Results for “briefing for industry” — Page 17

NASA NTRS2018

Unmanned Aircraft Systems (UAS) Integration in the National Airspace System (NAS) Project - Systems Integration and Operationalization (SIO) Demonstration

The UAS-NAS Project hosted a Systems Integration Operationalization (SIO) Industry Day for the SIO Request for Information (RFI) on November 30, 2017 in San Diego, California. This presentation is being presented to the same group as a follow up regarding the progress that the UAS-NAS project has made on the SIO RFI. The presentation will be virtual with a teleconference

outreach↗

DOE OSTI2020

Leveraging Flexible Smart Manufacturing to Accelerate Industrial Supply Chain Recovery

Any major crisis such as the latest coronavirus disease pandemic will have a monumental effect on the worldwide economy and on the international supply chain. Much of the global supply chain relies on China, Germany, and the United States for manufacturing and distribution; this fragile system is subject to failure. Climactic changes in demand and rapid shortages in necessities are the results of the pandemic’s disruption. The recovery forecast for the ongoing pandemic is uncertain and, therefore, any recovery effort will need to be adaptable to build the supply chain resiliency. A wide adoption of flexible smart automated technologies in the manufacturing sector are helping to build robust supply chains and assisting in recovery. Here, a brief discussion of these smart manufacturing technologies is presented, along with a list of potential supply chain issues and corresponding solutions. Such smart manufacturing technologies possess the potential to empower and revolutionize the traditional manufacturing environment by enhancing its resiliency and flexibility. These smart technologies will play a crucial role in accelerating the worldwide supply chain recovery in and after a pandemic.

99 GENERAL AND MISCELLANEOUS↗

NASA NTRS1981

Review of NASA programs in applying aerospace technology to energy

NASA's role in energy research and development, with the aid of aerospace technology, is reviewed. A brief history, which began in 1974 with studies of solar energy systems on earth, is presented, and the major energy programs, consisting of over 60 different projects, are described, and include solar terrestrial systems, conservation and fossil energy systems, and space utilization systems. Special attention is given to the Satellite Power System and the isolation of nuclear wastes in space. Emerging prospects for NASA programs in energy technology include bioenergy, and ocean thermal energy conversion, coal extraction and conversion technologies, and support to the nuclear industry in power plant systems safety.

Schwenk, F. C.↗

NASA NTRS2023

Lunar Dust Mitigation: A Guide and Reference: First Edition (2021)

On the surface of the Moon, lunar dust specifically presents unique challenges to operations long-term due to regolith particles’ ubiquitous presence in the lunar environment, potential to electrostatically charge and possible chemical reactivity. Whether to avoid exposure, try to remove or simply to tolerate lunar dust infiltrating a system becomes a complex question involving length of required service life, dust effects and critical risks, mass and complexity trades for the entire system. This publication provides a snapshot of advice from topical experts for specific areas of concern to systems targeted for deployment on the lunar surface. Following introductory overview commentary, dust mitigation approaches appropriate to the lunar surface are first addressed for typically static structures such as optical surfaces, radiators, and other thermal control surfaces, followed by regolith exposure concerns for communications equipment and non-optical sensors. The broad topic of mechanisms and mechanical assemblies is broken down to address relevant component level concerns, such as for bearings and for seals. “Soft goods” components of space suits (fabric) specific concerns are discussed, followed finally by brief coverage of human health issues and concerns, though the emphasis of this publication remains with components directly exposed to the harsh lunar surface environment. A description of some lunar surface hazard details, in particular characteristics of lunar surface dust, follows in Appendix A, and more detailed explanations of quantification issues for particulates are in Appendix B. The simple inertial removal of particles from a surface is discussed in Appendix C, followed by a summary of terrestrial best practices for dust mitigation recommended within select industries in Appendix D. The aggregated bibliography of references, while extensive and very useful, should not be construed to be exhaustive and can serve as a constructive start.

