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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 325 records · Page 18
All sourcesNASA NTRSDOE OSTI
NASA NTRS1989

Aging behavior of Au-based ohmic contacts to GaAs

Gold based alloys, commonly used as ohmic contacts for solar cells, are known to react readily with GaAs. It is shown that the contact interaction with the underlying GaAs can continue even at room temperature upon aging, altering both the electrical characteristics of the contacts and the nearby pn junction. Au-Ge-Ni as-deposited (no heat-treatment) contacts made to thin emitter (0.15 microns) GaAs diodes have shown severe shunting of the pn junction upon aging for several months at room temperature. The heat-treated contacts, despite showing degradation in contact resistance, did not affect the underlying pn junction. Au-Zn-Au contacts to p-GaAs emitter (0.2 microns) diodes, however, showed slight improvement in contact resistance upon 200 C isothermal annealing for several months, without degrading the pn junction. The effect of aging on electrical characteristics of the as-deposited and heat-treated contacts and the nearby pn junction, as well as on the surface morphology of the contacts are presented.

Fatemi, Navid S.↗
NASA NTRS1972

MSFC connector development

NASA flat conductor cable connectors with individually sealed contacts are described. Descriptions of the design, main features, contact spring, connector electrical data, dimensions and weight, FCC termination, and keying system for plug and receptacle are included.

Angele, W.↗
NASA NTRS1987

Improving the interlaminar shear strength of carbon fiber-epoxy composites through carbon fiber bromination

The use of bromine to improve the interlaminar shear strength of PAN-based carbon fibers was investigated. Composite test specimens fabicated from brominated T-300 fibers and a MY720 matrix exhibited on average a 30% improvement in ILSS over their pristine counterparts. Mass, electrical resistivity, density, contact angle, and scanning Auger microscopy results suggested a mechanism in which the bromine was covalently bonded to the surface of the fiber, and this resulted in an increased van der Waal's adhesion between fiber and matrix.

Jaworske, Donald A.↗
NASA NTRS1989

Novel applications of optical techniques to the study of buried semiconductor interfaces

Detailed electronic and structural information about buried semiconductor interfaces obtained through application of optical techniques is discussed. The measurements described include the determination of band discontinuities, strain, and disorder associated with semiconductor heterointerfaces. The contactless and nondestructive nature of these optical techniques is particularly important for the study of heterointerfaces which are inherently inaccessible to direct electrical or physical contact.

Wilson, Barbara A.↗
NASA NTRS1990

Piezoelectrostatic generator

A piezoelectrostatic generator includes a plurality of elongated piezoelectric elements having first and second ends, with the first ends fixedly mounted in a cylindrical housing and the second extending radially inwardly toward an axis. A shaft movable along the axis is connected to the inner ends of the elements to produce bending forces in piezoelectric strips within the elements. Each element includes a pair of strips mounted in surface contact and in electrical series to produce a potential upon bending. Electrodes spaced from the strips by a solid dielectric material act as capacitor plates to collect the potential charge.

Robertson, Glen A.↗
NASA NTRS1941

Preignition Characteristics of Several Fuels Under Simulated Engine Conditions

The preignition characteristics of a number of fuels have been studied under conditions similar to those encountered in an engine. These conditions were simulated by suddenly compressing a fuel-air mixture in contact with an electrically heated hot spot in the cylinder head of the NACA combustion apparatus. Schlieren photographs and indicator cards were taken of the burning, and the hot-spot temperatures necessary to cause ignition under various conditions were determined.

Spencer, R C↗
NASA NTRS1995

Better Ohmic Contacts For InP Semiconductor Devices

Four design modifications enable fabrication of improved ohmic contacts on InP-based semiconductor devices. First modification consists of insertion of layer of gold phosphide between n-doped InP and metal or other overlayer of contact material. Second, includes first modification plus use of particular metal overlayer to achieve very low contact resistivities. Third, also involves deposition of Au(2)P(3) interlayer; in addition, refractory metal (W or Ta) deposited to form contact overlayer. In fourth, contact layer of Auln alloy deposited directly on InP. Improved contacts exhibit low electrical resistances and fabricated without exposing devices to destructive predeposition or postdeposition treatments.

