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At least 325 records · Page 18

Laser Surface Preparation of Epoxy Composites for Secondary Bonding: Optimization of Ablation Depth

Surface preparation has been identified as one of the most critical aspects of attaining predictable and reliable adhesive bonds. Energetic processes such as laser ablation or plasma treatment are amenable to automation and are easily monitored and adjusted for controlled surface preparation. A laser ablation process was developed to accurately remove a targeted depth of resin, approximately 0.1 to 20 micrometers, from a carbon fiber reinforced epoxy composite surface while simultaneously changing surface chemistry and creating micro-roughness. This work demonstrates the application of this process to prepare composite surfaces for bonding without exposing or damaging fibers on the surface. Composite panels were prepared in an autoclave and had a resin layer approximately 10 micrometers thick above the fiber reinforcement. These composite panels were laser surface treated using several conditions, fabricated into bonded panels and hygrothermally aged. Bond performance of aged, experimental specimens was compared with grit blast surface treated specimens using a modified double cantilever beam test that enabled accelerated saturation of the specimen with water. Comparison of bonded specimens will be used to determine how ablation depth may affect average fracture energies and failure modes.

Palmieri, Frank L.↗

The role of material properties in adhesion

When two solid surfaces are brought into contact strong adhesive bond forces can develop between the materials. The magnitude of the forces will depend upon the state of the surfaces, cleanliness and the fundamental properties of the two solids, both surface and bulk. Adhesion between solids is addressed from a theoretical consideration of the electronic nature of the surfaces and experimentally relating bond forces to the nature of the interface resulting from solid state contact. Surface properties correlated with adhesion include, atomic or molecular orientation, reconstruction and segregation as well as the chemistry of the surface specie. Where dissimilar solids are in contact the contribution of each is considered as is the role of their interactive chemistry on bond strength. Bulk properties examined include elastic and plastic behavior in the surficial regions, cohesive binding energies, crystal structure, crystallographic orientation and state. Materials examined with respect to interfacial adhesive interactions include metals, alloys, ceramics, polymers and diamond. They are reviewed both in single and polycrystalline form. The surfaces of the contacting solids are studied both in the atomic or molecularly clean state and in the presence of selected surface contaminants.

Buckley, D. H.↗

Fabricating with Crystalline Si to Improve Superconducting Detector Performance

We built and measured radio-frequency (RF) loss tangent, tan δ, evaluation structures using float-zone quality silicon-on-insulator (SOI) wafers with 5 μm thick device layers. Superconducting Nb components were fabricated on both sides of the SOI Si device layer. Our main goals were to develop a robust fabrication for using crystalline Si (c-Si) dielectric layers with superconducting Nb components in a wafer bonding process and to confirm that tan δ with c-Si dielectric layers was reduced at RF frequencies compared to devices fabricated with amorphous dielectrics, such as SiO2 and SixNy, where tan δ ~ 10(exp -3). Our primary test structure used a Nb coplanar waveguide (CPW) readout structure capacitively coupled to LC resonators, where the capacitors were defined as parallel-plate capacitors on both sides of a c-Si device layer using a wafer bonding process with benzocyclobutene (BCB) wafer bonding adhesive. Our control experiment, to determine the intrinsic tan δ in the SOI device layer without wafer bonding, also used Nb CPW readout coupled to LC resonators; however, the parallel-plate capacitors were fabricated on both sides of the Si device layer using a deep reactive ion etch (DRIE) to access the c-Si underside through the buried oxide and handle Si layers in the SOI wafers. We found that our wafer bonded devices demonstrated F· δ = (8 +/- 2) × 10(exp -5), where F is the filling fraction of two-level states (TLS). For the control experiment, F· δ = (2.0 +/- 0.6) × 10(exp -5), and we discuss what may be degrading the performance in the wafer bonded devices as compared to the control devices.

