Results for “High temperature applications” — Page 17

DOE OSTI2025

Elastic properties of the W 0.75 R e 0.25 alloy at high pressure up to 183 GPa

The high pressure equation of state for the W 0.75 R e 0.25 alloy is experimentally determined up to 183 GPa with synchrotron angle-dispersive powder x-ray diffraction in the diamond-anvil cell and to ∼925 GPa with density-functional theory. W-Re alloys are used in many industrial high-temperature applications and as a confining gasket material in high-pressure diamond-anvil cell research. The inclusion of 25 wt. % Re achieves the highest performance in terms of strength and ductility while also maintaining the body-centered-cubic (bcc) crystal structure, yet to date there has been no investigation into its elastic behavior at high pressure. We present the experimentally and theoretically determined volumetric and elastic pressure response and systematically compare these results to other W-Re alloys, finding that the bulk modulus of W-Re alloys varies nonlinearly with Re content and W 0.75 Re 0.25 becomes less incompressible than W at 85 GPa. Published by the American Physical Society 2025

Alloys↗

NASA NTRS1994

Copper Alloy For High-Temperature Uses

Alloy of Cu/8Cr/4Nb (numbers indicate parts by atom percent) improved over older high-temperature copper-based alloys in that it offers enhanced high temperature strength, resistance to creep, and ductility while retaining most of thermal conductivity of pure copper; in addition, alloy does not become embrittled upon exposure to hydrogen at temperatures as high as 705 degrees C. Designed for use in presence of high heat fluxes and active cooling; for example, in heat exchangers in advanced aircraft and spacecraft engines, and other high-temperature applications in which there is need for such material. High conductivity and hardness of alloy exploited in welding electrodes and in high-voltage and high-current switches and other applications in which wear poses design problem.

Dreshfield, Robert L.↗

NASA NTRS1999

Design Tool Developed for Probabilistic Modeling of Ceramic Matrix Composite Strength

Ceramic matrix composites are being evaluated as candidate materials for many high temperature applications such as engine combustor liners for the High-Speed Civil Transport (HSCT). They are required to have an assured life of several thousand hours. Estimating the reliability of these components is quite a complex process and requires knowledge of the uncertainties that occur at various scales. The properties of ceramic matrix composites (CMC) are known to display a considerable amount of scatter due to variations in fiber/matrix properties, interphase/coating properties, bonding, amount of matrix voids, and many geometry- and fabrication-related parameters such as ply thickness and ply orientations. The objective of this research effort is to account for these uncertainties in a formal way by probabilistically analyzing both the stiffness- and strength related properties of CMC's. In current deterministic approaches, uncertainties are usually accounted for by safety factors. This approach often yields overly conservative designs, thereby reducing the potential of many advanced composite materials.

Murthy, Pappu L. N.↗

NASA NTRS1991

A statistical model of carbon/carbon composite failure

A failure model which considers the stochastic nature of the damage accumulation process is essential to assess reliability and to accurately scale the results from standard test specimens to composite structures. A superior filamentary composite for high temperature applications is composed of carbon fibers in a carbon matrix. Carbon-carbon composites are the strongest known material at very high temperatures. Since there appears to be a significant randomness in C-C material strength which cannot be controlled or detected with current technology, a better model of the material failure based upon statistical principles should be used. Simple applications of the model based upon the limited data provide encouraging results that indicate that better design of test specimens would provide a substantially higher prediction for the design strength of C-C composites. An A-basis strength for the C-C tensile rings from a first stage D-5 billets was estimated. A statistical failure model was developed for these rings which indicates that this strength may be very conservative for larger C-C parts. The analysis may be improved by use of a heterogeneous/noncontinuum finite element approach on the minimechanical level.

Slattery, Kerry T.↗

NASA NTRS1990

Effect of hydrogen on the strength and microstructure of selected ceramics

Ceramics in monolithic form and as composite constituents in the form of fibers, matrices, and coatings are currently being considered for a variety of high-temperature applications in aeronautics and space. Many of these applications involve exposure to a hydrogen-containing environment. The compatibility of selected ceramics in gaseous high-temperature hydrogen is assessed. Environmental stability regimes for the long term use of ceramic materials are defined by the parameters of temperature, pressure, and moisture content. Thermodynamically predicted reactions between hydrogen and several monolithic ceramics are compared with actual performance in a controlled environment. Morphology of hydrogen attack and the corresponding strength degradation is reported for silicon carbide, silicon nitride, alumina, magnesia, and mullite.

