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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 307 records · Page 17
All sourcesNASA NTRSDOE OSTI
DOE OSTI2021

In-situ x-ray computed tomography analysis of fracture mechanisms in ultrasonic additively manufactured Al-6061 alloy

The deformation and failure mechanisms in an ultrasonic additively manufactured Al-6061 alloy are studied using in-situ x-ray computed tomography during tensile deformation as well as ex-situ characterization with scanning electron microscopy. The role of pre-existing voids between the build layers on the failure mechanism is discussed with a focus on individual foil failures and void coalescence.

36 MATERIALS SCIENCE↗
DOE OSTI2026

Digital Twin-Enabled Adaptive Control for Hydroelectric Systems: Turbine Governor and Voltage Regulation

This paper presents a comprehensive digital twin (DT) framework for hydroelectric systems that enables adaptive control of turbine governors and excitation systems without requiring detailed manufacturer specifications. The proposed framework integrates neural network-based system identification with stabilizing adaptive control laws for the installed turbine controller and middle-branch adaptive tuning for the installed voltage regulator. Using real operational data from Unit C-8 at Rocky Reach Dam (1,349 MW capacity), highfidelity neural network models are developed to capture turbine and generator dynamics without requiring detailed manufacturer specifications. The DT enables safe controller synthesis and validation in simulation before deployment. For turbine control, the proposed method achieves a 79.9% mean square error (MSE) reduction compared with that of an optimal controller. For voltage regulation, the adaptive excitation controller achieves approximately 42.6% MSE reduction while preserving installed protection logic. The results demonstrate that DT technology provides a practical pathway for modernizing hydropower control systems with minimal operational disruption.

Gui, Yonghao [ORNL] (ORCID:0000000250435534)↗
NASA NTRS1990

Intelligent Robotic Systems Study (IRSS), phase 2

Under the Intelligent Robotics System Study (IRSS) contract, a generalized robotic control architecture was developed for use with the ProtoFlight Manipulator Arm (PFMA). The controller built for the PFMA provides localized position based force control, teleoperation and advanced path recording and playback capabilities. Various hand controllers can be used with the system in conjunction with a synthetic time delay capability to provide a realistic test bed for typical satellite servicing tasks. The configuration of the IRSS system is illustrated and discussed. The PFMA has six computer controllable degrees of freedom (DOF) plus a seventh manually indexable DOF, making the manipulator a pseudo 7 DOF mechanism. Because the PFMA was not developed to operate in a gravity field, but rather in space, it is counter balanced at the shoulder, elbow and wrist and a spring counterbalance has been added near the wrist to provide additional support. Built with long slender intra-joint linkages, the PFMA has a workspace nearly 2 meters deep and possesses sufficient dexterity to perform numerous satellite servicing tasks. The manipulator is arranged in a shoulder-yaw, pitch, elbow-pitch, and wrist-pitch, yaw, roll configuration, with an indexable shoulder roll joint. Digital control of the PFMA is implemented using a variety of single board computers developed by Heurikon Corporation and other manufacturers. The IRSS controller is designed to be a multi-rate, multi-tasking system. Independent joint servos run at a 134 Hz rate and position based impedance control functions at 67 Hz. Autonomous path generation and hand controller inputs are processed at a 33 Hz.

Source record↗
NASA NTRS1989

Measurement of surface microtopography using helicopter-mounted stereo film cameras and two stereo matching techniques

A common problem in acquiring ground-truth data for use in microwave interaction modeling is the capture of surface roughness data that are both sampled at distances comparable to a fraction of the wavelength and extensive enough to represent the surface statistics in at least one resolution cell of the microwave remote sensor used. A technique has been developed for acquiring the necessary photogrammetric data using twin 70-mm film cameras mounted on a helicopter boom. The apparatus is described, and the accuracy with which ground surface roughness can be characterized using this device is estimated. Both standard and cross-correlation methods were used for data reduction. Stereogrammetry is compared with a completely automated image-matching technique. Dense disparity images were generated from the helicopter stereo pairs. Using interior orientation parameters supplied by the camera manufacturers, and assuming that exterior orientation parameters remain constant between control target and test field photography, an extremely dense DEM (digital elevation model) for a test field has been derived. Results are compared, and accuracy estimates are presented.

