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At least 307 records · Page 17

LARC-13 polyimide adhesive bonding

The development of an addition-curing polyimide adhesive suitable for low pressure bonding without the generation of volatiles during cure is reported. LARC-13 is designed for bonding of polyimide matrix composites and of titanium to be used above 500 F, and is based on an oligomeric bis-nadimide which allows its processing at 50 psi or less, making it suitable for the bonding of fragile honeycomb sandwich structures. Few volatiles are evolved during its cure allowing large enclosed structures to be bonded, and it has high room and elevated temperature strengths and good strength retention after short terms up to 1100 F. LARC-13 was successfully used to bond the outer and inner skins of a polyimide/graphite wing shear panel for 500 F use, and for a short-term exposure up to 1100 F. Preparation of the adhesive, bonding, aging, and testing of lap shear and honeycomb samples are discussed.

Saint Clair, T. L.↗

Electrically conductive palladium-containing polyimide films

Palladium addition makes light, flexible film with low resistivity to relieve space charging. Polyimide film is prepared in four steps: preparation of polyamic acid in polar solvent; addition of soluable palladium complex salt; fabrication of film of "palladium polyamic acid" solution; and thermal imidization of film to palladium-containing polyimide by 300 C heating. Lowered resistivities were achieved without loss in film flexibility or increase in film weight.

St.clair, A. K.↗

Manufacturing processes for fabricating graphite/PMR 15 polyimide structural elements

Investigations were conducted to obtain commercially available graphite/PMR-15 polyimide prepreg, develop an autoclave manufacturing process, and demonstrate the process by manufacturing structural elements. Controls were established on polymer, prepreg, composite fabrication, and quality assurance, Successful material quality control and processes were demonstrated by fabricating major structural elements including flat laminates, hat sections, I beam sections, honeycomb sandwich structures, and molded graphite reinforced fittings. Successful fabrication of structural elements and simulated section of the space shuttle aft body flap shows that the graphite/PMR-15 polyimide system and the developed processes are ready for further evaluation in flight test hardware.

Sheppard, C. H.↗

Crystalline polyimides

Aromatic crystalline polyimides are disclosed that are synthesized from polyamide-acid and when heated to 200 C to 300 C become cyclized to afford an opaque polymer. X-ray diffraction of the unoriented film exhibited 47 percent crystallinity. Differential scanning calorimetry reveals a melt at 425 C with no glass transition in these crystalline polyimides.

St.clair, T. L.↗

Feasibility of Kevlar 49/PMR-15 Polyimide for High Temperature Applications

Kevlar 49 aramid organic fiber reinforced PMR-15 polyimide laminates were characterized to determine the applicability of the material to high temperature aerospace structures. Kevlar 49/3501-6 epoxy laminates were fabricated and characterized for comparison with the Kevlar 49/PMR-15 polyimide material. Flexural strengths and moduli and interlaminar shear strengths were determined from 75 F to 600 F for the PMR-15 and from 75 F to 450 F for the Kevlar/3501-6 epoxy material. The effects of hydrothermal and long-term elevated temperature exposures on the flexural strengths and moduli and the interlaminar shear strengths were also studied.

Hanson, M. P.↗

Characterization of PMR-15 polyimide composition in thermo-oxidatively exposed graphite fiber composites

The contributions of individual resin components to total resin weight loss in 600 F air aged Celion 6000/PMR-15 polyimide composites were determined from the overall resin weight loss in the composite by chemically separating the PMR-15 matrix resin into its monomeric components. The individual resin components were also analyzed by spectroscopic techniques in order to elucidate curing and degradation mechanisms of the PMR-15 matrix resin. The isothermal weight loss of the individual resin components during prolonged 600 F thermo-oxidative aging of the composite was correlated to the changes observed in the Fourier Transform infrared spectra and Fourier Transform nuclear magnetic resonance spectra of the individual resin components. The correlation was used to identify the molecular site of the thermo-oxidative changes in PMR-15 polyimide matrix resin during 600 F curing the prolonged 600 F thermo-oxidative aging.

