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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 325 records · Page 18

Transient Liquid Phase Bonding of AlN to AlSiC for Durable Power Electronic Packages

Conventional power electronic modules employ a direct bonded copper (DBC) substrate and multiple interface layers to dissipate heat. However, reliability issues arise due to the coefficient of thermal expansion (CTE) mismatch that exists between the metal, ceramic, and semiconductor materials in the conventional module. Significant performance enhancement can be achieved by eliminating the DBC and developing an integrated substrate/cold plate with a low CTE mismatch throughout the package. To address this need, we have demonstrated the ability to directly bond the aluminum nitride (AlN) substrate to an AlSiC heat sink through transient liquid phase bonding using a Cu-Al binary system. Fabricated samples are found to have good interfacial adhesion. The novel bond material exhibits properties analogous to AlSiC and is analyzed for thermal, mechanical, and metallographic properties. The novel structure demonstrated in this work will enable smaller, lighter, and more reliable power modules, when compared to traditional configurations.

42 ENGINEERING↗

Encapsulation materials research

Encapsulation materials for solar cells were investigated. The different phases consisted of: (1) identification and development of low cost module encapsulation materials; (2) materials reliability examination; and (3) process sensitivity and process development. It is found that outdoor photothermal aging devices (OPT) are the best accelerated aging methods, simulate worst case field conditions, evaluate formulation and module performance and have a possibility for life assessment. Outdoor metallic copper exposure should be avoided, self priming formulations have good storage stability, stabilizers enhance performance, and soil resistance treatment is still effective.

Willis, P. B.↗

Photovoltaic Inverter Reliability Assessment

As the price of PV modules drops, the price of power electronics become more important. Power electronics now constitute 8%-12% of the total lifetime PV cost. As of 2010, the inverter and associated power conditioning components accounted for $\$0.25$/W, well above the DOE benchmark of $\$0.12$/W by 2020. As efforts to reduce PV module costs yield diminishing returns, the importance of understanding and reducing inverter costs becomes an increasingly critical and cost-effective investment toward achieving the DOE SunShot goals. With this in view, this report showcases and describes an approach to help assess and predict the reliability of photovoltaic (PV) inverters. To predict the reliability, thermal cycling is considered as a prominent stressor in the inverter system. To evaluate the impacts of thermal cycling, a detailed linearized model of the PV inverter is developed along with controllers. This research also develops models and methods to compute the losses of the power electronics switches and other components in a PV inverter. The losses are then used to estimate the junction and heat sink temperature. The model is verified by developing an in-house inverter. Additionally, to assess the scalability of the research, the hardware inverter is placed inside a thermal chamber to verify the losses for different ambient temperatures. After the verification of the model, a reduced-order model of the inverter is implemented to translate the profile of ambient temperature and solar irradiance into the profile of junction temperatures of the switches. The estimated junction temperature data are used to identify inverter reliability indices and predict the useful lifetime of the inverter system. After developing the models to predict the useful lifetime of the system, the impact of reactive power on the overall reliability of the system will be studied. The first chapter involves the motivation behind the research on assessing the reliability of PV inverters. The inverter power stage and controller design of the power converter used in this research is also explained in detail in this chapter. The second chapter presents the various losses of the power converter system and the translation of power loss into temperature increase with thermal modeling. The results of the loss modeling and the thermal modeling are also explained in detail in this chapter. The third chapter involves implementing the reduced-order model to translate the mission profile of ambient temperature and solar irradiance into profile of the junction temperatures of the switches. The final chapter involves identifying reliability indices, which are of interest for this system to predict the remaining useful life of the system, and concludes with the impact of reactive power on the overall reliability of the inverter system.