Weizer, Victor G.↗
NASA NTRS1986

Method for contact resistivity measurements on photovoltaic cells and cell adapted for such measurement

A method is disclosed for scribing at least three grid contacts of a photovoltaic cell to electrically isolate them from the grid contact pattern used to collect solar current generated by the cell, and using the scribed segments for determining parameters of the cell by a combination of contact end resistance (CER) measurements using a minimum of three equally or unequally spaced lines, and transmission line modal (TLM) measurements using a minimum of four unequally spaced lines. TLM measurements may be used to determine sheet resistance under the contact, R.sub.sk, while CER measurements are used to determine contact resistivity, .rho..sub.c, from a nomograph of contact resistivity as a function of contact end resistance and sheet resistivity under the contact. In some cases, such as the case of silicon photovoltaic cells, sheet resistivity under the contact may be assumed to be equal to the known sheet resistance, R.sub.s, of the semiconductor material, thereby obviating the need for TLM measurements to determine R.sub.sk.

Burger, Dale R.↗
NASA NTRS2011

Failure Analysis of Nonvolatile Residue (NVR) Analyzer Model SP-1000

National Aeronautics and Space Administration (NASA) subcontractor Wiltech contacted the NASA Electrical Lab (NE-L) and requested a failure analysis of a Solvent Purity Meter; model SP-IOOO produced by the VerTis Instrument Company. The meter, used to measure the contaminate in a solvent to determine the relative contamination on spacecraft flight hardware and ground servicing equipment, had been inoperable and in storage for an unknown amount of time. NE-L was asked to troubleshoot the unit and make a determination on what may be required to make the unit operational. Through the use of general troubleshooting processes and the review of a unit in service at the time of analysis, the unit was found to be repairable but would need the replacement of multiple components.

Potter, Joseph C.↗
NASA NTRS2011

Cryogenic Quenching Process for Electronic Part Screening

The use of electronic parts at cryogenic temperatures (less than 100 C) for extreme environments is not well controlled or developed from a product quality and reliability point of view. This is in contrast to the very rigorous and well-documented procedures to qualify electronic parts for mission use in the 55 to 125 C temperature range. A similarly rigorous methodology for screening and evaluating electronic parts needs to be developed so that mission planners can expect the same level of high reliability performance for parts operated at cryogenic temperatures. A formal methodology for screening and qualifying electronic parts at cryogenic temperatures has been proposed. The methodology focuses on the base physics of failure of the devices at cryogenic temperatures. All electronic part reliability is based on the bathtub curve, high amounts of initial failures (infant mortals), a long period of normal use (random failures), and then an increasing number of failures (end of life). Unique to this is the development of custom screening procedures to eliminate early failures at cold temperatures. The ability to screen out defects will specifically impact reliability at cold temperatures. Cryogenic reliability is limited by electron trap creation in the oxide and defect sites at conductor interfaces. Non-uniform conduction processes due to process marginalities will be magnified at cryogenic temperatures. Carrier mobilities change by orders of magnitude at cryogenic temperatures, significantly enhancing the effects of electric field. Marginal contacts, impurities in oxides, and defects in conductor/conductor interfaces can all be magnified at low temperatures. The novelty is the use of an ultra-low temperature, short-duration quenching process for defect screening. The quenching process is designed to identify those defects that will precisely (and negatively) affect long-term, cryogenic part operation. This quenching process occurs at a temperature that is at least 25 C colder than the coldest expected operating temperature. This quenching process is the opposite of the standard burn-in procedure. Normal burn-in raises the temperature (and voltage) to activate quickly any possible manufacturing defects remaining in the device that were not already rejected at a functional test step. The proposed inverse burn-in or quenching process is custom-tailored to the electronic device being used. The doping profiles, materials, minimum dimensions, interfaces, and thermal expansion coefficients are all taken into account in determining the ramp rate, dwell time, and temperature.