Alston, W. B.↗

Tackifier for addition polyimides

A modification to the addition polyimide, LaRC-160, was prepared to improve tack and drape and increase prepeg out-time. The essentially solventless, high viscosity laminating resin is synthesized from low cost liquid monomers. The modified version takes advantage of a reactive, liquid plasticizer which is used in place of solvent and helps solve a major problem of maintaining good prepeg tack and drape, or the ability of the prepeg to adhere to adjacent plies and conform to a desired shape during the lay up process. This alternate solventless approach allows both longer life of the polymer prepeg and the processing of low void laminates. This approach appears to be applicable to all addition polyimide systems.

Butler, J. M.↗

Addition polyimide end cap study

The characterization of addition polyimides with various end caps for adhesive applications at 120-250 C environments is discussed. Oligometric polyimides were prepared from 3,3',4,4'-benzophenone tetracarboxylic dianhydride and 3,3'-methylenedianiline which were end-capped with functionally reactive moities which cause crosslinking when the oligomers are heated to 200-400 C. The syntheses of the oligomers are outlined. The thermolysis of the oligomers was studied by differential scanning calorimetry and the resulting polymers were characterized by differential thermal analysis and adhesive performance. The adhesive data include lap shear strengths on titanium 6-4 adherends both before and after aging for 1000 hours at 121 C and/or 232 C.

St.clair, T. L.↗

Tackifier for addition polyimides containing monoethylphthalate

An improvement of addition polyimides wherein an essentially solventless, high viscosity laminating resin is synthesized from low cost liquid monomers is disclosed. The improved process takes advantage of a reactive, liquid plasticizer such as monoethylphthalate (MEP) which is used in lieu of an alcohol solvent, and helps solve a major problem of maintaining good prepreg tack and drape, or the ability of the prepreg to adhere to adjacent plies and conform to a desired shape during the layup process. This improvement results in both longer life of the polymer prepreg and the processing of low void laminate and appears to be applicable to all addition polyimide systems.

St.clair, T. L.↗

Graphite polyimide fabrication research for supersonic cruise aircraft

Advanced fabrication processes and adhesive bonding methods have been developed for the fabrication of full scale fiberglass-polyimide honeycomb stiffened HTS-1 graphite/PMR-15 polyimide panels that meet the design criteria for an upper wing panel of the NASA YF-12 aircraft. Detailed manufacturing, bonding, and autoclave cure procedures are presented. Nondestructive test methods including pulse echo and through-transmission ultrasonic C-scan and laser holography were developed to detect flaws in components and the completed panels. Panels were tested in shear at room temperature and 533 K (500 F) following a variety of thermal exposures to obtain load, deflection and failure analysis data.

Freeman, W. T., Jr.↗

Feasibility of Kevlar 49/PMR-15 polyimide for high temperature applications

Kevlar 49 aramid organic fiber reinforced PMR-15 polyimide laminates were characterized to determine the applicability of the material to high temperature aerospace structures. Kevlar 49/3501-6 epoxy laminates were fabricated and characterized for comparison with the Kevlar 49/PMR-15 polyimide material. Flexural strengths and moduli and interlaminar shear strengths were determined from 75 to 600 F for the PMR-15 and from 75 to 450 F for the Kevlar 49/3501-6 epoxy material. The study also included the effects of hydrothermal and long-term elevated temperature exposures on the flexural strengths and moduli and the interlaminar shear strengths.

Hanson, M. P.↗

Fabrication of LARC 160/NR150B2 hybrid matrix polyimide composites

Graphite-polyimide composite materials exhibit high performance, low weight, and good thermal-oxidative stability, making them promising candidates for Space Shuttle applications. However, no single material is excellent in all respects: processibility, thermal-oxidative stability, toughness, and mechanical properties. This paper describes the development of hybrid matrix composite laminates that combine the attributes of two polyimide resins, NR150B2 and LARC 160, while avoiding their drawbacks. High quality laminates were fabricated from each resin system, and hybrid laminates were successfully co-cured, evaluated, and optimized.