Beyer, A. D↗

Fabricating with Crystalline Si to Improve Superconducting Detector Performance

We built and measured radio-frequency (RF) loss tangent, tan d, evaluation structures using float-zone quality silicon-on-insulator (SOI) wafers with 5 µ m thick device layers. Superconducting Nb components were fabricated on both sides of the SOI Si device layer. Our main goals were to develop a robust fabrication for using crystalline Si (c-Si) dielectric layers with superconducting Nb components in a wafer bonding process and to confirm that tan d with c-Si dielectric layers was reduced at RF frequencies compared to devices fabricated with amorphous dielectrics, such as SiO2 and SixNy, where tan d ~ 10-3. Our primary test structure used a Nb coplanar waveguide (CPW) readout structure capacitively coupled to LC resonators, where the capacitors were defined as parallel-plate capacitors on both sides of a c-Si device layer using a wafer bonding process with benzocyclobutene (BCB) wafer bonding adhesive. Our control experiment, to determine the intrinsic tan d in the SOI device layer without wafer bonding, also used Nb CPW readout coupled to LC resonators; however, the parallel-plate capacitors were fabricated on both sides of the Si device layer using a deep reactive ion etch (DRIE) to access the c-Si underside through the buried oxide and handle Si layers in the SOI wafers. We found that our wafer bonded devices demonstrated F· d = (8 ± 2) × 10-5, where F is the filling fraction of two-level states (TLS). For the control experiment, F· d = (2.0 ± 0.6) × 10-5, and we discuss what may be degrading the performance in the wafer bonded devices as compared to the control devices.

Beyer, A D↗

Duplicating Curved Tile Surfaces for Pull Testing

Strength of adhesive bonds to fragile objects with complex shapes tested easily with vacuum chucks. In bond-strength test, contact surface of chuck pressed against matching surface of bonded tile. Vacuum line extending through fine bore in chuck creates vacuum at chuck-and-tile interface. Thus, when chuck pulled away, atmospheric pressure tends to push tile away with chuck. If adhesive resists predetermined pull exerted by chuck on tile, bond acceptable. Originally developed for vacuum chucks used on silica tiles attached to outer surface of Space Shuttle orbiter, used to custom-fabricate chuck for specific tile.

Sebenick, R. H.↗

Proceedings of the Second Annual Symposium for Nondestructive Evaluation of Bond Strength

Ultrasonics, microwaves, optically stimulated electron emission (OSEE), and computational chemistry approaches have shown relevance to bond strength determination. Nonlinear ultrasonic nondestructive evaluation methods, however, have shown the most effectiveness over other methods on adhesive bond analysis. Correlation to changes in higher order material properties due to microstructural changes using nonlinear ultrasonics has been shown related to bond strength. Nonlinear ultrasonic energy is an order of magnitude more sensitive than linear ultrasound to these material parameter changes and to acoustic velocity changes caused by the acoustoelastic effect when a bond is prestressed. Signal correlations between non-linear ultrasonic measurements and initialization of bond failures have been measured. This paper reviews bond strength research efforts presented by university and industry experts at the Second Annual Symposium for Nondestructive Evaluation of Bond Strength organized by the NDE Sciences Branch at NASA Langley in November 1998.

Roberts, Mark J.↗

Design, fabrication, test, and qualification and price analysis of third generation design solar cell modules

The Block 4 shingle type module makes it possible to apply a photovoltaic array to the sloping roof of a residential building by simply nailing the overlapping hexagon shaped shingles to the plywood roof sheathing. This third-generation shingle module design consists of nineteen series connected 100 mm diameter solar cells which are arranged in a closely packed hexagon configuration to provide in excess of 75 watts/sq m of exposed module area under standard operating conditions. The solar cells are individually bonded to the embossed underside of a 4.4 mm thick thermally tempered piece of glass. An experimental silicone pottant was used as the transparent bonding adhesive between the cells and glass. The semi-flexible portion of each shingle module is a composite laminate construction consisting of an outer layer of FLEXSEAL bonded to an inner core of closed cell polyethylene foam. Silaprene is used as the substrate laminating adhesive. The module design has satisfactorily survived qualification testing program which includes 50 thermal cycles between -40 and +90 C, a seven day temperature-humidity exposure test, and a wind resistance test.

Shepard, N. F.↗

Develop, demonstrate, and verify large area composite structural bonding with polyimide adhesives

The technology required to produce graphite-polyimide structural components with operational capability at 598 K (600 F) is considered. A series of polyimide adhesives was screened for mechanical and physical properties and processibility in fabricating large midplane bonded panels and honeycomb sandwich panels in an effort to fabricate a structural test component of the space shuttle aft body flap. From 41 formulations, LaRC-13, FM34B-18, and a modified LaRC-13 adhesive were selected for further evaluation. The LaRC-13 adhesive was rated as the best of the three adhesives in terms of availability, cost, processibility, properties, and ability to produce void fee large area (12" x 12") midplane bonds. Surface treatments and primers for the adhesives were evaluated and processes were developed for the fabrication of honeycomb sandwich panels of very good quality which was evidenced by rupture in the honeycomb core rather than in the facesheet bands on flatwise tensile strength testing. The fabrication of the adhesively bonded honeycomb sandwich cover panels, ribs, and leading edge covers of Celion graphite/LARC-160 polyimide laminates is described.

