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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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All sourcesNASA NTRSDOE OSTI
DOE OSTI2023

Electronics for the far-forward CMS muon detector upgrade, ME0

Abstract With the High Luminosity upgrade of the Large Hadron Collider (LHC) we expect increased instantaneous luminosities up to 7.5 × 10 34 cm −2 s −1 , or five times more than the original values. In order to maintain performance of the Compact Muon Solenoid (CMS) experiment under these conditions, ME0 is one of three new muon sub-detectors being added, along with GE1/1 and GE2/1, which use the triple Gas Electron Multiplier (GEM) technology. ME0 is designed to cover the forward region of 2.0 < | η | < 2.8, thus improving muon reconstruction at high background rates by supplementing other overlapping muon subsystems up to | η | = 2.4, while also extending the acceptance for the first time to | η | = 2.8. The readout electronics for ME0 must be designed to accommodate high data rates and be sufficiently radiation hard to operate close to the beamline. The Optohybrid (OH) board for ME0, which reads out data from the front-end VFAT3b ASICs, has therefore been designed to operate without an FPGA (unlike GE1/1 and GE2/1) to ensure radiation hardness. The ME0 OH uses the radiation-hard CERN-designed lpGBT ASIC and VTRx+ optical transceiver module for high bandwidth optical links up to 10.24 Gb/s. The backend system is based on the ATCA standard. The design and development status of the readout electronics for ME0 is presented, along with recent results from integration tests performed using the first prototypes.

Instruments & Instrumentation↗
DOE OSTI2023

Analysis of humidity sensitivity of silicon strip sensors for ATLAS upgrade tracker, pre- and post-irradiation

During the prototyping phase of the new ATLAS Inner-Tracker (ITk) strip sensors, a degradation of the device breakdown voltage at high humidity was observed. Although the degradation was temporary, showing a fast recovery in dry conditions, the study of the influence of humidity on the sensor performance was critical to establish counter-measures and handling protocols during production testing in order to ensure the proper performance of the upgraded detector. The work presented here has the objective to study for the first time the breakdown voltage deterioration in presence of ambient humidity of ATLAS ITk production-layout strip sensors with different surface properties, before and after proton, neutron and gamma irradiations. A study of the humidity sensitivity of miniature ATLAS ITk strip sensors, before and after proton irradiations, is also presented to compare the sensitivity of devices with different sizes. The sensors were also exposed for several days to high humidity with the aim to recreate and evaluate the influence of the detector integration environment expected during the Large Hadron Collider (LHC) Long Shutdown 3 (LS3) in 2026, where the sensors will be exposed to ambient humidity for prolonged times.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
DOE OSTI2023

Hardware design and testing of the generic rear transition module for the global trigger subsystem of ATLAS Phase-II Upgrade

Abstract In the framework of the ATLAS experiment’s Phase-II Upgrade at the High-Luminosity Large Hadron Collider (HL-LHC), new and improved trigger hardware and algorithms will be implemented onto a single-level, 10 μs-latency architecture. The Global Trigger is a new subsystem which will bring event-filter capabilities by performing offline-like algorithms on full-granularity calorimeter data. The implementation of the functionality is firmware-focused and composed of several processing nodes, which are hosted on identical hardware, made up of an Advanced Telecommunications Computing Architecture (ATCA) front board, called Global Common Module (GCM), and a rear transition module (RTM), called Generic RTM (GRM). The GRM, which was developed to mitigate the risks deriving from the complex design and power management of the GCM, features an advanced Xilinx Versal Prime system-on-chip and can handle communication with the GCM and Front-End Link eXchange (FELIX) subsystem and trigger processors through 124 25.8 Gb/s transceiver links, for readout and control. Additionally, the GRM mounts a Low-Power GigaBit Transceiver (lpGBT) chip which enables emulation of the detector front-ends for integration tests. This paper presents the GRM hardware design and its testing.

Instruments & Instrumentation↗
DOE OSTI2023

Establishing the Quality Assurance programme for the strip sensor production of the ATLAS tracker upgrade including irradiation with neutrons, photons and protons to HL-LHC fluences

The successful pre-production delivery of strip sensors for the new Inner Tracker (ITk) for the upgraded ATLAS detector at the High Luminosity LHC (HL-LHC) at CERN was completed and based on their performance full production has commenced. The overall delivery period is anticipated to last 4 years to complete the approximately 22000 sensors required for the ITk. For Quality Assurance (QA), a number of test structures designed by the collaboration, along with a large area diode and miniature version of the main sensor, are produced in every wafer by the foundry Hamamatsu Photonics K.K (HPK). As well as Quality Control (QC) checks on every main sensor, samples of the QA pieces from each delivery batch are tested both before and after irradiation with results after exposure to neutrons, gammas or protons to fluences and doses corresponding to those anticipated after operation at the HL-LHC to roughly 1.5 times the ultimate integrated luminosity of 4000 fb -1 . In this paper the procedures are presented and the studies carried out to establish that the seven ITk QA Strip Sensor irradiation and test sites meet all the requirements to support this very extensive programme throughout the strip sensor production phase for the ITk project.