Herbell, Thomas P.↗

NASA NTRS1991

Effect of hydrogen on the strength and microstructure of selected ceramics

Ceramics in monolithic form and as composite constituents in the form of fibers, matrices, and coatings are currently being considered for a variety of high-temperature applications in aeronautics and space. Many of these applications involve exposure to a hydrogen-containing environment. The compatibility of selected ceramics in gaseous high-temperature hydrogen is assessed. Environmental stability regimes for the long term use of ceramic materials are defined by the parameters of temperature, pressure, and moisture content. Thermodynamically predicted reactions between hydrogen and several monolithic ceramics are compared with actual performance in a controlled environment. Morphology of hydrogen attack and the corresponding strength degradation is reported for silicon carbide, silicon nitride, alumina, magnesia, and mullite.

Herbell, Thomas P.↗

NASA NTRS1992

Thermal Conductivity Of Natural Type IIa Diamond

Report describes application of flash diffusivity method to measure thermal conductivity of 8.04 x 8.84 x 2.35-mm specimen of natural, white, type-IIa diamond at temperatures between 500 and 1,250 K. Provides baseline for comparison to isotopically pure (12C) diamond. Results used as reference against which diamond films produced by chemical-vapor deposition at low pressures can be compared. High thermal conductivity of diamond exploited for wide variety of applications, and present results also used to estimate heat-conduction performances of diamond films in high-temperature applications.

Vandersande, Jan↗

NASA NTRS2008

Processing and Structural Advantages of the Sylramic-iBN SiC Fiber for SiC/SiC Components

The successful high-temperature application of complex-shaped SiC/SiC components will depend on achieving as high a fraction of the as-produced fiber strength as possible during component fabrication and service. Key issues center on a variety of component architecture, processing, and service-related factors that can reduce fiber strength, such as fiber-fiber abrasion during architecture shaping, surface chemical attack during interphase deposition and service, and intrinsic flaw growth during high-temperature matrix formation and composite creep. The objective of this paper is to show that the NASA-developed Sylramic-iBN SiC fiber minimizes many of these issues for state-of-the-art melt-infiltrated (MI) SiC/BN/SiC composites. To accomplish this, data from various mechanical tests are presented that compare how different high performance SiC fiber types retain strength during formation of complex architectures, during processing of BN interphases and MI matrices, and during simulated composite service at high temperatures.

Yun, H. M.↗

NASA NTRS1981

Amorphous metallizations for high-temperature semiconductor device applications

The initial results of work on a class of semiconductor metallizations which appear to hold promise as primary metallizations and diffusion barriers for high temperature device applications are presented. These metallizations consist of sputter-deposited films of high T sub g amorphous-metal alloys which (primarily because of the absence of grain boundaries) exhibit exceptionally good corrosion-resistance and low diffusion coefficients. Amorphous films of the alloys Ni-Nb, Ni-Mo, W-Si, and Mo-Si were deposited on Si, GaAs, GaP, and various insulating substrates. The films adhere extremely well to the substrates and remain amorphous during thermal cycling to at least 500 C. Rutherford backscattering and Auger electron spectroscopy measurements indicate atomic diffussivities in the 10 to the -19th power sq cm/S range at 450 C.

Wiley, J. D.↗

NASA NTRS1988

Resources: NASA for entrepreneurs

The services of NASA's Technology Utilization Program are detailed and highlights of spinoff products in various stages of completion are described. Areas discussed include: Stirling engines for automotive applications, klystron tubes used to reduce power costs at UHF television stations, sports applications of riblet film (e.g., boat racing), reinforced plastic for high-temperature applications, coating technology appropriate for such applications similar to the renovation of the Statue of Liberty, and medical uses of fuel pump technology (e.g., heart pumps).