dust↗

DOE OSTI2020

Hydropower Geotechnical Foundations: Executive Summary on Current Practice and Innovation Opportunities for Low-Head Applications

The following content provides a companion executive summary of Hydropower Geotechnical Foundations: Current Practice and Innovation Opportunities for Low-Head Applications (DeNeale et al. 2020), a technical report developed by Oak Ridge National Laboratory (ORNL) and Knight Piésold Consulting, with funding from the US Department of Energy (DOE) Water Power Technologies Office (WPTO). This executive summary provides a brief synopsis of the broader information contained in the technical report. This study (and the associated technical report): (1) covers background information on hydropower; (2) describes various characteristics relevant to hydropower foundations for undeveloped US streams; (3) presents the current state of practice in foundation development; (4) provides a representative assessment of conventional hydropower foundation costs and timelines; (5) addresses key challenges facing conventional hydropower foundations; and (6) presents opportunity areas and examples for innovative hydropower foundation technologies while highlighting some advances in non-hydropower industries.

13 HYDRO ENERGY↗

NASA NTRSDate not supplied

Pt/HTCC Alumina based Electronic Packaging System and Integration Processes for High Temperature Harsh Environment Applications

Electronic devices capable of operation at 500°C are required for long term Venus surface missions, as well as for in situ monitoring and control of next generation aeronautical engines. High temperature sensors and electronics can also find many applications in military, and energy and automobile industries. Various silicon carbide (SiC) sensors and electronic devices have been developed for operation at 500 °C, and a compatible packaging system is needed for long term test and deployment of these high temperature devices. High temperature co-fired ceramics (HTCC) alumina with platinum (Pt) conductor was proposed for high temperature electronic packaging. A prototype Pt/HTCC alumina packaging system including chip-level package and circuit board has been briefly reported previously for long-term electrical testing of SiC integrated circuits at 500 °C, and brief testing at much higher temperatures. HTCC alumina is an excellent dielectric material with acceptable dielectric constant and low dielectric loss over wide temperature and frequency ranges. Pt is chemically noble and can be co-fired with HTCC alumina in air ambient producing a viable electronic packaging material system for high temperature applications. This paper presents a more detailed description of this packaging system including prototype low power packages and circuit boards based on HTCC alumina and Pt metallization for 500°C and other harsh environment applications. The key technical considerations for chip-level packaging and circuit board assembly, including materials and processes for 500 °C durable wire-bonding and SiC die attach, and integration of multi-chip circuit boards, are presented. Experimental test results of this packaging approach applied to SiC integrated circuits at 500 °C and 700°C are discussed as well.

High temperature↗

NASA NTRSDate not supplied

Pt/HTCC Alumina based Electronic Packaging System and Integration Processes for High Temperature Harsh Environment Applications

Electronic devices capable of operation at 500°C are required for long term Venus surface missions, as well as for in situ monitoring and control of next generation aeronautical engines. High temperature sensors and electronics can also find many applications in military, and energy and automobile industries. Various silicon carbide (SiC) sensors and electronic devices have been developed for operation at 500 °C, and a compatible packaging system is needed for long term test and deployment of these high temperature devices. High temperature co-fired ceramics (HTCC) alumina with platinum (Pt) conductor was proposed for high temperature electronic packaging. A prototype Pt/HTCC alumina packaging system including chip-level package and circuit board has been briefly reported previously for long-term electrical testing of SiC integrated circuits at 500 °C, and brief testing at much higher temperatures. HTCC alumina is an excellent dielectric material with acceptable dielectric constant and low dielectric loss over wide temperature and frequency ranges. Pt is chemically noble and can be co-fired with HTCC alumina in air ambient producing a viable electronic packaging material system for high temperature applications. This paper presents a more detailed description of this packaging system including prototype low power packages and circuit boards based on HTCC alumina and Pt metallization for 500°C and other harsh environment applications. The key technical considerations for chip-level packaging and circuit board assembly, including materials and processes for 500 °C durable wire-bonding and SiC die attach, and integration of multi-chip circuit boards, are presented. Experimental test results of this packaging approach applied to SiC integrated circuits at 500 °C and 700°C are discussed as well.

