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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 307 records · Page 17
All sourcesNASA NTRSDOE OSTI
NASA NTRS1981

An automated process sequence using preformed cell contacts and interconnects with a total cost of $0.64 per peak watt in 1986

A process sequence is described which utilizes a preformed metal mesh electrostatically bonded to each cell to provide the front contact. Cells of 12 percent AM1 efficiency have been produced using this scheme. This method also permits access to both contacts on the cell from the back side. In addition, low cost cell interconnection is accomplished using a flexible 'printed circuit' sheet which is ultrasonically bonded to the cell contacts. The complete process sequence as well as automated equipment which also uses ion implantation and pulse annealing is described. The total cost for module fabrication is estimated at $0.64 per peak watt for a 30 MW/year plant.

Armini, A. J.↗
NASA NTRS2011

Phase Stability and Thermal Conductivity of Composite Environmental Barrier Coatings on SiC/SiC Ceramic Matrix Composites

Advanced environmental barrier coatings are being developed to protect SiC/SiC ceramic matrix composites in harsh combustion environments. The current coating development emphasis has been placed on the significantly improved cyclic durability and combustion environment stability in high-heat-flux and high velocity gas turbine engine environments. Environmental barrier coating systems based on hafnia (HfO2) and ytterbium silicate, HfO2-Si nano-composite bond coat systems have been processed and their stability and thermal conductivity behavior have been evaluated in simulated turbine environments. The incorporation of Silicon Carbide Nanotubes (SiCNT) into high stability (HfO2) and/or HfO2-silicon composite bond coats, along with ZrO2, HfO2 and rare earth silicate composite top coat systems, showed promise as excellent environmental barriers to protect the SiC/SiC ceramic matrix composites.

Benkel, Samantha↗
NASA NTRS2012

Demonstration of Minimally Machined Honeycomb Silicon Carbide Mirrors

Honeycomb silicon carbide composite mirrors are made from a carbon fiber preform that is molded into a honeycomb shape using a rigid mold. The carbon fiber honeycomb is densified by using polymer infiltration pyrolysis, or through a reaction with liquid silicon. A chemical vapor deposit, or chemical vapor composite (CVC), process is used to deposit a polishable silicon or silicon carbide cladding on the honeycomb structure. Alternatively, the cladding may be replaced by a freestanding, replicated CVC SiC facesheet that is bonded to the honeycomb. The resulting carbon fiber-reinforced silicon carbide honeycomb structure is a ceramic matrix composite material with high stiffness and mechanical strength, high thermal conductivity, and low CTE (coefficient of thermal expansion). This innovation enables rapid, inexpensive manufacturing. The web thickness of the new material is less than 1 millimeter, and core geometries tailored. These parameters are based on precursor carbon-carbon honeycomb material made and patented by Ultracor. It is estimated at the time of this reporting that the HoneySiC(Trademark) will have a net production cost on the order of $38,000 per square meter. This includes an Ultracor raw material cost of about $97,000 per square meter, and a Trex silicon carbide deposition cost of $27,000 per square meter. Even at double this price, HoneySiC would beat NASA's goal of $100,000 per square meter. Cost savings are estimated to be 40 to 100 times that of current mirror technologies. The organic, rich prepreg material has a density of 56 kilograms per cubic meter. A charred carbon-carbon panel (volatile organics burnt off) has a density of 270 kilograms per cubic meter. Therefore, it is estimated that a HoneySiC panel would have a density of no more than 900 kilograms per cubic meter, which is about half that of beryllium and about onethird the density of bulk silicon carbide. It is also estimated that larger mirrors could be produced in a matter of weeks. Each cell is completely uniform, maintaining the shape of the inserted mandrel. Furthermore, the layup creates pressure that insures node bond strength. Each node is a composite laminate using only the inherent resin system to form the bond. This contrasts starkly with the other known method of producing composite honeycomb, in which individual corrugations are formed, cured, and then bonded together in a secondary process. By varying the size of the mandrels within the layup, varying degrees of density can be achieved. Typical sizes are 3/8 and 3/16 in. (approximately 10 and 5 millimeters). Cell sizes up to 1 in. (approximately 25 millimeters) have been manufactured. Similarly, the shape of the core can be altered for a flexible honeycomb structure.

