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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 307 records · Page 17

NY TBO Research: Integrated Demand Management (IDM): IDM Concept, Tools, and Training Package

A series of human-in-the-loop simulation sessions were conducted in the Airspace Operations Laboratory (AOL) to evaluate a new traffic management concept called Integrated Demand Management (IDM). The simulation explored how to address chronic equity, throughput and delay issues associated with New Yorks high-volume airports by operationally integrating three current and NextGen capabilities the Collaborative Trajectory Options Program (CTOP), Time-Based Flow Management (TBFM) and Required Time of Arrival (RTA) in order to better manage traffic demand within the National Air Traffic System. A package of presentation slides was developed to describe the concept, tools, and training materials used in the simulation sessions. The package will be used to outbrief our stakeholders by both presenting orally and disseminating of the materials via email.

trajectory-based operations↗

Non-Axisymmetric Inflatable Pressure Structure (NAIPS) Concept that Enables Mass Efficient Packageable Pressure Vessels with Sealable Openings

Achieving minimal launch volume and mass are always important for space missions, especially for deep space manned missions where the costs required to transport mass to the destination are high and volume in the payload shroud is limited. Pressure vessels are used for many purposes in space missions including habitats, airlocks, and tank farms for fuel or processed resources. A lucrative approach to minimize launch volume is to construct the pressure vessels from soft goods so that they can be compactly packaged for launch and then inflated en route or at the final destination. In addition, there is the potential to reduce system mass because the packaged pressure vessels are inherently robust to launch loads and do not need to be modified from their in-service configuration to survive the launch environment. A novel concept is presented herein, in which sealable openings or hatches into the pressure vessels can also be fabricated from soft goods. To accomplish this, the structural shape is designed to have large regions where one principal stress is near zero. The pressure vessel is also required to have an elongated geometry for applications such as airlocks.

Doggett, William R.↗

UTM RTT CWG Concept & Use Cases Package #2

The Concept & Use Cases Package #2: Technical Capability Level 3 document represents the collaborative research efforts between the FAA and NASA as joint members of the Unmanned Aircraft System Traffic Management (UTM) Research Transition Team (RTT). Contained in this document are the 1) Terms and Definitions, 2) Foundational Principles, 3) Concept Narratives, 4) Use Cases, 5) Operational Views, and 6) Roles and Responsibilities of actors interacting within what is considered to be encompassed by Technical Capability Level 3 UTM operating environments. The contents of Package #2 should NOT be considered established policy or construed as regulatory in nature. What is presented is meant to communicate the current, agreed upon understanding between the FAA and NASA on particular features of UTM as exemplified through use cases and concept narratives for the purposes of supporting joint NASA/Industry Demonstrations and the UTM Pilot Program. It is also meant to foster discussion and refinement of the concepts and approaches being pursued by the other RTT working groups.

RTT↗

Recovery, Restoration and Archiving of Previously Lost Data and Metadata from the Apollo Lunar Surface Experiments Package (ALSEP)

The Apollo Lunar Surface Experiments Package (ALSEP) is the name used to collectively represent the geophysical instruments deployed on the lunar surface by the astronauts on Apollo 12, 14, 15, 16, and 17. These instruments were active from the times of their deployment (November 1969 – December 1972) to September 1977. During that time, fourteen types of experiments were conducted, and their data were transmitted to Earth. The experiment PIs processed them. At the conclusion of the experiments, some of these data were submitted to the NASA Space Science Data Coordinated Archive (NSSDCA) for archiving, while others were not. The raw instrument data received from the Moon prior to March 1976 were not archived, either. The unarchived data, resided on open-reel magnetic tapes, became lost in the decades since, along with much of the metadata (the information necessary/useful in properly processing/analyzing the data). This article retraces the history of the ALSEP data archiving efforts in the 1970s, the subsequent loss of the data tapes, and the search, recovery, and restoration of the lost data by contemporary researchers in the 21st century. In 2006, NSSDCA began reformatting some of the ALSEP data archived in the 1970s to conform with the current Planetary Data System (PDS). In 2010, 440 of the previously lost magnetic tapes containing the raw ALSEP data were recovered. From these tapes, the data were extracted, re-packaged for individual experiments, and, for those with sufficient metadata, processed into higher order data readily usable by researchers. All of these data products have been recently archived with either PDS or NSSDCA. These newly restored data fill a number of gaps in the previously existing archive of the ALSEP data. In addition, tens of thousands of pages of Apollo era documents have been optically scanned and compiled into an online searchable catalog. This article also describes the content, organization, and usage of the restored raw ALSEP data and metadata.