47 OTHER INSTRUMENTATION↗
DOE OSTI2023

An 8 GeV linac as the Booster replacement in the Fermilab Power Upgrade

Increasing the Main Injector beam power above ~ 1.2 MW requires replacement of the 8 GeV Booster by a higher intensity alternative. In this paper, we consider an 8 GeV linac Booster replacement that produces 8 GeV H$^{-}$ beam for injection into the Recycler Ring or Main Injector. This upgrade will maximize the beam available for neutrino production for the long baseline DUNE experiment to greater than 2.5 MW and enable a next generation frontier experiments. The 8 GeV linac takes ~ 1 GeV beam from the PIP-II Linac and accelerates it to ~ 2 GeV in a650 MHz superconducting RF linac, followed by a ~ 2 to 8 GeV pulsed linac using 1300 MHz cryomodules. The linac components incorporate recent improvements in superconducting RF technology. The linac configuration and beam dynamics requirements are presented. Injection options are discussed, including use of an8 GeV Accumulator Ring. Foil-based injection is the present standard but R&D toward implementing laser-assisted injection could enable a significant improvement. Research needed to implement the Booster replacement is described.

43 PARTICLE ACCELERATORS↗
DOE OSTI2023

Neutron irradiation and electrical characterisation of the first 8” silicon pad sensor prototypes for the CMS calorimeter endcap upgrade

As part of its HL-LHC upgrade program, the CMS collaboration is replacing its existing endcap calorimeters with a high-granularity calorimeter (CE). The new calorimeter is a sampling calorimeter with unprecedented transverse and longitudinal readout for both electromagnetic and hadronic compartments. Due to its compactness, intrinsic time resolution, and radiation hardness, silicon has been chosen as active material for the regions exposed to higher radiation levels. The silicon sensors are fabricated as 20 cm (8”) wide hexagonal wafers and are segmented into several hundred pads which are read out individually. As part of the sensor qualification strategy, 8” sensor irradiation with neutrons has been conducted at the Rhode Island Nuclear Science Center (RINSC) and followed by their electrical characterisation in 2020-21. The completion of this important milestone in the CE's R&D program is documented in this paper and it provides detailed account of the associated infrastructure and procedures.The results on the electrical properties of the irradiated CE silicon sensors are presented.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
DOE OSTI2023

Evaluation of planar silicon pixel sensors with the RD53A readout chip for the Phase-2 Upgrade of the CMS Inner Tracker

The Large Hadron Collider at CERN will undergo an upgrade inorder to increase its luminosity to7.5 × 10$^{34}$ cm$^{-2}$s$^{-1}$. The increased luminosityduring this High-Luminosity running phase, starting around 2029,means a higher rate of proton-proton interactions, hence a largerionizing dose and particle fluence for the detectors. The currenttracking system of the CMS experiment will be fully replaced inorder to cope with the new operating conditions. Prototype planarpixel sensors for the CMS Inner Tracker with square50 μm × 50 μm and rectangular100 μm × 25 μm pixels read out by theRD53A chip were characterized in the lab and at the DESY-II testbeamfacility in order to identify designs that meet the requirements ofCMS during the High-Luminosity running phase. A spatial resolutionof approximately 3.4 μm (2 μm) is obtained using themodules with 50 μm × 50 μm(100 μm × 25 μm) pixels at the optimalangle of incidence before irradiation. After irradiation to a 1 MeVneutron equivalent fluence ofΦ$_{eq}$ = 5.3 × 10$^{15}$ cm$^{-2}$, a resolution of9.4 μm is achieved at a bias voltage of 800 V using a modulewith 50 μm × 50 μm pixel size. All modulesretain a hit efficiency in excess of 99% after irradiation tofluences up to 2.1 × 10$^{16}$ cm$^{-2}$. Further studies ofthe electrical properties of the modules, especially crosstalk, arealso presented in this paper.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
DOE OSTI2024

Characterization of the ATLAS Liquid Argon Front-End ASIC ALFE2 for the HL-LHC upgrade

In this study, ALFE2 is an ATLAS Liquid Argon Calorimeter (LAr) Front-End ASIC designed for the HL-LHC upgrade. ALFE2 comprises four channels of pre-amplifiers and CR-(RC) 2 shapers with adjustable input impedance. ALFE2 features two separate gain outputs to provide 16-bit dynamic-range coverage and an optimum resolution. ALFE2 is characterized using a Front-End Test Board (FETB) based on a Zynq UltraScale+ MPSoC and two octal-channel 16-bit high-speed ADCs. The test results indicate that ALFE2 fulfills or greatly exceeds all specifications on gain, noise, linearity, uniformity, and radiation tolerance.