Goodman, William↗
NASA NTRS2003

Superplastic Forming/Adhesive Bonding of Aluminum (SPF/AB) Multi-Sheet Structures

A significant fraction of airframe structure consists of stiffened panels that are costly and difficult to fabricate. This program explored a potentially lower-cost processing route for producing such panels. The alternative process sought to apply concurrent superplastic forming and adhesive bonding of aluminum alloy sheets. Processing conditions were chosen to balance adequate superplasticity of the alloy with thermal stability of the adhesive. As a first objective, an air-quenchable, superplastic aluminum-lithium alloy and a low-volatile content, low-viscosity adhesive with compatible forming/curing cycles were identified. A four-sheet forming pack was assembled which consisted of a welded two-sheet core separated from the face sheets by a layer of adhesive. Despite some preliminary success, of over 30 forming trials none was completely successful. The main problem was inadequate superplasticity in the heat-affected zones of the rib welds, which generally fractured prior to completion of the forming cycle. The welds are a necessary component in producing internal ribs by the 'four-sheet' process. Other challenges, such as surface preparation and adhesive bonding, were adequately solved. But without the larger issue of tearing at the weld locations, complex panel fabrication by SPF/AB does not appear viable.

Wagner, John A.↗
NASA NTRS2005

Bond Testing for Effects of Silicone Contamination

In 2003 ATK Thiokol discovered that the smocks and coveralls worn by its operations personnel for safety and contamination control were themselves contaminated with a silicone defoamer and a silicone oil. As a growing list of items have been identified as having this form of contamination, it was desirable to devise a test method to determine if the contamination level detected could cause subsequent processing concerns. The smocks and coveralls could potentially contact bonding surfaces during processing so the test method focused on dry transfer of the silicone from the clothing to the bonding surface.

Plaia, James↗
NASA NTRSDate not supplied

Sources of Uncertainty in Ultrasonic Phase-Based Assessment of Interfacial Stiffness in Adhesive Joints

Quantitative nondestructive evaluation (NDE) of adhesive joint strength is critical for certifying fastener-free bonded aerospace structures. Unfortunately, available adhesive NDE approaches are only suitable for detecting gross defects and delamination and cannot reliably detect variations in strength in intact bonds. Intact (i.e., nominally defect free) bonds are challenging to inspect because they, by definition, contain no macroscopic defects that would produce a strong NDE signature. Even in the absence of obvious defects, however, bond strength can vary substantially due to factors such as contamination, variations in the adhesive cure processes, and environmental exposure. For ultrasonic bond inspections, the effect of interactions from an imperfect adhesive interface are subtle and may include changes in the frequency content or phase of the ultrasonic signal. The bond condition can be deduced from these subtle changes in the acoustic response using an accompanying physics-based model of adhesive joint interaction. For example, researchers have used the spring network adhesion model of Baik and Thompson [1] to determine the interfacial stiffness of the joint from its ultrasonic response (e.g., [2]). This interfacial stiffness metric describes the bonds resistance to separation between the adhesive and adherent and has shown a strong correlation with joint strength. In this study, interfacial stiffness is assessed using the ultrasonic phase change associated with bond interaction in varying bond conditions. The phase change is measured precisely using a phase-locked-loop instrument over a swept range of frequencies. The phase transition at resonance, where the bond thickness is half the acoustic wavelength, produces a unique signature with which to fit a physics-based model. Interfacial stiffness is determined by minimizing the difference between the theoretical and experimental phase response. Experimental results are presented for glass specimens bonded with aerospace adhesives and a sensitivity analysis is performed to examine the effects of parameters that may be uncertain in the industrial inspection environment – namely bond thickness, adhesive and adherent properties, and porosity. The results are a first step toward an uncertainty quantified version of the measurement technique, show correlation between interfacial stiffness and bond strength, and are another key step toward maturing this approach for use in complex materials and joint geometries. [1] Baik, J.M. and Thompson, R.B., 1984. “Ultrasonic scattering from imperfect interfaces: a quasi-static model”. Journal of Nondestructive Evaluation, 4. [2] Haldren, H.A., Perey, D.F., Yost, W.T., Cramer, K.E., and Gupta, M.C., 2019. “Swept-frequency ultrasonic phase evaluation of adhesive bonding in tri-layer structures”. Journal of the Acoustical Society of America, 145.

