated magnetic fields in the primordial solar nebula proceeds in view of the ability of the combined action of Keplerian rotation and helical convention to generate, via alpha-omega dynamo, large-scale magnetic fields in those parts of the nebula with sufficiently high, gas-and magnetic field coupling electrical conductivity. Nebular gas electrical conductivity and the radial distribution of the local dynamo number are calculated for both a viscous-accretion disk model and the quiescent-minimum mass nebula. It is found that magnetic fields can be easily generated and maintained by alpha-omega dynamos occupying the inner and outer parts of the nebula.
Stepinski, Tomasz F.↗
NERVA irradiation program, GTR test 21. Volume 3 - Thermal conductivity and electrical resistivity of selected NERVA materials
Thermal conductivity and electrical resistivity of materials for NERVA engine - Vol. 3
Bell, J. R.↗
Method and Apparatus for Obtaining a Precision Thickness in Semiconductor and Other Wafers
A method and apparatus for processing a wafer comprising a material selected from an electrical semiconducting material and an electrical insulating material is presented. The wafer has opposed generally planar front and rear sides and a peripheral edge, wherein said wafer is pressed against a pad in the presence of a slurry to reduce its thickness. The thickness of the wafer is controlled by first forming a recess such as a dimple on the rear side of the wafer. A first electrical conducting strip extends from a first electrical connection means to the base surface of the recess to the second electrical connector. The first electrical conducting strip overlies the base surface of the recess. There is also a second electrical conductor with an electrical potential source between the first electrical connector and the second electrical connector to form. In combination with the first electrical conducting strip, the second electrical conductor forms a closed electrical circuit, and an electrical current flows through the closed electrical circuit. From the front side of the wafer the initial thickness of the wafer is reduced by lapping until the base surface of the recess is reached. The conductive strip is at least partially removed from the base surface to automatically stop the lapping procedure and thereby achieve the desired thickness.
Okojie, Robert S.↗
Thermoelectric Properties in the TiO2/SnO2 System
Nanotechnology has provided a new interest in thermoelectric technology. A thermodynamically driven process is one approach in achieving nanostructures in bulk materials. TiO2/SnO2 system exhibits a large spinodal region with exceptional stable phase separated microstructures up to 1400 C. Fabricated TiO2/SnO2 nanocomposites exhibit n-type behavior with Seebeck coefficients greater than -300 .V/K. Composites exhibit good thermal conductance in the range of 7 to 1 W/mK. Dopant additions have not achieved high electrical conductivity (<1000 S/m). Formation of oxygen deficient composites, TixSn1-xO2-y, can change the electrical conductivity by four orders of magnitude. Achieving higher thermoelectric ZT by oxygen deficiency is being explored. Seebeck coeffcient, thermal conductivity, electrical conductance and microstructure will be discussed in relation to composition and doping.
Dynys, F.↗