electronic packaging↗

NASA NTRSDate not supplied

Pathfinding for Airspace with Autonomous Vehicles (PAAV) Multi-Vehicle Operations with Digital Trajectories

The Path Finding for Airspace with Autonomous Vehicles (PAAV) subproject under ATM-X is developing concepts and solutions to allow pilots to supervise multiple uncrewed flights at a time. This line of research stems from industry's desire to leverage Uncrewed Aircraft (UA) operations to achieve maximum productivity from pilot and aircraft resources, driven partially by pilot staffing shortages. Trajectory based solutions delivered by data link offer a potential solution to the multi-vehicle (m:N) problem by minimizing the number of instructions between remote pilots and air traffic controllers. Furthermore, such solutions avoid the need for pilots to monitor multiple voice frequencies at a time for air traffic control instructions to manage multiple flights. This panel presentation will give a brief introduction to PAAV followed by a description of NASA's AutoResolver capability for generating comprehensive air traffic control clearances and communicating them via data link for controller approval and flight execution.

multi vehicle control, trajectory based operations↗

NASA NTRS2024

Wildland Fire Management Interim ConOps v1.0

This document outlines a concept of operations (ConOps) for a future state of wildland fire prevention, mitigation, and suppression offered as a recommendation and initial guidance for updating current methodologies, technologies, or standards to fit the growing scope of wildland fire. This document serves to collect and summarize the research and work of NASA and other U.S. federal agencies, partner groups, and private industry in envisioning ways, backed by expertise, that could bolster and increase support for firefighting personnel such that overall effectiveness, safety, and efficiency is drastically increased. This document will start with the background of the joint efforts and methods of research and collaboration, followed by a detailed discussion of the current state of wildland fire efforts. In contrast to the current state, the vision for the future state reveals specific areas of improvement with suggestions for potential emerging technologies. With such changes in mind, there is a brief discussion on the impacts of these changes from the systems, organizational, and procedural perspectives, as well as measures by which the effectiveness of this ConOps could be evaluated upon adoption. This is commenced with a general discussion on the various trade-offs considered and areas of improvements. Note, this is the first iteration of this document intended for initial peer review.

transportation↗

NASA NTRS2016

Simulation and Flight Test Data Collection Review for Supporting Phase 1 Detect and Avoid MOPS

RTCA Special Committee 228 is a consortium of government, industry, and academic organizations tasked to develop minimum operational performance standards for UAS detect and avoid systems. The UAS in the NAS (National Airspace System) project is studying the minimum operational performance standards for unmanned aerial systems (UAS's) detect-and-avoid (DAA) system in order to operate in the National Airspace System. Over the past 3 years, the project has executed a series of fast-time simulation, human-in-the-loop experiments, and flight tests in support of this effort. The purpose of this briefing is to summarize the models developed and data collected to overcome UAS integration barriers, so UAS can remain well clear of all traffic.