Sheldon, Douglas J.↗
NASA NTRS2015

Advanced Antireflection Coatings for High-Performance Solar Energy Applications

Phase II objectives: Develop and refine antireflection coatings incorporating lanthanum titanate as an intermediate refractive index material; Investigate wet/dry thermal oxidation of aluminum containing semiconductor compounds as a means of forming a more transparent window layer with equal or better optical properties than its unoxidized form; Develop a fabrication process that allows integration of the oxidized window layer and maintains the necessary electrical properties for contacting the solar cell; Conduct an experimental demonstration of the best candidates for improved antireflection coatings.

Pan, Noren↗
NASA NTRS1981

Contact resistivities of sputtered TiN and Ti-TiN metallizations on solar-cell-type-silicon

The resistivities of TiN and Ti-TiN contacts on a shallow junction solar-cell-type silicon substrate have been determined by the method of the transmission line model. The contacts investigated are shown to be suitable for standard solar cells from an electrical point of view. Contact resistivity values of the order of 0.0001 ohm/sq cm as obtained for the n(+)Si-TiSi2-TiN contact system may be acceptable for concentrations up to 100 times, but lower values are necessary beyond this point.

Maenpaa, M.↗
NASA NTRS1993

The Achievement of Near-Theoretical-Minimum Contact Resistance to InP

We have investigated the electrical and metallurgical behavior of the InP/Au/Ni contact system. We show that when a layer of Au, 100 A or more in thickness, is introduced between n-InP and Ni contact metallization, specific contact resistivity R, values in the low 10(exp -8) Omega cm(exp 2) range are achieved after sintering. It is suggested that these ultralow values of R(sub c) are due to the presence, at the metal-InP interface, of a Ni3P layer combined with a stoichiometry change in the InP surface. We show, in addition, that it is possible to achieve very low R(sub c) values with this system without incurring device destroying sinter-induced metallurgical interdiffusion.

Fatemi, Navid S.↗
NASA NTRS2018

Gas Sensors with Contact Pads

Systems, methods, and other embodiments associated with gas detecting sensors. According to one embodiment, a gas sensor includes a metal layer, a barrier interlayer, a substrate layer, a first insulating layer, a conduction path, a contact pad, and a second insulating layer. The conduction path connects the metal layer to the contact pad. The second insulating layer prevents diffusion through the contact pad, the conduction path, or the metal layer. The sensor includes a wire bonded electrical connection to the contact pad such that voltage can be determined and/or applied.