Wall, S. D.↗
NASA NTRS2023

Assessing Flow Formability of Aerospace Aluminum Alloys via DIC Tensile Testing

Over the past decade, NASA Langley Research Center (LaRC) has championed integrally stiffened cylinder (ISC) technology for single-piece, cryogenic tank barrels on launch vehicles. The current investigation aims to extend the hybrid spin/shear/flow forming process to aircraft fuselage structures, a damage tolerance critical application. The WF Maschinenbau VUD-600® vertical spin/flow forming facility recently established at LaRC represents a reasonable sub-scale facsimile of the ISC deformation process for research and development (R&D) purposes. The objective of this study is to explore whether tensile testing with digital image correlation (DIC) is an effective way to rank the formability of candidate aerospace Al alloys and expedite empirical forming trials. Specific tensile data, such as reduction of area, strain hardening exponent, and modulus of resilience, are used as formability metrics for a variety of alloy/temper/product form combinations. Results from high-strength aluminum alloys AA 2139, AA 2050, AA 2043 and AA 2219 are compared with the medium-strength, highly formable AA 6061 benchmark. Rolled, forged and cast preform materials in both the -O temper (fully annealed) and -T4 temper (solution-treated, quenched, and naturally aged) conditions are evaluated. AA 2139 plate in the -T4 temper emerges as the top-ranked material, based on the criteria selected. Starting with preforms in the -T4 temper will result in flow-formed material exhibiting mechanical properties closer to aircraft fuselage requirements. The optimum balance between strength and damage tolerance may also be achieved via post-forming procedures that avoid quenching and stretching.

Aluminum alloys↗
DOE OSTI2024

PRODUCTION OF GLASS-TO-METAL SEALS USING ADDITIVE MANUFACTURING TECHNIQUES

Glass-to-metal (GtM) seals are hermetic barriers between glass and metal components, often used in the electronic and vacuum industries. Creating the seals traditionally requires heating all the components to the glass melting temperature, where the glass will flow and bond to the metal. Due to the manufacturing constraints of the individual components and sealing conditions there are geometric and material restrictions. Additive manufacturing techniques were used to make GtM seals to reduce these restrictions. Hermetic, single pin seals were produced using printed metal shells, by selective laser melting (SLM), and digital light processing (DLP) printed glass preforms. Glass preforms were printed with photosensitive resin mixed with a silicate sealing glass powder in a 1:2 weight ratio. Thermal analysis, TGA/DSC, and screening experiments were used to determine an organic removal schedule. Video techniques determined a sintering schedule by producing a densification curve at different isothermal holds which were fit with a viscous sintering model. Single pin seals were also produced use a laser assisted manufacturing (LAM) process as an alternative to the conventional furnace sealing process. A Nd:YAG laser was focused on a solid glass preform, heating the glass to form the glass-metal bond. The sealing glass was doped with a transition metal oxide, Fe2O3 or CuO, to increase absorption of the laser wavelength. The interface of hermetic LAM seals were analyzed using electron microscopy, compared to conventional prepared seals, finding a reduction of interfacial morphologies.

Read, Aaron Reece↗
DOE OSTI2024

A 32-Channel Cryo-CMOS ASIC for SNSPD Biasing and Readout with Picosecond

Superconducting nanowire single-photon detectors (SNSPD) are a promising technology for particle detection. Although SNSPDs have demonstrated picosecond timing accuracy, scaling up large arrays has proved challenging. In this work, we introduce a 32-channel cryo-CMOS application-specific integrated circuit (ASIC) that can be tightly integrated with SNSPD arrays. The ASIC is designed to operate at a temperature of 4K and can perform up to 32 simultaneous timing measurements with a root-mean-square (RMS) accuracy of 8.0ps. The ASIC includes on-chip circuitry for externally biasing superconducting devices, low-noise amplifiers for reading superconducting devices, high-resolution time-to-digital converters (TDC) for time-tagging events, and serializers for transmitting data to room-temperature electronics. The ASIC is manufactured in a 22nm FDSOI process and occupies an area of 4.0mm x 1.0mm. The performance of the ASIC was verified using custom cryogenic device models internally developed for the 22nm SOI process. Measurement results will be presented at the conference.