Jannazo, Mary Ann↗

NASA NTRS2007

Thermal Testing and Analysis of an Efficient High-Temperature Multi-Screen Internal Insulation

Conventional multi-layer insulations exhibit excellent insulation performance but they are limited to the temperature range to which their components reflective foils and spacer materials are compatible. For high temperature applications, the internal multi-screen insulation IMI has been developed that utilizes unique ceramic material technology to produce reflective screens with high temperature stability. For analytical insulation sizing a parametric material model is developed that includes the main contributors for heat flow which are radiation and conduction. The adaptation of model-parameters based on effective steady-state thermal conductivity measurements performed at NASA Langley Research Center (LaRC) allows for extrapolation to arbitrary stack configurations and temperature ranges beyond the ones that were covered in the conductivity measurements. Experimental validation of the parametric material model was performed during the thermal qualification test of the X-38 Chin-panel, where test results and predictions showed a good agreement.

Weiland, Stefan↗

NASA NTRS2002

Joining and Attachment Technologies for Ceramic Matrix Composites: Current Status and Future Prospects

Fiber reinforced ceramic composites are either currently being used, or are under active consideration for use in a wide variety of high temperature applications. The engineering designs require fabrication and manufacturing of complex shaped parts. In many instances, it is more economical to build up complex shapes by joining simple geometrical shapes. Thus, joining and attachment have been recognized as enabling technologies for successful utilization of ceramic components in various aerospace and ground based applications. In this presentation, various challenges and opportunities in design, fabrication, and testing of high temperature joints in composites will be presented. Various joint design philosophies and design issues in joining of composites will be discussed along with an affordable, robust ceramic joining technology (ARCJoinT). A wide variety of ceramic composites (C/C, C/SiC, and SiC), in different shapes and sizes, have been joined using this technology. Microstructure and mechanical properties of joints will be reported. Current status of various ceramic joining technologies and future prospects for their applications will also be discussed.

Singh, M.↗

DOE OSTI2024

Development of a high-temperature Inconel 625 heat exchanger by model design and binder jetting additive manufacturing

A nickel-based Inconel 625 superalloy heat exchanger for high-temperature applications was developed via binder jetting additive manufacturing. The material properties were characterized first on printed and sintered parts. Two sintering temperatures were used to investigate the effects of the temperature on densification and microstructure. For channel geometry design, the heat transfer capabilities of the heat exchanger were optimized for the cross-section geometry of fluid flow channels in a counterflow configuration, and a stress analysis was conducted to investigate the effects of channel geometry. After headers were incorporated into the heat exchanger as a one-piece component, a prototype was printed. A complete depowdering was achieved via compressed air blowing, and sintering was performed with the developed profile. Ultimately, a one-piece heat exchanger with a nearly full density was obtained. Heat transfer tests were performed on this unit, and the results were compared with those from the simulations. In this study, systematic processes were developed for an additively manufactured Inconel-based heat exchanger for high-pressure, high-temperature heat transfer applications.

36 MATERIALS SCIENCE↗

NASA NTRS2002

Robust Joining and Assembly Technologies for Ceramic Matrix Composites: Technical Challenges and Opportunities

Fiber reinforced ceramic matrix composites are under active consideration for use in a wide variety of high temperature applications within the aeronautics, energy, process, and nuclear industries. The engineering designs require fabrication and manufacturing of complex shaped parts. In many instances, it is more economical to build up complex shapes by Joining simple geometrical shapes. Thus, joining and attachment have been recognized as enabling technologies for successful utilization of ceramic components in various demanding applications. In this presentation, various challenges and opportunities in design, fabrication, and testing of high temperature joints in ceramic matrix composites will be presented. Various joint design philosophies and design issues in joining of composites will be discussed along with an affordable, robust ceramic joining technology (ARCJoinT). A wide variety of ceramic composites, in different shapes and sizes, have been joined using this technology. Microstructure and mechanical properties of joints will be reported. Current status of various ceramic joining technologies and future prospects for their applications will also be discussed.

Mrityunjay, Singh↗

DOE OSTI2025

An accelerated framework for predicting creep rupture lifetimes in engineering alloys

Confidently predicting high-temperature deformation, including creep and creep rupture, is paramount for the design and commercialization of candidate materials for advanced nuclear energy systems. To accelerate creep quantification, we introduce a framework that enables rapid, cost-effective, and reliable prediction of creep rupture lifetimes, minimizing reliance on time-intensive bulk creep testing. Unlike conventional creep analysis, which requires extensive time and resources, our method leverages a maximum of four short-term bulk creep tests as training data for prediction. This framework combines high-throughput nanoindentation up to 700 °C with these targeted bulk tests to inform our creep rupture model in order to predict rupture lifetimes. The strong agreement between our predictions and conventional experimental data demonstrates the effectiveness of our approach for accelerated creep analysis and lifetime prediction of structural components in high-temperature applications. Our multi-pronged approach motivates further integration of computational tools and advanced instrumentation to establish a universal framework for understanding high-temperature material responses.