14 SOLAR ENERGY↗

Advanced Power Electronics and Electric Machines

The advanced power electronics and electric machines (APEEM) research group at the National Renewable Energy Laboratory (NREL) has developed world-class experimental and modeling capabilities for designing and evaluating efficient and reliable power electronics and electric machines thermal management systems. They also design, fabricate and characterize advanced power electronics packaging, and are developing state-of-health monitoring techniques. These researchers deliver safe, reliable, high performing, power-dense components that allow seamless integration between renewable energy sources, electric transportation, and the grid, helping to make widespread electric vehicle (EV) adoption and greenhouse gas emissions reduction more feasible. This document outlines the group's major capabilities in the areas of power electronics; module development and characterization; thermal modeling and management; thermomechanical reliability analysis of devices, modules, inverters/converters, and electric machines; physics-of-failure-based reliability analysis; and microelectronics. It also overviews the group's state-of-the-art equipment for fluid-based thermal management; thermal measurement & characterization; thermomechanical reliability analysis; micro- and power electronics measurement & characterization; and prototype fabrication, as well as the group's world-class modeling and simulation capabilities.

advanced gate drivers↗

Reliability Technology to Achieve Insertion of Advanced Packaging (RELTECH) program

A joint military-commercial effort to evaluate multichip module (MCM) structures is discussed. The program, Reliability Technology to Achieve Insertion of Advanced Packaging (RELTECH), has been designed to identify the failure mechanisms that are possible in MCM structures. The RELTECH test vehicles, technical assessment task, product evaluation plan, reliability modeling task, accelerated and environmental testing, and post-test physical analysis and failure analysis are described. The information obtained through RELTECH can be used to address standardization issues, through development of cost effective qualification and appropriate screening criteria, for inclusion into a commercial specification and the MIL-H-38534 general specification for hybrid microcircuits.

Fayette, Daniel F.↗

Cell dark current–voltage from non-calibrated module electroluminescence image analysis

Here, we present a fast, accurate, and reliable method of obtaining cell dark current–voltage (I–V) curves from module electroluminescence (EL) images without requiring calibration or correction. For a pristine module, EL-derived dark I–V are compared to directly probed data for a variety of changing imaging parameters: camera sensor, lens, filter, aperture width, exposure time (level of sensor saturation), number of images used, and various combinations of these. Pristine modules and those experiencing different modes and degrees of degradation are examined. A recent study of modules using five different cell technologies demonstrates the practicality of our “EL sweep” technique for performance and degradation studies.

14 SOLAR ENERGY↗

Evaluation of the DC bus link capacitors and power transistor modules in the qualification testing of PV inverters

To achieve useful, fair, and cost-effective design qualification and type approval testing for PV inverters, two procedures were developed and demonstrated to evaluate the bus link capacitors and power transistor—and where applicable, its module—for long-term reliability. We evaluate the inverter under simulated use conditions with heat run tests to find the highest operating temperatures reached by these components. The procedures are demonstrated in this study with a 4-kVA class string inverter. The maximum temperature of the DC bus link capacitors was determined to be 76.4°C when the ambient temperature was at the inverter's maximum rated temperature of 60°C with derating occurring. On the other hand, the power transistor module's maximum temperature using the heat sink temperature as the index, 92.6°C, occurred in an ambient of 40.8°C when derating was not occurring. The conditions found for upper temperatures exhibited by these components are, respectively, proposed for implementation in the dry heat and thermal cycling tests in the IEC 62093 “Power conversion equipment for photovoltaic systems – Design qualification testing” international standard draft so that the levels applied in the tests are in proportion to those experienced in the field. Finally as a result, fairer evaluation of inverter reliability is realized.