47 OTHER INSTRUMENTATION↗
DOE OSTI2024

ETROC1: the first full chain precision timing prototype ASIC for CMS MTD endcap timing layer upgrade

We present the design and characterization of the first fullchain precision timing prototype ASIC, named ETL Readout Chipversion 1 (ETROC1) for the CMS MTD endcap timing layer (ETL)upgrade. The ETL utilizes Low Gain Avalanche Diode (LGAD) sensors todetect charged particles, with the goal to achieve a time resolutionof 40–50 ps per hit, and 30–40 ps per track with hits from twodetector layers. The ETROC1 is composed of a 5 × 5 pixelarray and peripheral circuits. The pixel array includes a4 × 4 active pixel array with an H-tree shaped networkdelivering clock and charge injection signals. Each active pixel iscomposed of various components, including a bump pad, a chargeinjection circuit, a pre-amplifier, a discriminator, adigital-to-analog converter, and a time-to-digital converter. Thesecomponents play essential roles as the front-end link in processingLGAD signals and measuring timing-related information. Theperipheral circuits provide clock signals and readoutfunctionalities. The size of the ETROC1 chip is7 mm× 9 mm. ETROC1 has been fabricated in a 65 nmCMOS process, and extensively tested under stimuli of chargeinjection, infrared laser, and proton beam. The time resolution ofbump-bonded ETROC1 + LGAD chipsets reaches 42–46 ps per hit in thebeam test.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
DOE OSTI2025

The effect of radiation damage on the light yield and uniformity of candidate plastic scintillator tiles for the CMS hadron calorimeter upgrade

A study has been performed to understand the effects of radiation damage on various plastic scintillator tiles considered for a possible upgrade of the hadron calorimeter of the CMS detector. Measurements were made with unirradiated tiles and with tiles that had been irradiated in the CMS collision hall to a dose of 44 kGy. Results are presented for the tiles of different shapes in terms of the energy spectrum, efficiency as a function of the position at which each tile was hit, as well as light yield. All the tiles showed a light reduction of up to about 50%. The tiles with the shape currently used in the CMS detector did not see increased non-uniformity of light collection, while a significant disuniformity was observed for the tiles considered as alternatives.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
DOE OSTI2025

RD53 pixel readout integrated circuits for ATLAS and CMS HL-LHC upgrades

The RD53 collaboration has since 2013 developed new hybrid pixel detector chips with 50 × 50 μm2 pixels for the HL-LHC upgrades of the ATLAS and CMS experiments at CERN. A common architecture, design and verification framework has been developed to enable final pixel chips of different sizes to be designed, verified and tested to handle extreme hit rates of 3 GHz/cm2 (up to 12 GHz per chip) together with an increased trigger rate of 1 MHz and efficient readout of up to 5.12 Gbits/s per pixel chip. Tolerance to an extremely hostile radiation environment with 1 Grad over 10 years and induced SEU (Single Event Upset) rates of up to 100 upsets per second per chip have been major challenges to make reliable pixel chips. Three generations of pixel chips, and many specific mixed signal building blocks and radiation test chips, have been submitted and extensively tested to get to final production chips. The large, complex and high rate pixel chips have been developed with a strong emphasis on low power consumption together with a concurrent development and qualification of novel serial powering at chip, module and system level, to minimize detector material budget.

Alimonti, G↗
DOE OSTI2025

Development of a test system for data links of the ATLAS Inner Tracker (ITk) upgrade silicon pixel detector

This contribution introduces a novel test system developed to evaluate the signal transmission quality in high-speed data links for the 2026 Inner Tracker (ITk) upgrade of the ATLAS experiment. Using an FPGA-based data acquisition (DAQ) framework, the setup can run simultaneous Bit Error Rate (BER) tests for up to 64 channels and generate virtual eye diagrams, for qualifying the ∼26k electrical links at the ATLAS ITk data rate of 1.28 Gb/s. The paper includes results from system calibration, yielding its contribution to the measured losses, and preliminary results from tests of prototype and pre-production assemblies of on-detector links of the three ATLAS ITk Pixel subsystems.

47 OTHER INSTRUMENTATION↗
DOE OSTI2026

Upgrades to the TRIUMF Fast Ion Counter, TRIFIC

TRIFIC, the TRIUMF Fast Ion Counter, is a downstream ionization chamber which provides beam composition monitoring and recoil tagging for in-beam reaction experiments. TRIFIC has been commissioned and deployed for use with radioactive isotope beams at the TRIUMF-ISAC facility. Recently, the detector has been upgraded to include an improved gas window that can accommodate higher beam rates and position-sensitive electrode grids for better position reconstruction.