36 MATERIALS SCIENCE↗

DOE OSTI2024

Enhancement of γ/γ’ Microstructured Cobalt Superalloys Produced from Atomized Powder by Creating a Harmonic Structure

A material’s properties must be continuously improved to meet the demands of extreme conditions in high-temperature applications. It is demonstrated that γ-γ’ Co-based superalloys could surpass the yield stress of Ni-based superalloys at high temperature due to the γ-γ’ structure. The powders were subjected to a harmonic modification in order to refine the grain structure on the surface and to activate the sintering process. This study examines how harmonic structure affects microstructure and mechanical properties at high temperatures. Spark Plasma Sintering (SPS) was used for consolidation to maintain the ultrafine grain size microstructure of the powder. Compression tests were conducted from room temperature (RT) to 750 °C to assess the mechanical properties of the material. Yield stress values obtained from harmonic structures are four times higher than those obtained from cast alloys.

36 MATERIALS SCIENCE↗

NASA NTRSDate not supplied

Pt/HTCC Alumina based Electronic Packaging System and Integration Processes for High Temperature Harsh Environment Applications

Electronic devices capable of operation at 500°C are required for long term Venus surface missions, as well as for in situ monitoring and control of next generation aeronautical engines. High temperature sensors and electronics can also find many applications in military, and energy and automobile industries. Various silicon carbide (SiC) sensors and electronic devices have been developed for operation at 500 °C, and a compatible packaging system is needed for long term test and deployment of these high temperature devices. High temperature co-fired ceramics (HTCC) alumina with platinum (Pt) conductor was proposed for high temperature electronic packaging. A prototype Pt/HTCC alumina packaging system including chip-level package and circuit board has been briefly reported previously for long-term electrical testing of SiC integrated circuits at 500 °C, and brief testing at much higher temperatures. HTCC alumina is an excellent dielectric material with acceptable dielectric constant and low dielectric loss over wide temperature and frequency ranges. Pt is chemically noble and can be co-fired with HTCC alumina in air ambient producing a viable electronic packaging material system for high temperature applications. This paper presents a more detailed description of this packaging system including prototype low power packages and circuit boards based on HTCC alumina and Pt metallization for 500°C and other harsh environment applications. The key technical considerations for chip-level packaging and circuit board assembly, including materials and processes for 500 °C durable wire-bonding and SiC die attach, and integration of multi-chip circuit boards, are presented. Experimental test results of this packaging approach applied to SiC integrated circuits at 500 °C and 700°C are discussed as well.

High temperature↗

NASA NTRSDate not supplied

Pt/HTCC Alumina based Electronic Packaging System and Integration Processes for High Temperature Harsh Environment Applications

Electronic devices capable of operation at 500°C are required for long term Venus surface missions, as well as for in situ monitoring and control of next generation aeronautical engines. High temperature sensors and electronics can also find many applications in military, and energy and automobile industries. Various silicon carbide (SiC) sensors and electronic devices have been developed for operation at 500 °C, and a compatible packaging system is needed for long term test and deployment of these high temperature devices. High temperature co-fired ceramics (HTCC) alumina with platinum (Pt) conductor was proposed for high temperature electronic packaging. A prototype Pt/HTCC alumina packaging system including chip-level package and circuit board has been briefly reported previously for long-term electrical testing of SiC integrated circuits at 500 °C, and brief testing at much higher temperatures. HTCC alumina is an excellent dielectric material with acceptable dielectric constant and low dielectric loss over wide temperature and frequency ranges. Pt is chemically noble and can be co-fired with HTCC alumina in air ambient producing a viable electronic packaging material system for high temperature applications. This paper presents a more detailed description of this packaging system including prototype low power packages and circuit boards based on HTCC alumina and Pt metallization for 500°C and other harsh environment applications. The key technical considerations for chip-level packaging and circuit board assembly, including materials and processes for 500 °C durable wire-bonding and SiC die attach, and integration of multi-chip circuit boards, are presented. Experimental test results of this packaging approach applied to SiC integrated circuits at 500 °C and 700°C are discussed as well.

electronic packaging↗