S Nagihara↗

TriTruss Packaging and Deployment Trade Study

A trade study was conducted that evaluated viable concepts of operation for the packaging and deployment (P&D) of novel deployable modular truss modules, called TriTruss modules, that can be assembled to form a large aperture In-Space Assembled Telescopes (iSAT). In this first phase of an ongoing more comprehensive trade study, concepts were proposed and then evaluated based on initial metrics representing features of an ideal P&D concept. The ideal TriTruss P&D concept is defined as one that: allows for efficient packaging, has sufficient geometric versatility to be launch vehicle independent, provides a stiff and lightweight structure, has low mechanical complexity, and has component modularity. The P&D concept should allow for prelaunch subsystem or utility integration if required. The concept should be kinematically simple and be robotically deployed using a minimum number of specialized tools. The P&D concepts evaluated are categorized as: core collapse, face collapse, and erectable structures. Sub-scale models were constructed to help understand the kinematics and mechanical complexity required to enable P&D. Based on a weighting scale, the most promising candidate P&D concepts have been selected and will undergo more rigorous structural design, analysis, and testing in the study’s next phase. The ultimate goal of the comprehensive trade study will be to recommend a single TriTruss design and associated P&D concept that will be built and evaluated at NASA Langley Research Center’s In-Space Assembly Laboratory.

in-space assembly (ISA)↗

Reliability of recolumned area array packages

This report presents qualification guidelines developed for recolumned, high I/O ceramic column grid array (CCGA) packages assembled onto printed wiring/circuit boards (PWBs/PCBs). It includes recolumn and assembly process development for two types of CCGA packages: those with and those without interposer. Thermal cycle test results and photomicrographs showing damage progress for recolumned CCGA assemblies are documented and presented.

Ghaffarian, Reza↗

Flip chip packaging of a MEMS neuro-prosthetic system

A joint research team from California Institute of Technology and Jet Propulsion Laboratory is developing a fully miniaturized, smart implantable neuro-prosthetic system, by combining integrated electronics with Micro Electro Mechanical Structure (MEMS) based electrode arrays. The packaging group of this project team has been tasked with designing and fabricating a package to interface electrically between a MEMS electrode array, capable of extracting signals from brain, and an electronic chip, capable of providing on chip conditioning/processing of extracted data, while delivering the output data to a detector located outside the body.

flip↗

Reliability of area array packages with 1500-2500 I/Os

This report first provides a literature survey for designing, manufacturing, and reliability test results for area array packages with 1500 to 2500 inputs/outputs (I/Os). It then presents test matrix on design, yield, and workmanship defects on assembly and environmental testing, including thermal cycle and mechanical drop-test evaluation results for FCBGA1704, FPBGA432, and PBGA676 I/Os packages assembled onto printed circuit/wiring boards (PCBs/PWBs). Finally, it summarizes lessons learned from test results for assembly and environmental testing along with optical, scanning electron microscopy (SEM), and x-ray photomicrographs showing damage progress.

Ghaffarian, Reza↗

Reliability of CGA/LGA/HDI Package Board/Assembly

This follow-up report presents reliability test results conducted by thermal cycling of five CGA assemblies evaluated under two extreme cycle profiles, representative of use for high-reliability applications. The thermal cycles ranged from a low temperature of −55°C to maximum temperatures of either 100°C or 125°C with slow ramp-up rate (3°C/min) and dwell times of about 15 minutes at the two extremes. Optical photomicrographs that illustrate key inspection findings of up to 200 thermal cycles are presented. Other information presented include an evaluation of the integrity of capacitors on CGA substrate after thermal cycling as well as process evaluation for direct assembly of an LGA onto PCB. The qualification guidelines, which are based on the test results for CGA/LGA/HDI packages and board assemblies, will facilitate NASA projects’ use of very dense and newly available FPGA area array packages with known reliably and mitigation risks, allowing greater processing power in a smaller board footprint and lower system weight.

Ghaffarian, Reza↗

MLtool++ package for machine learning and its applications to materials data

We are developing Mltool++ package of software programs for machine learning (ML). Given the MLtool Python code, we create a faster C++ code with the potential for parallelization. We have extracted materials data from the literature. One dataset contains melting temperatures of stoichiometric 1:1 metallic compounds XZ, composed by elements X={Al, Ti, V, Cr, Zr, Nb, Mo, Hf, Ta, W} and Z={Co, Ni, Cu, Rh, Pd, Ag, Ir, Pt, Au}, and another contains solid-solid symmetry-breaking phase transition temperatures. We studied dependences of temperatures on composition, found several correlations, and parametrized them by analytical functions. Mltool++ package is generic and applicable to any tabulated numeric data.

Pierce M. Pettit↗

Thermal Management System Modeling in the Heat Transport System Simulation (HeaTSSPy) Package

This paper describes the development of a thermal management system (TMS) concept design and analysis software package called Heat Transport System Simulation (HeaTSSPy). Built within Python using the OpenMDAO framework, HeaTSSPy can be used to size and optimize an active (using liquid/air heat exchangers) or passive (using finned heat sinks) TMS. The package makes use of modular TMS elements that allow for the creation of different system architectures and includes components such as heat sinks, heat exchangers, liquid pumps, fans, ducts, air inlets, air nozzles, and liquid pipes. Modeling methods for these components include a combination of physics-based analytical and empirical equations that relate component sizing criteria to system performance. The HeatSSPy heat sink methods are fully detailed within this paper, while the heat exchanger methods are described and referenced from previous work. This paper also uses high-fidelity simulation to validate two different methods of calculating thermal resistance using CFD results. Once the methods are fully described, the code is exercised to compare an active TMS with that of a passive TMS. Design criteria for this study include rejected heat, system altitude, Mach number, and ambient temperature. These criteria are used to develop a TMS system with estimated performance metrics such as weight, drag, and operational power. Results of this paper show the crossover point when a passive system begins to weigh more than an active system for a given heat rejection.

Thermal management system↗