14 SOLAR ENERGY↗

Mirror monochromator

In this SBIR project, Electron Optica, Inc. (EOI) is developing a mirror electron monochromator (MirrorChrom) attachment to new and retrofitted electron microscopes (EMs) for improving the energy resolution of the EM from the characteristic range of 0.2-0.5 eV to the range of 10-50 meV. This improvement will enhance the characterization of materials by imaging and spectroscopy. In particular, the monochromator will refine the energy spectra characterizing materials, as obtained from transmission EMs [TEMs] fitted with electron spectrometers, and it will increase the spatial resolution of the images of materials taken with scanning EMs (SEMs) operated at low voltages. EOI’s MirrorChrom technology utilizes a magnetic prism to simultaneously deflect the electron beam off the axis of the microscope column by 90° and disperse the electrons in proportional to their energies into a module with an electron mirror and a knife-edge. The knife-edge cuts off the tails of the energy distribution to reduce the energy spread of the electrons that are reflected, and subsequently deflected, back into the microscope column. The knife-edge is less prone to contamination, and thereby charging, than the conventional slits used in existing monochromators, which improves the reliability and stability of the module. The overall design of the MirrorChrom exploits the symmetry inherent in reversing the electron trajectory in order to maintain the beam brightness – a parameter that impacts how well the electron beam can be focused downstream onto a sample. During phase I, EOI drafted a set of candidate monochromator architectures and evaluated the trade-offs between energy resolution and beam current to achieve the optimum design for three particular applications with market potential: increasing the spatial resolution of low voltage SEMs, increasing the energy resolution of low voltage TEMs (beam energy of 5-20 keV), and increasing the energy resolution of conventional TEMs (beam energy of 80-120 keV). Specialized software packages that have been developed by MEBS, Ltd. were used to calculate the electron optical properties of the key monochromator components: namely, the magnetic prism, the electron mirror, and the electron lenses. In the final step, these results were folded into a model describing the key electron-optical parameters of the complete monochromator. The simulations reveal that the mirror monochromator can reduce the energy spread of a Schottky electron source, an established electron emitter used widely in EMs, to 10 meV for practical beam current values and that further reduction of the energy spread down to 3 meV is possible for low current applications with a Cold Field Emitter (an electron source with 10x the brightness of a Schottky source). MirrorChroms can be designed and built to attach to different types of TEMs and SEMs, thus making them suitable for enhancing the study of the structure, composition, and bonding states of new materials at the nanoscale to advance material science research in the field of nanotechnology as well as biomedical research.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Establishing a process of irradiating small animal brain using a CyberKnife and a microCT scanner

Purpose: Establish and validate a process of accurately irradiating small animals using the CyberKnife G4 System (version 8.5) with treatment plans designed to irradiate a hemisphere of a mouse brain based on microCT scanner images. Methods: These experiments consisted of four parts: (1) building a mouse phantom for intensity modulated radiotherapy (IMRT) quality assurance (QA), (2) proving usability of a microCT for treatment planning, (3) fabricating a small animal positioning system for use with the CyberKnife's image guided radiotherapy (IGRT) system, and (4)in vivo verification of targeting accuracy. A set of solid water mouse phantoms was designed and fabricated, with radiochromic films (RCF) positioned in selected planes to measure delivered doses. After down-sampling for treatment planning compatibility, a CT image set of a phantom was imported into the CyberKnife treatment planning system—MultiPlan (ver. 3.5.2). A 0.5 cm diameter sphere was contoured within the phantom to represent a hemispherical section of a mouse brain. A nude mouse was scanned in an alpha cradle using a microCT scanner (cone-beam, 157 × 149 pixels slices, 0.2 mm longitudinal slice thickness). Based on the results of our positional accuracy study, a planning treatment volume (PTV) was created. A stereotactic body mold of the mouse was “printed” using a 3D printer laying UV curable acrylic plastic. Printer instructions were based on exported contours of the mouse's skin. Positional reproducibility in the mold was checked by measuring ten CT scans. To verify accurate dose delivery in vivo, six mice were irradiated in the mold with a 4 mm target contour and a 2 mm PTV margin to 3 Gy and sacrificed within 20 min to avoid DNA repair. The brain was sliced and stained for analysis. Results: For the IMRT QA using a set of phantoms, the planned dose (6 Gy to the calculation point) was compared to the delivered dose measured via film and analyzed using Gamma analysis (3% and 3 mm). A passing rate of 99% was measured in areas of above 40% of the prescription dose. The final inverse treatment plan was comprised of 43 beams ranging from 5 to 12.5 mm in diameter (2.5 mm size increments are available up to 15 mm in diameter collimation). Using the Xsight Spine Tracking module, the CyberKnife system could not reliably identify and track the tiny mouse spine; however, the CyberKnife system could identify and track the fiducial markers on the 3D mold.In vivo positional accuracy analysis using the 3D mold generated a mean error of 1.41 mm ± 0.73 mm when fiducial markers were used for position tracking. Analysis of the dissected brain confirmed the ability to target the correct brain volume. Conclusions: With the use of a stereotactic body mold with fiducial markers, microCT imaging, and resolution down-sampling, the CyberKnife system can successfully perform small-animal radiotherapy studies.