Matt Webster↗
NASA NTRS1991

Processing and properties of SiC whisker- and particulate-reinforced reaction bonded Si3N4

The microstructure and mechanical properties of reaction bonded Si3N4 (RBSN) reinforced with SiC whiskers of particles were investigated using RBSN composites made from colloidally pressed octanol dispersions of high-purity Si powders mixed with either SiC whiskers or alpha-SiC particles. Results of investigations, revealing high conversions of Si to Si3N4, specific surface areas, and constant relative densities and strengths, showed that the uniform microstructure and small flaw size of the matrix were maintained in the composites and that no degradation of the reinforcements was taking place. Neither the monolithic nor the composite materials exhibited R-curve behavior. A modest increase in fracture toughness was observed only in the RBSN containing 33 vol pct SiC(p).

Lightfoot, A.↗
NASA NTRS1998

Electrical Bonding: A Survey of Requirement, Methods, and Specifications

This document provides information helpful to engineers imposing electrical bonding requirements, reviewing waiver requests, or modifying specifications on various space programs. Electrical bonding specifications and some of the processes used in the United States have been reviewed. This document discusses the specifications, the types of bonds, the intent of each, and the basic requirements where possible. Additional topics discussed are resistance versus impedance, bond straps, corrosion, finishes, and special applications.

Evans, R. W.↗
NASA NTRS1980

Photonitride passivating coating for IC's

Increased reliability and simplified fabrication result from postassembly preencapsulation passivation process. Photonitride reaction chamber receives silane, ammonia, and mercury from mixing manifold to form passivating coating on IC's. Photonitride layer is barrier to moisture and penetration by mobile ions, and helps to protect IC devices subjected to severe mechanical handling or circuit repair procedures. Process is compatible with variety of wire-bonded lead frame assemblies. Advantages over plasma and sputtering deposition processes are low deposition temperature and zero stray radiation and ion levels.

Hall, T. C.↗
NASA NTRS2018

Conductivity of a Copper-Carbon Covetic Composite

NASA is currently engaged in the development of highly electrically conductive wire for space and aviation power and propulsion applications. Higher levels of electrical conductivity and lower densities compared to copper and aluminum are needed to improve the efficiency of commercial aviation and space flight. Carbon, in various forms, is being considered as a component in composites to increase conductivity and decrease density in Cu and Al. One form of carbon that is currently receiving much interest is known as covectic. The technology currently known as covetics was first introduced by Shugart and Scherer whose patents claimed "Carbon can be incorporated into any of these metals by melting the metal, mixing the carbon into the molten metal and, while mixing, applying a current of sufficient amperage to the molten mixture such that the carbon becomes incorporated into the metal, thereby forming a single phase metal-carbon material." It is reported that in this process a conversion reaction occurs with the carbon forming covalent bonds with the host metal, and that covetic processing enables higher carbon solubility and improvements in properties. Although there is a growing body of work supporting covetic materials, it is still a very new and somewhat controversial field. Composition, density, and electrical conductivity measurements of a covetically processed alloy ingot of Cu and C, with a nominal composition of Cu-0.4wt.% C, were made. A pure Cu ingot was similarly processed for comparison. Sections of these ingots were worked into wire and tested. Only small amounts of C could be detected in the Cu-0.4wt.% C ingot, and trace amounts (0.006 wt.%) in the wire. All wires had densities very close to the full density of pure Cu, indicating a high level of Cu purity and low void fraction. Finally, the electrical conductivity of the Cu-0.4wt.% C wires were 9% lower than the samples similarly processed but without C additions. The wires made without C additions had conductivities approximately equal to pure Cu. The low conductivity of the Cu-0.4wt.% C material is believed to be due to: (1) a structure of interfaces in the wire created by collapsed voids lined with elemental C, (2) impurities, such as Fe in the Cu, which came from the added C, and (3) a small volume fraction of voids.