Fredenburg, Jeff↗
DOE OSTI2024

A 32-Channel Cryo-CMOS ASIC for SNSPD Biasing and Readout with Picosecond Timing

Superconducting nanowire single-photon detectors (SNSPD) are a promising technology for particle detection. Although SNSPDs have demonstrated picosecond timing accuracy, scaling up large arrays has proved challenging. In this work, we introduce a 32-channel cryo-CMOS application-specifc integrated circuit (ASIC) that can be tightly integrated with SNSPD arrays. The ASIC is designed to operate at a temperature of 4K and can perform up to 32 simultaneous timing measurements with a root-mean-square (RMS) accuracy of 8.0ps. The ASIC includes on-chip circuitry for externally biasing superconducting devices, low-noise amplifers for reading superconducting devices, high-resolution time-to-digital converters (TDC) for time-tagging events, and serializers for transmitting data to room-temperature electronics. The ASIC is manufactured in a 22nm FDSOI process and occupies an area of 4.0mm x 1.0mm. The performance of the ASIC was verifed using custom cryogenic device models internally developed for the 22nm SOI process. Measurement results will be presented at the conference.

Fredenburg, Jeff↗
DOE OSTI2026

Evaluating Protection System Performance for a Real-World Weak Grid Area With High Inverter-Based Resources

This paper evaluates an existing protection scheme implemented in a real-world weak grid area with a high penetration of inverter-based resources (IBRs). The study aims to assess the reliability and adequacy of protection schemes originally designed for traditional synchronous machine systems and determine whether they can continue to operate reliably in systems with high levels of IBRs. Hardware relays are tested using a controller-hardware-in-the-loop setup. PSCAD electromagnetic transient simulation with an IBR original equipment manufacturer black-box model is used to perform fault studies and generate COMTRADE data, which are replayed by a realtime digital simulator (RTDS) to feed input to the hardware relays. Three scenarios are analyzed: normal operation, an N-1 contingency, and an IBR-only scenario. The evaluation results reveal the following: 1) the protection scheme remains reliable under normal conditions and N-1 contingencies and 2) in IBRonly scenarios, differential protection (87L) continues to operate reliably, whereas local protection elements, such as distance and directional elements, fail because of the lack of regulated negative sequence current contributed by IBRs. These findings provide utilities with valuable insights for improving their protection systems in high-IBRs.

24 POWER TRANSMISSION AND DISTRIBUTION↗
DOE OSTI2024

Future of plasma etching for microelectronics: Challenges and opportunities

Plasma etching is an essential semiconductor manufacturing technology required to enable the current microelectronics industry. Along with lithographic patterning, thin-film formation methods, and others, plasma etching has dynamically evolved to meet the exponentially growing demands of the microelectronics industry that enables modern society. At this time, plasma etching faces a period of unprecedented changes owing to numerous factors, including aggressive transition to three-dimensional (3D) device architectures, process precision approaching atomic-scale critical dimensions, introduction of new materials, fundamental silicon device limits, and parallel evolution of post-CMOS approaches. The vast growth of the microelectronics industry has emphasized its role in addressing major societal challenges, including questions on the sustainability of the associated energy use, semiconductor manufacturing related emissions of greenhouse gases, and others. The goal of this article is to help both define the challenges for plasma etching and point out effective plasma etching technology options that may play essential roles in defining microelectronics manufacturing in the future. The challenges are accompanied by significant new opportunities, including integrating experiments with various computational approaches such as machine learning/artificial intelligence and progress in computational approaches, including the realization of digital twins of physical etch chambers through hybrid/coupled models. These prospects can enable innovative solutions to problems that were not available during the past 50 years of plasma etch development in the microelectronics industry. To elaborate on these perspectives, the present article brings together the views of various experts on the different topics that will shape plasma etching for microelectronics manufacturing of the future.

Engineering↗
NASA NTRS2016

Meso-Scale Digital Materials: Modular, Reconfigurable, Lattice-Based Structures

We present a modular, reconfigurable system for building large structures. This system uses discrete lattice elements, called digital materials, to reversibly assemble ultralight structures that are 99.7% air and yet maintain sufficient specific stiffness for a variety of structural applications and loading scenarios. Design, manufacturing, and characterization of modular building blocks are described, including struts, nodes, joints, and build strategies. Simple case studies are shown using the same building blocks in three different scenarios: a bridge, a boat, and a shelter. Field implementation and demonstration is supplemented by experimental data and numerical simulation. A simplified approach for analyzing these structures is presented which shows good agreement with experimental results.