Bhombal, B. D.↗

Processing study of a high temperature adhesive

An adhesive-bonding process cycle study was performed for a polyimidesulphone. The high molecular weight, linear aromatic system possesses properties which make it attractive as a processable, low-cost material for elevated temperature applications. The results of a study to better understand the parameters that affect the adhesive properties of the polymer for titanium alloy adherends are presented. These include the tape preparation, the use of a primer and press and simulated autoclave processing conditions. The polymer was characterized using Fourier transform infrared spectroscopy, glass transition temperature determination, flow measurements, and weight loss measurements. The lap shear strength of the adhesive was used to evaluate the effects of the bonding process variations.

Progar, D. J.↗

Testing the Shuttle heat-protection armor

The article deals with the thermal protection system (TPS) designed to keep Space Shuttle structures at 350 F ratings over a wide range of temperatures encountered in orbit, but also during prelaunch, launch, deorbit and re-entry, landing and turnaround. The structure, function, fabrication, and bonding of various types of reusable surface insulation and composite materials are described. Test programs are developed for insulation, seals, and adhesion bonds; leak tests and acoustic fatigue tests are mentioned. Test facilities include arc jets, radiant heaters, furnaces, and heated tunnels. The certification tests to demonstrate TPS reusability, structural integrity, thermal performance, and endurance will include full-scale assembly tests and initial orbital flight tests.

Strouhal, G.↗

A fundamental approach to adhesion: Synthesis, surface analysis, thermodynamics and mechanics

The ability of SEM/EDAX to determine the physical and chemical composition of very small areas was used to study several diverse types of samples representative of NASA-LaRC technology. More systematic investigation was carried out on differences in the results of grit-blasting Ti 6-4 adherends and the presence of extraneous elements, primarily silicon, in some polymer/HT-S fiber composites. Initial results were obtained from a fractured (ILS) short-beam shear specimen, and from Ti 6-4 alloy, before and after a proprietary Boeing anodizing surface preparation for adhesive bonding. Photomicrographs and EDAX spectra were also obtained from new, fractured lap shear strength specimens that employed PPQ and LARC-13 adhesives.

Dwight, D. W.↗

Functionally Graded Adhesives for Composite Joints

Adhesives with functionally graded material properties are being considered for use in adhesively bonded joints to reduce the peel stress concentrations located near adherend discontinuities. Several practical concerns impede the actual use of such adhesives. These include increased manufacturing complications, alterations to the grading due to adhesive flow during manufacturing, and whether changing the loading conditions significantly impact the effectiveness of the grading. An analytical study is conducted to address these three concerns. An enhanced joint finite element, which uses an analytical formulation to obtain exact shape functions, is used to model the joint. Furthermore, proof of concept testing is conducted to show the potential advantages of functionally graded adhesives. In this study, grading is achieved by strategically placing glass beads within the adhesive layer at different densities along the joint.

Stapleton, Scott E.↗

Process Sensitivity, Performance, and Direct Verification Testing of Adhesive Locking Features