Santiago, Confesor↗

NASA NTRS2018

Levitation Experiments on ISS: Science and Applications

Levitation experiments on the International Space Station (ISS) are ongoing. The European Space Agency (ESA) Materials Science Laboratory Electromagnetic Levitator (MSL-EML) has been in operation since 2015. US investigators are on several of the European Topical Teams and have been heavily involved with the experiments since 2009. The experiments include magneto-hydrodynamic (MHD) modeling of macro-convection, the effects of convection on microstructure, investigation of metallic glass formation, and much more. Recently NASA selected four proposals to the MaterialsLab NASA Research Announcement (NRA) for experiments on the Japan Aerospace eXploration Agency (JAXA) Electrostatic Levitation Furnace (ELF), which was launched to the ISS in 2015. It is estimated that the four US investigators will have flight experiments on ELF within the next few years. The experiments range from a novel method to measure interfacial tension to investigations of thermophysical properties of metals, metal oxides, and non-linear optical materials. Using the MSL-EML and ELF, US investigators are studying a wide range of NASA exploration-relevant materials. Levitation experiments enable exploration in many ways. For example, high quality thermophysical properties of high-temperature materials are critical to develop accurate models of casting, welding, and metal additive manufacturing, which could lead to more efficient and more reliable production of metallic parts for exploration, commercial, and industrial applications. High-quality thermophysical properties could also lead to the development of functional oxide glass and optical materials. In many cases, the accuracy of available property data is the limiting factor in the predictive capabilities of the models. Many thermophysical properties can be measured in a levitator on Earth, but with convective contamination. This contamination plays a significant role in the formation of the intermediate phases. In particular, nucleation and viscosity measurements demand quiescent conditions that can only be attained in microgravity-based levitation systems. A brief overview of the ongoing and planned levitation experiments on the ISS will be presented, followed by the exploration-relevance.

SanSoucie, Michael P.↗

NASA NTRS1973

Skylab experiments. Volume 1: Physical science, solar astronomy

The basic subject of this volume is the solar astronomy program conducted on Skylab. In addition to descriptions of the individual experiments and the principles involved in their performance, a brief description is included of the sun and the energy characteristics associated with each zone. Wherever possible, related classroom activities have been identified and discussed in some detail. It will be apparent that the relationships rest not only in the field of solar astronomy, but also in the following subjects: (1) physics - optics, electromagnetic spectrum, atomic structure, etc.; (2) chemistry - emission spectra, kinetic theory, X-ray absorption, etc.; (3) biology - radiation and dependence on the sun; (4) electronics - cathode ray tubes, detectors, photomultipliers, etc.; (5) photography; (6) astronomy; and (7) industrial arts.

Source record↗

NASA NTRS1990

Activities of the Structures Division, Lewis Research Center

The purpose of the NASA Lewis Research Center, Structures Division's 1990 Annual Report is to give a brief, but comprehensive, review of the technical accomplishments of the Division during the past calendar year. The report is organized topically to match the Center's Strategic Plan. Over the years, the Structures Division has developed the technology base necessary for improving the future of aeronautical and space propulsion systems. In the future, propulsion systems will need to be lighter, to operate at higher temperatures and to be more reliable in order to achieve higher performance. Achieving these goals is complex and challenging. Our approach has been to work cooperatively with both industry and universities to develop the technology necessary for state-of-the-art advancement in aeronautical and space propulsion systems. The Structures Division consists of four branches: Structural Mechanics, Fatigue and Fracture, Structural Dynamics, and Structural Integrity. This publication describes the work of the four branches by three topic areas of Research: (1) Basic Discipline; (2) Aeropropulsion; and (3) Space Propulsion. Each topic area is further divided into the following: (1) Materials; (2) Structural Mechanics; (3) Life Prediction; (4) Instruments, Controls, and Testing Techniques; and (5) Mechanisms. The publication covers 78 separate topics with a bibliography containing 159 citations. We hope you will find the publication interesting as well as useful.

Source record↗

NASA NTRS2002

Space Ops 2002: Bringing Space Operations into the 21st Century. Track 3: Operations, Mission Planning and Control. 2nd Generation Reusable Launch Vehicle-Concepts for Flight Operations