Reconfigurable↗
DOE OSTI2022

Computational models of direct and indirect X‐ray breast imaging detectors for in silico trials

Abstract Background To facilitate in silico studies that investigate digital mammography (DM) and breast tomosynthesis (DBT), models replicating the variety in imaging performance of the DM and DBT systems, observed across manufacturers are needed. Purpose The main purpose of this work is to develop generic physics models for direct and indirect detector technology used in commercially available systems, with the goal of making them available open source to manufacturers to further tweak and develop the exact in silico replicas of their systems. Methods We recently reported on an in silico version of the SIEMENS Mammomat Inspiration DM/DBT system using an open‐source GPU‐accelerated Monte Carlo x‐ray imaging simulation code (MC‐GPU). We build on the previous version of the MC‐GPU codes to mimic the imaging performances of two other Food and Drug Administration (FDA)‐approved DM/DBT systems, such as Hologic Selenia Dimensions (HSD) and the General Electric Senographe Pristina (GSP) systems. In this work, we developed a hybrid technique to model the optical spread and signal crosstalk observed in the GSP and HSD systems. MC simulations are used to track each x‐ray photon till its first interaction within the x‐ray detector. On the other hand, the signal spread in the x‐ray detectors is modeled using previously developed analytical equations. This approach allows us to preserve the modeling accuracy offered by MC methods in the patient body, while speeding up secondary carrier transport (either electron–hole pairs or optical photons) using analytical equations in the detector. The analytical optical spread model for the indirect detector includes the depth‐dependent spread and collection of optical photons and relies on a pre‐computed set of point response functions that describe the optical spread as a function of depth. To understand the capabilities of the computational x‐ray detector models, we compared image quality metrics like modulation transfer function (MTF), normalized noise power spectrum (NNPS), and detective quantum efficiency (DQE), simulated with our models against measured data. Please note that the purpose of these comparisons with measured data would be to gauge if the model developed as part of this work could replicate commercially used direct and indirect technology in general and not to achieve perfect fits with measured data. Results We found that the simulated image quality metrics such as MTF, NNPS, and DQE were in reasonable agreement with experimental data. To demonstrate the imaging performance of the three DM/DBT systems, we integrated the detector models with the VICTRE pipeline and simulated DM images of a fatty breast model containing a spiculated mass and a calcium oxalate cluster. In general, we found that the images generated using the indirect model appeared more blurred with a different noise texture and contrast as compared to the systems with direct detectors. Conclusions We have presented computational models of three commercially available FDA‐approved DM/DBT systems, which implement both direct and indirect detector technology. The updated versions of the MC‐GPU codes that can be used to replicate three systems are available in open source format through GitHub.

Sengupta, Aunnasha↗
DOE OSTI2021

Core–Multishell-Structured Digital-Gradient Cathode Materials with Enhanced Mechanical and Electrochemical Durability

Ni-rich cathode materials provide high energy density, but their structural and surface instability limits their cyclability and thermal stability. As one of the approaches to mitigate this problem, cathode materials comprising Ni-rich high-capacity core wrapped in Mn-rich multiple shells are produced successfully. In contrast to the conventional batch-type process for concentration-gradient materials, a digital-gradient cascade coprecipitation process described here achieves the improvements in productivity and quality consistency needed to move toward large-scale manufacturing. The core-multishell cathode materials produced in this manner not only have longer cycle life and improved rate performance compared to homogeneous Ni-rich cathode materials having the same overall composition, but also show remarkably enhanced thermal stability and low impedance growth characteristics. In a novel attempt to determine the correlation between the mechanical properties of the core-multishell cathode particles and their electrochemical cyclabilities, their breaking force and elasticity were successfully measured using a statistical approach, which indicates that a cathode particle with stable surface composition as well as high breaking force has improved capacity retention and durability. These results guide the realization of long life and high thermal stability in Ni-rich cathode materials through heterogeneous particle engineering.