Bergren, O. D.↗

A multi-purpose thermoplastic polyimide

A linear thermoplastic polyimide, LARC-TPI, has been characterized and developed for a variety of high-temperature applications. In its fully imidized form, this new material can be used as an adhesive for bonding metals such as titanium, aluminum, copper, brass, and stainless steel. LARC-TPI is being evaluated as a thermoplastic for bonding large pieces of polyimide film to produce flexible, 100% void-free laminates for flexible circuit applications. The further development of LARC-TPI as a potential molding powder, composite matrix resin, high-temperature film and fiber will also be discussed.

Saint Clair, A. K.↗

Formulation and characterization of polyimide resilient foams of various densities for aircraft seating applications

Light weight, heat and fire resistant low smoke generating polyimide foams are developed for aircraft seating applications. The material is upgraded and classified into groups for fabrication of cushions possessing acceptable comfort properties. Refinement and selection of foaming processes using a variety of previously developd foaming techniques and definition of property relationships to arrive at the selection and classfication of polyimide foams into five groups in accordance with predetermined ILD values are emphasized.

Gagliani, J.↗

Electrically conductive palladium containing polyimide films

Lightweight, high temperature resistant, electrically conductive, palladium containing polyimide films and methods for their preparation are described. A palladium (II) ion-containing polyamic acid solution is prepared by reacting an aromatic dianhydride with an equimolar quantity of a palladium II ion-containing salt or complex and the reactant product is cast as a thin film onto a surface and cured at approximately 300 C to produce a flexible electrically conductive cyclic palladium containing polyimide. The source of palladium ions is selected from the group of palladium II compounds consisting of LiPdCl4, PdS(CH3)2Cl2Na2PdCl4, and PdCl2. The films have application to aerodynamic and space structures and in particular to the relieving of space charging effects.

Taylor, L. T.↗

LARC-TPI: A multi-purpose thermoplastic polyimide

A linear thermoplastic polyimide, LARC-TPI, was characterized and developed for a variety of high temperature applications. In its fully imidized form, this material can be used as an adhesive for bonding metals such as titanium, aluminum, copper, brass, and stainless steel. LARC-TPI was evaluated as a thermoplastic for bonding large pieces of polyimide film to produce flexible, 100 void-free laminates for flexible circuit applications. The development of LARC-TPI as a potential molding powder, composite matrix resin, high temperature film and fiber is also discussed.

St.clair, A. K.↗

Novel improved PMR polyimides

The development of a class of high-temperature-resistant resins known as PMR polyimides has been reported by Serafini et al. (1972). Serafini and Vannucci (1975) found that the lower formulated molecular weight (FMW) compositions exhibited increased resin flow, but with some sacrifice in elevated temperature thermo-oxidative stability. Vannucci (1977) reported that the resin flow characteristics of the PMR composition having an FMW of 1500 could be varied by controlling the degree of resin advancement or imidization. The current investigation is concerned with an alternative approach to obtain improved flow PMR polyimides without sacrificing the desirable thermo-oxidative characteristics. The new approach is based on the utilization of a chemically compatible flow modifying agent. This agent is N-phenylnadimide (PN). The determination of the processing characteristics and properties of PN modified PMR/Celion 6000 composites is discussed.

Pater, R. H.↗

A multi-purpose thermoplastic polyimide

A linear thermoplastic polyimide, LARC-TPI, has been characterized and developed for a variety of high-temperature applications. In its fully imidized form, this new material can be used as an adhesive for bonding metals such as titanium, aluminum, copper, brass, and stainless steel. LARC-TPI is being evaluated as a thermoplastic for bonding large pieces of polyimide film to produce flexible, 100% void-free laminates for flexible circuit applications. The further development of LARC-TPI as a potential molding powder, composite matrix resin, high-temperature film and fiber is also discussed.

Saint Clair, A. K.↗