With the successful implementation of the International Space Station (ISS), the National Aeronautics and Space Administration (NASA) enters a new era of opportunity for scientific research. The ISS provides a working laboratory in space, with tremendous capabilities for scientific research. Utilization of these capabilities requires a launch system capable of routinely transporting crew and logistics to/from the ISS, as well as supporting ISS assembly and maintenance tasks. The Space Shuttle serves as NASA's launch system for performing these functions. The Space Shuttle also serves as NASA's launch system for supporting other science and servicing missions that require a human presence in space. The Space Shuttle provides proof that reusable launch vehicles are technically and physically implementable. However, a couple of problems faced by NASA are the prohibitive cost of operating and maintaining the Space Shuttle and its relative inability to support high launch rates. The 2nd Generation Reusable Launch Vehicle (2nd Gen RLV) is NASA's solution to this problem. The 2nd Gen RLV will provide a robust launch system with increased safety, improved reliability and performance, and less cost. The improved performance and reduced costs of the 2nd Gen RLV will free up resources currently spent on launch services. These resource savings can then be applied to scientific research, which in turn can be supported by the higher launch rate capability of the 2nd Gen RLV. The result is a win - win situation for science and NASA. While meeting NASA's needs, the 2nd Gen RLV also provides the United States aerospace industry with a commercially viable launch capability. One of the keys to achieving the goals of the 2nd Gen RLV is to develop and implement new technologies and processes in the area of flight operations. NASA's experience in operating the Space Shuttle and the ISS has brought to light several areas where automation can be used to augment or eliminate functions performed by crew and ground controllers. This experience has also identified the need for new approaches to staffing and training for both crew and ground controllers. This paper provides a brief overview of the mission capabilities provided by the 2nd Gen RLV, a description of NASA's approach to developing the 2nd Gen RLV, a discussion of operations concepts, and a list of challenges to implementing those concepts.

Hagopian, Jeff↗

NASA NTRS2007

NASA's Software Safety Standard

NASA relies more and more on software to control, monitor, and verify its safety critical systems, facilities and operations. Since the 1960's there has hardly been a spacecraft launched that does not have a computer on board that will provide command and control services. There have been recent incidents where software has played a role in high-profile mission failures and hazardous incidents. For example, the Mars Orbiter, Mars Polar Lander, the DART (Demonstration of Autonomous Rendezvous Technology), and MER (Mars Exploration Rover) Spirit anomalies were all caused or contributed to by software. The Mission Control Centers for the Shuttle, ISS, and unmanned programs are highly dependant on software for data displays, analysis, and mission planning. Despite this growing dependence on software control and monitoring, there has been little to no consistent application of software safety practices and methodology to NASA's projects with safety critical software. Meanwhile, academia and private industry have been stepping forward with procedures and standards for safety critical systems and software, for example Dr. Nancy Leveson's book Safeware: System Safety and Computers. The NASA Software Safety Standard, originally published in 1997, was widely ignored due to its complexity and poor organization. It also focused on concepts rather than definite procedural requirements organized around a software project lifecycle. Led by NASA Headquarters Office of Safety and Mission Assurance, the NASA Software Safety Standard has recently undergone a significant update. This new standard provides the procedures and guidelines for evaluating a project for safety criticality and then lays out the minimum project lifecycle requirements to assure the software is created, operated, and maintained in the safest possible manner. This update of the standard clearly delineates the minimum set of software safety requirements for a project without detailing the implementation for those requirements. This allows the projects leeway to meet these requirements in many forms that best suit a particular project's needs and safety risk. In other words, it tells the project what to do, not how to do it. This update also incorporated advances in the state of the practice of software safety from academia and private industry. It addresses some of the more common issues now facing software developers in the NASA environment such as the use of Commercial-Off-the-Shelf Software (COTS), Modified OTS (MOTS), Government OTS (GOTS), and reused software. A team from across NASA developed the update and it has had both NASA-wide internal reviews by software engineering, quality, safety, and project management. It has also had expert external review. This presentation and paper will discuss the new NASA Software Safety Standard, its organization, and key features. It will start with a brief discussion of some NASA mission failures and incidents that had software as one of their root causes. It will then give a brief overview of the NASA Software Safety Process. This will include an overview of the key personnel responsibilities and functions that must be performed for safety-critical software.