25 ENERGY STORAGE↗
DOE OSTI2025

Experimental Evaluation of Interfacial Bonding Strength Between 304 Stainless Steel Substrate and Electrodeposited Nickel Coating Using Mesoscale Mechanical Testing Methods

Electrodeposition is a commonly used method for depositing a metal layer on a metallic substrate, to provide a decorative finish or for functional purposes including wear and corrosion resistance. The interfacial bonding strength is a critical factor in determining the quality of electrodeposition, as it ensures the adhesion of the deposited layer to the substrate. Despite its importance, there has not previously been a suitable mechanical testing method to quantitatively characterize the bonding strength between the electrodeposited layers and the substrate, due to the high strength of the materials and to restrictions imposed by the geometry (due to the small thickness of the plating layer) to manufacture tensile bars. In this study, we introduce a novel mesoscale mechanical testing method to overcome these limitations. This technique was applied to assess the bonding strength between a 304 stainless steel (SS) substrate and electrodeposited nickel with three different plating formulae (nickel sulfamate, Watts bath, and hard nickel). The thickness of the pure nickel coatings achieved for each of the three electrolyte solutions was approximately 1 mm on each side of the substrate. Mesoscale tensile bars of 1 mm length were manufactured by a femtosecond laser, with the material interface at the center of the gauge section, and then tensile-tested with digital image correlation. Further, the results proved that the electrodeposition technique is able to produce a very high bonding strength that is close to the yield strength of both the substrate material and the electrodeposited nickel layer. Additionally, in the case of the Watts bath formula, the interfacial bonding strength between the SS 304 and electrodeposited nickel can exceed that of the nickel layer. This method is expected to be useful for quantifying the interfacial bonding strength in numerous applications.

36 MATERIALS SCIENCE↗
DOE OSTI2025

Nature of innovations affecting photovoltaic system costs

Innovations improve technology costs through various kinds of engineering advancements, including changes to materials choices and device or process designs. Understanding how these innovations relate to cost change can reveal aspects of the process of technology evolution, yet developing such understanding is often not possible with a strictly quantitative approach due to data limitations. In this paper we develop a hybrid quantitative-qualitative framework for relating specific innovations to cost change by using the variables in a quantitative technology cost change model as an organizing principle. We demonstrate this framework by applying it to the cost decline in photovoltaic (PV) systems over the last five decades. This framework generates new understanding of a set of innovations that contributed to PV modules’ sustained cost decline and the more modest trends observed in balance-of-system (BOS) costs. The results show the great diversity of innovations that affected PV costs, drawing on wide-ranging fields of expertise within scientific research and practice. We find that there are differences in the characteristics of innovations that reduced the cost of PV modules compared to innovations influencing BOS costs. Numerous module innovations reduced costs by advancing manufacturing tools and processes that improved material quality. Many BOS innovations reduced costs through a combination of component design changes, integration, automation, digitalization, and standardization. Overall, most innovations in our sample affected PV hardware. However, some also target ‘soft technologies’ such as task durations through innovations like fast-track permitting, which require improved collaboration and process streamlining. This framework also provides insight into the nature of knowledge spillovers between technologies. Both module and BOS hardware innovations show the benefits of PV’s position within an ‘ecosystem’ of continuously advancing technologies in many industries, in particular semiconductors and electronics, and also point to the importance of public institutions for accelerating testing, permitting, and training.

14 SOLAR ENERGY↗
DOE OSTI2020

2019 LDRD Annual Report

This summary report provides an overview of all LDRD projects at Argonne that concluded in Fiscal Year 2019. Many projects are funded for multiple years, the initial fiscal year for each project is indicated by the first four digits of the LDRD project number. Focus areas were: Advanced Computing; Biological and Environmental Science Capability Development; Hard X-ray Sciences; Manufacturing Science and Engineering; Materials and Chemistry; National and Global Security; Photon Sciences; Securing Energy and Critical Resources; and, The Universe as Our Laboratory (ULab).

36 MATERIALS SCIENCE↗
NASA NTRS2018

Discrete Assemblers Utilizing Conventional Motion Systems

An alternative to additive manufacturing is disclosed, introducing an end-to-end workflow in which discrete building blocks are reversibly joined to produce assemblies called digital materials. Described is the design of the bulk-material building blocks and the devices that are assembled from them. Detailed is the design and implementation of an automated assembler, which takes advantage of the digital material structure to avoid positioning errors within a large tolerance. To generate assembly sequences, a novel CAD/CAM workflow is described for designing, simulating, and assembling digital materials. The structures assembled using this process have been evaluated, showing that the joints perform well under varying conditions and that the assembled structures are functionally precise.

Langford, William Kai↗