Phase I: The use of adhesive locking features or liquid locking compounds (LLCs) (e.g., Loctite) as a means of providing a secondary locking feature has been used on NASA programs since the Apollo program. In many cases Loctite was used as a last resort when (a) self-locking fasteners were no longer functioning per their respective drawing specification, (b) access was limited for removal & replacement, or (c) replacement could not be accomplished without severe impact to schedule. Long-term use of Loctite became inevitable in cases where removal and replacement of worn hardware was not cost effective and Loctite was assumed to be fully cured and working. The NASA Engineering & Safety Center (NESC) and United Space Alliance (USA) recognized the need for more extensive testing of Loctite grades to better understand their capabilities and limitations as a secondary locking feature. These tests, identified as Phase I, were designed to identify processing sensitivities, to determine proper cure time, the correct primer to use on aerospace nutplate, insert and bolt materials such as A286 and MP35N, and the minimum amount of Loctite that is required to achieve optimum breakaway torque values. The .1900-32 was the fastener size tested, due to wide usage in the aerospace industry. Three different grades of Loctite were tested. Results indicate that, with proper controls, adhesive locking features can be successfully used in the repair of locking features and should be considered for design. Phase II: Threaded fastening systems used in aerospace programs typically have a requirement for a redundant locking feature. The primary locking method is the fastener preload and the traditional redundant locking feature is a self-locking mechanical device that may include deformed threads, non-metallic inserts, split beam features, or other methods that impede movement between threaded members. The self-locking resistance of traditional locking features can be directly verified during assembly by measuring the dynamic prevailing torque. Adhesive locking features or LLCs are another method of providing redundant locking, but a direct verification method has not been used in aerospace applications to verify proper installation when using LLCs because of concern for damage to the adhesive bond. The reliability of LLCs has also been questioned due to failures observed during testing with coupons for process verification, although the coupon failures have often been attributed to a lack of proper procedures. It is highly desirable to have a direct method of verifying the LLC cure or bond integrity. The purpose of the Phase II test program was to determine if the torque applied during direct verification of an adhesive locking feature degrades that locking feature. This report documents the test program used to investigate the viability of such a direct verification method. Results of the Phase II testing were positive, and additional investigation of direct verification of adhesive locking features is merited.

Golden, Johnny L.↗

Impact damage resistance of flat glass/cellular glass solar mirror experimental panels

An attempt is made to characterize the hail-impact behavior of a solar concentrator structural material which consists of thin, second-surface silvered glass sheets bonded to structural support panels of cellular glass. The resulting glass/cellular glass panel can be described as a thin, brittle plate supported by an elastic foundation, with the adhesive bonding the two as a third component. The plate will bend during impact. Attention is experimentally given to how variations in the characteristics or geometry of the flat glass, adhesive and cellular glass affect hail-impact damage resistance. The critical energy needed to cause impact damage is calculated from the critical velocity of the iceball by means of the kinetic energy formula. The complexity of this structural system and the variability of the specimens render it impossible to completely develop an analytical treatment for the prediction of impact damage resistance.

Varner, J. R.↗

The effect of adhesive layer elasticity on the fracture mechanics of a blister test specimen

An analytical model of a blister type specimen for evaluating adhesive bond strength was developed. Plate theory with shear deformation was used to model the deformation of the plate, and elastic deformation of the adhesive layer is taken into account. It is shown that the inclusion of the elastic deformation of the adhesive layer can have a significant influence in the energy balance calculations of fracture mechanics.

Updike, D. P.↗

Tribological properties of surfaces

The real area of contact between two solid surfaces is only a small portion of the apparent area. Deformation of these areas can result in solid state contact through surface films. For clean solid to solid contact strong adhesive bonding occurs across the interface. Under these conditions many properties of the solid such as the metallurgical and chemical nature of metals can influence adhesion, friction, and wear behavior. The presence of gases, liquids, and solid films on the surface of solids alter markedly tribological characteristics. These surface films can also considerably change the mechanical effects of solid state contact on bulk material behavior.

Buckley, D. H.↗

Tribological properties of surfaces

The real area of contact between two solid surfaces is only a small portion of the apparent area. Deformation of these areas can result in solid state contact through surface films. For clean solid to solid contact strong adhesive bonding occurs across the interface. Under these conditions many properties of the solid such as the metallurgical and chemical nature of metals can influence adhesion, friction, and wear behavior. The presence of gases, liquids, and solid films on the surface of solids alter markedly tribological characteristics. These surface films can also considerably change the mechanical effects of solid state contact on bulk material behavior.

Buckley, D. H.↗

A critical examination of stresses in an elastic single lap joint

The results of an approximate nonlinear finite-element analysis of a single lap joint are presented and compared with the results of a linear finite-element analysis, and the geometric nonlinear effects caused by the load-path eccentricity on the adhesive stress distributions are determined. The results from finite-element, Goland-Reissner, and photoelastic analyses show that for a single lap joint the effect of the geometric nonlinear behavior of the joint has a sizable effect on the stresses in the adhesive. The Goland-Reissner analysis is sufficiently accurate in the prediction of stresses along the midsurface of the adhesive bond to be used for qualitative evaluation of the influence of geometric or material parametric variations. Detailed stress distributions in both the adherend and adhesive obtained from the finite-element analysis are presented to provide a basis for comparison with other solution techniques.

Cooper, P. A.↗