Degroh, Henry C.↗
NASA NTRSDate not supplied

Apatite Nanoresponse to Acidic Dissolution

Phosphorus uptake by plants and organisms is one of the most important life-sustaining processes occurring in the critical zone (CZ). Because 95% of Earth’s reserves is relatively immobile in the form of apatite, plants and organisms rely on molecular scale solubilization process to extract available P. As the world experiences a global P shortage, influencing food production, it becomes increasingly important to understand apatite dissolution. The detailed study of chemically weathered apatite surfaces at the μm to nm-scale is key to understanding P solubilization and uptake in the CZ, allowing for better crop management and efficient fertilization. Apatite weathering is generally viewed in terms of a pH-dependent process where protons weaken atomic bonds, this leading to the disintegration of the apatite structure. A general feature of apatite weathering in acid and near neutral pH conditions is an apparent non-stoichiometric dissolution characterized by [Ca/P]aq > 1.66 in both fluorapatites (FAP) and hydroxyapatites (HAP). This process leads to the formation of a surface altered layer (SAL) with a different composition from the bulk, which many have argued is a Ca-depleted “leached layer.” We investigated apatite weathering at the nanoscale using FIB-prepared TEM-foils. Our preliminary results based on laboratory-altered FAP at ambient T and pH 3 show the formation of amorphous SALs with a maximum thickness of ~10 nm. High resolution chemical mapping and profiling using STEM-EELS and STEM-EDXS indicate that the SALs are generally, but not always, depleted in Ca and enriched in P. These results provide an alternate view of the mechanism of apatite dissolution with stoichiometric breakdown of the apatite structure, followed by the reprecipitation of an amorphous surface layer depleted in Ca. This mechanism can be described in terms of coupled interfacial dissolution-reprecipitation (CIDR), which is increasingly viewed as a universal mechanism of silicate mineral and glass dissolution. Our observation that apatite may dissolve similarly to silicates implies not only that apatite weathering may be more complex than originally thought, but also that the CIDR mechanism may extend beyond silicates.

mineralogy↗
NASA NTRS2017

Surface Characterization of Carbon Fiber Reinforced Polymers by Picosecond Laser Induced Breakdown Spectroscopy

Adhesive bonding of composite materials requires reliable monitoring and detection of surface contaminants as part of a vigorous quality control process to assure robust and durable bonded structures. Surface treatment and effective monitoring prior to bonding are essential in order to obtain a surface which is free from contaminants that may lead to inferior bond quality. In this study, the focus is to advance the laser induced breakdown spectroscopy (LIBS) technique by using pulse energies below 100 μJ (μLIBS) for the detection of low levels of silicone contaminants in carbon fiber reinforced polymer (CFRP) composites. Various CFRP surface conditions were investigated by LIBS using ∼10 ps, 355 nm laser pulses with pulse energies below 30 μJ. Time-resolved analysis was conducted to optimize the gate delay and gate width for the detection of the C I emission line at 247.9 nm to monitor the epoxy resin matrix of CFRP composites and the Si I emission line at 288.2 nm for detection of silicone contaminants in CFRP. To study the surface sensitivity to silicone contamination, CFRP surfaces were coated with polydimethylsiloxane (PDMS), the active ingredient in many mold release agents. The presence of PDMS was studied by inspecting the Si I emission lines at 251.6 nm and 288.2 nm. The measured PDMS areal densities ranged from 0.15 to 2 μg/cm(sup 2). LIBS measurements were performed before and after laser surface ablation. The results demonstrate the successful detection of PDMS thin layers on CFRP using picosecond μLIBS.