62 RADIOLOGY AND NUCLEAR MEDICINE↗

Flat-plate solar array project. Volume 6: Engineering sciences and reliability

The Flat-Plate Solar Array (FSA) Project activities directed at developing the engineering technology base required to achieve modules that meet the functional, safety, and reliability requirements of large scale terrestrial photovoltaic systems applications are reported. These activities included: (1) development of functional, safety, and reliability requirements for such applications; (2) development of the engineering analytical approaches, test techniques, and design solutions required to meet the requirements; (3) synthesis and procurement of candidate designs for test and evaluation; and (4) performance of extensive testing, evaluation, and failure analysis of define design shortfalls and, thus, areas requiring additional research and development. A summary of the approach and technical outcome of these activities are provided along with a complete bibliography of the published documentation covering the detailed accomplishments and technologies developed.

Ross, R. G., Jr.↗

A hybrid electronically scanned pressure module for cryogenic environments

Pressure is one of the most important parameters measured when testing models in wind tunnels. For models tested in the cryogenic environment of the National Transonic Facility at NASA Langley Research Center, the technique of utilizing commercially available multichannel pressure modules inside the models is difficult due to the small internal volume of the models and the requirement of keeping the pressure transducer modules within an acceptable temperature range well above the -173 degrees C tunnel temperature. A prototype multichannel pressure transducer module has been designed and fabricated with stable, repeatable sensors and materials optimized for reliable performance in the cryogenic environment. The module has 16 single crystal silicon piezoresistive pressure sensors electrostatically bonded to a metalized Pyrex substrate for sensing the wind tunnel model pressures. An integral temperature sensor mounted on each silicon micromachined pressure sensor senses real-time temperature fluctuations to within 0.1 degrees C to correct for thermally induced non-random sensor drift. The data presented here are from a prototype sensor module tested in the 0.3 M cryogenic tunnel and thermal equilibrium conditions in an environmental chamber which approximates the thermal environment (-173 degrees C to +60 degrees C) of the National Transonic Facility.

Chapman, J. J.↗

Multiphysics Co-Optimization Design and Analysis of Double-Side Cooled Silicon Carbide-Based Power Module: Preprint

With the rapid growth of Electric Vehicles (EVs) and Hybrid Electric Vehicles (HEVs), much more rigorous design targets have been set for automotive power electronics, including high power density, high reliability, and low cost. Novel power module and inverter technologies based on wide bandgap (WEG) semiconductors have been developed to meet these design targets, while providing optimal power semiconductor operating temperature and promising thermomechanical performance. Compared with conventional cooling techniques which are normally applied only on one side of power module, double-side cooling approach is now believed to be the solution to enable high power density and low thermal resistance of WEG semiconductor-based power electronics. In this work, we develop a three-phase power module that is double-sided cooled using dielectric fluid jet impingement. In each phase, four silicon carbide (SiC) power semiconductors are bonded to copper busbars without electrical insulation layers. A finite element analysis (FEA) model is created for thermal and thermomechanical analysis. Based on FEA modeling results, we select particular dimensions for a parametric study to optimize thermal and mechanical performance. Using a multi-objective genetic algorithm (MOGA)-based optimization method, we have minimized the maximum junction temperature and thermal stresses within the power module. The multiphysics co-optimization approach has enabled an efficient design process of power modules with greatly reduced computational cost, as compared to conventional processes that rely on exhaustive numerical simulations and iterations.

ADVANCED PROPULSION SYSTEMS↗

Ribbons Affect Movement of Cracked Solar Cells [Poster]

Cracking of crystalline silicon photovoltaic cells remains a challenging topic in accurately assessing the long-term reliability and performance of affected modules. Cells can be damaged in every stage throughout the lifetime of a photovoltaic module, ranging from manufacturing, transportation, and installation to operation. Initially, the metallization can be able to bridge the gap of fractured cells and keep individual cell fragments electrically connected. However, photovoltaic modules and cells experience thermo-mechanical stresses during operation from temperature changes and pressure cycles of wind and snow loads. This causes the cell fragments to move, which, in turn, can lead to the wear out of the metallization and, consequently, to power loss or a safety hazard. The rate at which this degradation mechanism proceeds is currently unknown. Hence, in this work, we quantify the cell fragment movement of polycrystalline and monocrystalline mini-modules. By using digital image correlation, we were able to extract the normal crack opening and tangential sliding distances of adjacent cell fragments during heating of the mini-modules. Those distances are essential to develop wear-out models for the metallization and determine the rate of the degradation mechanism. We found that the interconnect technology has a significant impact on the direction and quantity of the cell fragment movements.