Xu, Jennifer↗
NASA NTRS2010

Foldable Instrumented Bits for Ultrasonic/Sonic Penetrators

Long tool bits are undergoing development that can be stowed compactly until used as rock- or ground-penetrating probes actuated by ultrasonic/sonic mechanisms. These bits are designed to be folded or rolled into compact form for transport to exploration sites, where they are to be connected to their ultrasonic/ sonic actuation mechanisms and unfolded or unrolled to their full lengths for penetrating ground or rock to relatively large depths. These bits can be designed to acquire rock or soil samples and/or to be equipped with sensors for measuring properties of rock or soil in situ. These bits can also be designed to be withdrawn from the ground, restowed, and transported for reuse at different exploration sites. Apparatuses based on the concept of a probe actuated by an ultrasonic/sonic mechanism have been described in numerous prior NASA Tech Briefs articles, the most recent and relevant being "Ultrasonic/ Sonic Impacting Penetrators" (NPO-41666) NASA Tech Briefs, Vol. 32, No. 4 (April 2008), page 58. All of those apparatuses are variations on the basic theme of the earliest ones, denoted ultrasonic/sonic drill corers (USDCs). To recapitulate: An apparatus of this type includes a lightweight, low-power, piezoelectrically driven actuator in which ultrasonic and sonic vibrations are generated and coupled to a tool bit. The combination of ultrasonic and sonic vibrations gives rise to a hammering action (and a resulting chiseling action at the tip of the tool bit) that is more effective for drilling than is the microhammering action of ultrasonic vibrations alone. The hammering and chiseling actions are so effective that the size of the axial force needed to make the tool bit advance into soil, rock, or another material of interest is much smaller than in ordinary twist drilling, ordinary hammering, or ordinary steady pushing. Examples of properties that could be measured by use of an instrumented tool bit include electrical conductivity, permittivity, magnetic field, magnetic permeability, temperature, and any other properties that can be measured by fiber-optic sensors. The problem of instrumenting a probe of this type is simplified, relative to the problem of attaching electrodes in a rotating drill bit, in two ways: (1) Unlike a rotating drill bit, a bit of this type does not have flutes, which would compound the problem of ensuring contact between sensors and the side wall of a hole; and (2) there is no need for slip rings for electrical contact between sensor electronic circuitry and external circuitry because, unlike a rotating drill, a tool bit of this type is not rotated continuously during operation. One design for a tool bit of the present type is a segmented bit with a segmented, hinged support structure (see figure). The bit and its ultrasonic/sonic actuator are supported by a slider/guiding fixture, and its displacement and preload are controlled by a motor. For deployment from the folded configuration, a spring-loaded mechanism rotates the lower segment about the hinges, causing the lower segment to become axially aligned with the upper segment. A latching mechanism then locks the segments of the bit and the corresponding segments of the slider/guiding fixture. Then the entire resulting assembly is maneuvered into position for drilling into the ground. Another design provides for a bit comprising multiple tubular segments with an inner alignment string, similar to a foldable tent pole comprising multiple tubular segments with an inner elastic cable connecting the two ends. At the beginning of deployment, all segments except the first (lowermost) one remain folded, and the ultrasonic/sonic actuator is clamped to the top of the lowermost segment and used to drive this segment into the ground. When the first segment has penetrated to a specified depth, the second segment is connected to the upper end of the first segment to form a longer rigid tubular bit and the actuator is moved to the upper end of the second segnt. The process as described thus far is repeated, adding segments until the desired depth of penetration has been attained. Yet other designs provide for bits in the form of bistable circular- or rectangular- cross-section tubes that can be stowed compactly like rolls of flat tape and become rigidified upon extension to full length, in a manner partly similar to that of a common steel tape measure. Albeit not marketed for use in tool bits, a bistable reeled composite product that transforms itself from a flat coil to a rigid tube of circular cross section when unrolled, is commercially available under the trade name RolaTube(TradeMark) and serves as a model for the further development of tool bits of this subtype.

Bar-Cohen, Yoseph↗
NASA NTRS2011

Non-Contact Thermal Properties Measurement with Low-Power Laser and IR Camera System

As shown by the Phoenix Mars Lander's Thermal and Electrical Conductivity Probe (TECP), contact measurements of thermal conductivity and diffusivity (using a modified flux-plate or line-source heat-pulse method) are constrained by a number of factors. Robotic resources must be used to place the probe, making them unavailable for other operations for the duration of the measurement. The range of placement is also limited by mobility, particularly in the case of a lander. Placement is also subject to irregularities in contact quality, resulting in non-repeatable heat transfer to the material under test. Most important from a scientific perspective, the varieties of materials which can be measured are limited to unconsolidated or weakly-cohesive regolith materials, rocks, and ices being too hard for nominal insertion strengths. Accurately measuring thermal properties in the laboratory requires significant experimental finesse, involving sample preparation, controlled and repeatable procedures, and, practically, instrumentation much more voluminous than the sample being tested (heater plates, insulation, temperature sensors). Remote measurements (infrared images from orbiting spacecraft) can reveal composite properties like thermal inertia, but suffer both from a large footprint (low spatial resolution) and convolution of the thermal properties of a potentially layered medium. In situ measurement techniques (the Phoenix TECP is the only robotic measurement of thermal properties to date) suffer from problems of placement range, placement quality, occupation of robotic resources, and the ability to only measure materials of low mechanical strength. A spacecraft needs the ability to perform a non-contact thermal properties measurement in situ. Essential components include low power consumption, leveraging of existing or highly-developed flight technologies, and mechanical simplicity. This new in situ method, by virtue of its being non-contact, bypasses all of these problems. The use of photons to both excite and measure the thermal response of any surface material to a high resolution (estimated footprint = 10 square centimeters) is a generational leap in physical properties measurements. The proposed method consists of spot-heating the surface of a material with a low (less than 1 W) power laser. This produces a moderate (5-10 K) temperature increase in the material.

Hudson, Troy L.↗