Rodolfo Ledesma↗
NASA NTRS1974

Holographic and ultrasonic detection of bond flaws in aluminum panels reinforced with boron-epoxy

An experimental investigation was made of the application of holographic interferometry to the nondestructive detection of unbonded areas (flaws) in bonded panels. Flaw detection results were compared with results obtained with an ultrasonic flaw detector. Holography, with panel deformation accomplished by a reduction in ambient pressure, is less sensitive for flaws beneath 5 and 10 plies of boron-epoxy than the ultrasonic method, though it does have its operational advantages. A process for the manufacture of bonded panels which incorporate known unbonded areas was also developed. The unbonded areas were formed without the use of foreign materials, which makes the method suitable for the construction of reference standards for bonded panels whenever needed for the proper setup of ultrasonic flaw-detection instruments.

Platt, R. J., Jr.↗
DOE OSTI2024

Towards a quantitative understanding of bonding in supersonic single particle impacts: A three-dimensional FIB-SEM exploration

Particle bonding is crucial to coating quality in cold spray, but it has been a challenge to accurately quantify bonding even in single particle impacts. This paper uses FIB-SEM to explicitly map the particle-substrate interface for Cu-on-Cu single microparticle impacts in a full 3D rendering that spans a wide range of impact velocities. This approach permits a detailed quantification of the total bonding area and all of its associated components. In addition to revealing why prior 2D characterization efforts have missed important details about impact bonding, these data quantitatively reveal the evolution of bonding from its onset at the “critical velocity” V cr (where bonding is generally poor, ∼6 %) to its peak at around 1.3‧V cr (where almost 90 % of the particle bonds). Further increase in the velocity to 1.5‧V cr and beyond finds the onset of hydrodynamic penetration and a decrease in bonding. These data then support the development of a simple analytical model based on oxide rarefication and extrusion of bare metal through gaps in the oxide layer as driving the development of bonding. As a result, the model reproduces the experiments and provides guidance on optimization of bonding as a function of material and process parameters.

Analytical methods↗
NASA NTRS1980

Screening of high temperature adhesives for large area bonding

High temperature-resistant adhesive systems were screened for processability, mechanical and physical properties, operational capability at 589 K (600 F), and the ability to produce large area bonds of high quality in fabricating Space Shuttle components. The adhesives consisted primarily of polyimide systems, including FM34B-18, NR-150B2 (DuPont), PMR-15, LARC-13, LARC-160, Thermid 600, and AI-1130L (AMOCA). The processing studies included preparation of polyimide resins, fabrication of film adhesives, development of lay-up and cure procedures, fabrication of honeycomb sandwich panels, and fabrication of mid-plane bonded panels in joints up to 30.5 cm (12 in.) wide. The screening program included tests for tack and drape properties, reticulation and filleting characteristics, ability to produce void-free or low porosity bonds in mid-plane bonded panels, out-time stability, lap shear strength, climbing drum peel strength, and glass transition temperature (Tg). This paper describes the processing methods developed and the test results.

Stenersen, A. A.↗
NASA NTRS1994

Making Skew-Resistant Fabrics For Composite Layups

Fabrics used in curved composite-material structures prevented from skewing during composite layup by weaving them in modified process in which warp and fill yarns bonded together at their points of contact. (Bonding concept may prove similarly beneficial for braided and knitted fabrics.) In modified weaving process, adhesives prevent excessive shifting of warp and fill yarns with respect to each other.

Farley, Gary L.↗
NASA NTRS1974

Adhesive coating eliminated in new honeycomb-core fabrication process

Technique eliminates use of silicone-based adhesive material as bonding medium. Adhesive requires precise time-temperature cure. Prepreg resin is used as bonding medium, and each layer is laminated together to form honeycomb billet. Process can be used in any application where nonmetallic honeycomb core is being fabricated.

Batty, W. L.↗