14 SOLAR ENERGY↗

SU-F-T-184: 3D Range-Modulator for Scanned Particle Therapy: Development, Monte Carlo Simulations and Measurements

Purpose: Active raster scanning in particle therapy results in highly conformal dose distributions. Treatment time, however, is relatively high due to the large number of different iso-energy layers used. By using only one energy and the so called 3D range-modulator irradiation times of a few seconds only can be achieved, thus making delivery of homogeneous dose to moving targets (e.g. lung cancer) more reliable. Methods: A 3D range-modulator consisting of many pins with base area of 2.25 mm2 and different lengths was developed and manufactured with rapid prototyping technique. The form of the 3D range-modulator was optimised for a spherical target volume with 5 cm diameter placed at 25 cm in a water phantom. Monte Carlo simulations using the FLUKA package were carried out to evaluate the modulating effect of the 3D range-modulator and simulate the resulting dose distribution. The fine and complicated contour form of the 3D range-modulator was taken into account by a specially programmed user routine. Additionally FLUKA was extended with the capability of intensity modulated scanning. To verify the simulation results dose measurements were carried out at the Heidelberg Ion Therapy Center (HIT) with a 400.41 MeV 12C beam. Results: The high resolution measurements show that the 3D range-modulator is capable of producing homogeneous 3D conformal dose distributions, simultaneously reducing significantly irradiation time. Measured dose is in very good agreement with the previously conducted FLUKA simulations, where slight differences were traced back to minor manufacturing deviations from the perfect optimised form. Conclusion: Combined with the advantages of very short treatment time the 3D range-modulator could be an alternative to treat small to medium sized tumours (e.g. lung metastasis) with the same conformity as full raster-scanning treatment. Further simulations and measurements of more complex cases will be conducted to investigate the full potential of the 3D range-modulator.

60 APPLIED LIFE SCIENCES↗

Analysis of electrically conductive adhesives in shingled solar modules by X-ray imaging techniques

The failure mechanisms of electrically conductive adhesives (ECAs) in solar modules are difficult to study since the ECA layer is not easily accessible within the module package. In this work, we present two complementary imaging modalities—X-ray radiography and X-ray microcomputed tomography (XCT)—that reveal important morphological features of the ECA within a shingled module. X-ray radiography uses single X-ray projections to provide fast and non-destructive imaging of the shingled interconnection, illuminating the alignment of the ECA relative to the busbars, the size and shape of the ECA, and the presence of voids within it. Through X-ray radiography, we observed, for example, that the average void coverage area of ECA segments reduced from 36.7% to 4.4% when an ECA was cured for 60 s prior to module lamination. XCT is a three-dimensional imaging technique that can identify regions in which the ECA makes electrical contact to busbars on cells and regions in which the ECA has cracked, among other features. XCT can also be used to image the individual metal particles within ECA, from which the metal volume fraction of an ECA was found here to be 70.4%. This is a quantity that is not often reported by ECA manufacturers but is important to ensure isotropic conduction. As X-ray projections can be performed non-destructively on full modules, the technique may be used to pinpoint ECA failures in accelerated degradation testing. XCT is complementary and is suited to forensic analysis of failing modules.

14 SOLAR ENERGY↗

Reliability Improvement by Fault-Tolerant Operation of NPC Inverter for Motor Driving

The high-reliability operation of three-level inverters is crucial to prevent equipment damage, process downtime, and economic losses. This article investigates a three-level neutral-point-clamped inverter under all possible combinations of open-circuit and short-circuit faults and proposes a new postfault operation method without adding extra hardware. This method provides comprehensive solution for operations after single and multiple-device failures, increasing the inverter reliability by 24%. This article classified postfault modulations and uncovered previously unknown fault scenarios that can be addressed using the proposed control method. A new postfault modulation based on space vector modulation with virtual vectors is proposed. The feasibility of the proposed control method is verified by simulation and an experiment for one fault scenario in a three-level neutral-point-clamped inverter with a 3.73 kW motor load. Furthermore, this article contributes to improving the reliability of three-level inverters.

42 ENGINEERING↗