Back side defect imaging in crystalline silicon photovoltaic modules
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Within the framework of IEA PVPS, Task 13 aims to provide support to market actors working to improve the operation, the reliability and the quality of PV components and systems. Operational data from PV systems in different climate zones compiled within the project will help provide the basis for estimates of the current situation regarding PV reliability and performance. The general setting of Task 13 provides a common platform to summarize and report on technical aspects affecting the quality, performance, reliability and lifetime of PV systems in a wide variety of environments and applications. By working together across national boundaries we can all take advantage of research and experience from each member country and combine and integrate this knowledge into valuable summaries of best practices and methods for ensuring PV systems perform at their optimum and continue to provide competitive return on investment. Task 13 has so far managed to create the right framework for the calculations of various parameters that can give an indication of the quality of PV components and systems. The framework is now there and can be used by the industry who has expressed appreciation towards the results included in the high-quality reports. The IEA PVPS countries participating in Task 13 are Australia, Austria, Belgium, Canada, Chile, China, Denmark, Finland, France, Germany, Israel, Italy, Japan, the Netherlands, Norway, Spain, Sweden, Switzerland, Thailand, and the United States of America.
Abstract not provided.
Abstract not provided.
This work experimentally investigates hail-related failures in Glass/Backsheet and Glass/Glass PV modules with varying ice ball diameters and velocities.
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A new iteration of the Hydroscanner prototype was designed and built during the execution of the contract. Compared to the previous designs, the communication port was changed from ethernet to USB C, since it provides a more seamless integration as a peripheral unit. An additional advantage is that one single port can be used for both communication and power up of the infrared camera. Although the power requirements are higher than the typical amount provided by a laptop computer, the camera can be run as a peripheral from a docking station when connected to a thunderbolt charging port. The software interface was modified to accommodate two imaging modes, an 8-bit and 14-bit image display. The 8-bit images use a custom colorization scheme that divides all pixels in the image into bins of equal width, such that images containing a wide range of brightness display the intermediate pixel intensities in greyscale values that enhance the contrast. The 14-bit images provide the direct readout from the focal plane array of the camera and can be saved as a text file for later processing in other software packages (MATLAB, Python).
Invited talk to ACS Southwest Regional Meeting
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The design of a 1.2 by 2.4 m curved glass superstrate and support clip assembly is presented, along with the results of finite element computer analysis and a glass industry survey conducted to assess the technical and economic feasibility of the concept. Installed costs for four curved glass module array configurations are estimated and compared with cost previously reported for comparable flat glass module configurations. Electrical properties of candidate module encapsulation systems are evaluated along with present industry practice for the design and testing of electrical insulation systems. Electric design requirements for module encapsulation systems are also discussed.
Pertinent electrical termination attributes were identified and used in the development of selection criteria which included function, environmental durability, utility, manufacturing, code, and cost. Significant aspects of each criteria are discussed, and eight different types of terminations are ranked according to their performance in remote, residential, intermediate, and industrial applications.
Recent developments in the solar array manufacturing industry costing standards (SAMICS) are described. Consideration is given to the added capability to handle arbitrary operating schedules and the revised procedure for calculation of one-time costs. The results of an extensive validation study are summarized.
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The results of comprehensive investigation of interconnect fatigue that has led to the definition of useful reliability-design and life-prediction algorithms are presented. Experimental data indicate that the classical strain-cycle (fatigue) curve for the interconnect material is a good model of mean interconnect fatigue performance, but it fails to account for the broad statistical scatter, which is critical to reliability prediction. To fill this shortcoming the classical fatigue curve is combined with experimental cumulative interconnect failure rate data to yield statistical fatigue curves (having failure probability as a parameter) which enable (1) the prediction of cumulative interconnect failures during the design life of an array field, and (2) the unambiguous--ie., quantitative--interpretation of data from field-service qualification (accelerated thermal cycling) tests. Optimal interconnect cost-reliability design algorithms are derived based on minimizing the cost of energy over the design life of the array field.
Growth of round ingots is cost-effective for sheets but leaves unused space when round cells are packed into a module. This reduces the packing efficiency, which approaches 95% for square cells, to about 78% and reduces the conversion efficiency of the module by the same ratio. Shaping these ingots into squares with regrowth of cut silicon improves the packing factor, but increases growth cost. The cost impact on solar cell modules was determined by considering shaping ingots in stages from full round to complete square. The sequence of module production with relevant price allocation guidelines is outlined. The severe penalties in add-on price due to increasing slice thickness and kerf are presented. Trade-offs between advantages of recycling silicon and shaping costs are developed for different slicing scenarios. It is shown that shaping results in cost saving of up to 21% for a 15 cm dia. ingot.
As part of the Jet Propulsion Laboratory's Low-Cost Solar Array Project, the susceptibility of fat-plate modules to hot-spot problems is investigated. Hot-spot problems arise in modules when the cells become back-biased and operate in the negative-voltage quadrant, as a result of short-circuit current mismatch, cell cracking or shadowing. The details of a qualification test for determining the capability of modules of surviving field hot-spot problems and typical results of this test are presented. In addition, recommended circuit-design techniques for improving the module and array reliability with respect to hot-spot problems are presented.
Mounting strips patterned after glazing gaskets. Easy to install supports for rooftop solar modules consist of extruded rubber mullions with locking zippers. Supports cut to length with utility knife and installed without special tools. Adaptable to many different roof configurations.
A summary version of Volume 1, presenting the basic encapsulation systems, their purposes and requirements, and the characteristics of the most promising candidate systems and materials, as identified and evaluated by the Flat-Plate Solar Array Project is presented. In this summary version considerable detail and much supporting and experimental information has necessarily been omitted. A reader interested in references and literature citations, and in more detailed information on specific topics, should consult Reference 1, JPL Document No. 5101-177, JPL Publication 81-102, DOE/JPL-1012-60 (JPL), June 1, 1982.