Ramsay, Christopher M.↗

NASA NTRS2017

High Density Packaging Technologies for RF Electronics in Small Spacecraft

This paper will describe a few high density packaging technologies which we are currently exploring for use in current and future small spacecraft applications. The three categories of technologies include organic multichip modules (MCMs), ceramic leadless surface mount technology (SMT) and 3D printed waveguide structures. There are many other packaging technologies that currently exist but these three were selected in part due to their long heritage in various commercial, military and space applications along with each having a relatively clear path to flight. For each of these technologies, detailed examples will be included in which hardware has been fabricated and tested for use in RF electronics for spacecraft transponders. The organic MCM example will be described in most detail and it utilizes a packaging technology by the name of CoreEZ which is a trademark of i3 Electronics. This MCM has shrunk a portion of our electronics down to 1/8th of its previous area. The CoreEZ technology has been shown to be rad hard beyond a total ionizing dose (TID) of 300kRad and the MCM which was fabricated has gone through thermal cycling and shown to have no degradation in performance. The ceramic leadless package examples include packages from high reliability manufactures by the name of KCB solutions and Barry Industries. In the case of KCB solutions, we have multiple products that will be described including a hermetic ceramic carrier which houses three microwave monolithic integrated circuits (MMICs) along with small discrete components. Finally, we will discuss the results of our search for a 3D printing process that allows us to reduce the cost and volume of our waveguide filters and diplexers for low cost small satellite applications. We have fabricated a few prototypes using direct metal laser sintering (DMLS) and metal coated plastics. Each of these packaging technology discussions will have a brief overview of its current and future use.

Aquirre, Fernando↗

NASA NTRS2020

Introduction to UTM Services & Communication

This presentation provides an overview of NASA's UAS traffic management (UTM) system, defines key concepts, and gives a brief recap of the research done thus far. The UTM system is comprised of four key concepts: UAS Service Suppler (USS), USS Network, UAS Supplemental Data Service Suppliers (SDSP), and the Flight Information Management System (FIMS). Walking through an example UTM operation illustrates the basic contribution of and relationship between each of these components. While this is what a future operation could look like, today we have only started down the road. NASA, and particularly NASA Ames, has spent the last four years on UTM research, of which helped inform both regulation and industry.

Claudatos, Lauren↗

NASA NTRS2016

High Density Packaging Technologies for RF Electronics in Small Spacecraft

This paper will describe a few high density packaging technologies which we are currently exploring for use in current and future small spacecraft applications. The three categories of technologies include organic multichip modules (MCMs), ceramic leadless surface mount technology (SMT) and 3D printed waveguide structures. There are many other packaging technologies that currently exist but these three were selected in part due to their long heritage in various commercial, military and space applications along with each having a relatively clear path to flight. For each of these technologies, detailed examples will be included in which hardware has been fabricated and tested for use in RF electronics for spacecraft transponders. The organic MCM example will be described in most detail and it utilizes a packaging technology by the name of CoreEZ which is a trademark of i3 Electronics. This MCM has shrunk a portion of our electronics down to 1/8th of its previous area. The CoreEZ technology has been shown to be rad hard beyond a total ionizing dose (TID) of 300kRad and the MCM which was fabricated has gone through thermal cycling and shown to have no degradation in performance. The ceramic leadless package examples include packages from high reliability manufactures by the name of KCB solutions and Barry Industries. In the case of KCB solutions, we have multiple products that will be described including a hermetic ceramic carrier which houses three microwave monolithic integrated circuits (MMICs) along with small discrete components. Finally, we will discuss the results of our search for a 3D printing process that allows us to reduce the cost and volume of our waveguide filters and diplexers for low cost small satellite applications. We have fabricated a few prototypes using direct metal laser sintering (DMLS) and metal coated plastics. Each of these packaging technology discussions will have a brief overview of its current and future use.

Schatzel, Donald↗