Gaseous detectors↗
DOE OSTI2020

Thermal Analysis of a Superconducting Undulator Cryostat for the APS Upgrade

The Advanced Photon Source Upgrade includes four 4.8-m-long superconducting undulator (SCU) cryostats, each containing two planar undulator NbTi magnets up to 1.9 m long. The cooling is provided by six cryocoolers arranged in three thermal circuits. The magnets are indirectly cooled with LHe penetrating through channels in the magnet cores. This 4 K circuit, which also includes a LHe tank, is cooled by five 4 K cryocooler 2nd stages. A beam vacuum, which is thermally isolated from the magnets, is cooled by one 10 K cryocooler 2nd stage. A thermal shield and warm parts of current leads are cooled by the 1st stages of all six cryocoolers. This paper presents an ANSYS-based thermal analysis of the new SCU cryostat including all thermal circuits. The benchmarked thermal conductance between the cryocooler cold heads and the LHe tank are used in the calculations as well as the measured cryocooler load lines. The model predicts temperatures in the system, total 4 K heat loads, and excess cooling power for various operational modes of the undulator.

Shiroyanagi, Y.↗
DOE OSTI2020

A New Superconducting Undulator Cryostat for the APS Upgrade

The Advanced Photon Source (APS) is in the midst of a major facility upgrade including both a new electron storage ring (SR) and many new insertion devices ( IDs) providing x-ray photon beams to a new suite of experimental end stations. Included among the new IDs are four 4.8-meter superconducting undulator (SCU) cryostats, each containing two 1.8-meter planar undulator magnets operating at 4.2 K in either a phase shifted or canted configuration. We describe a new, compact cryocooler-based cryostat design which supports the magnets and associated subsystems and also fits the space constraints of the SR ID straight sections. The design is an evolution of earlier single-magnet 2-meter cryostats, retaining some subsystem commonality while incorporating lessons learned and several features unique to the challenge of supporting two independently operable undulator magnets in a single device.

Anliker, E.↗
DOE OSTI2020

A cantilevered liquid-nitrogen-cooled silicon mirror for the Advanced Light Source Upgrade

This paper presents a novel cantilevered liquid-nitrogen-cooled silicon mirror design for the first optic in a new soft X-ray beamline that is being developed as part of the Advanced Light Source Upgrade (ALS-U) (Lawrence Berkeley National Laboratory, USA). The beamline is optimized for photon energies between 400 and 1400 eV with full polarization control. Calculations indicate that, without correction, this design will achieve a Strehl ratio greater than 0.85 for the entire energy and polarization ranges of the beamline. With a correction achieved by moving the focus 7.5 mm upstream, the minimum Strehl ratio is 0.99. This design is currently the baseline plan for all new ALS-U insertion device beamlines.

47 OTHER INSTRUMENTATION↗
DOE OSTI2020

Compensation of heat load deformations using adaptive optics for the ALS upgrade: a wave optics study

In this paper, a realistic wave optics simulation method has been developed to study how wavefront distortions originating from heat load deformations can be corrected using adaptive X-ray optics. Several planned soft X-ray and tender X-ray insertion-device beamlines in the Advanced Light Source upgrade rely on a common design principle. A flat, first mirror intercepts the white beam; vertical focusing is provided by a variable-line-space monochromator; and horizontal focusing comes from a single, pre-figured, adaptive mirror. A variety of scenarios to cope with thermal distortion in the first mirror are studied by finite-element analysis. The degradation of the intensity distribution at the focal plane is analyzed and the adaptive optics that correct it is modeled. The range of correctable wavefront errors across the operating range of the beamlines is reported in terms of mirror curvature and spatial frequencies. The software developed is a one-dimensional wavefront propagation package made available in the OASYS suite, an adaptable, customizable and efficient beamline modeling platform.

73 NUCLEAR PHYSICS AND RADIATION PHYSICS↗
DOE OSTI2025

ETROC2 as the Final Version for CMS MTD Endcap Timing Layer (ETL) Upgrade

The ETROC2 is the first full-size full-functionality prototype design fully compatible with the final chip specifications for CMS ETL. The ETROC2 chips have been extensively tested and the results have been presented at IEEE NSS MIC RTSD 2024. We will present here new results including the bump bonding yield improvement study, the time walk correction (TWC) generality study with single pixel TWC applied to all pixels, the final SEU testing results using both heavy ion and proton beam, more beam test studies including different sensors and irradiated sensors, and readiness for the ETROC2 production for CMS ETL upgrade.

Liu, Tie Hui [Fermilab] (ORCID:0009000765225605)↗